CN111747376A

CN111747376A - Fabrication method of microfluidic actuator module

Info

Publication number: CN111747376A
Application number: CN201910247977.6A
Authority: CN
Inventors: 莫皓然; 余荣侯; 张正明; 戴贤忠; 廖文雄; 黄启峰; 韩永隆; 陈宣恺
Original assignee: Microjet Technology Co Ltd
Current assignee: Microjet Technology Co Ltd
Priority date: 2019-03-29
Filing date: 2019-03-29
Publication date: 2020-10-09
Anticipated expiration: 2039-03-29
Also published as: CN111747376B

Abstract

A method for manufacturing a microfluidic actuator module comprises the following steps: 1. providing a first substrate to deposit and etch a first protective layer; 2. rolling and developing the first photoresist layer on the first protective layer; 3. providing an auxiliary substrate to roll and etch a thin film adhesive layer and a valve layer; 4. flipping and aligning the valve layer and bonding it to the first photoresist layer; 5. providing a second substrate; 6. rolling and developing the second photoresist layer on the second substrate; 7. over-chipping the second photoresist layer and hot-pressing bonding it to the valve layer; 8. screen-printing a conductive adhesive layer on the second substrate; 9. gluing the conductive adhesive layer to a piezoelectric layer; and 10. welding the piezoelectric layer and the second substrate to an electrode layer.

Description

Method for manufacturing micro-fluid actuator module

Technical Field

The present disclosure relates to a method for manufacturing a micro-fluid actuator module, and more particularly, to a method for manufacturing a micro-fluid actuator module using micro-electromechanical surface and body type processing.

Background

At present, in various fields, no matter in medicine, computer technology, printing, energy and other industries, products are developed toward refinement and miniaturization, wherein fluid actuators included in products such as micropumps, sprayers, ink jet heads, industrial printing devices and the like are key technologies.

With the development of technology, the applications of fluid conveying structures are becoming more diversified, such as industrial applications, biomedical applications, medical care, electronic heat dissipation … …, and even the image of a hot wearable device is seen recently, which shows that the conventional fluid actuators have gradually tended to be miniaturized and maximized in flow rate.

Many micro-electromechanical process micro-fluid actuators have been developed in the prior art, however, the improvement of fluid transfer by innovative structures is still an important development.

Disclosure of Invention

The main objective of the present invention is to provide a method for manufacturing a micro-fluid actuator module, which is manufactured by using micro-electromechanical surface and body type processing processes and integrated with precision packaging technology.

One broad aspect of the present disclosure is a method of fabricating a microfluidic actuator module, comprising: 1. providing a first substrate for depositing and etching a first protective layer; 2. rolling and developing a first photoresist layer on the first protective layer; 3. providing an auxiliary substrate for rolling and etching a film adhesive layer and a valve layer; 4. the valve layer is turned over and aligned and jointed on the first photoresist layer; 5. providing a second substrate; 6. rolling and developing a second photoresist layer on the second substrate; 7. the second photoresist layer is flip-chip bonded to the valve layer by hot pressing; 8. screen printing a conductive adhesive layer on the second substrate; 9. the conductive adhesive layer is adhered with a piezoelectric layer; and 10, welding an electrode layer on the piezoelectric layer and the second substrate. The first substrate has a first surface and a second surface, and is formed on the first surface of the first substrate through a nitride material deposition process to form a first protection layer, and then through an etching process to form a plurality of outlet openings, a plurality of fluid outlets and a plurality of nozzles. The outlet openings are respectively communicated with the nozzles through the fluid outlets. A photoresist layer is formed on the first passivation layer by a photoresist rolling process to form a first photoresist layer, and a communication channel, a plurality of inlet channels, a plurality of valve seats and a plurality of cavity openings are formed by a developing process. The auxiliary substrate is formed on the substrate through a film material rolling process to form a film adhesive layer, then the auxiliary substrate is formed on the film adhesive layer through a polymer material rolling process to form a valve layer, and finally a plurality of outlet valves, a plurality of inlet valves and a first flow channel opening are formed through an etching process. The valve layer is bonded to the first photoresist layer by flip alignment and bonding process, and the auxiliary substrate is removed by soaking. The first flow channel opening of the valve layer is communicated with the communicating flow channel of the first photoresist layer. A plurality of vibration openings are formed through an etching process, and a plurality of vibration regions are defined. The vibration areas correspond to the positions of the vibration openings, respectively. A second photoresist layer is formed on the second substrate by a photoresist rolling process, and a plurality of cavity holes and a second flow channel opening are formed by a developing process. The second photoresist layer is bonded to the valve layer by flip chip and hot pressing process. The cavity holes of the second photoresist layer are respectively communicated with the vibration opening of the second substrate and the cavity opening of the first photoresist layer, so that a plurality of vibration cavities are formed. The second flow channel opening of the second photoresist layer is communicated with the communicating flow channel of the first photoresist layer through the first flow channel opening of the valve layer. A conductive adhesive layer is formed on the second substrate by a screen printing process. A piezoelectric material is formed on the conductive adhesive layer through a bonding process to form a piezoelectric layer, and then a plurality of actuating regions are defined through a cutting process. An electrode material is formed on the piezoelectric layer and the second substrate by a soldering process to form an electrode layer. The electrode layer has a plurality of upper electrode regions and a plurality of lower electrode regions.

