200949256 九、發明說明： 【發明所屬之技術領域】 種且有鏡頭 本發明是一種關於探針卡之技術領域，特別是指一 組且用於測試影像感測晶片之探針卡。 【先前技術】 Ο ❹ -般測試半導體晶片之探針卡，主要是作為測試機台與半導 體晶片之間的連接物件，由測試機台提供電壓使半導體晶片產生 相對電性碱而進行戦。但是若為絲勤叫㈤如^ CMOS)的測試，賴制試光_朗影像感測晶片之光學感應 區，晶片时練之騎會產生概肢，城生概訊號靖 連接的探針卡及測試機台處。由於與習用―般探針卡的要求不 同，於是就有人設計了專驗影像_晶片之探針卡。 此類用於影佩W之探針卡，主钟殊之處是在電路板 上具有-開口，使得外部的光線能照射至内部， 像感測晶㈣需之光線。目前外部光線的照射方式，是錢= -光源於探針卡的上方位置，此光源内部具有特殊的結構，當光 源發㈣光線是呈似平行光照射，大部份光線除了會經預先設定 路徑由電路板之開口處進人’到達電路板下方_試區，但 部=線會繼t姆椒咐，佛 — :，研崎，軸㈣物。糊編㈣ 時會對測試光線有特殊須求，例如是否能對不可見光(紅外線） 200949256 感應’此部份是為了罐保影像感測晶片在夜間仍能正常運作。此 時職光賴必難行更換錢財赠備加_助，非常麻項 又不方便。因此本創作人則思考設計另一種結構，使得用於測試 衫像感測晶片之探針卡在使用上更為方便，品質更好。 【發明内容】 本發明之主要目的是提供-種具有鏡頭組且能胁測試影像 〇 —狀探針卡，主要是探針相部具有醜組歸光線作有 效的處理與雜，讓最後投射前mf彡像—4的光線最符合 測試條件，藉此讓影像感測晶片的測試之準確度更加提高。 本發明之次要目的;I:提供—種祕測試影佩測晶丨之探針 卡’由於補作之探針卡具有-鏡数，該鏡雜能將光線作有 效的處理及聚焦’因此燈光單元產生光線後，即光線不須再經特 ©殊的處理，如此能簡紐光單元的結構，使探針卡在料上更為 簡單。 目献提n祕峨影像制晶片之垂直 式探針卡，該探針卡内部可採用彈簧式探針(spring pr〇be)或垂 直式可撓《WWertical Bending PrGbe)，g&合本發明所使用 之鏡頭組’與位於·板之視窗，構成—_制試影像感測晶 片之創新的垂直式探針卡。 200949256 * 為達成前述之目的，本發明包含有一電路板、一第一固定單 元複數探針、-第二固定單元、以及一燈光單元。該電路板具 f-=窗，該第-固定單元結合於電路板下面，但未將該視窗遮 蔽刖述複數探針是被第一固定單元定位於電路板下方位置。該 第一固疋單兀結合於電路板上面。該鏡頭組則受該第二固定單元 固疋而位於電路板的上綠置，該鏡頭組並對應著前述視窗的所 在位置。另外該燈光單元設置於第二固定單元頂面，燈光單元能 ®產生適當的光線。如此即為本發明用於測試影像感測晶片之探針 卡。 另外本發狀探針卡所制的的探針麟單—型式，可依不 同的須求選用合適的探針’而所使用的探針則可為彈簣式探針、 垂直式可撓曲探針、懸臂式探針(cantilever pr〇be)等，藉此增 加本發明的適用範圍。 ❹ 【實施方式】 兹配合下狀圖示制本發明之詳細結構及其連結關係俾 使熟習該項技術領域者在研讀核明書後能據以實施。 請參閱第-圖所示，係為本創作之結構剖面示意圖。本創作 之探針卡A主要包含有-電路板1G、_第—固定單元2()、複數根 探針30、-第二固定單元40、一鏡頭組5〇、以及一燈光單元6〇 所構成。在圖中鏡頭組50與燈光單元6〇並未以剖面圖表示。該 7 200949256 Ο ❹200949256 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to the field of probe cards, and more particularly to a set of probe cards for testing image sensing wafers. [Prior Art] The probe card of the semiconductor wafer is generally tested as a connection object between the test machine and the semiconductor wafer, and the voltage is supplied from the test machine to cause the semiconductor wafer to generate a relatively alkaline alkali. However, if it is a test of the silk (5) such as ^ CMOS), the optical sensing area of the test light _ 朗 image sensing chip, the riding of the wafer will produce an integrated limb, the probe card of the city connection signal Test machine. Because of the different requirements from the conventional probe card, someone has designed a probe card for the image_chip. This kind of probe card used to admire W, the main difference is that there is an opening on the circuit board, so that the external light can be radiated to the inside, like the light required to sense the crystal (4). At present, the external light is irradiated in such a way that the light source is located above the probe card. The light source has a special structure inside. When the light source emits (four) light is illuminated in parallel light, most of the light will pass through a preset path. From the opening of the circuit board into the person 'reaching the bottom of the circuit board _ test area, but the Ministry = line will follow the t 咐 咐, Buddha — :, Yanqi, axis (four) objects. Paste (4) has special requirements for test light, such as whether it can be used for invisible light (infrared) 200949256. This part is for the canned image sensing chip to still operate normally at night. At this time, it is difficult for the job to change the money, and it is very inconvenient. Therefore, the creator thinks about designing another structure, which makes the probe card for testing the shirt-like sensing chip more convenient and better in