CN111830043A - A surface defect detection device and detection method based on spatial frequency shift regulation - Google Patents
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Abstract
Description
技术领域technical field
本发明涉及机器视觉和表面缺陷检测领域,特别涉及一种基于空间频移调控的表面缺陷检测装置和检测方法。The invention relates to the fields of machine vision and surface defect detection, in particular to a surface defect detection device and detection method based on spatial frequency shift regulation.
背景技术Background technique
手机散热膜在手机显示屏的最底层,对手机屏幕进行有效的散热。然而,该膜表面存在缺陷时,会严重影响手机屏幕的显示效果和散热效果。另外,手机偏振片、显示面板上的微小缺陷也会严重影响屏幕的显示效果。目前对这类薄膜表面缺陷的检测可利用机器视觉的方法来实现,而随着手机厂家对屏幕质量的要求提高,要求对薄膜表面小于45微米的缺陷能实现有效检测,这是目前传统的机器视觉方法所无法实现的。本发明提出了一种基于空间频移调控的微小缺陷检测方法,该方法使用更高波矢的照明光在频谱空间对样品更高频的成分进行搬移从而实现远场探测时,使得反应缺陷信息的高频成分能进入图像采集系统的镜头视场内,从而对缺陷进行有效检测。该方法对传统照明方式难以获取的微小缺陷能实现放大作用,从而通过简单的图像获取系统就可以得到微小缺陷,实现了高分辨率的特点。The heat dissipation film of the mobile phone is at the bottom of the mobile phone display, which can effectively dissipate the heat of the mobile phone screen. However, when there are defects on the surface of the film, it will seriously affect the display effect and heat dissipation effect of the mobile phone screen. In addition, small defects on the polarizer and display panel of the mobile phone will also seriously affect the display effect of the screen. At present, the detection of surface defects of such films can be realized by machine vision. With the increasing requirements of mobile phone manufacturers for screen quality, it is required to effectively detect defects on the surface of the film smaller than 45 microns. This is the current traditional machine. What is not possible with visual methods. The invention proposes a small defect detection method based on spatial frequency shift regulation. The method uses illumination light with a higher wave vector to move the higher frequency components of the sample in the spectral space to realize far-field detection, so that the defect information can be reflected. High-frequency components can enter the field of view of the lens of the image acquisition system, so that defects can be effectively detected. The method can amplify the small defects that are difficult to obtain by traditional illumination methods, so that the small defects can be obtained through a simple image acquisition system, and the characteristics of high resolution are realized.
发明内容SUMMARY OF THE INVENTION
本发明公开了一种空间光移频量的调控方法,以及基于该方法的薄膜表面缺陷检测装置和方法。通过线扫面相机或面阵相机获取经待测样品表面的反射光图像来实现对薄膜表面缺陷的检测,解决了现有人工目测方法存在的效率低,机器检测准确率偏低等问题。The invention discloses a method for regulating the frequency shift amount of spatial light, and a device and method for detecting surface defects of thin films based on the method. A line scan camera or an area scan camera is used to obtain the reflected light image of the surface of the sample to be tested to detect the surface defects of the film, which solves the problems of low efficiency and low machine detection accuracy of the existing manual visual inspection methods.
本发明解决其技术问题所采用的技术方案是:The technical scheme adopted by the present invention to solve its technical problems is:
一种表面缺陷检测装置,其特征在于该装置包含光源1,样品传动机构2,待测样品3,线阵或面阵相机4,图像采集卡5和计算机6。A surface defect detection device is characterized in that the device comprises a
光源为条形光源。The light source is a bar light source.
条形光源长度应大于待测样品的3倍。The length of the strip light source should be greater than 3 times of the sample to be tested.
光源的光波长选用短波长的光以获得大的横向光波矢,波长范围为330-700nm。The light wavelength of the light source selects short wavelength light to obtain a large transverse light wave vector, and the wavelength range is 330-700 nm.
