CN111722093A - Probe Card Test Device - Google Patents

Abstract

The present invention discloses a probe card test device, comprising a test circuit board, a signal adapter board and a probe head. The test circuit board comprises a first light-transmitting portion located in a chip test area, and a plurality of metal pads located in a signal suppression area. The signal adapter board comprises a second light-transmitting portion located in a chip test area. The top surface of the signal adapter board is provided with a plurality of external pads located in the chip test area and arranged along the periphery of the second light-transmitting portion. The bottom surface of the signal adapter board is provided with a plurality of connection pads located in the signal suppression area. The positioning seat body of the probe head comprises a third light-transmitting portion located in the chip test area. A plurality of conductive probes of the probe head are inserted and set in the positioning seat body and arranged along the periphery of the third light-transmitting portion. One ends of the plurality of conductive probes pass through the positioning seat body and respectively abut against a plurality of external pads. Thereby, the needle implantation operation time of the conductive probes can be greatly reduced, and the maintenance difficulty of the probe card test device can be greatly reduced.

Description

Probe Card Test Device

technical field

The invention relates to a probe card testing device, in particular to a probe card testing device suitable for peripheral chip testing.

Background technique

Since CMOS image sensors are peripheral chips, they are generally tested by using Cantilever Probe Cards. However, such probe cards require manual wire bonding. It takes a long time for the wire planting operation to connect the signal by means of the needle, and in the case of multi-die testing, the difficulty of the wire planting operation and maintenance operation will be greatly increased. Another test method is to use a MEMS Probe Card for testing. However, the limitation of this kind of probe card is that a ceramic substrate must be used, and the structure of this kind of probe card is not easy to maintain. For example, when the probe is damaged, in maintenance, in addition to removing the probe, a new probe must be welded, which must rely on equipment, and manual operation is not easy to complete.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a probe card testing device aiming at the deficiencies of the prior art.

An embodiment of the present invention discloses a probe card testing device, which defines a chip testing area and a signal suppression area around the chip testing area, and the probe card testing device includes: a testing circuit board, a signal Adapter board and a probe head. The test circuit board includes a first light-transmitting portion located in the chip testing area and a plurality of metal pads disposed in the signal pressing area; the signal transfer board has a top surface and a bottom surface located on opposite sides, the The bottom surface of the signal adapter board faces the test circuit board, the signal adapter board includes a second light-transmitting portion located in the chip testing area, and the signal adapter board is provided on the top surface with a a plurality of external pads, and the signal transfer board is provided with a plurality of connection pads on the bottom surface; wherein, a plurality of the external pads are located in the chip testing area and are arranged along the periphery of the second light-transmitting portion , a plurality of the connection pads are located in the signal suppression area, and are respectively electrically coupled to a plurality of the external pads and also to a plurality of the metal pads of the test circuit board; probes The head is arranged above the top surface of the signal transfer board, and the probe head includes: a positioning base and a plurality of conductive probes, and the positioning base includes a first position located in the wafer testing area. Three light-transmitting parts; a plurality of conductive probes are arranged through the positioning base and are arranged along the periphery of the third light-transmitting part; wherein, one end of the plurality of conductive probes passes through the positioning base The body is respectively abutted against a plurality of the external pads of the signal transfer board, and the other ends of the plurality of conductive probes pass through the positioning base to abut against an object to be tested; wherein , the probe card testing device can be used to receive a light, and let the light pass through the first light-transmitting part, the second light-transmitting part, and the third light-transmitting part in sequence, and then Irradiate the object to be tested to generate a photoelectric sensing signal.

Preferably, at least one of the conductive probes can be used to receive the photoelectric sensing signal, and pass the photoelectric sensing signal through the corresponding external pad, the corresponding connection pad, and the corresponding of the metal pad and transferred to the test circuit board.

Preferably, a length direction of the one end of each of the conductive probes is substantially perpendicular to the top surface of the signal transfer board.

Preferably, the middle portion of the third light-transmitting portion of the positioning base body of the probe head is not provided with any conductive probes.

Preferably, the signal transfer board is provided with a plurality of transfer pads and a plurality of outer layers on the top surface, a plurality of the transfer pads are located in the signal pressing area, and a plurality of the outer layers It is arranged in the chip testing area and the signal pressing area, and a plurality of the external pads are respectively electrically connected to a plurality of the transfer pads through a plurality of the outer layer lines.