use. SUMMARY OF THE INVENTION The main object of the present invention is to provide a lens set with a lens group and capable of testing an image 〇-like probe card, mainly because the probe phase has an ugly group of light for effective processing and mixing, so that the final projection is performed. The mf image--4 light is most suitable for the test conditions, thereby improving the accuracy of the image sensing wafer test. The secondary purpose of the present invention; I: provide a probe card for the test of the crystal-catching tester. Since the probe card has a mirror number, the mirror can effectively process and focus the light. After the unit generates light, the light does not need to be processed by special specials, so that the structure of the simple light unit makes the probe card more simple. A vertical probe card for image-forming wafers can be used. The probe card can be spring-loaded (spring pr〇be) or vertical flexible (WWertical Bending PrGbe), g& The lens group used and the window located in the board form an innovative vertical probe card for the image sensing chip. 200949256 * To achieve the foregoing objects, the present invention comprises a circuit board, a first fixed unit plurality of probes, a second fixed unit, and a light unit. The circuit board has an f-= window. The first-fixed unit is coupled to the underside of the circuit board, but the window is not obscured. The plurality of probes are positioned by the first fixed unit below the circuit board. The first solid unit is bonded to the upper surface of the circuit board. The lens group is fixed by the second fixing unit and placed on the upper side of the circuit board, and the lens group corresponds to the position of the window. In addition, the light unit is disposed on the top surface of the second fixed unit, and the light unit can generate appropriate light. Thus, the present invention is a probe card for testing an image sensing wafer. In addition, the probe single-type type of the hairpin probe card can be selected according to different requirements, and the probe used can be an elastic probe, vertical flexible A probe, a cantilever probe, or the like, thereby increasing the scope of application of the present invention.实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Please refer to the figure-picture, which is a schematic cross-section of the structure of the creation. The probe card A of the present invention mainly comprises a circuit board 1G, a _first fixing unit 2 (), a plurality of probes 30, a second fixing unit 40, a lens group 5 〇, and a light unit 6 〇 Composition. In the figure, the lens group 50 and the light unit 6A are not shown in a sectional view. The 7 200949256 Ο ❹
電路板ίο具有-第一表s i卜一第二表面12及一視窗13，該第 一表面11與第二表面12分別為電路板10上下呈相對的表面該 視窗13則貫穿該電路板10。該第一固定單元20結合於電路板1〇 的第二表面12處。該第一固定單元2〇鄰近視窗13且未將視窗13 遮蔽。複數探針30是被第一固定單元2〇固定於電路板1〇的下方 位置’但該探針30的一端（頂端）須與電路板1〇之第二表面丨2的 電路相電性連接’另一端(底端）則須延伸至第-固定單元20的下 方位置。該第二固定單元4〇是設置於電職1()㈣—表面^處。 該鏡頭組50採可調整方式被結合固定於第二固定單元40處，位 於電路板10的上綠置。該鏡馳5Q的位置並與視窗13相互對 應。該燈光單元60設置於第二固定單元4〇頂面，該燈光單元6〇 能產生適當的光線，該光線為—可見光。藉此，#本發針卡A 像感見a片之測試時，光線能透過鏡職Μ聚焦投射於影 像感測晶从，麟影_晶㈣縣佳㈣说 的測試品質。 风汁日日乃 以下就部份構件作更詳細的說明： 置定單元20用以將複數探針30固定電路板10下方位 !構=探針30的結構不同’該第1定單元20也為不同的 、“冓。在第-圖實施例中，該探針3〇 喊）。該彈簧式探㈣兩端分別具有外祕=件 8 200949256 31及一第二接觸件32，該第—接觸件31與第二接觸件32复中至 少一個具有可伸縮的彈性。在本實施中該第一接觸件31具有 縮的彈性。該第-固定單元2〇呈一環狀，在本實施例中為似四方 形中，的環形。該第—狀單元2()則是由—第—固餅〗卜—第 ❹ ❾ 口疋件22、以及-第二岐件23所構成，前述三構件採堆疊方 絲合在—起。