CN111747376B - Fabrication method of microfluidic actuator module - Google Patents

Abstract

A method of manufacturing a microfluidic actuator module, comprising the steps of: 1. providing a first substrate for deposition and etching of a first protection layer; 2. rolling and developing the first photoresist layer; 3. providing an auxiliary substrate rolling and etching film adhesive layer and a valve layer; 4. the valve layer is turned over to be aligned and is jointed on the first photoresist layer; 5. providing a second substrate; 6. rolling and developing the second photoresist layer on the second substrate; 7. the second photoresist layer is coated with crystal and bonded to the valve layer by hot pressing; 8. screen printing a conductive adhesive layer on the second substrate; 9. the conductive adhesive layer is stuck with a piezoelectric layer; and 10. A piezoelectric layer and a second substrate bonding electrode layer.

Description

Fabrication method of microfluidic actuator module

technical field

This case relates to a method of manufacturing a microfluidic actuator module, especially a method of manufacturing a microfluidic actuator module using micro-electromechanical surface and body processing.

Background technique

At present, in various fields, whether it is medicine, computer technology, printing, energy and other industries, products are developing towards refinement and miniaturization. Among them, the fluid contained in products such as micro pumps, sprayers, inkjet heads, and industrial printing devices The actuator is its key technology.

With the rapid development of science and technology, the application of fluid conveying structure is becoming more and more diversified, such as industrial application, biomedical application, medical care, electronic heat dissipation, etc., and even the recent popular wearable devices can be seen. It can be seen that traditional fluid actuators are gradually trending toward device miniaturization and flow maximization.

Various microfluidic actuators produced by microelectromechanical processes have been developed in the prior art. However, improving the efficiency of fluid transmission through innovative structures is still an important content of development.

Contents of the invention

The main purpose of this case is to provide a manufacturing method for a microfluidic actuator module, which is manufactured using micro-electromechanical surface and body processing, supplemented by precision packaging technology.

A broad implementation of this case is a method of manufacturing a microfluidic actuator module, comprising the following steps: 1. Provide a first substrate to deposit and etch a first protective layer; 2. Roll the first protective layer and Developing a first photoresist layer; 3. providing an auxiliary substrate for rolling and etching a thin film adhesive layer and a valve layer; 4. turning the valve layer over and bonding on the first photoresist layer; 5. providing a 6. The second substrate is rolled and developed a second photoresist layer; 7. The second photoresist layer is flip-chip and thermocompression bonded to the valve layer; 8. The second substrate is screen-printed with a conductive an adhesive layer; 9. the conductive adhesive layer is pasted with a piezoelectric layer; and 10. the piezoelectric layer and the second substrate are welded with an electrode layer. The first substrate has a first surface and a second surface, and is firstly formed on the first surface of the first substrate through a nitride material deposition process to form a first protective layer, and then through an etching process to form a plurality of outlet openings, Multiple fluid outlets and multiple spouts. The outlet openings communicate with the spouts through fluid outlets, respectively. The first photoresist layer is formed on the first protection layer through a photoresist rolling process, and then a communication flow channel, a plurality of inlet flow channels, a plurality of valve seats and a plurality of cavity openings are formed through a development process. Formed on the auxiliary substrate by a thin film material rolling process to form a thin film adhesive layer, then formed on the thin film adhesive layer by a polymer material rolling process to form a valve layer, and finally formed a plurality of outlet valves and a plurality of inlets by an etching process valve and a first channel opening. The valve layer is bonded to the first photoresist layer by reverse alignment and bonding processes, and then the auxiliary substrate is removed by soaking. The first channel opening of the valve layer communicates with the communicating channel of the first photoresist layer. A plurality of vibration openings are formed through an etching process, and a plurality of vibration regions are defined. The vibrating areas correspond to the positions of the vibrating openings, respectively. The second photoresist layer is formed on the second substrate through a photoresist material rolling process, and then a plurality of cavity holes and a second channel opening are formed through a development process. The second photoresist layer is bonded to the valve layer through flip-chip and hot pressing processes. The cavity holes of the second photoresist layer communicate with the vibration openings of the second substrate and the cavity openings of the first photoresist layer respectively, so as to form a plurality of vibration chambers. The second channel opening of the second photoresist layer communicates with the communication channel of the first photoresist layer through the first channel opening of the valve layer. The conductive adhesive layer is formed on the second substrate through a screen printing process of conductive adhesive material. The piezoelectric layer is formed on the conductive adhesive layer through a piezoelectric material bonding process, and then a plurality of actuation regions are defined through a cutting process. The electrode layer is formed on the piezoelectric layer and the second substrate through an electrode material welding process. The electrode layer has a plurality of upper electrode regions and a plurality of lower electrode regions.

