CN111896557A - A three-dimensional measurement device and method for dark-field microscopic defects with structured light modulation - Google Patents
A three-dimensional measurement device and method for dark-field microscopic defects with structured light modulation Download PDFInfo
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Abstract
本发明公开了一种结构光调制的暗场显微缺陷三维测量装置与方法,所述三维测量装置包括光源、空间光调制器、第一透镜、分光镜、显微物镜、第二透镜、第三透镜、滤波器、第四透镜和CCD;所述空间光调制器用于接收光源发出的光并调制成结构光;所述空间光调制器调制的结构光依次经过第一透镜、分光镜和显微物镜微缩投影至样品上并在样品上反射形成零级光和一级光;所述零级光依次经过显微物镜、第二透镜和第三透镜达到滤波器;所述一级光依次经过显微物镜、第二透镜、第三透镜和第四透镜到达CCD成像。本发明解决了现有无损检测方法存在照明背景光和离焦光干扰缺陷散射光成像的问题。
The invention discloses a three-dimensional measurement device and method for dark-field microscopic defects with structured light modulation. The three-dimensional measurement device comprises a light source, a spatial light modulator, a first lens, a beam splitter, a microscope objective lens, a second lens, a third lens Three lenses, a filter, a fourth lens and a CCD; the spatial light modulator is used to receive the light emitted by the light source and modulate it into structured light; the structured light modulated by the spatial light modulator passes through the first lens, the beam splitter and the display in sequence. The micro-objective lens is miniature projected onto the sample and reflected on the sample to form zero-order light and first-order light; the zero-order light passes through the microscope objective lens, the second lens and the third lens in turn to reach the filter; the first-order light passes through the The microscope objective, the second lens, the third lens and the fourth lens reach the CCD for imaging. The invention solves the problem that the illumination background light and the defocused light interfere with the imaging of the scattered light of the defect in the existing non-destructive testing method.
Description
技术领域technical field
本发明涉及材料检测领域,具体涉及一种结构光调制的暗场显微缺陷三维测量装置与方法。The invention relates to the field of material detection, in particular to a three-dimensional measurement device and method for dark field microscopic defects modulated by structured light.
背景技术Background technique
对透明光学材料缺陷的三维形态的准确测量,是获得高品质低缺陷的光学元件的关键之一。现有的缺陷检测方法可分为有损检测和无损检测两大类。有损检测方法(如截面显微法、角度抛光法、离子束刻蚀法和磁流变抛光斑点法等)通过腐蚀、抛光等手段将缺陷的内部结构暴露并扩大,检测缺陷的深度信息,检测精度较高,但会导致光学元件破坏或失效,只能作为一种抽检手段。无损检测方法不破坏光学元件,并且效率高、成本低,已经成为缺陷检测的必然发展趋势。Accurate measurement of the three-dimensional morphology of defects in transparent optical materials is one of the keys to obtaining high-quality and low-defect optical components. Existing defect detection methods can be divided into two categories: destructive testing and non-destructive testing. Destructive detection methods (such as cross-section microscopy, angle polishing, ion beam etching, and magnetorheological polishing spots) expose and expand the internal structure of defects by means of etching, polishing, etc., and detect the depth information of defects. The detection accuracy is high, but it will cause damage or failure of optical components, and can only be used as a sampling method. Non-destructive testing methods do not damage optical components, and have high efficiency and low cost, and have become an inevitable development trend in defect detection.
在无损检测方法中,暗场成像法灵敏度很高,但仅能测量缺陷的二维结构,缺乏对纵向深度的检测能力。无损的三维微缺陷检测方法主要包括白光干涉、原子力显微、共聚焦扫描显微、光学相干层析、数字全息显微、全内反射暗场显微等技术,其中白光干涉、原子力显微只能检测表面缺陷的三维形貌,其他几种方法都同时具有表面和内部缺陷的三维检测能力,但存在照明背景光和离焦光干扰缺陷散射光成像的问题。Among non-destructive testing methods, dark-field imaging has high sensitivity, but it can only measure the two-dimensional structure of defects and lack the ability to detect longitudinal depths. Non-destructive 3D micro-defect detection methods mainly include white light interference, atomic force microscopy, confocal scanning microscopy, optical coherence tomography, digital holographic microscopy, total internal reflection dark field microscopy and other technologies. It can detect the three-dimensional topography of surface defects. Several other methods have the ability of three-dimensional detection of surface and internal defects at the same time, but there is a problem that illumination background light and defocused light interfere with the imaging of scattered light of defects.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种结构光调制的暗场显微缺陷三维测量装置,解决现有无损检测方法存在照明背景光和离焦光干扰缺陷散射光成像的问题。The purpose of the present invention is to provide a structured light-modulated dark-field microscopic defect three-dimensional measuring device, which solves the problem of the existing non-destructive testing methods that the illumination background light and the defocused light interfere with the scattered light imaging of the defect.