光源照射到待测样品表面为斜入射,入射角范围为10-80度。The light source irradiates the surface of the sample to be tested for oblique incidence, and the incident angle ranges from 10 to 80 degrees.
光源照射到待测样品时应当使反射光得明暗交界处处在相机的成像视场内。When the light source illuminates the sample to be tested, the reflected light should be placed in the imaging field of view of the camera at the junction of light and dark.
一种表面缺陷检测方法,其特征在于,包括:通过对输入光移频量进行调控实现高分辨成像,增加照明光的横向波矢,使得远场成像时,经过样品后的反射光的高频空间部分能进入相机镜头的视场范围内。A surface defect detection method is characterized in that, comprising: realizing high-resolution imaging by adjusting the frequency shift amount of input light, increasing the transverse wave vector of illumination light, so that during far-field imaging, the high frequency of reflected light after passing through the sample The space part can enter the field of view of the camera lens.
通过增加入射光的横向波矢来实现待测样品缺陷的放大,从而实现超分辨成像。By increasing the transverse wave vector of the incident light, the defects of the sample to be tested are amplified, thereby realizing super-resolution imaging.
照明光经过样品后的反射光的高频空间部分能进入相机镜头的视场范围内。The high-frequency spatial part of the reflected light after the illumination light passes through the sample can enter the field of view of the camera lens.
光源照射到待测样品时应当使反射光的明暗交界处处在相机的成像视场内。When the light source illuminates the sample to be tested, the light and dark boundary of the reflected light should be within the imaging field of view of the camera.
本发明具有的有益效果是:集成性好,可批量生产,易于操作。应用于超分辨成像中具有大视场、快速成像与超高分辨率的特点。本发明通过选取合适的入射角和合理波长的入射光,以及光源照射到待测样品时使反射光的明暗交界处处在相机的成像视场内,能够获取最清晰的缺陷图像,效率高,准确率高。The invention has the beneficial effects of good integration, mass production and easy operation. It has the characteristics of large field of view, fast imaging and ultra-high resolution in super-resolution imaging. The invention can obtain the clearest defect image by selecting the incident light with a suitable incident angle and reasonable wavelength, and when the light source irradiates the sample to be tested, so that the light-dark junction of the reflected light is within the imaging field of view of the camera, so that the clearest defect image can be obtained, and the efficiency is high and accurate. high rate.
附图说明Description of drawings
图1为本发明入射光横向波矢与入射角之间的关系图。FIG. 1 is a diagram showing the relationship between the transverse wave vector of incident light and the incident angle of the present invention.
图2为计算的不同照明下的图像对比度图。Figure 2 is a graph of calculated image contrast under different illuminations.
图3为本发明实施例测量装置框图。FIG. 3 is a block diagram of a measuring apparatus according to an embodiment of the present invention.
图4为不同波长的照明光的缺陷检测效果对比图。FIG. 4 is a comparison diagram of defect detection effects of illumination light of different wavelengths.
图5为不同入射光角度下的缺陷检测效果对比图。Figure 5 is a comparison diagram of defect detection effects under different incident light angles.
图6明暗相间和均匀光场照明的对比。Figure 6. Comparison of light and dark and uniform field illumination.
具体实施方式Detailed ways
本发明实施例提供了一种薄膜表面缺陷检测装置和方法,通过线扫面相机或面阵相机获取经待测样品表面的反射光图像来实现对薄膜表面缺陷的检测,解决了现有人工目测方法存在的效率低并受人为因素影响大等问题。The embodiment of the present invention provides a film surface defect detection device and method, which realizes detection of film surface defects by acquiring a reflected light image from the surface of a sample to be tested by a line scan camera or an area array camera, which solves the problem of existing manual visual inspection. The method has problems such as low efficiency and great influence by human factors.
为了使本发明的目的、特征和优点能够显而易见,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚和完整的描述,但不应以此限制本发明的保护范围。In order to make the objectives, features and advantages of the present invention obvious, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, but the protection of the present invention should not be limited by this. scope.