Preferably, the probe card testing device further includes an electrical connection module, the electrical connection module is clamped between the test circuit board and the signal adapter board, and the electrical connection module includes: a A spacer plate and a plurality of vertical conductive structures, the spacer plate includes a fourth light-transmitting portion located in the chip testing area and a plurality of through holes located in the signal pressing area; a plurality of vertical conductive structures are respectively disposed on the spacer plate Among the plurality of said perforations; wherein, the fourth translucent portion is located in a light transmission path formed by the first translucent portion, the second translucent portion, and the third translucent portion and a plurality of the connection pads of the signal transfer board are respectively electrically connected to the plurality of the metal pads of the test circuit board through a plurality of the vertical conductive structures to form an electrical transmission path.

Preferably, the probe card testing device further includes a pressing structure, the pressing structure includes: a pressing plate and a screw, the pressing plate is arranged on the top surface of the signal adapter board, the pressing plate A screw hole is included in the signal pressing area; a screw penetrates the screw hole of the pressing board to fix the pressing board on the signal transfer board.

Preferably, the screw further penetrates the signal adapter board, the electrical connection module, and the test circuit board along a thickness direction of the signal adapter board, so that the pressing board presses the signal adapter board. a connection board, the electrical connection module, and the test circuit board, and the two ends of the plurality of vertical conductive structures are respectively abutted against the plurality of the connection pads and the plurality of the metal pads; wherein, the Any electrical transmission paths between the test circuit board and the signal transition board are not implemented with a solder material.

Preferably, a solder resist layer is further provided on the top surface of the signal transfer board, and the solder resist layer covers a plurality of the transfer pads.

The embodiment of the present invention also discloses a probe card testing device, which defines a chip testing area and a signal suppression area around the chip testing area, and the probe card testing device includes: a testing circuit board, a A signal transfer board and a probe head. The test circuit board includes a first blank part located in the chip testing area and a plurality of metal pads disposed in the signal pressing area; the signal transfer board has a top surface and a bottom surface located on opposite sides, the signal The bottom surface of the adapter board faces the test circuit board, the signal adapter board includes a second blank portion located in the chip testing area, and the signal adapter board is provided with a plurality of an external pad, and the signal transfer board is provided with a plurality of connection pads on the bottom surface; wherein, a plurality of the external pads are located in the chip testing area and are arranged along the periphery of the second blank portion, and a plurality of The connection pads are located in the signal pressing area, and are respectively electrically coupled to a plurality of the external pads, and are also electrically coupled to a plurality of the metal pads of the test circuit board; the probe heads are arranged on the Above the top surface of the signal transfer board, and the probe head includes: a positioning base and a plurality of conductive probes, the positioning base includes a third blank part located in the chip testing area ; A plurality of conductive probes are set through the positioning base and arranged along the periphery of the third blank portion; wherein, one end of the plurality of conductive probes passes through the positioning base and abuts respectively a plurality of the external pads on the signal transfer board, and the other ends of the plurality of the conductive probes pass through the positioning base to abut against an object to be tested; wherein, each of the A length direction of the conductive probe is substantially perpendicular to the top surface of the signal adapter board, and the middle part of the third blank portion of the positioning base of the probe head is not provided with any conductive probe.

To sum up, the probe card testing device disclosed in the embodiments of the present invention can pass the first light-transmitting portion of the test circuit board, the second light-transmitting portion of the signal adapter board, and the third light-transmitting portion of the probe head. the design of the part (or the first blank part, the second blank part, the third blank part), a plurality of external pads arranged along the periphery of the second light-transmitting part (or the second blank part) matched with the signal adapter board, And the design of a plurality of conductive probes arranged along the periphery of the third light-transmitting portion (or the third blank portion) of the probe head, to replace the traditional peripheral chip test probe card, which needs to be manually pulled and soldered. By connecting the signals, multiple conductive probes can be implanted in a straight-up and straight-down manner, thereby greatly reducing the needle implantation time of the conductive probes, and greatly reducing the maintenance difficulty of the probe card testing device.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a probe card testing device according to a first embodiment of the present invention.