Description of drawings

FIG. 1 is a partial cross-sectional schematic diagram of the microfluidic actuator module of the present case.

Fig. 2 is a schematic flow chart of the manufacturing method of the microfluidic actuator module of the present invention.

3A to 3T are exploded schematic diagrams of the manufacturing steps of the microfluidic actuator of the microfluidic actuator module of the present invention.

FIG. 4 is a schematic top view of the microfluidic actuator module of the present invention.

FIG. 5 is another schematic top view of the microfluidic actuator module of the present invention.

FIG. 6A and FIG. 6B are schematic diagrams of the action of the microfluidic actuator of the microfluidic actuator module of the present invention.

7A to 7E are top cross-sectional schematic diagrams of different types of valves of the microfluidic actuator of the present invention.

FIG. 8 is a schematic diagram of the driving circuit of the microfluidic actuator module of the present invention.

Explanation of reference signs

100: Microfluidic Actuator Module

10: Microfluidic actuators

1a: first substrate

11a: first surface

12a: Second surface

13a: IC circuit

14a: Fluid outlet

15a: Spout

1b: First protective layer

11b: Exit opening

1c: The first photoresist layer

11c: Connected flow channel

12c: Inlet runner

121c: Fence Construction

13c: valve seat

131c: columnar structure

14c: cavity opening

1d: Auxiliary substrate

1e: film adhesive layer

1f: valve layer

11f: Outlet valve

12f: Inlet valve

121f: groove

13f: First runner opening

1g: Second substrate

11g: Vibration opening

12g: Vibration zone

13g: Diameter area

131g: through hole

1h: Second photoresist layer

11h: cavity hole

12h: Second runner opening

1i: Conductive adhesive layer

1j: piezoelectric layer

1k: electrode layer

11k: lower electrode area

12k: Upper electrode area

13k: Second protective layer

131k: leads

A, B, C, D: endpoint (control signal terminal)

B1: first junction

B2: Second junction

E: vibration chamber

CT1, CT2: cutting direction

G: endpoint (ground terminal)

L: logic generator

M: actuation zone

P: positioning mark

PD: contact pad

PL: endpoint (left power supply terminal)

PR: endpoint (right power terminal)

T: cutting mark

X-X, Y-Y: hatching

S1-S10: Steps of the manufacturing method of the microfluidic actuator module

Detailed ways

Embodiments embodying the features and advantages of this case will be described in detail in the description of the latter paragraph. It should be understood that the present case can have various changes in different aspects without departing from the scope of the present case, and the descriptions and diagrams therein are used for illustration in nature rather than limiting the present case.

The microfluidic actuator in this case is used to transport fluid, please refer to FIG. 1 and FIG. 4. In the embodiment of this case, the microfluidic actuator module 100 includes a plurality of microfluidic actuators 10, and consists of a first substrate 1a, A first protective layer 1b, a first photoresist layer 1c, an auxiliary substrate 1d (as shown in Figure 2H to Figure 2J), a film adhesive layer 1e (as shown in Figure 2H to Figure 2J), a valve layer 1f , a second substrate 1g, a second photoresist layer 1h, a conductive adhesive layer 1i, a piezoelectric layer 1j, and an electrode layer 1k, the manufacturing method is described in the following steps, and its manufacturing process will be actuated by a single microfluidic Device 10 is used as an illustration.

