CN116559201B - A three-dimensional detection method for transparent sample defects - Google Patents
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G01N21/88—Investigating the presence of flaws or contamination
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Abstract
The invention provides a defect positioning and three-dimensional detecting method for a transparent sample. The method is based on combination of microscopic imaging and holographic imaging, firstly, a non-coherent light source microscopic system is utilized to scan and image a sample, screening and positioning of defects are carried out, then hologram recording and reconstruction are carried out on the defects based on a holographic interferometry principle of a coherent light source, accurate identification and positioning of the defects on the surface and the inside of the sample are rapidly and efficiently achieved through phase recovery, unwrapping and depth information conversion algorithms, and finally comprehensive analysis and display are carried out on the defects according to the obtained three-dimensional information. The invention provides a detection method which is rapid, non-contact and can realize high-precision nondestructive measurement for transparent sample defect measurement, and can be applied to the fields of mobile phone glass screen quality detection and the like.
Description
Technical Field
The invention relates to the technical field of defect three-dimensional detection, in particular to a defect positioning and three-dimensional detection method for a transparent sample.
Background
With the development of industrial manufacturing technology, the precision of the finished size or shape of elements in the fields of optics, semiconductors, precision engineering, aerospace engineering and the like is higher and higher, and particularly transparent samples such as glass screens of electronic products, optical films and the like are obtained. The defects of scratch, bump and the like generated on the surface or inside the transparent samples in the manufacturing, processing and forming processes are important evaluation indexes in the production process.
Currently, there is an increasing demand for measuring instruments with high flexibility and high precision in the market, in particular three-dimensional measuring techniques. Conventional contact measurement techniques can cause unavoidable scratches or other damage due to contact of the stylus with the test surface during measurement. Thus, research into non-contact measurement techniques has gained increasing attention. Non-contact measurement techniques are mostly based on the principle of white light interferometry, or confocal scanning of lasers.
Because of the wide spectrum of white light, although the measurement range can be from nanometer to micrometer, the coherence and stability of the light source in the interference process are poor, the contrast of the obtained interference fringes is poor, the white light interference is mostly used for detecting the defects of the surface, the defects of the inner part and the lower surface of an object are difficult to obtain, and the long-term stability of the measurement precision is seriously influenced by the phase shift precision of a PZT (piezoelectric ceramic driver) module.
The single wavelength coherent light source, such as a laser light source, has measurement accuracy related to the wavelength of the light source due to excellent coherence conditions, and can reach the nanometer level, which is superior to the white light source. In a confocal laser scanning microscopic imaging system, a detector collects sample information illuminated by a point light source, and finally three-dimensional information of the whole sample is obtained by using a transverse and axial scanning technology. But its overall efficiency and accuracy is affected by the scanning operation.
The coherent holographic measurement technology can record and reconstruct the surface and internal structure information of an object through single exposure in a reflection or transmission mode and the like, and can rapidly realize ultra-precise three-dimensional measurement of the surface or the internal shape of the object according to the reconstructed light wave phase information. In particular to the detection of transparent samples, the traditional measurement of surface morphology is broken through, and meanwhile, the defects inside the samples can be accurately analyzed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a defect positioning and three-dimensional detecting method for a transparent sample based on the combination of microscopic imaging and holographic imaging methods. The method provides defect coordinates through two-dimensional data positioning, acquires three-dimensional defect information through small-range coherent holographic detection, and finally comprehensively analyzes the defects through the three-dimensional information.
The method comprises the steps of scanning and imaging a sample under an incoherent light source, screening and positioning defects by using a large aperture illumination microscopic system, rapidly judging whether the sample has defects or not and marking the defects by parallel image calculation, carrying out small-range and high-precision phase measurement on the defects by using a holographic interferometry principle based on the coherent light source, thereby obtaining depth and specific position (upper surface, lower surface or inside) information of the defects, and finally classifying and counting the defects to finish the three-dimensional defect detection of the transparent sample.
The technical scheme adopted by the invention is that the three-dimensional detection method for the defects of the transparent sample adopts a measurement mode combination of incoherent and coherent light sources, realizes the positioning and three-dimensional detection of the defects of the transparent sample, and comprises the following specific steps:
Step 1, starting a microscopic scanning imaging system based on incoherent illumination, placing a transparent sample under an incoherent light source, and scanning and imaging the sample by controlling a motion control system to obtain a two-dimensional RGB image of the sample.