FIG. 2 is a schematic exploded plan view of FIG. 1 .

FIG. 3 is a schematic diagram of a plurality of wafer testing areas and a plurality of signal pressing areas interlaced with each other and arranged in a matrix according to the first embodiment of the present invention.

4 is a schematic diagram of a plurality of wafer testing areas located within a central area and a plurality of signal suppression areas located within a peripheral area according to another variant embodiment of the present invention.

FIG. 5 is a partial schematic diagram of the circuit pattern on the top surface of the signal transfer board according to the first embodiment of the present invention.

6 is a partial schematic diagram of the circuit pattern on the bottom surface of the signal transfer board according to the first embodiment of the present invention.

7 is a schematic cross-sectional view of a probe card testing device according to a second embodiment of the present invention.

Detailed ways

The following are specific specific examples to illustrate the embodiments disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", "third" and the like may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component, or one signal from another. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Referring to FIG. 1 to FIG. 6, it is the first embodiment of the present invention. As shown in FIG. 1 and FIG. 2 , the present embodiment discloses a probe card testing device 100 . The probe card testing device 100 is particularly suitable for testing CMOS image sensors, but The present invention is not limited to this. Further, the probe card testing device 100 includes a test circuit board 1 , a signal transfer board 2 disposed above the test circuit board 1 , and a probe needle disposed above the signal transfer board 2 The head 3 , an electrical connection module 4 arranged between the test circuit board 1 and the signal adapter board 2 , and a pressing device arranged on the signal adapter board 2 for pressing the signal adapter board 2 Structure 5. The above-mentioned test circuit board 1 , electrical connection module 4 , signal transfer board 2 , pressing structure 5 , and probe head 3 are sequentially stacked along a thickness direction T in this embodiment, but the present invention is not limited to here.

As shown in FIG. 3 , in this embodiment, the probe card testing apparatus 100 defines a plurality of wafer test regions R1 and a plurality of signal suppression regions R2 , and the above-mentioned plurality of wafer test regions R1 and a plurality of signal suppression regions R2 They are staggered and arranged in a matrix, but the present invention is not limited thereto. For example, as shown in FIG. 4 , in another variant embodiment of the present invention, a plurality of chip testing regions R1 are arranged in a matrix and are located within a central range RC, and a plurality of signal suppression regions R2 are is located in a peripheral area RE surrounding the central area RC.

It should be noted that, since the probe card testing apparatus 100 has substantially the same structure in the plurality of wafer testing regions R1 and the signal suppression regions R2 located around them, the following description is based on the probe card. The test device 100 is constructed in one of the wafer test regions R1 and the signal suppression region R2 located around it as an example, but the present invention is not limited thereto. For example, in an embodiment not shown in the present invention, the probe card testing apparatus 100 may also have different structures in different wafer testing regions R1 and signal pressing regions R2.

As shown in FIG. 1 and FIG. 2 , the test circuit board 1 is substantially disc-shaped. The test circuit board 1 includes a first light-transmitting portion 101 located in the wafer test region R1, and the test circuit board 1 includes on its board surface (eg, the top surface of the test circuit board 1 in FIG. 1 ) A plurality of metal pads 11 arranged at intervals. Wherein, the first light-transmitting portion 101 of the test circuit board 1 can be used to provide a light penetration. More specifically, in this embodiment, the surface of the test circuit board 1 is made of an insulating material that does not transmit light, and the first light-transmitting portion 101 of the test circuit board 1 is a through hole 12 to provide a Light penetrates, but the present invention is not limited thereto. For example, the first light-transmitting portion 101 of the test circuit board 1 may also be an optical lens (eg, a concave lens or a convex lens) inserted into the through hole 12 .

Further, the above-mentioned test circuit board 1 is used for electrically coupling to a test machine (not shown in the figure). That is to say, the above-mentioned plurality of metal pads 11 are electrically coupled to the testing machine, so that the signals received by the testing circuit board 1 can be analyzed by the testing machine. Wherein, the electrical coupling mode between the test circuit board 1 and the test machine can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the test circuit board 1 may also be directly integrated into the test machine.