Referring to FIG. 2 to FIG. 3E , as shown in step S1 , a first substrate is provided to deposit and etch a first protection layer. In this embodiment, the first substrate 1a has a first surface 11a and a second surface 12a opposite to the first surface 11a, which is firstly formed on the first surface 11a of the first substrate 1a through a nitride material deposition process. above to form the first protective layer 1b, and then form an outlet opening 11b of the first protective layer 1b and a fluid outlet 14a of the first substrate 1a through an etching process, and then make the first substrate 1a thinner through a grinding process, and finally A nozzle 15a of the first substrate 1a is formed by an etching process. Wherein, the outlet opening 11b of the first protective layer 1b communicates with the nozzle 15a through the fluid outlet 14a of the first substrate 1a. In this embodiment, the first substrate 1a is a silicon substrate, but not limited thereto. In this embodiment, the nitride material is a silicon nitride material, but not limited thereto. In this embodiment, the fluid outlet 14a is formed on the first substrate 1a through a deep etching process, but it is not limited thereto. In this embodiment, the nozzle 15a is formed on the first substrate 1a through a dry etching process, but it is not limited thereto. In this embodiment, the deposition process of the first protection layer 1b is a chemical vapor deposition process (CVD), but not limited thereto. In this embodiment, the etching process of the first protection layer 1b may be a wet etching process, a dry etching process or a combination of both, but not limited thereto. In this embodiment, the first substrate 1a includes an IC circuit 13a disposed on the first substrate 1a.

Please refer to FIG. 2 , FIG. 3F , FIG. 3G and FIG. 4 , as shown in step S2 , the first protective layer is rolled and a first photoresist layer is developed. In the embodiment of this case, the first photoresist layer 1c is first formed on the first protective layer 1b by a photoresist rolling process, and then a communication flow channel 11c and an inlet flow channel are formed by a developing process. 12c, a valve seat 13c and a cavity opening 14c. In this embodiment, the cavity opening 14c communicates with the communication channel 11c through the inlet channel 12c. In this embodiment, the photoresist material is a thick film photoresist, but not limited thereto. In the embodiment of this case, a plurality of grille structures 121c (as shown in FIG. 4 ) are provided in the inlet channel 12c to filter impurities in the fluid. In addition, the setting of the grille structures 121c can also form damping The effect is to reduce the return flow of fluid. In other embodiments of the present application, the barrier structure 121c of the inlet flow channel 12c may also be omitted, and is not limited thereto.

Referring to FIG. 2 , FIG. 3H and FIG. 3I , as shown in step S3 , an auxiliary substrate is provided for rolling etching a thin film adhesive layer and a valve layer. In the embodiment of this case, the thin film adhesive layer 1e is first formed on the auxiliary substrate 1d through a thin film material rolling process, and then formed on the thin film adhesive layer 1e through a polymer material rolling process to form the valve layer 1f , and finally form an outlet valve 11f, an inlet valve 12f and a first channel opening 13f of the valve layer 1f through an etching process. In this embodiment, the polymer material is a polyimide (PI) material, but not limited thereto. In this embodiment, the valve layer 1f forms the outlet valve 11f, the inlet valve 12f and the first channel opening 13f through a dry etching process or a laser etching process, but not limited thereto.

Referring to FIG. 2 , FIG. 3J and FIG. 3K , as shown in step S4 , the valve layer is reversed, aligned and bonded to the first photoresist layer. In this embodiment, the valve layer 1f is first bonded to the first photoresist layer 1c through an inversion alignment process and a wafer level bonding (Wafer Level Bonding) process, and then the auxiliary substrate 1d is removed by soaking. Thereby, the first channel opening 13f of the valve layer 1f communicates with the communication channel 11c of the first photoresist layer 1c. In the embodiment of the present case, the soaking process is to soak the thin film adhesive layer 1e with chemicals to make the thin film adhesive layer 1e lose its viscosity, thereby removing the auxiliary substrate 1d. In the embodiment of this case, at the first junction B1 between each inlet valve 12f of the valve layer 1f and the valve seat 13c corresponding to the first photoresist layer 1c, a The surface treatment process prevents the joint effect between the inlet valve 12f and the valve seat 13c, so as to facilitate the actuation of the inlet valve 12f.