根据阿贝成像原理,物体是一系列不同空间频率信息的集合,这些频谱信息通过镜头展现在镜头的后焦面上。这些频谱成分包含与入射光相同频率的直流成分和包含物体细节信息的高频成分。而待测物体的表面缺陷都是通过高频信息来反应的。当一波长为λ的光入射到待测样品表面,假设样品表面存在一宽度为d的缺陷,则光经过该缺陷后的反射光的横向波矢可表示为:相机能接收的物体反射光的频率信息可表示为:According to the Abbe imaging principle, an object is a collection of a series of different spatial frequency information, and these spectral information are displayed on the back focal plane of the lens through the lens. These spectral components include DC components with the same frequency as the incident light and high-frequency components containing detailed information about the object. The surface defects of the object to be tested are all reflected by high-frequency information. When a light with a wavelength of λ is incident on the surface of the sample to be measured, assuming that there is a defect with a width of d on the surface of the sample, the transverse wave vector of the reflected light after the light passes through the defect can be expressed as: The frequency information can be expressed as:
上式中为入射光的波矢,且有 为待测样品缺陷引起的反射光的波矢,且有根据衍射极限可知,当成像镜头的数值孔径为NA时,相机能接收的物体的频率成分满足如下关系:In the above formula is the wave vector of the incident light, and has is the wave vector of the reflected light caused by the defect of the sample to be tested, and has According to the diffraction limit, when the numerical aperture of the imaging lens is NA, the frequency components of the object that the camera can receive satisfies the following relationship:
上式中左边两波矢相加的成分超出了成像镜头的频率接收范围,两波矢相减的部分则能够被镜头所接收而在相机中成像,(2)式右边代表了镜头所收集的光的截至频率。由(2)式可知,当增加入射光的横向波矢时可使样品的反射光的波矢增加,也就是其空间频率也增加,两者相减可保持小于镜头的截至频率。样品的空间频率的增加意味着样品尺寸的减小,等价于将缺陷放大的作用。根据可知,采用短波长的光或增大入射角(入射光与检测面法线夹角,将增加入射光横向方向上的波矢,从而达到放大待测样品表面缺陷而实现微小缺陷检测的目的。横向波矢与入射光波矢及角度的关系如图1所示。In the above formula, the sum of the two wavevectors on the left exceeds the frequency receiving range of the imaging lens, and the subtracted part of the two wavevectors can be received by the lens and imaged in the camera. cut-off frequency of light. It can be seen from equation (2) that when the transverse wave vector of the incident light is increased, the wave vector of the reflected light of the sample can be increased, that is, its spatial frequency can also be increased. An increase in the spatial frequency of the sample means a decrease in the size of the sample, which is equivalent to amplifying the defects. according to It can be seen that using short wavelength light or increasing the incident angle (the angle between the incident light and the normal line of the detection surface will increase the wave vector in the lateral direction of the incident light, so as to achieve the purpose of amplifying the surface defects of the sample to be tested and realizing the detection of small defects. The relationship between the transverse wave vector and the incident light wave vector and angle is shown in Figure 1.