As shown in FIG. 1 , FIG. 2 , FIG. 5 , and FIG. 6 , the signal transfer board 2 is substantially in the shape of a rectangular plate. The signal adapter board 2 has a top surface 21 and a bottom surface 22 on opposite sides, and the bottom surface 22 of the signal adapter board 2 faces the test circuit board 1 along the thickness direction T. As shown in FIG. Wherein, the signal transfer board 2 includes a second light-transmitting portion 201 located in the chip testing area R1. The signal transfer board 2 is provided with a plurality of external pads 211 , a plurality of transfer pads 212 , a plurality of outer layers 213 , and a solder mask 214 on the top surface 21 of the signal transfer board 2 , and the signal transfer board 2 is located on the The bottom surface 22 is provided with a plurality of connection pads 221 . The connection pads 221 are located in the signal pressing region R2 and are electrically coupled to the external pads 211 and the metal pads 11 of the test circuit board 1 respectively. More specifically, a plurality of the external pads 211 are located in the wafer testing region R1 and are disposed along the periphery of the second light-transmitting portion 201 . A plurality of the transfer pads 212 are located in the signal pressing area R2, a plurality of the outer layers 213 are arranged across the chip testing area R1 and the signal pressing area R2, and the plurality of the external pads 211 pass through the plurality of outer layers respectively 213 is electrically connected to a plurality of transfer pads 212 (as shown in FIG. 1 and FIG. 5 ). Furthermore, the plurality of transfer pads 212 are electrically connected to the plurality of connection pads 221 through a plurality of inner-layer lines 222 respectively. The solder resist layer 214 covers the transfer pads 212 to avoid short circuit caused by direct contact between the pressing board 51 and the transfer pads 212 as described below.

Wherein, the arrangement of the plurality of connection pads 221 of the above-mentioned signal transfer board 2 is substantially the same as the arrangement of the plurality of metal pads 11 of the test circuit board 1 . It should be noted that the connection pad 221 is described as a circle in this embodiment, but in practical application, the shape of the connection pad 221 can be adjusted and changed according to design requirements (for example, square, rectangular, or irregular shape).

Furthermore, in this embodiment, the distance between any two adjacent external pads 211 is preferably smaller than the distance between the corresponding two connection pads 221 . That is to say, the signal transfer board 2 includes a signal fan-out (FAN-OUT) structure in this embodiment, but the present invention is not limited thereto.

It is worth mentioning that, in this embodiment, the substrate material of the signal adapter board 2 is preferably a transparent glass substrate, so the second light-transmitting portion 201 of the signal adapter board 2 can be made of transparent glass. The substrate is designed to have light-transmitting properties, but the present invention is not limited thereto. For example, in an embodiment not shown in the present invention, the signal transfer board 2 may be, for example, a non-transparent substrate, and the second light-transmitting portion 201 of the signal transfer board 2 may be, for example, through The way of digging holes has the property of light transmission.

In addition, it should be noted that, in this embodiment, although the signal transfer board 2 is described by taking a circuit board with double-layer circuits as an example, the invention is not limited to this. For example, in the embodiment not shown in the present invention, the signal transfer board 2 can also be designed as a multi-layer circuit board with four layers of lines or more than six layers of lines according to design requirements.

As shown in FIG. 1 and FIG. 2 , the probe head 3 is disposed above the top surface 21 of the signal adapter board 2 , and the probe head 3 can be electrically coupled to the test circuit through the signal adapter board 2 plate 1. The probe head 3 includes a positioning base 31 and a plurality of conductive probes 32 . The positioning base 31 includes a third transparent portion 301 located in the wafer testing region R1. In this embodiment, the positioning base 31 is made of a transparent glass substrate, so the third light-transmitting portion 301 of the positioning base 31 can have a light-transmitting property through the design of the transparent glass substrate. However, the present invention is not limited to this. For example, in the embodiment not shown in the present invention, the positioning base 31 may be, for example, a non-transparent positioning base, and the third light-transmitting portion 301 of the positioning base 31 may also be, for example, through The way of digging holes has the property of light transmission.

Further, a plurality of the conductive probes 32 are disposed on the positioning base 31 and are disposed along the periphery of the third light-transmitting portion 301 . Wherein, one end of the plurality of conductive probes 32 protrudes out of the positioning base 31 to contact the plurality of external pads 211 of the signal adapter board 2 respectively, and the other end of the plurality of conductive probes 32 protrudes out of the positioning base 31 The base body 31 is used to abut against an object to be tested O (eg, a semiconductor chip).