And 2, in the process of the step1, simultaneously carrying out calculation processing on the obtained two-dimensional image, wherein the specific method comprises the following steps of:
Firstly, performing image preprocessing, converting an RGB image into a gray image, performing edge contour detection on the gray image, obtaining sample contour information, extracting an ROI (region of interest) of a sample to be detected, then performing defect detection, performing Canny edge detection and expansion on the ROI of the sample, primarily grouping and screening the detected suspected defect information based on the concentration degree of the distance and the area, and finally performing defect marking, marking the screened group defect, and obtaining a mask image corresponding to the defect position, wherein 0 represents no defect, and 1 represents defective pixels.
And 3, positioning physical coordinates of the defect in the sample according to the generated binary defect mask image and the position information fed back by the motion control system grating ruler through microscopic image processing in the step 2.
And 4, starting a holographic interference imaging system based on coherent light illumination, and placing the sample defect under a coherent light source according to the defect physical coordinates and the binary defect mask image provided in the step 3, and performing holographic interference measurement to obtain a digital holographic image of the sample defect.
And 5, reconstructing the hologram obtained in the step 4 according to a digital holographic reconstruction algorithm, obtaining phase information of the defect by using a phase unwrapping algorithm, and converting three-dimensional depth data of the defect. The specific method comprises the following steps:
First a reference hologram of an empty sample is acquired for dark field, flat field correction of the hologram. Then collecting hologram of defect area, reconstructing phase information by using formula (1)
In the formula,H 1 (x, y) is the acquired defect holographic image, H 0 (x, y) is the reference holographic image; representing a fourier transform; represents inverse fourier transform, L represents a filter window function, and angle (·) represents a reconstruction information extraction phase.
For the depth distribution of the sample, the depth distribution is proportional to the measured phase information. However, in general, for interferometry, the measured phase values are distributed within [ -pi, pi ], and when the depth difference is greater than half the measured wavelength, an uncertainty in the wrapped phase is created. Thus, this can be solved by using a phase unwrapping method. As shown in formula (2):
In the formula, Representing the phase information reconstructed from the defect area obtained finally unwrap {.
Calculating the depth of the defect after transmission measurement from the unwrapped phase requires converting the unwrapped phase information into depth data according to equation (3):
where h (x, y) is depth data of the defect and λ is wavelength of the laser light source.
And 6, classifying and counting the defects of the sample according to the incoherent light microscopic imaging and digital holographic interference detection results in the steps 2 and 5, and displaying the specific information of the defects in a thermodynamic diagram form.
Thus, the three-dimensional detection method for the defects of the transparent sample is realized.
Compared with the prior art, the invention has the advantages that:
(1) The invention can realize two-dimensional data acquisition and three-dimensional data acquisition of the defects of the element surface and the internal structure simultaneously;
(2) The invention realizes multi-dimensional defect data acquisition, measurement and analysis based on the cooperative work of incoherent microscopic imaging and digital holographic coherent detection, partitions defects by means of a two-dimensional data graph of an incoherent microscopic illumination system and generates a defect mask graph, can accurately locate the center coordinates and area values of the defects, further carries out single exposure acquisition of the digital hologram on the defect parts of the sample, acquires a proper image sampling number according to the size of the area values so as to cover the whole range of the defects, reduces scanning work during three-dimensional measurement and improves the detection efficiency of the system;
(3) The invention can realize accurate identification and accurate positioning of the defects on the surface and the inside of the element by phase restoration, unwrapping and depth information conversion algorithm based on the sample defect digital hologram.
Drawings
FIG. 1 is a flow chart of a detection method proposed by the present invention;
FIG. 2 is a flow chart of an algorithm for performing defect partition screening and localization on a two-dimensional image obtained by incoherent light microscopy imaging;
FIG. 3 is a flow chart of a holographic detection and reconstruction algorithm under a coherent light illumination system;
The present invention will now be described in detail with reference to the drawings and specific examples, which are provided for further description of the invention and are not meant to limit the scope of the invention in any way.