缺陷如果要清晰可见,对比度和清晰度和分辨率一样重要。对比度:指的是一幅图像中明暗区域最亮的白和最暗的黑之间不同亮度层级的测量,差异范围越大代表对比越大。清晰度:是图像细节边缘变化的敏锐程度。在图像细节的边缘处,光学密度或亮度随位置的变化越敏锐(变化快)、越剧烈(反差大),则细节的边缘就越清晰,可辨程度越高。对于局部细节而言,起决定作用的应当是清晰度而非对比度。在这里清晰度可定义为局部对比度,即一个很小的范围内,对比度的大小。根据韦伯定律,其中I是信号强度,Ib是背景强度。通过计算可以发现明暗相间处的对比度最高,如图2所示。从图2可知,左边为光场图,右边为局部对比度图,光场图为正弦分布的光场,可以看出在峰和谷间隙的A、B点处,光场变化最剧烈,在对比度图中,A、B点处的对比度是峰值,位于强度峰或谷处的点的对比度等于零。峰和谷间隙处的光场即为明暗相间处的光场。Contrast and sharpness are as important as resolution if defects are to be clearly visible. Contrast: refers to the measurement of different brightness levels between the brightest white and the darkest black in the light and dark areas of an image. The greater the difference range, the greater the contrast. Sharpness: is the sharpness of edge changes in image detail. At the edge of image details, the sharper (faster change) and sharper (larger contrast) changes in optical density or brightness with position are, the clearer the edge of the details and the higher the degree of discernment. For local details, sharpness, not contrast, should be decisive. Sharpness here can be defined as the local contrast, that is, the size of the contrast in a small range. According to Weber's law, where I is the signal intensity and I b is the background intensity. Through calculation, it can be found that the contrast between light and dark is the highest, as shown in Figure 2. As can be seen from Figure 2, the left side is the light field map, the right side is the local contrast map, and the light field map is the light field with sinusoidal distribution. It can be seen that at points A and B between the peak and valley gaps, the light field changes most drastically, and the contrast In the figure, the contrast at points A and B is the peak, and the contrast at the point at the intensity peak or valley is equal to zero. The light field at the gap between the peaks and valleys is the light field between light and dark.
基于以上的分析,本发明提供了一种检测薄膜表面缺陷的检测装置和方法,如图3所示,该检测装置包含光源1,样品传动机构2,待测薄膜样品3,线阵或面阵相机4,图像采集卡 5和计算机6。Based on the above analysis, the present invention provides a detection device and method for detecting film surface defects. As shown in FIG. 3, the detection device includes a
光源1以一定角度入射到待测样品上,入射光经样品反射后的反射光进入相机4中从而实现了相机对待测样品的成像,相机4将所得到的待测样品的图像传输到图像采集卡5中并通过计算机6中的图像处理算法自动判断出待测样品表面的缺陷。测量时,通过传动机构移动待测样品,使得相机能对样品所有区域进行有效成像,从而获得样品的完整图像。The
检测装置的光源1为条形光源。为了达到最佳成像效果,选用的条形光源的长度应大于待测样品的3倍。The
线阵或面阵相机4的核心是镜头,镜头的基本功能就是实现光束变换(调制),在机器视觉系统中,镜头的主要作用是将目标成像在图像传感器的光敏面上。镜头的质量直接影响到机器视觉系统的整体性能,合理地选择和安装镜头,是机器视觉系统设计的重要环节。在评价工业镜头质量时一般还会从分辨率、明锐度和景深等几个实用参数判断:1.分辨率 (Resolution):又称鉴别率、解像力,指镜头清晰分辨被摄景物纤维细节的能力,制约工业镜头分辨率的原因是光的衍射现象,即衍射光斑(爱里斑)。分辨率的单位是“线对/毫米“(lp/mm)。2.明锐度(Acutance):也称对比度,是指图像中最亮和最暗的部分的对比度。 3.景深(DOF):在景物空间中,位于调焦物平面前后一定距离内的景物,还能够结成相对清晰的影像。上述位于调焦物平面前后的能结成相对清晰影像的景物间之纵深距离,也就是能在实际像平面上获得相对清晰影像的景物空间深度范围,称为景深。4.最大相对孔径与光圈系数:相对孔径,是指该工业镜头的入射光孔直径(用D表示)与焦距(用f表示)之比,即:相对孔径=D/f。相对孔径的倒数称为光圈系数(aperture scale),又称为f/制光圈系数或光孔号码。一般镜头的相对孔径是可以调节的,其最大相对孔径或光圈系数往往标示在工业镜头上,如1:1.2或f/1.2。如果拍摄现场的光线较暗或曝光时间很短,则需要尽量选择最大相对孔径较大的工业镜头。综合考虑,选用日本VST工业镜头VS-L(F)系列的VST VS-L10028/F型号。The core of the line or area scan camera 4 is the lens. The basic function of the lens is to realize beam transformation (modulation). In the machine vision system, the main function of the lens is to image the target on the photosensitive surface of the image sensor. The quality of the lens directly affects the overall performance of the machine vision system. Reasonable selection and installation of the lens is an important part of the design of the machine vision system. When evaluating the quality of industrial lenses, it is generally judged from several practical parameters such as resolution, sharpness and depth of field: 1. Resolution: Also known as the discrimination rate and resolution, it refers to the ability of the lens to clearly distinguish the fiber details of the subject. , The reason that restricts the resolution of industrial lenses is the diffraction phenomenon of light, that is, the diffraction spot (Airy spot). The unit of resolution is "line pairs per millimeter" (lp/mm). 