In this embodiment, a length direction of one end of each of the conductive probes 32 (eg, the bottom portion of the conductive probes 32 ) is substantially perpendicular to the top surface 21 of the signal adapter board 2 . Furthermore, the middle portion of the third transparent portion 301 of the positioning base 31 of the probe head 3 is not provided with any conductive probes, and the middle portion of the second transparent portion 201 of the signal adapter board 2 is not provided with any conductive probes. Parts are also not provided with any conductive pads or conductive lines.

It should be noted that the conductive probes 32 in this embodiment are conductive and flexible elongated structures, but the conductive probes 32 of the present invention are not limited to rectangular conductive probes, circular conductive probes Probes, or conductive probes of other configurations.

According to the above configuration, the probe card testing device 100 can be used to receive a light L, and let the light L pass through the first light-transmitting part 101 , the second light-transmitting part 201 , and the third light-transmitting part 101 in sequence. A light transmission path formed by the light-transmitting portion 301 is then irradiated to the object to be tested O to generate a photoelectric sensing signal.

Then, at least one of the conductive probes 32 of the plurality of conductive probes 32 can be used to receive the photoelectric sensing signal, and pass the photoelectric sensing signal through the corresponding external pads 211, corresponding to The outer layer circuit 213, the corresponding transfer pad 212, the corresponding inner layer circuit 222, the corresponding connection pad 221, the corresponding vertical conductive structure 42, and the corresponding metal pad 11 are transmitted to the The test circuit board 1 is finally transmitted to the test machine, so that the signal received by the test circuit board 1 is analyzed by the test machine.

Please continue to refer to FIG. 1 and FIG. 2 , the electrical connection module 4 is clamped between the test circuit board 1 and the signal transfer board 2 . The electrical connection module 4 includes a spacer 41 and a plurality of vertical conductive structures 42 . The spacer 41 includes a fourth light-transmitting portion 401 located in the wafer testing region R1 and a plurality of through holes 411 located in the signal pressing region R2. Wherein, the fourth transparent portion 401 is located on the light transmission path formed by the first transparent portion 101, the second transparent portion 201, and the third transparent portion 301 (and is located in the first transparent portion 101 and the second transparent portion 201). In this embodiment, the spacer 41 can be made of, for example, a transparent glass substrate, so the fourth light-transmitting portion 401 of the spacer 41 can have a light-transmitting property by virtue of the design of the transparent glass substrate, However, the present invention is not limited to this. Furthermore, each of the above-mentioned through holes 411 penetrates through the partition plate 41 along the thickness direction T in this embodiment. The spacer plate 41 is sandwiched between the test circuit board 1 and the signal transfer board 2 , and the plurality of metal pads 11 face the plurality of connection pads 221 through the plurality of through holes 411 respectively. That is, opposite sides of each through hole 411 (eg, the bottom side and the top side of the through hole 411 in FIG. 1 ) correspond to one of the metal pads 11 and one of the connection pads 221 respectively.

Furthermore, the plurality of vertical conductive structures 42 are respectively disposed in the plurality of through holes 411 of the spacer plate 41 , and the plurality of connection pads 221 of the signal transfer board 2 can be electrically connected to the plurality of vertical conductive structures 42 respectively through the plurality of vertical conductive structures 42 . The plurality of metal pads 11 of the circuit board 1 are tested to form an electrical transmission path. In this embodiment, the plurality of vertical conductive structures 42 may be, for example, vertical conductive metal glue (eg, vertical conductive silver glue), but the present invention is not limited thereto. For example, the plurality of the vertical conductive structures 42 can also be elastic mechanism components such as metal elastic arms.

