CN107357397A - A kind of novel C PU radiators - Google Patents
A kind of novel C PU radiators Download PDFInfo
- Publication number
- CN107357397A CN107357397A CN201710796792.1A CN201710796792A CN107357397A CN 107357397 A CN107357397 A CN 107357397A CN 201710796792 A CN201710796792 A CN 201710796792A CN 107357397 A CN107357397 A CN 107357397A
- Authority
- CN
- China
- Prior art keywords
- heat
- cpu
- water
- pump body
- exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000013536 elastomeric material Substances 0.000 claims description 2
- 239000003643 water by type Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention discloses a kind of novel C PU radiators, including heat conducting pipe, radiating fin, CPU heat exchange water tanks, waterpipe jointing, oral siphon, outlet pipe, fan and water cooling heat-exchange pump body, CPU heat exchange water tanks are connected with the middle part of two heat conducting pipes, the other end of two heat conducting pipes is connected with radiating fin, two waterpipe jointings are installed on CPU heat exchange water tanks, the one end of two waterpipe jointings respectively with oral siphon and outlet pipe is connected, the other end of oral siphon and outlet pipe is connected with water cooling heat-exchange pump body, and fan is provided with the top of water cooling heat-exchange pump body.The cpu heat can selectively turn on water cooling pattern according to actual conditions, and when cpu temperature is too high, wind-cooling heat dissipating can not solve problem and then open water-cooling immediately, and the radiating mode combined using air-cooled and water cooling drastically increases radiating efficiency.
Description
Technical field
The present invention relates to a kind of radiator, and in particular to a kind of novel C PU radiators, belongs to computer equipment field.
Background technology
CPU is the product of very large scale integration technology, is the core of Computing, with CPU technologies develop into
Step, CPU radiating efficiency also require more and more higher.Current desktop computer cpu heat mainly uses fan-cooled radiator, and one
Increase the dimensioned area of fin and the size of fan to wish to improve radiating by increasing radiating surface whereby with quantity taste
Amount.But so cause heat dissipation capacity not effectively improve, it can also reduce on the contrary sometimes.Develop it is a kind of it is simple in construction,
It is compact, and the high efficient cpu heat of desktop computer of radiating efficiency is those skilled in the art institute urgent need to solve the problem.
The content of the invention
The technical problem to be solved in the present invention is to overcome the problem of existing, there is provided a kind of novel C PU radiators.
In order to solve the above-mentioned technical problem, the invention provides following technical scheme：
The invention provides a kind of novel C PU radiators, including heat conducting pipe, radiating fin, CPU heat exchange water tanks, water pipe
Interface, oral siphon, outlet pipe, fan and water cooling heat-exchange pump body, in the CPU heat exchange water tanks and two heat conducting pipes
Portion is connected, and the other end of two heat conducting pipes is connected with the radiating fin, and two are provided with the CPU heat exchange water tanks
The waterpipe jointing, the one end of two waterpipe jointings respectively with the oral siphon and the outlet pipe are connected, it is described enter water
The other end of pipe and the outlet pipe is connected with the water cooling heat-exchange pump body, and the top of the water cooling heat-exchange pump body is set
There is the fan.
As a preferred technical solution of the present invention, the inside of the CPU heat exchange water tanks is cavity structure, described
CPU heat exchange water tanks are made up of aluminum alloy materials.
As a preferred technical solution of the present invention, the radiating fin is made up of blocks of aluminum alloy flake, institute
Heat conducting pipe is stated to be made up of pure copper material.
As a preferred technical solution of the present invention, the inside of the water cooling heat-exchange pump body is provided with water pump and radiating
Sheet metal, the oral siphon and the outlet pipe are made by elastomeric material.
The beneficial effect that is reached of the present invention is：The cpu heat can selectively turn on water cooling according to actual conditions
Pattern, when cpu temperature is too high, wind-cooling heat dissipating can not solve problem and then open water-cooling immediately, using air-cooled and water
The radiating mode that cold junction closes drastically increases radiating efficiency.
Brief description of the drawings
Accompanying drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Apply example to be used to explain the present invention together, be not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the structural representation of the present invention；
In figure：1st, heat conducting pipe；2nd, radiating fin；3rd, CPU heat exchange water tanks；4th, waterpipe jointing；5th, oral siphon；6th, water outlet
Pipe；7th, fan；8th, water cooling heat-exchange pump body.
Embodiment
The preferred embodiments of the present invention are illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein preferred real
Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
As shown in figure 1, the present invention provides a kind of novel C PU radiators, including heat conducting pipe 1, radiating fin 2, CPU heat exchanges
Water tank 3, waterpipe jointing 4, oral siphon 5, outlet pipe 6, fan 7 and water cooling heat-exchange pump body 8, CPU heat exchange water tanks 3 are led with two
The middle part connection of heat pipe 1, the other end of two heat conducting pipes 1 are connected with radiating fin 2, and two are provided with CPU heat exchange water tanks 3
Waterpipe jointing 4, the one end of two waterpipe jointings 4 respectively with oral siphon 5 and outlet pipe 6 are connected, oral siphon 5 and outlet pipe 6 it is another
One end is connected with water cooling heat-exchange pump body 8, and the top of water cooling heat-exchange pump body 8 is provided with fan 7.
The inside of CPU heat exchange water tanks 3 is cavity structure, and CPU heat exchange water tanks 3 are made up of aluminum alloy materials.
Radiating fin 2 is made up of blocks of aluminum alloy flake, and heat conducting pipe 1 is made up of pure copper material.
The inside of water cooling heat-exchange pump body 8 is provided with water pump and heat dissipation metal plate, and oral siphon 5 and outlet pipe 6 are by rubber
Material is made.