Referring to FIG. 2 , FIG. 3L , FIG. 3M and FIG. 5 , as shown in step S5 , a second substrate is provided. In this embodiment, a vibration opening 11g and a cutting mark T are formed on the second substrate 1g through an etching process. In this embodiment, the vibration opening 11g and the cutting mark T are formed on opposite sides of the second substrate 1g. In this embodiment, the arrangement of the vibration opening 11g defines a vibration area 12g, and the vibration area 12g corresponds to the position of the vibration opening 11g. In this embodiment, the second substrate 1g is a stainless steel material, but not limited thereto. In this embodiment, the etching process of the second substrate 1g is a half etching process, but it is not limited thereto.

Referring to FIG. 2 , FIG. 3N and FIG. 3O , as shown in step S6 , the second substrate is rolled and developed with a second photoresist layer. In this embodiment, the second photoresist layer 1h is first formed on the second substrate 1g by a photoresist rolling process, and then a cavity hole 11h and a second channel opening 12h are formed by a developing process.

Referring to FIG. 2 and FIG. 3P , as shown in step S7 , the second photoresist layer is flip-chip bonded to the valve layer by thermocompression. In this embodiment, the second photoresist layer 1h is bonded to the valve layer 1f through a Flip-Chip process and a hot pressing process. Thereby, the cavity hole 11h of the second photoresist layer 1h communicates with the vibration opening 11g of the second substrate 1g and the cavity opening 14c of the first photoresist layer 1c. In this way, the cavity hole 11h, the vibration opening 11g and the cavity opening 14c form a vibration chamber E together. In addition, the second channel opening 12h of the second photoresist layer 1h communicates with the communication channel 11c of the first photoresist layer 1c through the first channel opening 13f of the valve layer 1f. It should be noted that in this embodiment, each outlet valve 11f of the valve layer 1f and the second junction B2 of the second photoresist layer 1h are not bonded during thermocompression bonding, that is, the outlet valve 11f and the second photoresist layer 1h are not bonded. There is no bonding effect between the second photoresist layers 1h, so as to facilitate the operation of the outlet valve 11f.

Referring to FIG. 2 and FIG. 3Q , as shown in step S8 , a conductive adhesive layer is screen-printed on the second substrate. In this embodiment, the conductive adhesive layer 1i is formed on the second substrate 1g through a screen printing process of conductive adhesive material. In the embodiment of this case, the conductive adhesive material is an anisotropic conductive paste (ACP), but it is not limited thereto.

Referring to FIG. 2 , FIG. 3R and FIG. 3S , as shown in step S9 , a piezoelectric layer is pasted on the conductive adhesive layer. In this embodiment, the piezoelectric layer 1j is first formed on the conductive adhesive layer 1i through a piezoelectric material bonding process, and then an activation region M is defined through a cutting process. In this embodiment, the opening width of the vibration opening 11g of the second substrate 1g is larger than the width of the actuation region M of the piezoelectric layer 1j.

Referring to FIG. 2 and FIG. 3T , as shown in step S10 , an electrode layer is welded to the piezoelectric layer and the second substrate. In this embodiment, the electrode layer 1k is formed on the piezoelectric layer 1j and the second substrate 1g through an electrode material welding process. The electrode layer 1k has a lower electrode region 11k and an upper electrode region 12k, and includes a second protection layer 13k. The lower electrode region 11k and the upper electrode region 12k are exposed outside the second protection layer 13k, and are electrically connected to the piezoelectric layer 1j and the second substrate 1g respectively. The lower electrode regions 11k are respectively formed on the actuation regions M of the piezoelectric layer 1j. In the embodiment of this case, the electrode material is a flexible circuit board, and a polyimide (PI) is used as a base material, but it is not limited thereto. In this embodiment, the second protection layer 13k includes a plurality of leads 131k, which are electrically connected to the IC circuit 13a of the first substrate 1a. In this embodiment, each lead 131k is a gold-plated copper foil material, but it is not limited thereto.