Please continue to refer to FIG. 1 and FIG. 2 , the pressing structure 5 is disposed on the signal adapter board 2 and used for pressing the signal adapter board 2 . The pressing structure 5 includes a pressing plate 51 and a plurality of screws 52 . The pressing plate 51 is disposed on the top surface 21 of the signal adapter board 2 . The pressing plate 51 includes a plurality of screw holes 511 in the signal pressing region R2. The plurality of screws 52 respectively penetrate through the plurality of screw holes 511 of the pressing board 51 to fix the pressing board 51 on the signal adapter board 2 . A plurality of the screws 52 further penetrate the signal adapter board 2 , the electrical connection module 4 , and the test circuit board 1 along the thickness direction T, so that the pressing board 51 can press the signal adapter board 2 , the electrical connection module 4 , and the test circuit board 1 , and the two ends of the plurality of vertical conductive structures 42 are respectively abutted against the plurality of connection pads 221 and the plurality of metal pads 11 , so as to enhance the signal transfer board 2 The characteristics of the electrical connection with the test circuit board 1, and the electrical transmission path between the test circuit board 1 and the signal transfer board 2 can be realized without any soldering material. In addition, in this embodiment, when a plurality of the screws 52 penetrate the signal adapter board 2 , the electrical connection module 4 , and the test circuit board 1 , the plurality of the screws 52 only touch the insulating substrate material, and Will not touch any conductive pads or conductive lines. From another perspective, the pressing board 51 of the pressing structure 5 can hold the signal adapter board 2 and the electrical connection module 4 together with the test circuit board 1 , so that the two ends of the plurality of the vertical conductive structures 42 are tightened respectively. Abuts against the plurality of connection pads 221 and the plurality of metal pads 11 .

[Second Embodiment]

Please refer to FIG. 7 , which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned embodiment, and the similarities between the two embodiments are not repeated here, and this embodiment is similar to the above-mentioned first embodiment. The difference is that in this embodiment, the non-transparent first blank portion 101 ′, the second blank portion 201 ′, and the third blank portion 301 ′ are used to replace the first transparent portion 101 , the second transparent portion 101 ′ and the second blank portion 301 ′ in the above-mentioned embodiment. The light-transmitting portion 201 and the third light-transmitting portion 301 are described in detail as follows.

This embodiment discloses a probe card testing device 100 , and the probe card testing device 100 is particularly suitable for testing a liquid crystal display driver IC (LCD driver IC) or a memory. The probe card testing device 100 defines a chip testing area R1 and a signal pressing area R2 around the chip testing area R1, and the probe card testing device 100 includes a testing circuit board 1 and a signal transition board 2 , and a probe head 3 . The test circuit board 1 includes a first blank portion 101' located in the chip testing area R1 and a plurality of metal pads 11 disposed in the signal pressing area R2.

The signal transfer board 2 has a top surface 21 and a bottom surface 22 on opposite sides. The bottom surface 22 of the signal adapter board 2 faces the test circuit board 1 , the signal adapter board 2 includes a second blank portion 201 ′ located in the chip testing area R1 , and the signal adapter board 2 is on the top surface. 21 is provided with a plurality of external pads 211 , and the signal transfer board 2 is provided with a plurality of connection pads 221 on the bottom surface 22 . Wherein, a plurality of the external pads 211 are located in the chip testing region R1 and are disposed along the periphery of the second blank portion 201 ′, and a plurality of the connecting pads 221 are located in the signal pressing region R2 and are respectively electrically coupled to multiple Each of the external pads 211 is also electrically coupled to the plurality of metal pads 11 of the test circuit board 1 respectively.

The probe head 3 is disposed above the top surface 21 of the signal adapter board 2 , and the probe head 3 includes a positioning base 31 and a plurality of conductive probes 32 . The positioning base 31 includes a third blank portion 301' located in the wafer testing area R1. A plurality of conductive probes 32 are disposed on the positioning base 31 and along the periphery of the third blank portion 301'. Wherein, one end of the plurality of conductive probes 32 protrudes out of the positioning base 31 to contact the plurality of external pads 211 of the signal adapter board 2 respectively, and the other end of the plurality of conductive probes 32 protrudes out of the positioning base 31 The seat body 31 is used to abut against an object to be tested. Further, a length direction of one end of each of the conductive probes 32 (eg, the bottom end of the conductive probes 32 ) is substantially perpendicular to the top surface 21 of the signal adapter board 2 , and the probes The middle portion of the third blank portion 301 ′ of the positioning base 31 of the head 3 is not provided with any conductive probes, and the middle portion of the second blank portion 201 ′ of the signal adapter board 2 is also not provided with any conductive probes. Conductive pads or conductive lines.