Drawings

Fig. 1 is a schematic partial cross-sectional view of a microfluidic actuator module according to the present disclosure.

Fig. 2 is a schematic flow chart of a method for manufacturing the microfluidic actuator module according to the present disclosure.

Fig. 3A to 3T are exploded views illustrating steps of manufacturing a micro-fluid actuator of the micro-fluid actuator module according to the present invention.

Fig. 4 is a schematic top view of the microfluidic actuator module of the present disclosure.

Fig. 5 is another schematic top view of the present microfluidic actuator module.

Fig. 6A and 6B are schematic operation diagrams of the micro-fluid actuator module according to the present invention.

Fig. 7A to 7E are schematic top cross-sectional views of different types of valves of the present microfluidic actuator.

Fig. 8 is a schematic diagram of a driving circuit of the microfluidic actuator module according to the present disclosure.

Description of the reference numerals

100: the microfluidic actuator module 10: microfluidic actuator

1 a: first substrate

11 a: first surface

12 a: second surface

13 a: IC circuit

14 a: fluid outlet

15 a: nozzle orifice

1 b: first protective layer

11 b: outlet opening

1 c: the first photoresist layer

11 c: communicating flow passage

12 c: inlet flow passage

121 c: barrier structure

13 c: valve seat

131 c: columnar structure

14 c: opening of cavity

1 d: auxiliary substrate

1 e: film glue layer

1 f: valve layer

11 f: outlet valve

12 f: inlet valve

121 f: groove

13 f: first flow passage opening

1 g: second substrate

11 g: vibrating aperture

12 g: vibration region

13 g: pipe diameter zone

131 g: through hole

1 h: the second photoresist layer

11 h: cavity hole

12 h: second flow passage opening

1 i: conductive adhesive layer

1 j: piezoelectric layer

1 k: electrode layer

11k is as follows: lower electrode area

12 k: upper electrode region

13 k: second protective layer

131 k: lead wire

A. B, C, D: endpoint (control signal terminal)

B1: first joint

B2: second joint

E: vibration chamber

CT1, CT 2: direction of cutting

G: endpoint (grounding terminal)

L: logic generator

M: actuation area

P: location mark

PD: contact pad

PL: endpoint (left power supply end)

PR: endpoint (Right power supply end)

T: cutting mark

X-X, Y-Y: section line

S1-S10: method for manufacturing a microfluidic actuator module

Detailed Description

Embodiments that embody the features and advantages of this disclosure will be described in detail in the description that follows. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Referring to fig. 1 and 4, in the embodiment of the present invention, a micro-fluid actuator module 100 includes a plurality of micro-fluid actuators 10, and is composed of a first substrate 1a, a first protection layer 1b, a first photoresist layer 1c, an auxiliary substrate 1d (as shown in fig. 2H to 2J), a thin film adhesive layer 1e (as shown in fig. 2H to 2J), a valve layer 1f, a second substrate 1g, a second photoresist layer 1H, a conductive adhesive layer 1i, a piezoelectric layer 1J, and an electrode layer 1k, and the manufacturing method thereof is described as follows, and the manufacturing process thereof will be described by using a single micro-fluid actuator 10 as an illustration.