Specifically, the radiator is at work, the bottom of CPU heat exchange water tanks 3 is contacted with CPU, and CPU heat is conducted to
CPU heat exchange water tanks 3, CPU heat exchange water tanks 3 transfer heat to radiating fin 2, CPU heat exchange water tanks 3 by heat conducting pipe 1
Centre is cavity, is filled with water, and CPU heat exchange water tanks 3 feed water a part of heat transfer, and water cooling heat-exchange pump body 8 passes through water
Interface tube 4, oral siphon 5 and outlet pipe 6 circulate water back and forth, and the fan 7 at the top of water cooling heat-exchange pump body 8 is then by the portion in water
Heat is divided to be taken away by air blast.
Finally it should be noted that：The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic.
Within the spirit and principles of the invention, any modification, equivalent substitution and improvements made etc., it should be included in the present invention's
Within protection domain.
Claims (4)
1. a kind of novel C PU radiators, including heat conducting pipe (1), radiating fin (2), CPU heat exchange water tanks (3), waterpipe jointing
(4), oral siphon (5), outlet pipe (6), fan (7) and water cooling heat-exchange pump body (8), it is characterised in that the CPU heat exchange waters
Case (3) is connected with the middle part of two heat conducting pipes (1), the other end and the radiating fin (2) of two heat conducting pipes (1)
Connect, two waterpipe jointings (4) are installed, two waterpipe jointings (4) are respectively on the CPU heat exchange water tanks (3)
It is connected with one end of the oral siphon (5) and the outlet pipe (6), the other end of the oral siphon (5) and the outlet pipe (6)
It is connected with the water cooling heat-exchange pump body (8), the fan (7) is provided with the top of the water cooling heat-exchange pump body (8).
2. a kind of novel C PU radiators according to claim 1, it is characterised in that the CPU heat exchange water tanks (3)
Inside is cavity structure, and the CPU heat exchange water tanks (3) are made up of aluminum alloy materials.
3. a kind of novel C PU radiators according to claim 1, it is characterised in that the radiating fin (2) is by a piece of
Piece aluminum alloy flake is formed, and the heat conducting pipe (1) is made up of pure copper material.
4. a kind of novel C PU radiators according to claim 1, it is characterised in that the water cooling heat-exchange pump body (8)
Inside is provided with water pump and heat dissipation metal plate, and the oral siphon (5) and the outlet pipe (6) are made by elastomeric material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710796792.1A CN107357397A (en) | 2017-09-06 | 2017-09-06 | A kind of novel C PU radiators |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710796792.1A CN107357397A (en) | 2017-09-06 | 2017-09-06 | A kind of novel C PU radiators |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107357397A true CN107357397A (en) | 2017-11-17 |
Family
ID=60290059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710796792.1A Withdrawn CN107357397A (en) | 2017-09-06 | 2017-09-06 | A kind of novel C PU radiators |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107357397A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108803851A (en) * | 2018-08-29 | 2018-11-13 | 南昌大学 | A kind of novel C PU heat-pipe radiators |
| CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
| CN111857270A (en) * | 2020-07-21 | 2020-10-30 | 重庆电力高等专科学校 | Device beneficial to heat dissipation of computer |
-
2017
- 2017-09-06 CN CN201710796792.1A patent/CN107357397A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108803851A (en) * | 2018-08-29 | 2018-11-13 | 南昌大学 | A kind of novel C PU heat-pipe radiators |
| CN108803851B (en) * | 2018-08-29 | 2024-07-05 | 南昌大学 | Novel CPU heat pipe radiator |
| CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
| CN111857270A (en) * | 2020-07-21 | 2020-10-30 | 重庆电力高等专科学校 | Device beneficial to heat dissipation of computer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205028233U (en) | Notebook computer water -cooling circulation heat abstractor | |
| CN206075227U (en) | A kind of computer radiator | |
| CN100435609C (en) | Pulsating Heat Pipe Heat Sinks for Electronics Cooling | |
| CN210052735U (en) | Novel attenuation chip heat dissipation device | |
| CN107357397A (en) | A kind of novel C PU radiators | |
| CN207096911U (en) | A kind of computer radiating shell | |
| CN117075695A (en) | Liquid cooling assembly, liquid cooling device and server | |
| CN209544095U (en) | Novel aluminum alloy heat radiating type power transformer | |
| CN109287100B (en) | Liquid metal heat abstractor and electronic equipment | |
| CN205656568U (en) | Ultrafast computer with high -efficient chip water -cooling heat -radiating devices | |
| CN207133756U (en) | A kind of novel C PU radiators | |
| CN103344133B (en) | Cooling system | |
| CN206895114U (en) | A positioning radiator for communication equipment | |
| CN207487103U (en) | A kind of radiator | |
| CN206684659U (en) | A kind of computer high efficiency and heat radiation plate | |
| WO2018161615A1 (en) | Finned radiator with helical twisted stripe | |
| CN201274036Y (en) | CPU radiator for multiple computers | |
| CN2904296Y (en) | IC water cooler | |
| CN206016995U (en) | Stirling thermal engine operating cooler using liquid metal heat radiation | |
| CN208188773U (en) | A kind of computer housing water-cooled radiator | |
| CN208224983U (en) | A kind of cpu heat | |
| CN107702570A (en) | One kind heat exchange cooling device | |
| CN210660854U (en) | Hydraulic oil circulation heat sink | |
| CN208781835U (en) | A kind of high power transistor water-cooling heat radiating device | |
| CN107643815A (en) | A kind of fan-free laptop heat-dissipation system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171117 |