The invention provides a three-dimensional detection method for defects of a transparent sample, and the implementation flow of the method is shown in figure 1. The method specifically comprises the following steps:
in a first step, a defect detection device for transparent samples is initialized, including but not limited to an integral frame, an incoherent light detection system, a coherent light detection system, and a motion control system. The detection system and the motion system are assembled on the rack, and the motion system controls the movement in the horizontal direction and the vertical direction perpendicular to the detection system. When the detection device is initialized, a detection system is started and is in a standby state, a motion system is started and is zeroed, and a detection sample is fixed by the motion system and is controlled to move;
Secondly, performing defect image acquisition by using a white light source, realizing two-dimensional image acquisition of each position on the surface of the sample by controlling the movement of the sample, performing gray preprocessing on the acquired image, performing edge contour detection, extracting a sample ROI (region of interest) to be detected, performing Canny edge detection and expansion on the sample ROI to group and screen defective positions, performing defect marking, marking the screened group of defects, and obtaining a binary mask diagram corresponding to the defective positions, wherein 0 represents no defect, and 1 represents defective pixels;
Thirdly, calculating the real geometric position of the defect in the element according to the generated binary defect mask graph and the known position fed back by the grating ruler of the equipment motion control system, and feeding back the position information of the defect, including a central coordinate value and an area range value of the defect, to the motion control system;
And fourthly, moving the sample again by the motion control system according to the defect area value and the central coordinate value of the block defect, acquiring a proper image sampling number according to the size of the area value so as to cover the whole range of the defect, quickly aligning the center of the block defect with a laser source, and acquiring hologram data of the defect position.
And fifthly, carrying out three-dimensional reconstruction and splicing on the holograms at the defects by utilizing a holographic reconstruction algorithm to obtain defect depth data, thereby obtaining a three-dimensional detection result of the defects of the transparent sample. And counting and classifying according to the detection result, and displaying the defect in a thermodynamic diagram form.
The above embodiments are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereto, and any modification made on the basis of the technical scheme according to the technical idea of the present invention falls within the protection scope of the present invention.
Claims (1)
1. A three-dimensional detection method for defects of a transparent sample comprises the following steps:
Recording a two-dimensional RGB image of a transparent sample, placing the transparent sample under an incoherent light source by a microscopic scanning imaging system based on incoherent illumination, and scanning and imaging the sample by controlling a motion control system;
The second step is to calculate the obtained two-dimensional image, and judge whether the image has defect information by using a digital image correlation algorithm and mark the defect information, and the specific steps are as follows:
1) Performing image preprocessing to convert the RGB image into a gray image;
2) Edge contour detection, namely acquiring sample contour information through a gray level image, and extracting an ROI (region of interest) of a sample to be detected;
3) Performing defect detection, namely performing Canny edge detection and expansion on a sample ROI region, and performing concentration grouping and screening on the detected suspected defect information based on distance and area;
4) A defect mark, namely marking the screened group defects, and obtaining a mask diagram corresponding to the positions of the defects, wherein 0 represents no defect, and 1 represents defective pixels;
Step three, obtaining defect position information and feeding back the defect position information to a motion control system, calculating the defect position information comprising a central coordinate value and an area range value of the defect by utilizing a defect mask image and a motion control system grating ruler, obtaining a proper image sampling number according to the size of the area value so as to cover the whole range of the defect, and feeding back the central coordinate value of the blocked defect to the motion control system;
recording a defective hologram, and placing the sample defect under a coherent light source for holographic interferometry based on a holographic interference imaging system of coherent light illumination;
and fifthly, carrying out three-dimensional reconstruction on the defective hologram, acquiring phase information of the defect by utilizing a phase unwrapping algorithm according to a digital holographic reconstruction algorithm, and converting three-dimensional depth data of the defect, wherein the method comprises the following specific steps of:
1) Collecting a reference hologram of an empty sample, and using the reference hologram as dark field and flat field correction of the hologram;
2) Collecting holograms of defective areas;
3) Reconstructing phase information by using a formula (1);
In the formula, H 1 (x, y) is the acquired defect holographic image, H 0 (x, y) is the reference holographic image; representing a fourier transform; An inverse Fourier transform is represented, L is represented as a filter window function, angle (·) represents the reconstruction information extraction phase;
1) Unfolding of phase information is performed using equation (2)
In the formula,Unwrap {. Cndot } represents the unwrapping of the phase;
2) From the unwrapped phase information using equation (3) Calculating depth of defect
Wherein h (x, y) is depth data of a defect part, and lambda is the wavelength of a laser light source;
Classifying, counting and displaying defects, classifying and identifying the defects by using a digital image related algorithm on a two-dimensional data graph of the defects and corresponding depth data, and finally displaying specific information of the defects by using a three-dimensional depth thermodynamic diagram;
thus, the three-dimensional detection method for the defects of the transparent sample is realized.
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| CN111896557A (en) * | 2020-09-07 | 2020-11-06 | 中国工程物理研究院机械制造工艺研究所 | A three-dimensional measurement device and method for dark-field microscopic defects with structured light modulation |
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