Referring to fig. 2 to 3E, in step S1, a first substrate is provided to deposit and etch a first passivation layer. In this embodiment, the first substrate 1a has a first surface 11a and a second surface 12a opposite to the first surface 11a, and is formed on the first surface 11a of the first substrate 1a through a nitride material deposition process to form a first passivation layer 1b, an outlet opening 11b of the first passivation layer 1b and a fluid outlet 14a of the first substrate 1a are formed through an etching process, the first substrate 1a is thinned through a polishing process, and a nozzle 15a of the first substrate 1a is formed through an etching process. Wherein the outlet opening 11b of the first protect layer 1b communicates with the nozzle 15a through the fluid outlet 14a of the first substrate 1 a. In the present embodiment, the first substrate 1a is a silicon substrate, but not limited thereto. In the present embodiment, the nitride material is a silicon nitride material, but not limited thereto. In this embodiment, the fluid outlet 14a is formed on the first substrate 1a by a deep etching process, but not limited thereto. In this embodiment, the first substrate 1a is processed to form the nozzle 15a by a dry etching process, but not limited thereto. In the present embodiment, the deposition process of the first passivation layer 1b is a Chemical Vapor Deposition (CVD) process, but not limited thereto. In the present embodiment, the etching process of the first passivation layer 1b may be a wet etching process, a dry etching process, or a combination thereof, but not limited thereto. In the present embodiment, the first substrate 1a includes an IC circuit 13a disposed on the first substrate 1 a.

Referring to fig. 2, fig. 3F, fig. 3G and fig. 4, in step S2, the first passivation layer is rolled and a first photoresist layer is developed. In the present embodiment, a photoresist rolling process is performed on the first passivation layer 1b to form a first photoresist layer 1c, and a developing process is performed to form a communication channel 11c, an inlet channel 12c, a valve seat 13c and a cavity opening 14 c. In this embodiment, the cavity opening 14c communicates with the communicating flow channel 11c through the inlet flow channel 12 c. In the present embodiment, the photoresist material is a thick film photoresist, but not limited thereto. In the present embodiment, a plurality of barrier structures 121c (as shown in fig. 4) are disposed in the inlet flow channel 12c to filter impurities in the fluid, and the barrier structures 121c can also form a damping effect to reduce the backflow amount of the fluid. In other embodiments, the barrier structure 121c of the inlet channel 12c may be omitted, but not limited thereto.

Referring to fig. 2, fig. 3H and fig. 3I, in step S3, an auxiliary substrate is provided to roll-etch a film glue layer and a valve layer. In the embodiment, a thin film material rolling process is performed to form the thin film adhesive layer 1e on the auxiliary substrate 1d, a polymeric material rolling process is performed to form the valve layer 1f on the thin film adhesive layer 1e, and an outlet valve 11f, an inlet valve 12f and a first flow channel opening 13f of the valve layer 1f are formed by an etching process. In the embodiment, the polymer material is a Polyimide (PI) material, but not limited thereto. In this embodiment, the valve layer 1f is formed by a dry etching process or a laser etching process to form the outlet valve 11f, the inlet valve 12f and the first flow channel opening 13f, but not limited thereto.

Referring to fig. 2, 3J and 3K, in step S4, the valve layer is flipped over and bonded onto the first photoresist layer. In the embodiment, the valve layer 1f is bonded on the first photoresist layer 1c through an inversion alignment process and a Wafer Level Bonding (Wafer Level Bonding) process, and then the auxiliary substrate 1d is removed through soaking. Thereby, the first flow channel opening 13f of the valve layer 1f communicates with the communication flow channel 11c of the first photoresist layer 1 c. In the embodiment of the present invention, the soaking process is to soak the film adhesive layer 1e with a chemical agent to make the film adhesive layer 1e lose its adhesiveness, thereby removing the auxiliary substrate 1 d. In the present embodiment, a surface treatment process may be performed on the surface of the inlet valve 12f or the valve seat 13c at the first joint B1 of each inlet valve 12f of the valve layer 1f and the valve seat 13c corresponding to the first photoresist layer 1c, so that there is no joint effect between the inlet valve 12f and the valve seat 13c, and the action of the inlet valve 12f is facilitated.