該第—固定件21具有複數第-定位孔2U，該第 一定位孔211是小於前述彈簧式探針30身部的外徑但略大於第一 接觸件31的外彳雙^第二固定件22也具有複數第二定位孔2^，該 第二定位孔22i是對應㈣述彈簧式探針3〇身部的外徑。該^ 固定件23也具錢鄕三定位細，該第三定抓231是小於 铋針30身部的外徑但略大於第二接觸件％的外徑。該彈菁式探 軸定於與第—峡單處，但兩者之間無任何黏著劑 固定’正確說明是被彈簧式探針30被定位第-固定單元2〇 的各定位孔内。當在第—峡單元2{)各構件齡姐裝在一起 時，該彈簧式探針30身部、第—接觸件31、以及第二接觸件％ 則分於位於相對應之第二定位孔221、第一定位及第三定位 孔231内，如此彈簧式探針3〇雖被固定於第一固定單元别處， 第一接觸件21仍具可伸縮的彈性。 該鏡頭，，且50内部具有數片透鏡，能將光線聚焦投射於電路板 下方之測麵域，提供待測之影像_“最適當的光線。另外 200949256 該翻組50内部也能設置有許多功能不同的鏡片，以過遽不必要 的光波或使光波作有適當的處理。該第二固定單元4() _以將鏡 頭組50採可調整高度的方式言免置於冑路板1〇的上方位置。該第 二固定單元40是固定於電路板1〇的第一表面114。該第二固定 單兀40具有-調整區塊4卜在本實施例+，該調整區塊41是在 第二固定單元40接近中心區域的上下表面皆呈凹陷狀，形成—個 厚度較薄的區塊。該調整區塊41的厚度較第二固定單元4〇的最 ® A厚度薄。該調整區塊41並與上方的發光單元60及下方的第二 表面12之間各存在一間隙42、43。前述鏡頭組50則採螺紋方式 結合於調整區塊41處。該調整區塊41中心區域具有—内螺紋孔 411 ’該鏡頭組50圓周外圍具有外螺紋51，該鏡頭組5〇是以外螺 紋51與内螺紋孔411相螺合。當欲調整鏡頭组5〇之光線絲焦 距時，轉動該鏡頭組5〇即可產生上下的位移。 〇 該燈光單元6(3是結合於第二©定單元4G的頂部，提供測試 時所須之光線。該光線以平行光及可見光為佳。在本實施例中， 該燈光單元60内部具有至少—個以上的燈源61，該燈源61可為 發光二極體或其他光源，提供測試時適當亮度的光線。 如第二圖所示，本實施例之探針卡A用於測試影像感測晶片 之較佳實施_。本創狀探針卡A職職影像感測晶片9〇 200949256 時’該彈箦式探針30是以第二接觸件32與影像感測晶片9〇上表 面的線路相接觸。該燈光單元60由電路板1〇上方照射時，光線 先經鏡頭組50聚焦後’能使光線會經視窗13投射到影像感測晶 片90的光學感應區9卜光線的亮度與品質最接近影像感測晶片 90使用時的狀態，最後影像感測晶片9〇因受光線之照射而產生電 性變化，提供電性訊號予探針30、電路板1〇、最後至測試機台， 由測試機台進行相關的測試及資料處理。 0 如第三圖所示，為本發明的第二種實施例圖。在本實施例中 該抵針30A改為垂直式可撓曲探針(Vertical Bending 。 因此該第-固定單元20A也有些改變。其餘構件如電路板1〇、第 二固定單元40、鏡頭組50及燈光單元60乃與前述實施例相同。 忒第一固定單元20A形狀呈一環狀，在本實施例中為似四方形中 ❹空的環形。該第一固定單元20A是由-第-固定件21A、-第二固 定件22A、以及一第三固定件23A所構成，該第一固定件21 a具有 複數個第一定位孔211A，而第三固定件23A則具有數個第三定位 孔231A，該第一定位孔211A與第三定位孔231A的孔徑及孔型分 別與探針31A(垂直式可撓曲探針)接近兩端的區段外形相對應。該 疋位孔211A與第二疋位孔231A並不在同一中心線上。組裝 時則述探針31A接近兩端的區段外壁分別設置於該第一定位孔 211A與第三定位孔231A内。使該探針31A的一端是與該電路板 200949256 第四圖所示，為本發明第三種實施綱。在本實施例中該探 針30B為懸臂式探針(cantilever pr〇be)，因此該第一固定件· 也為不同的型,％。在本實施例中第—岐單元施呈環狀且底部 為斜面24 ’前述探針識則被固定於第一固定單元應之斜面^ 〇處。懸臂式探針30β 一端是與該電路板10之第二表面12的電路 、作電性連接，另一端延伸至該第-固定單元20Β的下方位置。在 本實施例中’ 雜1()仍具有—減13，職f 13上方位置 乃具有鏡頭組50及燈光單元6〇。 綜合以上所述，本發明之用於測試影像感測晶片之探針卡， 主要是在電路板處具有-視窗，視窗上方不同高度位置分別具有 ❾-可調整⑧度的鏡頭組’與能提供適當統的燈光單元。如此一 來，探針卡除了可進行影像感測晶片的測試外，光線經鏡頭組内 部處理及聚焦後，光線能投射於影像感測晶片最適當範圍内，提 供最佳測試的光線亮度與品質。另外探針卡也能由彈簧式探針、 垂直式可撓曲探針或懸臂式探針所構成，以符足不同使用者之需 求0 12 200949256 惟以上所述者，僅為本發明之較佳實施例而已，當不萨、 限定本發明實施之範圍，即大凡依本發明申請專利範圍所作之^ 等變化與修飾，皆應仍屬於本發明專利涵蓋之範圍内。 = 【圖式簡單說明】 第一圖係為本發明第一種實施例之結構剖面示意圖； 第二圖係為本發明之探針卡用於測試影像感測晶片之較佳實施例 圖； 〇 第二圖係為本發明之第二種實施例的結構剖面示意圖； 第四圖係為本發明之第三種實施例的結構剖面示意圖。 【主要元件符號說明】 A 探針卡 10電路板 11第一表面 12第二表面 13視窗 20第一固定單元 21第一固定件 211第一定位孔 22第二固定件 221第二定位孔 23第三固定件 231第三定位孔 20A第一固定單元 21A第一固定件 211A第一定位孔 22A第二固定件 23A第三固定件 231A第三定位孔 13 200949256 20B第一固定單元 24斜面 30探針 31第一接觸件 32第二接觸件 30A探針 30B探針 40第二固定單元 41結合區塊 411内螺紋孔 42間隙 43間隙 50鏡頭組 51外螺紋 60燈光單元 61燈源 90影像感測晶片 91光學感應區The circuit board ίο has a first surface s i a second surface 12 and a window 13. The first surface 11 and the second surface 12 are respectively opposite upper and lower surfaces of the circuit board 10, and the window 13 extends through the circuit board 10. The first fixing unit 20 is coupled to the second surface 12 of the circuit board 1A. The first fixing unit 2 is adjacent to the window 13 and does not obscure the window 13. The plurality of probes 30 are fixed to the lower position of the circuit board 1' by the first fixing unit 2' but the one end (top end) of the probe 30 must be electrically connected to the circuit of the second surface 2 of the circuit board 1 The other end (bottom end) must extend to the lower position of the first fixing unit 20. The second fixing unit 4 is disposed at the electric job 1 () (four) - surface ^. The lens group 50 is fixedly coupled to the second fixing unit 40 in an adjustable manner, and