此外,本发明还提供基于上述测量装置的方法。In addition, the present invention also provides a method based on the above-mentioned measuring device.
本发明通过下述技术方案实现:The present invention is achieved through the following technical solutions:
一种结构光调制的暗场显微缺陷三维测量装置,包括光源、空间光调制器、第一透镜、分光镜、显微物镜、第二透镜、第三透镜、滤波器、第四透镜和CCD;A structured light-modulated dark-field microscopic defect three-dimensional measurement device, comprising a light source, a spatial light modulator, a first lens, a beam splitter, a microscope objective lens, a second lens, a third lens, a filter, a fourth lens and a CCD ;
所述空间光调制器用于接收光源发出的光并调制成结构光;The spatial light modulator is used for receiving the light emitted by the light source and modulating it into structured light;
所述空间光调制器调制的结构光依次经过第一透镜、分光镜和显微物镜微缩投影至样品上并在样品上反射形成零级光和一级光;The structured light modulated by the spatial light modulator is micro-projected onto the sample through the first lens, the beam splitter and the microscope objective lens in turn, and is reflected on the sample to form zero-order light and first-order light;
所述零级光依次经过显微物镜、第二透镜和第三透镜达到滤波器;The zero-order light reaches the filter through the microscope objective lens, the second lens and the third lens in sequence;
所述一级光依次经过显微物镜、第二透镜、第三透镜和第四透镜到达CCD成像。The first-order light passes through the microscope objective lens, the second lens, the third lens and the fourth lens in sequence to reach the CCD imaging.
本发明所述显微物镜既是照明透镜,又是成像物镜,所述CCD为荷耦合元件,可以称为CCD图像传感器。The microscope objective lens of the present invention is both an illumination lens and an imaging objective lens, and the CCD is a charge-coupled element, which can be called a CCD image sensor.
零级光为照明背景光的绝大部分,一级光包含小部分照明背景光和部分缺陷散射光,使用外置滤波器能够去除大部分照明背景光。The zero-order light is most of the illumination background light, the first-order light contains a small part of the illumination background light and part of the defect scattered light, and most of the illumination background light can be removed by using an external filter.
在焦光和离焦光的分离是通过高频结构光场照明和后续的调制度分析算法实现的,这个高频结构光场是指空间光调制器的调制的结构光必须是高频才能使在焦光与离焦光的分离效果最好,具体来讲,结构光频率为具体的系统截止频率的一半时,分离效果最好。The separation of in-focus light and defocused light is achieved by high-frequency structured light field illumination and subsequent modulation degree analysis algorithms. This high-frequency structured light field means that the modulated structured light of the spatial light modulator must be high-frequency The separation effect is the best when the focused light and the defocused light are separated. Specifically, when the frequency of the structured light is half of the specific system cutoff frequency, the separation effect is the best.
系统截止频率fc=2NA/λ,其中NA为显微物镜的数值孔径,λ为照明光波长。The system cut-off frequency f c =2NA/λ, where NA is the numerical aperture of the microscope objective, and λ is the wavelength of the illumination light.
综上,本发明使用高频结构光场照明缺陷,通过结构光频域调制的方式分离在焦光与离焦光,并使用外置频域滤波器去除大部分照明背景光,可排除照明背景光和离焦光干扰的干扰,提升成像灵敏度。To sum up, the present invention uses high-frequency structured light field illumination defects, separates on-focus light and defocused light by means of structured light frequency-domain modulation, and uses an external frequency-domain filter to remove most of the illumination background light, which can eliminate the illumination background. The interference of light and defocused light interference improves imaging sensitivity.
进一步地,滤波器置于第三透镜和第四透镜之间。Further, a filter is interposed between the third lens and the fourth lens.
进一步地,第三透镜的后焦面和第四透镜的前焦面重合形成频谱面,所述滤波器位于频谱面上。Further, the back focal plane of the third lens and the front focal plane of the fourth lens overlap to form a spectrum plane, and the filter is located on the spectrum plane.
进一步地,滤波器的尺寸小于CCD的孔径尺寸。Further, the size of the filter is smaller than the aperture size of the CCD.
即在光路上遮挡物不能完全遮挡CCD的成像幅面,一级光和缺陷散射的光可以部分进入CCD的成像幅面。That is, the blocking objects on the optical path cannot completely block the imaging format of the CCD, and the first-order light and the light scattered by the defects can partially enter the imaging format of the CCD.
进一步地,还包括用于安装样品的位移机构,所述位移机构用于样品在光轴方向移动。Further, a displacement mechanism for installing the sample is also included, and the displacement mechanism is used for the sample to move in the direction of the optical axis.