Referring to fig. 2, fig. 3L, fig. 3M and fig. 5, in step S5, a second substrate is provided. In this embodiment, a vibration opening 11g and a cutting mark T are formed on the second substrate 1g by an etching process. In the present embodiment, the vibration openings 11g and the cutting marks T are formed on opposite sides of the second substrate 1 g. In the present embodiment, the vibration opening 11g is disposed to define a vibration region 12g, and the vibration region 12g corresponds to the position of the vibration opening 11 g. In the present embodiment, the second substrate 1g is made of a stainless material, but not limited thereto. In the embodiment, the etching process of the second substrate 1g is a half etching process, but not limited thereto.

Referring to fig. 2, fig. 3N and fig. 3O, in step S6, the second substrate is rolled and a second photoresist layer is developed. In the embodiment, a second photoresist layer 1h is formed on the second substrate 1g by a photoresist rolling process, and a cavity hole 11h and a second flow channel opening 12h are formed by a developing process.

Referring to fig. 2 and fig. 3P, in step S7, the second photoresist layer is flip-chip bonded and thermocompression bonded to the valve layer. In the present embodiment, the second photoresist layer 1h is bonded to the valve layer 1f through a Flip-Chip (Flip-Chip) process and a thermal pressing process. Therefore, the cavity hole 11h of the second photoresist layer 1h is communicated with the vibration opening 11g of the second substrate 1g and the cavity opening 14c of the first photoresist layer 1 c. Thus, the cavity hole 11h, the vibration opening 11g and the cavity opening 14c together form a vibration chamber E. In addition, the second channel opening 12h of the second photoresist layer 1h is communicated with the communication channel 11c of the first photoresist layer 1c through the first channel opening 13f of the valve layer 1 f. It should be noted that, in the embodiment of the present invention, each of the outlet valves 11f of the valve layer 1f and the second joint B2 of the second photoresist layer 1h are not joined during thermocompression bonding, i.e., there is no joint effect between the outlet valve 11f and the second photoresist layer 1h, so as to facilitate the operation of the outlet valve 11 f.

Referring to fig. 2 and fig. 3Q, in step S8, a conductive adhesive layer is screen printed on the second substrate. In the present embodiment, the conductive adhesive layer 1i is formed on the second substrate 1g through a conductive adhesive screen printing process. In the embodiment of the present invention, the Conductive adhesive material is Anisotropic Conductive Adhesive (ACP), but not limited thereto.

Referring to fig. 2, fig. 3R and fig. 3S, in step S9, a piezoelectric layer is adhered to the conductive adhesive layer. In the embodiment, the piezoelectric layer 1j is formed on the conductive adhesive layer 1i through a piezoelectric material pasting process, and then an actuating region M is defined through a cutting process. In the present embodiment, the opening width of the vibration opening 11g of the second substrate 1g is larger than the width of the actuation region M of the piezoelectric layer 1 j.

Referring to fig. 2 and fig. 3T, in step S10, an electrode layer is bonded to the piezoelectric layer and the second substrate. In the present embodiment, the electrode layer 1k is formed on the piezoelectric layer 1j and the second substrate 1g through an electrode material soldering process. The electrode layer 1k has a lower electrode region 11k and an upper electrode region 12k, and includes a second passivation layer 13 k. The lower electrode region 11k and the upper electrode region 12k are exposed outside the second passivation layer 13k and are electrically connected to the piezoelectric layer 1j and the second substrate 1g, respectively. The lower electrode regions 11k are formed on the actuation regions M of the piezoelectric layer 1j, respectively. In the embodiment, the electrode material is a flexible printed circuit board and a Polyimide (PI) is used as a substrate, but not limited thereto. In the present embodiment, the second passivation layer 13k includes a plurality of leads 131k electrically connected to the IC circuit 13a of the first substrate 1 a. In the present embodiment, each lead 131k is a copper foil gold-plating material, but not limited thereto.