According to the above configuration, at least one of the conductive probes 32 of the plurality of conductive probes 32 can be used to receive a test signal generated by the DUT O and pass the test signal through the corresponding external pads 211 in sequence , the corresponding outer layer circuit 213, the corresponding transfer pad 212, the corresponding inner layer circuit 222, the corresponding connection pad 221, the corresponding vertical conductive structure 42, and the corresponding metal pad 11, and transmit to the test circuit board 1, and finally to the test machine, so as to analyze the signal received by the test circuit board 1 through the test machine.

[Advantageous effects of the embodiment]

To sum up, the probe card testing device 100 disclosed in the embodiment of the present invention can pass the test of the first light-transmitting portion 101 of the circuit board 1 , the second light-transmitting portion 201 of the signal adapter board 2 , and the probe head. The design of the third transparent portion 301 of 3 (or the first blank portion 101 ′, the second blank portion 201 ′, the third blank portion 301 ′), and the second transparent portion 201 along the signal adapter board 2 A plurality of external pads 211 disposed on the periphery of the second blank portion 201 ′ (or the second blank portion 201 ′), and a plurality of conductive probes 32 of the probe head 3 disposed along the periphery of the third light-transmitting portion 301 (or the third blank portion 301 ′) The design of the probe card to replace the traditional peripheral chip test needs to connect the signal by manually pulling the wire and soldering pins, so that the plurality of conductive probes 32 can be implanted in a straight-up and straight-down manner, thereby greatly reducing the number of conductive probes. The operation time of the needle 32 is reduced, and the maintenance difficulty of the probe card testing device 100 can be greatly reduced.

Further, in the probe card testing device 100 disclosed in the embodiment of the present invention, a plurality of vertical conductive structures 42 of the electrical connection module 4 are used to electrically connect the signal adapter board 2 and the test circuit board 1 , and the pressing structure is used to electrically connect the signal adapter board 2 and the test circuit board 1 . 5 to improve the electrical connection characteristics between the signal transfer board 2 and the test circuit board 1 without using soldering, so the probe card testing device 100 can effectively avoid damage caused by thermal shock.

In addition, since the substrate material of the signal adapter board 2 in the embodiment of the present invention is a transparent glass substrate, the second light-transmitting portion 201 of the signal adapter board 2 can have a transparent glass substrate through the design of the transparent glass substrate. As a result, the signal adapter board 2 of the embodiment of the present invention does not need a notch for light guidance, thus facilitating the application of smaller-sized die and larger-area testing. Furthermore, the positioning base 31 of the probe head 3 in the embodiment of the present invention can also be made of a transparent glass substrate, so the third light-transmitting portion 301 of the positioning base 31 can be designed by the above-mentioned transparent glass substrate. It has the property of light transmission.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the claims of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the claims of the present invention. Inside.

Claims (10)

1. A probe card testing apparatus, wherein the probe card testing apparatus defines a wafer testing area and a signal pressing area located at the periphery of the wafer testing area, and the probe card testing apparatus comprises:

the test circuit board comprises a first light transmission part positioned in the wafer test area and a plurality of metal pads arranged in the signal pressing area;

a signal adapter plate having a top surface and a bottom surface on opposite sides, the bottom surface of the signal adapter plate facing the test circuit board, the signal adapter plate including a second light-transmitting portion located in the wafer test area, the signal adapter plate having a plurality of external pads on the top surface and a plurality of connection pads on the bottom surface; the plurality of external pads are positioned in the wafer test area and arranged along the periphery of the second light transmission part, and the plurality of connecting pads are positioned in the signal pressing area and are respectively and electrically coupled with the plurality of external pads and the plurality of metal pads of the test circuit board; and

a probe head disposed above the top surface of the signal adapter plate, the probe head comprising:

a positioning base body, which comprises a third light-transmitting part positioned in the wafer testing area; and

the plurality of conductive probes penetrate through the positioning base body and are arranged along the periphery of the third light-transmitting part; one end of each of the plurality of conductive probes penetrates through the positioning base body and is respectively abutted against the plurality of external connecting pads of the signal adapter plate, and the other end of each of the plurality of conductive probes penetrates through the positioning base body and is used for abutting against an object to be tested;

the probe card testing device can be used for receiving a light ray, enabling the light ray to sequentially penetrate through the first light-transmitting part, the second light-transmitting part and the third light-transmitting part and then irradiate the object to be tested so as to generate a photoelectric sensing signal.