is disposed on the upper side of the circuit board 10. The mirror is in a position of 5Q and corresponds to the window 13. The light unit 60 is disposed on the top surface of the second fixing unit 4, and the light unit 6 〇 can generate appropriate light, which is visible light. In this way, when the test of the hairpin A is like the test of the a film, the light can be projected through the mirror to focus on the image sensing crystal, and the quality of the test is described by Lin Ying_jing (4) County Jia (4). The wind juice is described in more detail below for some components: The setting unit 20 is used to fix the plurality of probes 30 to the lower direction of the circuit board 10; the structure of the probe 30 is different. The first fixed unit 20 is also For the different, "冓. In the first embodiment, the probe 3 screams." The spring type probe (four) has two external ends = member 8 200949256 31 and a second contact member 32, the first - At least one of the contact member 31 and the second contact member 32 has a retractable elasticity. In the present embodiment, the first contact member 31 has a contracted elasticity. The first fixing unit 2 is formed in a ring shape, in this embodiment. The middle is a ring shaped like a square. The first unit 2() is composed of a first-solid cake, a second member 22, and a second member 23, and the third member The first fixing hole 21 has a plurality of first positioning holes 2U which are smaller than the outer diameter of the body of the spring type probe 30 but slightly larger than the first contact piece 31. The outer casing double second fixing member 22 also has a plurality of second positioning holes 2^, which are corresponding to the (four) spring type probes. The outer diameter of the body. The fixing member 23 is also thinly positioned, and the third fixed grip 231 is smaller than the outer diameter of the body of the pick 30 but slightly larger than the outer diameter of the second contact. The type of probe is fixed at the same place as the first gorge, but there is no adhesive fixing between the two. The correct description is that the spring type probe 30 is positioned in each positioning hole of the first fixing unit 2 。. When in the first When the gorge unit 2{) is assembled with the older members, the spring-type probe 30 body, the first contact member 31, and the second contact member % are respectively located in the corresponding second positioning holes 221, first In the positioning and the third positioning hole 231, the spring contact probe 3 is fixed to the first fixing unit, and the first contact member 21 has elasticity and elasticity. The lens has 50 lenses inside. The light can be focused on the measurement area below the board to provide the image to be tested _ "the most appropriate light. In addition, 200949256 can also be equipped with many different lenses in the inside of the flip 50 to eliminate unnecessary light waves or to properly handle the light waves. The second fixing unit 4 () _ is placed at a position above the boring plate 1 以 in such a manner that the lens group 50 is adjustable in height. The second fixing unit 40 is fixed to the first surface 114 of the circuit board 1A. The second fixing unit 40 has an adjustment block 4 in the embodiment +, and the adjustment block 41 is concave on the upper and lower surfaces of the second fixing unit 40 near the central area to form a thinner thickness. Block. The