Referring to FIG. 5, in one embodiment, FIGS. 3A-3T are taken on the X-X section. In the embodiment, the second substrate 1g further has a plurality of positioning marks P, so that the conductive adhesive layer 1i is subjected to a screen printing process according to the range of the positioning marks P, and then the piezoelectric layer 1j is subjected to a pasting process. The cutting process or the laser cutting process is performed along the cutting directions CT1 and CT2 according to the cutting marks T of the second substrate 1g, thereby defining the active region M of the piezoelectric layer 1 j. It should be noted that in the present embodiment, the bonding process is performed by using two piezoelectric layers 1j, so that the total amount of waste material is reduced, thereby reducing the cost, and in other embodiments, the bonding process may be performed by using a whole piezoelectric layer 1 j.

Referring to fig. 5, the second substrate 1g further has at least one pipe diameter region 13g, and the at least one pipe diameter region includes a through hole 131g communicating with the communicating channel 11c of the first photoresist layer 1 c. The caliber region 13g is disposed away from the actuation region M of the piezoelectric layer 1j to prevent the piezoelectric layer 1j from being wetted. In the present embodiment, the through hole 131g is formed by performing a half etching process from both sides of the second substrate 1g, but not limited thereto. In the embodiment, the second substrate 1g has two pipe diameter zones 13g, and in other embodiments, the number of the pipe diameter zones 13g can be changed according to the design requirement. In the embodiment, the through hole 131g is an elliptical shape, but not limited thereto, and the shape of the through hole 131g may be changed according to design requirements.

Referring to fig. 1, fig. 6A and fig. 6B, in the present embodiment, the micro-fluid actuator module 100 is operated by providing driving power sources with different phase charges to the lower electrode region 11k and the upper electrode region 12k, so as to drive and control the vibrating region 12g of the second substrate 1g to generate reciprocating displacement. As shown in fig. 1 and fig. 6A, when a positive voltage is applied to the upper electrode region 12k and a negative voltage is applied to the lower electrode region 11k, the actuating region M of the piezoelectric layer 1j drives the vibrating region 12g of the second substrate 1g to displace in a direction away from the first substrate 1 a. Thereby, the external fluid is sucked through the communication flow path 11c, passes through the inlet flow path 12c, pushes open the inlet valve 12f, and is collected in the vibration chamber E. It should be noted that the outlet valve 11f is pushed by the fluid against the second photoresist layer 1h, so that the fluid cannot flow into the outlet valve 11 f. As shown in fig. 1 and fig. 6B, the electrical properties of the lower electrode region 11k and the upper electrode region 12k are then switched, and a negative voltage is applied to the upper electrode region 12k and a positive voltage is applied to the lower electrode region 11k, so that the actuating region M of the piezoelectric layer 1j drives the vibrating region 12g of the second substrate 1g to displace toward the direction approaching the first substrate 1 a. Thereby, the fluid collected in the vibration chamber E is pushed, the outlet valve 11f is pushed open, and the fluid passes through the fluid outlet 14a of the first substrate 1a and is discharged from the nozzle 15a, thereby completing the transfer of the fluid. It should be noted that the inlet valve 12f is pushed by the fluid against the valve seat 13c of the first photoresist layer 1c, so that the fluid cannot be discharged from the inlet valve 12 f.