Please refer to FIG. 5 , in the embodiment of this case, FIG. 3A to FIG. 3T are taken from X-X section. In this embodiment, the second substrate 1g also has a plurality of positioning marks P, whereby the conductive adhesive layer 1i is screen printed according to the range of the positioning marks P, and then the piezoelectric layer 1j is pasted. According to the cutting mark T of the second substrate 1g, a cutting process or a laser cutting process is performed along the cutting directions CT1 and CT2, so as to define the actuation region M of the piezoelectric layer 1j. It is worth noting that in the embodiment of this case, two piezoelectric layers 1j are used for the bonding process, so that the total amount of waste materials is reduced, thereby reducing costs. In other embodiments, a whole piece of piezoelectric layer 1j can also be bonded. Then process.

Referring to FIG. 5 again, the second substrate 1g also has at least one diameter area 13g, and the at least one diameter area includes a through hole 131g communicating with the communication channel 11c of the first photoresist layer 1c. The tube diameter area 13g is set away from the actuation area M of the piezoelectric layer 1j, so as to prevent the piezoelectric layer 1j from getting wet. In this embodiment, the through hole 131g is formed by performing a half-etching process from both sides of the second substrate 1g, but it is not limited thereto. In this embodiment, the second substrate 1g has two diameter regions 13g, and in other embodiments, the number of diameter regions 13g can be changed according to design requirements. In this embodiment, the through hole 131g is in an elliptical shape, but it is not limited thereto, and the shape of the through hole 131g can be changed according to design requirements.

Please refer to FIG. 1, FIG. 6A and FIG. 6B. In the embodiment of this case, the specific operation mode of the microfluidic actuator module 100 is to provide driving power with different phase charges to the lower electrode area 11k and the upper electrode area 12k, The vibrating region 12g for driving and controlling the second substrate 1g generates a reciprocating displacement. As shown in FIG. 1 and FIG. 6A, when a positive voltage is applied to the upper electrode region 12k and a negative voltage is applied to the lower electrode region 11k, the actuation region M of the piezoelectric layer 1j drives the vibration region 12g of the second substrate 1g to move away from the first electrode region. The direction of the substrate 1a is displaced. In this way, the external fluid is sucked through the communication channel 11c, passes through the inlet channel 12c, pushes the inlet valve 12f open, and collects in the vibration chamber E. It should be noted that at this time, the outlet valve 11f is pushed by the fluid to abut against the second photoresist layer 1h, so that the fluid cannot flow in from the outlet valve 11f. As shown in Figure 1 and Figure 6B, then switch the electrical properties of the lower electrode region 11k and the upper electrode region 12k, apply a negative voltage to the upper electrode region 12k and a positive voltage to the lower electrode region 11k, so that the actuation region of the piezoelectric layer 1j M drives the vibration region 12g of the second substrate 1g to displace in a direction close to the first substrate 1a. Thereby, the fluid collected in the vibrating chamber E is squeezed, and the outlet valve 11f is pushed open, passes through the fluid outlet 14a of the first substrate 1a, and is discharged from the nozzle 15a to complete the fluid transmission. It should be noted that at this moment, the inlet valve 12f is pushed by the fluid to abut against the valve seat 13c of the first photoresist layer 1c, so that the fluid cannot be discharged from the inlet valve 12f.

Please refer to FIG. 7A to FIG. 7E , in this embodiment, the valve and the valve seat of the microfluidic actuator module 100 may have different implementations, and the inlet valve 12f is taken as an example for description below. As shown in FIG. 7A , in the embodiment of the present case, the inlet valve 12f is supported by the valve seat 13c, which facilitates returning to the original position after actuation. As shown in FIG. 7B , in this embodiment, the inlet valve 12f is designed with an S-shaped bracket, which facilitates the stretching during actuation and the return to the original position after actuation. As shown in Figure 7C, in the embodiment of this case, the valve seat 13c can be added to the columnar structure 131c to ensure that the inlet valve 12f is not easily deformed under long-term operation. The flow rate when the fluid passes through the inlet valve 12f. Fig. 7D is an extended design of Fig. 7C, and Fig. 7E is a schematic diagram of the Y-Y section in Fig. 7D. In the embodiment of this case, a plurality of grooves 121f are alternately etched on the front and back of the inlet valve 12f, so that the inlet valve 12f works A spring effect is generated during actuation, so as to greatly increase the stretching amount of actuation, and at the same time, it also has the effect of making the inlet valve 12f smooth. It should be noted that the implementation of the valve is not limited to the above, and can be changed according to different design requirements.