如此,检测时,被测样品安装于位移机构上,位移机构带动被测样品在光轴方向移动进行测试,以实现样品缺陷的轴向三维扫描。In this way, during detection, the sample to be tested is installed on the displacement mechanism, and the displacement mechanism drives the sample to be tested to move in the direction of the optical axis for testing, so as to realize axial three-dimensional scanning of sample defects.
优选地,所述位移机构带动被测样品移动的方向与所述同轴光路的光轴平行。Preferably, the direction in which the displacement mechanism drives the sample to be tested is parallel to the optical axis of the coaxial optical path.
进一步地,样品安装在显微物镜的焦面附近。Further, the sample is mounted near the focal plane of the microscope objective.
进一步地,样品为透明材料。Further, the sample is a transparent material.
进一步地,光源为LED光源。Further, the light source is an LED light source.
一种结构光调制的暗场显微缺陷三维测量装置的测量方法,包括以下步骤:A measurement method of a structured light-modulated dark-field microscopic defect three-dimensional measurement device, comprising the following steps:
S1、将待测的样品安装在显微物镜的焦面附近;S1. Install the sample to be tested near the focal plane of the microscope objective lens;
S2、调整样品,使样品的待测量区域进入显微物镜的成像视野,并设置空间光调制器的条纹频率、相移步长和相移步数;S2, adjust the sample so that the area to be measured of the sample enters the imaging field of view of the microscope objective lens, and set the fringe frequency, phase shift step size and phase shift step number of the spatial light modulator;
S3、启动光源、空间光调制器和CCD,在每个轴向位置暂停并采集设定相移条纹的暗场显微图像。S3. Activate the light source, the spatial light modulator and the CCD, pause at each axial position and collect a dark-field microscopic image of the set phase-shift fringes.
进一步地,还包括:Further, it also includes:
S4、使用相移调制度分析方法,对每个轴向位置的调制度进行计算获得轴向调制度曲线,计算公式如下所示:S4. Use the phase shift modulation degree analysis method to calculate the modulation degree of each axial position to obtain the axial modulation degree curve. The calculation formula is as follows:
式中,N表示相移步数,Ii表示第i次相移时某点的光强值;In the formula, N represents the number of phase shift steps, and I i represents the light intensity value of a certain point during the i-th phase shift;
S5、根据轴向调制度曲线对样品上的缺陷进行三维重构。S5. Perform three-dimensional reconstruction of the defects on the sample according to the axial modulation curve.
本发明与现有技术相比,具有如下的优点和有益效果:Compared with the prior art, the present invention has the following advantages and beneficial effects:
1、本发明的三维测量装置通过高频结构光调制和外置频域滤波器,同时排除照明背景光和离焦光的干扰,提高缺陷成像的灵敏度。1. The three-dimensional measurement device of the present invention improves the sensitivity of defect imaging through high-frequency structured light modulation and external frequency domain filters, while eliminating the interference of illumination background light and defocused light.
2、本发明能够有效用于透明材料的三维缺陷检测,满足光学制造等领域对透明材料表面及内部缺陷三维结构的检测需求。2. The present invention can be effectively used for three-dimensional defect detection of transparent materials, and meets the detection requirements of the three-dimensional structure of the surface and internal defects of transparent materials in the fields of optical manufacturing and the like.
附图说明Description of drawings
此处所说明的附图用来提供对本发明实施例的进一步理解,构成本申请的一部分,并不构成对本发明实施例的限定。在附图中:The accompanying drawings described herein are used to provide further understanding of the embodiments of the present invention, and constitute a part of the present application, and do not constitute limitations to the embodiments of the present invention. In the attached image:
图1为三维测量装置的结构示意图;FIG. 1 is a schematic structural diagram of a three-dimensional measurement device;
图2为三维测量装置的测量流程图。FIG. 2 is a measurement flow chart of the three-dimensional measurement device.
附图中标记及对应的零部件名称:The marks in the attached drawings and the corresponding parts names:
1-光源,2-空间光调制器,3-第一透镜,4-分光镜,5-显微物镜,6-样品,7-缺陷,8-位移机构,9-第二透镜,10-第三透镜,11-滤波器,12-第四透镜,13-CCD,14-零级光,15-一级光。1-light source, 2-spatial light modulator, 3-first lens, 4-beamsplitter, 5-microscopic objective, 6-sample, 7-defect, 8-displacement mechanism, 9-second lens, 10-th Three lenses, 11-filter, 12-fourth lens, 13-CCD, 14-zeroth-order light, 15-first-order light.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚明白,下面结合实施例和附图,对本发明作进一步的详细说明,本发明的示意性实施方式及其说明仅用于解释本发明,并不作为对本发明的限定。In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and the accompanying drawings. as a limitation of the present invention.