Referring to fig. 7A-7E, in this embodiment, the valve and valve seat of the micro-fluidic actuator module 100 can be implemented differently, and the inlet valve 12f is described as an example. As shown in fig. 7A, in the present embodiment, the inlet valve 12f is supported by the valve seat 13c to facilitate the original position to be restored after actuation. As shown in fig. 7B, in the present embodiment, the inlet valve 12f is designed by an S-shaped bracket to facilitate the expansion amount during the actuation and the original position after the actuation. As shown in fig. 7C, in this embodiment, a cylindrical structure 131C may be added to the valve seat 13C to ensure that the inlet valve 12f is not easily deformed during long-term operation, and the inlet valve 12f is perforated at a position opposite to the cylindrical structure 131C to increase the flow rate of the fluid passing through the inlet valve 12 f. Fig. 7D is a schematic diagram of the extension of fig. 7C, and fig. 7E is a schematic diagram of the cross section Y-Y of fig. 7D, in this embodiment, a plurality of grooves 121f are alternately etched on the front and back surfaces of the inlet valve 12f, so that the inlet valve 12f generates a spring effect during actuation, thereby greatly increasing the amount of actuation extension and simultaneously flattening the inlet valve 12 f. It should be noted that the implementation of the valve is not limited to the above, and may be changed according to different design requirements.

Referring to fig. 1 and 8, in the present embodiment, the micro fluid actuator module 100 further includes a logic generator L and a plurality of contact pads PD electrically connected to the IC circuit 13a of the first substrate 1a for controlling the operation of the micro fluid actuator module 100. The electrode layer 1k includes a plurality of terminals PL, PR, G, A, B, C, D for receiving an externally inputted control signal. Wherein, the terminals PL, PR represent the left and right power terminals respectively, and can be directly electrified to the second substrate 1g to form the lower electrode power; terminal G represents ground; and terminal A, B, C, D represents a control signal terminal. The pad PD is electrically connected to the logic generator L through the IC circuit 13a of the first substrate 1 a. For example, in the present embodiment, the micro-fluid actuator module 100 includes 8 micro-fluid actuators 10, and when a control signal (a ═ 1, B ═ 1, and C ═ 1) is externally input, the signal is decoded by the logic generator L and output to the contact pad PD1, thereby driving the micro-fluid actuator 10 numbered 1, and when a control signal (a ═ 1, B ═ 1, and C ═ 0) is externally input, the signal is decoded by the logic generator L and output to the contact pad PD2, thereby driving the micro-fluid actuator 10 numbered 2, and the micro-fluid actuators 10 numbered 3 to 8, and so on. It should be noted that the number of the micro-fluid actuators 10 is not limited to 8 in this embodiment, and may be changed according to the design requirement.

The present invention provides a method for manufacturing a micro-fluid actuator module, which is mainly manufactured by micro-electromechanical surface and body type processing and integrated molding with precision packaging technology, and can achieve the required flow rate by controlling the driving of the micro-fluid actuator, thereby having great industrial utilization value and applying the method.

Various modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims.

Claims

1. A method of manufacturing a microfluidic actuator module, comprising the steps of:

1) providing a first substrate for depositing and etching a first protective layer, wherein the first substrate is provided with a first surface and a second surface, a nitriding material deposition process is firstly carried out to form the first protective layer on the first surface of the first substrate, then a plurality of outlet openings, a plurality of fluid outlets and a plurality of nozzles are formed through an etching process, and the plurality of outlet openings are respectively communicated with the plurality of nozzles through the plurality of fluid outlets;

2) rolling and developing a first photoresist layer on the first protective layer by a photoresist material rolling process to form the first photoresist layer, and forming a communication channel, a plurality of inlet channels, a plurality of valve seats and a plurality of cavity openings by a developing process;

3) providing an auxiliary substrate, rolling and etching a film adhesive layer and a valve layer, forming the film adhesive layer on the auxiliary substrate through a film material rolling process, forming the valve layer on the film adhesive layer through a polymer material rolling process, and forming a plurality of outlet valves, a plurality of inlet valves and a first flow channel opening through an etching process;

4) the valve layer is turned over and aligned and jointed on the first photoresist layer, through turning over and aligning and wafer-level jointing process to joint the valve layer on the first photoresist layer first, remove the auxiliary base plate through soaking, the first flow passage opening of the valve layer is communicated with the communicating flow passage of the first photoresist layer;

5) providing a second substrate, forming a plurality of vibration openings through an etching process, and defining a plurality of vibration areas, wherein the plurality of vibration areas correspond to the positions of the plurality of vibration openings respectively;