Please refer to FIG. 1 and FIG. 8. In this embodiment, the microfluidic actuator module 100 further includes a logic generator L and a plurality of contact pads PD, electrically connected to the IC circuit 13a of the first substrate 1a, for The action of the microfluidic actuator module 100 is controlled. The electrode layer 1k includes a plurality of terminals PL, PR, G, A, B, C, D for receiving externally input control signals. Among them, the terminals PL and PR respectively represent the left and right power terminals, which can be directly energized to the second substrate 1g to form the power supply for the lower electrodes; the terminal G represents the ground terminal; and the terminals A, B, C, and D represent the control signal terminals. The contact pad PD is electrically connected to the logic generator L through the IC circuit 13a of the first substrate 1a. For example, in this embodiment, the microfluidic actuator module 100 includes 8 microfluidic actuators 10, when a control signal (A=1, B=1, C=1) is input from the outside, the logic After decoding, the generator L outputs a signal to the contact pad PD1, thereby driving the microfluidic actuator 10 numbered 1, and when a control signal (A=1, B=1, C=0) is input from the outside, the logic After decoding, the generator L outputs a signal to the contact pad PD2, thereby driving the microfluidic actuator 10 numbered 2, and the microfluidic actuators 10 numbered 3-8 are driven by analogy. It should be noted that the number of microfluidic actuators 10 is not limited to eight in this embodiment, and can be changed according to design requirements.

This case provides a manufacturing method of a microfluidic actuator module, which is mainly manufactured by micro-electromechanical surface and body processing, supplemented by precision packaging technology, and can be achieved by controlling the drive of the microfluidic actuator. The flow of demand has great industrial utilization value, and the application is filed according to law.

This case can be modified in various ways by the people who are familiar with this technology, Ren Shijiang, but all of them do not break away from the intended protection of the scope of the attached patent application.

Claims (20)