2. The probe card testing apparatus of claim 1, wherein at least one of the conductive probes is capable of receiving the photo sensing signal and transmitting the photo sensing signal to the test circuit board through the corresponding external pads, the corresponding connecting pads, and the corresponding metal pads.

3. The probe card testing apparatus of claim 1, wherein a length of said one end of each of said electrically conductive probes is perpendicular to said top surface of said signal interposer.

4. The probe card testing apparatus of claim 1, wherein a middle portion of the third light-transmitting portion of the positioning base body of the probe head is not provided with any conductive probe.

5. The probe card testing device of claim 1, wherein the signal interposer has a plurality of interposer pads and a plurality of outer layer traces disposed on the top surface, the interposer pads are disposed in the signal pressing region, the outer layer traces are disposed across the chip testing region and the signal pressing region, and the outer pads are electrically connected to the interposer pads through the outer layer traces, respectively.

6. The probe card testing apparatus of claim 1, further comprising an electrical connection module sandwiched between the test circuit board and the signal interposer, the electrical connection module comprising:

the spacing plate comprises a fourth light-transmitting part positioned in the wafer testing area and a plurality of through holes positioned in the signal pressing area; and

the vertical conductive structures are respectively arranged in the through holes of the spacing plate;

the fourth light transmission part is positioned on a light transmission path formed by the first light transmission part, the second light transmission part and the third light transmission part, and the connecting pads of the signal adapter plate are electrically connected with the metal pads of the test circuit board through the vertical conductive structures respectively to form an electric transmission path.

7. The probe card testing apparatus of claim 6, further comprising a hold down structure, the hold down structure comprising:

the pressing plate is arranged on the top surface of the signal adapter plate and comprises a screw hole positioned in the signal pressing area; and

and the screw penetrates through the screw hole of the pressing plate so as to fix the pressing plate on the signal adapter plate.

8. The probe card testing apparatus of claim 7, wherein the screws further penetrate the signal interposer, the electrical connection module, and the test circuit board along a thickness direction of the signal interposer, such that the pressing plate presses the signal interposer, the electrical connection module, and the test circuit board, and such that two ends of the vertical conductive structures are respectively pressed against the connection pads and the metal pads; wherein any electrical transmission path between the test circuit board and the signal patch panel is not realized with a solder material.

9. The probe card testing device of claim 1, wherein the signal interposer further has a solder mask layer on a top surface thereof, and the solder mask layer covers the plurality of bonding pads.

10. A probe card testing apparatus, wherein the probe card testing apparatus defines a wafer testing area and a signal pressing area located at the periphery of the wafer testing area, and the probe card testing apparatus comprises:

the test circuit board comprises a first blank part positioned in the wafer test area and a plurality of metal pads arranged in the signal pressing area;

the signal adapter plate is provided with a top surface and a bottom surface which are positioned on the opposite sides, the bottom surface of the signal adapter plate faces the test circuit board, the signal adapter plate comprises a second blank part positioned in the wafer test area, the top surface of the signal adapter plate is provided with a plurality of external connection pads, and the bottom surface of the signal adapter plate is provided with a plurality of connection pads; the plurality of external pads are positioned in the chip test area and arranged along the periphery of the second blank part, and the plurality of connecting pads are positioned in the signal pressing area and are respectively and electrically coupled with the plurality of external pads and the plurality of metal pads of the test circuit board; and

a probe head disposed above the top surface of the signal adapter plate, the probe head comprising:

a positioning base body, which comprises a third blank part positioned in the wafer testing area; and

a plurality of conductive probes which are arranged on the positioning base in a penetrating way and are arranged along the periphery of the third blank part; one end of each of the plurality of conductive probes penetrates through the positioning base body and is respectively abutted against the plurality of external connecting pads of the signal adapter plate, and the other end of each of the plurality of conductive probes penetrates through the positioning base body and is used for abutting against an object to be tested;

wherein a length direction of each conductive probe is perpendicular to the top surface of the signal transfer board, and no conductive probe is arranged at a middle part of the third blank part of the positioning seat body of the probe head.

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