2. Acutance: Also known as contrast, it refers to the contrast between the brightest and darkest parts of an image. 3. Depth of Field (DOF): In the scene space, the scene located within a certain distance before and after the focusing object plane can also form a relatively clear image. The depth distance between the above-mentioned objects located in front of and behind the focusing object plane that can form a relatively clear image, that is, the spatial depth range of the scene that can obtain a relatively clear image on the actual image plane, is called the depth of field. 4. Maximum relative aperture and aperture coefficient: relative aperture refers to the ratio of the diameter of the incident light aperture (represented by D) to the focal length (represented by f) of the industrial lens, namely: relative aperture=D/f. The reciprocal of the relative aperture is called the aperture scale, also known as the f/stop or aperture number. The relative aperture of general lenses can be adjusted, and the maximum relative aperture or aperture factor is often marked on industrial lenses, such as 1:1.2 or f/1.2. If the shooting scene is dark or the exposure time is short, you need to try to choose an industrial lens with a larger maximum relative aperture. Comprehensive consideration, the VST VS-L10028/F model of the Japanese VST industrial lens VS-L(F) series is selected.
光源的光波长选用短波长的光以获得大的横向光波矢,合理的波长范围为330-700nm。图4显示了不同光波长的照明光对缺陷检测效果的差异。如图4所示,光源发出的紫外光时,采用的紫外光波长范围为330-400纳米,检测出的缺陷图像清晰,光源发出的红光时,采用的红光波长范围为620-700纳米,检测出的缺陷图像可见,可见采用波长更短的紫外光时,能够获得更大的横向光波矢。The light wavelength of the light source selects short wavelength light to obtain a large transverse light wave vector, and a reasonable wavelength range is 330-700 nm. Figure 4 shows the difference in the defect detection effect of illumination light with different light wavelengths. As shown in Figure 4, when the light source emits ultraviolet light, the wavelength range of the ultraviolet light used is 330-400 nanometers, and the detected defect image is clear. When the light source emits red light, the wavelength range of the red light used is 620-700 nanometers. , the detected defect image can be seen, and it can be seen that when the ultraviolet light with a shorter wavelength is used, a larger transverse light wave vector can be obtained.
光源照射到待测样品表面为斜入射同样能够获得大的横向光波矢,合理的入射角范围为 10-80度。图5显示了不同照明光入射角度对缺陷检测效果的差异。如图5所示,光源采用紫外光时,入射角为10度时的缺陷图像照片,可以看出水波纹缺陷隐约可见,入射角为80度时的缺陷图像照片,可以看出水波纹缺陷隐约可见,当入射角为45±5度下缺陷图像照片,可以看出水波纹缺陷清晰。When the light source irradiates the surface of the sample to be tested with oblique incidence, a large transverse light wave vector can also be obtained, and the reasonable incident angle range is 10-80 degrees. Figure 5 shows the difference in the defect detection effect of different illumination light incident angles. As shown in Figure 5, when the light source uses ultraviolet light, the defect image photo when the incident angle is 10 degrees, it can be seen that the water ripple defect is faintly visible, and the defect image photo when the incident angle is 80 degrees, it can be seen that the water ripple defect is faintly visible, When the incident angle is 45±5 degrees, it can be seen that the water ripple defect is clear.