6) rolling and developing a second photoresist layer on the second substrate by photoresist rolling process to form the second photoresist layer, and forming multiple cavity holes and a second flow channel opening by developing process;

7) the second photoresistance layer is flip-chip bonded and hot pressed on the valve layer, the second photoresistance layer is bonded on the valve layer through flip-chip and hot pressing processes, the plurality of cavity holes of the second photoresistance layer are respectively communicated with the plurality of vibration openings of the second substrate and the plurality of cavity openings of the first photoresistance layer so as to form a plurality of vibration cavities, and the second runner openings of the second photoresistance layer are communicated with the communication runner of the first photoresistance layer through the first runner openings of the valve layer;

8) the second substrate is screen-printed with a conductive adhesive layer, which is formed on the second substrate through a screen printing process of a conductive adhesive material to form the conductive adhesive layer;

9) the piezoelectric layer is formed on the conductive adhesive layer through a piezoelectric material pasting process to form the piezoelectric layer, and then a plurality of actuating areas are defined through a cutting process; and

10) an electrode layer is welded on the piezoelectric layer and the second substrate and is formed on the piezoelectric layer and the second substrate through an electrode material welding process to form the electrode layer, and the electrode layer is provided with a plurality of upper electrode areas and a plurality of lower electrode areas.

2. The method of claim 1, wherein the first substrate comprises an IC trace disposed on the first substrate and electrically connected to the electrode layer.

3. The method of claim 2, further comprising a logic generator electrically connected to the IC circuit for controlling the operation of the micro fluid actuator module.

4. The method of claim 1, wherein a plurality of columnar structures are disposed within the plurality of inlet flow channels.

5. The method of claim 1, wherein the plurality of orifices are formed by a dry etching process.

6. The method of claim 1, wherein the plurality of fluid outlets are formed by a deep etch process.

7. The method of claim 1, wherein the outlet valves, the inlet valves, and the first flow channel opening are formed by a dry etching or laser etching process.

8. The method of claim 1, wherein an opening width of each of the vibration openings is greater than a width of the corresponding actuation area of the piezoelectric layer.

9. The method of claim 1, wherein the first substrate is a silicon substrate.

10. The method of claim 1, wherein the nitride material is a silicon nitride material.

11. The method of claim 1, wherein the photoresist material is a thick film photoresist.

12. The method of claim 1, wherein the polymeric material is a polyimide material.

13. The method of claim 1, wherein the electrode material is a flexible circuit board.

14. The method of claim 1, wherein the second substrate is a stainless steel material.

15. The method of claim 1, wherein the conductive adhesive is an anisotropic conductive adhesive.

16. The method of claim 1, wherein the electrode layer comprises a plurality of leads.

17. The method of claim 16, wherein the plurality of leads are a copper foil gold plated material.

18. The method of claim 1, wherein applying a positive voltage to the upper electrode regions and a negative voltage to the lower electrode regions causes the actuating regions of the piezoelectric layer to displace the vibrating regions of the second substrate away from the first substrate.

19. The method of claim 1, wherein a negative voltage is applied to the upper electrode regions and a positive voltage is applied to the lower electrode regions, such that the actuating regions of the piezoelectric layer drive the vibrating regions of the second substrate to move toward the first substrate.

20. The method of manufacturing a microfluidic actuator module of claim 1, wherein:

applying a negative voltage to the upper electrode regions and a positive voltage to the lower electrode regions, so that the actuating regions of the piezoelectric layer drive the vibrating regions of the second substrate to displace toward a direction close to the first substrate, thereby sucking external fluid from the communicating flow channel, pushing open the inlet valves after passing through the inlet flow channels, and collecting the fluid in the vibrating chambers; and

and converting the electrical properties of the upper electrode regions and the lower electrode regions, and applying a positive voltage to the upper electrode regions and a negative voltage to the lower electrode regions, so that the vibration regions of the second substrate are displaced towards a direction away from the first substrate, and the fluid collected in the vibration chamber pushes away the outlet valves, passes through the fluid outlets, and is finally discharged from the nozzles to finish the transmission of the fluid.