实施例1:Example 1:
如图1所示,一种结构光调制的暗场显微缺陷三维测量装置,包括光源1、空间光调制器2、第一透镜3、分光镜4、显微物镜5、第二透镜9、第三透镜10、滤波器11、第四透镜12和CCD13;As shown in Figure 1, a structured light modulation dark field microscopic defect three-dimensional measurement device includes a light source 1, a spatial
所述空间光调制器2用于接收光源1发出的光并调制成结构光;The spatial
所述空间光调制器2调制的结构光依次经过第一透镜3、分光镜4和显微物镜5微缩投影至样品6上并在样品6上反射形成零级光14和一级光15,所述样品6安装在显微物镜5的焦面附近,所述样品6为透明材料;The structured light modulated by the spatial
所述零级光14依次经过显微物镜5、第二透镜9和第三透镜10达到滤波器11,所述第三透镜10的后焦面和第四透镜12的前焦面重合形成频谱面,所述滤波器11位于频谱面上,所述滤波器11的尺寸小于CCD13的孔径尺寸;The zero-order light 14 passes through the microscope objective lens 5, the
所述一级光15依次经过显微物镜5、第二透镜9、第三透镜10和第四透镜12到达CCD13成像。The
如图2所示,本实施例的测量方法包括以下步骤:As shown in Figure 2, the measurement method of this embodiment includes the following steps:
S1、将待测的样品6安装在显微物镜5的焦面附近;S1, the
S2、调整样品6,使样品6的待测量区域进入显微物镜5的成像视野,并设置空间光调制器2的条纹频率、相移步长和相移步数;S2, adjust the
S3、启动光源1、空间光调制器2和CCD13,在每个轴向位置暂停并采集设定相移条纹的暗场显微图像;S3, start the light source 1, the spatial
具体地:光源1发出的光以特定的角度入射到空间光调制器2被空间光调制器2调制成结构光后次经过第一透镜3、分光镜4和显微物镜5微缩投影至样品6上并在样品6上反射形成零级光14和一级光15,零级光14依次经过显微物镜5、第二透镜9和第三透镜10达到滤波器11,所述一级光15依次经过显微物镜5、第二透镜9、第三透镜10和第四透镜12到达CCD13成像;样品6中若存在缺陷,缺陷散射光与一级光15一起到达CCD13成像。Specifically: the light emitted by the light source 1 is incident on the spatial
S4、使用相移调制度分析方法,对每个轴向位置的调制度进行计算获得轴向调制度曲线,计算公式如下所示:S4. Use the phase shift modulation degree analysis method to calculate the modulation degree of each axial position to obtain the axial modulation degree curve. The calculation formula is as follows:
式中,N表示相移步数,Ii表示第i次相移时某点的光强值;In the formula, N represents the number of phase shift steps, and I i represents the light intensity value of a certain point during the i-th phase shift;
S5、根据轴向调制度曲线对样品6上的缺陷7进行三维重构:S5. Perform three-dimensional reconstruction of the defect 7 on the
提取缺陷同一位置对应的轴向调制度曲线,使用重心法或拟合法计算曲线峰值对应的光轴方向位置,该位置即为缺陷的焦面。Extract the axial modulation curve corresponding to the same position of the defect, and use the center of gravity method or the fitting method to calculate the position of the optical axis direction corresponding to the peak of the curve, which is the focal plane of the defect.
本实施例使用高频结构光场照明缺陷,通过结构光频域调制的方式分离在焦光与离焦光,并使用外置频域滤波器去除照明背景光,可排除照明背景光和离焦光干扰的干扰,提升成像灵敏度。This embodiment uses the high-frequency structured light field illumination defect, separates the in-focus light and the defocused light by means of frequency-domain modulation of the structured light, and uses an external frequency-domain filter to remove the illumination background light, which can exclude the illumination background light and the defocused light. The interference of light interference improves the imaging sensitivity.
实施例2:Example 2:
如图1所示,本实施例基于实施例1,还包括用于安装样品6的位移机构8,所述位移机构8用于样品6在光轴方向移动,所述光源1为LED光源。As shown in FIG. 1 , this embodiment is based on Embodiment 1, and further includes a
本实施例中的位移机构8为现有技术中常用的移动装置,例如但不限采用运输线、传动装置等,其只要实现带动样品6在光轴方向移动即可,本实施例中不再赘述其结构。The
以上所述的具体实施方式,对本发明的目的、技术方案和有益效果进行了进一步详细说明,所应理解的是,以上所述仅为本发明的具体实施方式而已,并不用于限定本发明的保护范围,凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The specific embodiments described above further describe the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention, and are not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
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