如图6所示,为明暗相间和均匀光场照明的对比图。从图中可看出,明暗相间光场照明时获得的缺陷图像更加清晰可见。As shown in Figure 6, it is a comparison diagram of light and dark and uniform light field illumination. As can be seen from the figure, the defect images obtained when illuminated by light and dark light fields are more clearly visible.
在检测时,光源和相机安装在一个可移动的机械结构主体上,同时需要安装在一个能实现俯仰和摆角等角度调节的机械结构主体上,两个机械结构主体相互嵌套安装。During detection, the light source and the camera are installed on a movable mechanical structure body, and at the same time, they need to be installed on a mechanical structure body that can realize angle adjustment such as pitch and yaw angle. The two mechanical structure bodies are nested and installed in each other.
通过对输入光移频量进行调控实现高分辨成像。增加照明光的横向波矢,使得远场成像时,经过样品后的反射光的高频空间部分能进入相机镜头的视场范围内。High-resolution imaging is achieved by adjusting the frequency shift amount of the input light. The transverse wave vector of the illumination light is increased, so that the high-frequency space part of the reflected light after passing through the sample can enter the field of view of the camera lens during far-field imaging.
为了提高缺陷识别的对比度,光源照射到待测样品时应当使反射光的明暗交界处处在相机的成像视场内。In order to improve the contrast of defect identification, when the light source illuminates the sample to be tested, the light and dark boundary of the reflected light should be within the imaging field of view of the camera.
尽管上面对本发明说明性的具体实施方式进行了描述,以便于本技术领域的技术人员能够理解本发明,但是本发明不仅限于具体实施方式的范围,对本技术领域的普通技术人员而言,只要各种变化只要在所附的权利要求限定和确定的本发明精神和范围内,一切利用本发明构思的发明创造均在保护之列。Although the illustrative specific embodiments of the present invention are described above so that those skilled in the art can understand the present invention, the present invention is not limited to the scope of the specific embodiments. As long as such changes fall within the spirit and scope of the present invention as defined and determined by the appended claims, all inventions and creations utilizing the inventive concept are included in the protection list.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080144023A1 (en) * | 2006-11-07 | 2008-06-19 | Yukihiro Shibata | Apparatus for inspecting defects |
US20090059216A1 (en) * | 2007-08-29 | 2009-03-05 | Yukihiro Shibata | Defect inspection method and defect inspection apparatus |
JP2009251412A (en) * | 2008-04-09 | 2009-10-29 | Renesas Technology Corp | Device and method for inspecting mask blank, method of manufacturing reflection type exposure mask, and method of manufacturing semiconductor integrated circuit |
CN103048272A (en) * | 2013-01-08 | 2013-04-17 | 浙江大学 | Frequency-shift super-resolution microimaging method and device based on evanescent field illumination |
CN106296585A (en) * | 2016-08-12 | 2017-01-04 | 浙江大学 | Fourier iteration splicing super-resolution microscopic method based on surface wave illumination and device |
-
2019
- 2019-03-10 CN CN201910177740.5A patent/CN111830043A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080144023A1 (en) * | 2006-11-07 | 2008-06-19 | Yukihiro Shibata | Apparatus for inspecting defects |
US20090059216A1 (en) * | 2007-08-29 | 2009-03-05 | Yukihiro Shibata | Defect inspection method and defect inspection apparatus |
JP2009251412A (en) * | 2008-04-09 | 2009-10-29 | Renesas Technology Corp | Device and method for inspecting mask blank, method of manufacturing reflection type exposure mask, and method of manufacturing semiconductor integrated circuit |
CN103048272A (en) * | 2013-01-08 | 2013-04-17 | 浙江大学 | Frequency-shift super-resolution microimaging method and device based on evanescent field illumination |
CN106296585A (en) * | 2016-08-12 | 2017-01-04 | 浙江大学 | Fourier iteration splicing super-resolution microscopic method based on surface wave illumination and device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116993653A (en) * | 2022-09-28 | 2023-11-03 | 腾讯科技(深圳)有限公司 | Camera lens defect detection method, device, equipment, storage medium and product |
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