1. A method for manufacturing a microfluidic actuator module, comprising the following steps: 1) Provide a first substrate to deposit and etch a first protective layer. The first substrate has a first surface and a second surface, which is first formed on the first substrate by a nitride material deposition process. Form the first protective layer on the surface, and then form a plurality of outlet openings, a plurality of fluid outlets and a plurality of nozzles through an etching process, and the plurality of outlet openings are respectively connected to the plurality of nozzles through the plurality of fluid outlets; 2) The first protective layer is rolled and developed. A first photoresist layer is firstly formed on the first protective layer by a photoresist material rolling process to form the first photoresist layer, and then formed by a developing process. a communication flow channel, a plurality of inlet flow channels, a plurality of valve seats and a plurality of cavity openings; 3) Provide an auxiliary substrate for rolling and etching a film adhesive layer and a valve layer, which are first formed on the auxiliary substrate by a film material rolling process to form the film adhesive layer, and then pass a polymer material rolling process Formed on the thin film adhesive layer to form the valve layer, and finally form a plurality of outlet valves, a plurality of inlet valves and a first channel opening through an etching process; 4) The valve layer is flipped and aligned and bonded to the first photoresist layer. First, the valve layer is bonded to the first photoresist layer through flipping alignment and wafer-level bonding processes, and then the valve layer is removed by soaking. an auxiliary substrate, the opening of the first channel of the valve layer communicates with the communication channel of the first photoresist layer; 5) providing a second substrate, forming a plurality of vibration openings through an etching process, and defining a plurality of vibration regions, the plurality of vibration regions corresponding to the positions of the plurality of vibration openings; 6) Rolling and developing a second photoresist layer on the second substrate is first formed on the second substrate through a photoresist material rolling process to form the second photoresist layer, and then a plurality of photoresist layers are formed through a developing process. cavity hole and a second channel opening; 7) The second photoresist layer is flip-chip and thermocompression bonded to the valve layer. The second photoresist layer is bonded to the valve layer through a flip-chip and thermocompression process. The plurality of second photoresist layers The cavity holes communicate with the plurality of vibration openings of the second substrate and the plurality of cavity openings of the first photoresist layer to form a plurality of vibration chambers, and the second of the second photoresist layer The channel opening communicates with the communication channel of the first photoresist layer through the first channel opening of the valve layer; 8) A conductive adhesive layer is screen printed on the second substrate, which is formed on the second substrate through a conductive adhesive material screen printing process to form the conductive adhesive layer; 9) The conductive adhesive layer is pasted with a piezoelectric layer, which is formed on the conductive adhesive layer through a piezoelectric material bonding process to form the piezoelectric layer, and then a plurality of actuation areas are defined through a cutting process; and 10) The piezoelectric layer and the second substrate are welded with an electrode layer, which is formed on the piezoelectric layer and the second substrate through an electrode material welding process to form the electrode layer, and the electrode layer has a plurality of upper electrodes area and a plurality of lower electrode areas. 2 . The manufacturing method of the microfluidic actuator module according to claim 1 , wherein the first substrate comprises an IC circuit disposed on the first substrate and electrically connected to the electrode layer. 3 . 3. The manufacturing method of the microfluidic actuator module as claimed in claim 2, further comprising a logic generator electrically connected to the IC circuit for controlling the action of the microfluidic actuator module. 4 . The manufacturing method of the microfluidic actuator module according to claim 1 , wherein a plurality of columnar structures are arranged in the plurality of inlet channels. 5. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the plurality of nozzles are formed by dry etching process. 6 . The manufacturing method of the microfluidic actuator module as claimed in claim 1 , wherein the plurality of fluid outlets are formed by deep etching process. 7 . 7. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the plurality of outlet valves, the plurality of inlet valves and the first flow channel opening are produced by dry etching or laser etching process . 8 . The manufacturing method of the microfluidic actuator module as claimed in claim 1 , wherein the opening width of each vibration opening is larger than the corresponding actuating region width of the piezoelectric layer. 9. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the first substrate is a silicon substrate. 10. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the nitride material is a silicon nitride material. 11. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the photoresist material is a thick film photoresist. 12. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the polymer material is a polyimide material. 13. The manufacturing method of the microfluidic actuator module according to claim 1, wherein the electrode material is a flexible circuit board. 14. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the second substrate is a stainless steel material. 15. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the conductive adhesive is an anisotropic conductive adhesive. 16. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein the electrode layer comprises a plurality of leads. 17. The manufacturing method of the microfluidic actuator module as claimed in claim 16, wherein the plurality of lead wires are a gold-plated copper foil material. 18. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein a positive voltage is applied to the plurality of upper electrode regions and a negative voltage is applied to the plurality of lower electrode regions, so that the piezoelectric layer The plurality of actuating regions drives the plurality of vibrating regions of the second substrate to displace in a direction away from the first substrate. 19. The manufacturing method of the microfluidic actuator module as claimed in claim 1, wherein a negative voltage is applied to the plurality of upper electrode regions and a positive voltage is applied to the plurality of lower electrode regions, so that the piezoelectric layer The plurality of actuating regions drives the plurality of vibrating regions of the second substrate to displace in a direction close to the first substrate. 20. The manufacture method of microfluidic actuator module as claimed in claim 1, is characterized in that: applying a positive voltage to the upper electrode regions and a negative voltage to the lower electrode regions, so that the actuation regions of the piezoelectric layer drive the vibration regions of the second substrate away from the first substrate directional displacement, whereby the external fluid is sucked through the communication channel, passes through the plurality of inlet channels, pushes the plurality of inlet valves, and gathers in the plurality of vibration chambers; and converting the electrical properties of the plurality of upper electrode regions and the plurality of lower electrode regions, applying negative voltage to the plurality of upper electrode regions and positive voltage to the plurality of lower electrode regions, so that the plurality of vibration regions of the second substrate The displacement toward the direction close to the first substrate causes the fluid collected in the vibrating chamber to be pushed open by the plurality of outlet valves, pass through the plurality of fluid outlets, and finally be discharged from the plurality of nozzles to complete the transmission of fluid.

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