thickness of the adjustment block 41 is thinner than the thickness of the most ® A of the second fixing unit 4A. The adjustment block 41 has a gap 42 and 43 between the upper light-emitting unit 60 and the lower second surface 12. The aforementioned lens group 50 is threadedly coupled to the adjustment block 41. The central portion of the adjustment block 41 has an internal threaded hole 411'. The peripheral portion of the lens group 50 has an external thread 51. The lens group 5 is screwed by the external thread 51 and the internally threaded hole 411. When you want to adjust the focal length of the lens group 5〇, turn the lens group 5〇 to generate the up and down displacement. The light unit 6 (3 is coupled to the top of the second letter unit 4G to provide the light required for the test. The light is preferably parallel light and visible light. In the embodiment, the light unit 60 has at least the inside. More than one light source 61, which may be a light emitting diode or other light source, providing light of appropriate brightness during the test. As shown in the second figure, the probe card A of the present embodiment is used for testing the image sense. The preferred embodiment of the test chip _. The present invention is the use of the second contact member 32 and the image sensing chip 9 on the upper surface of the image sensor chip When the light unit 60 is illuminated by the upper side of the circuit board 1 , the light is first focused by the lens group 50 to enable the light to be projected through the window 13 to the optical sensing area of the image sensing chip 90. The quality is closest to the state in which the image sensing wafer 90 is used. Finally, the image sensing wafer 9 is electrically changed by the irradiation of the light, and the electrical signal is supplied to the probe 30, the circuit board, and finally to the testing machine. , conducted by the test machine and related tests Data Processing 0 As shown in the third figure, a second embodiment of the present invention is shown. In the present embodiment, the abutting pin 30A is changed to a vertical flexible probe (Vertical Bending. Therefore, the first fixed unit The other components such as the circuit board 1A, the second fixing unit 40, the lens group 50, and the light unit 60 are the same as the foregoing embodiment. The first fixing unit 20A has a ring shape, in this embodiment. The first fixing unit 20A is composed of a first-fixing member 21A, a second fixing member 22A, and a third fixing member 23A, and the first fixing member 21a has a ring shape. The plurality of first positioning holes 211A, and the third fixing member 23A has a plurality of third positioning holes 231A, and the apertures and hole patterns of the first positioning holes 211A and the third positioning holes 231A are respectively opposite to the probe 31A (vertical type The flexural probe has a shape corresponding to the segment at both ends. The clamp hole 211A and the second clamp hole 231A are not on the same center line. When assembling, the outer wall of the probe 31A near the both ends is respectively disposed on the first a positioning hole 211A and a third positioning hole 231A. The probe 31A is made One end of the circuit board 200949256 is shown in the fourth figure, which is a third embodiment of the present invention. In the embodiment, the probe 30B is a cantilever probe, so the first fixing member · Also in different types, %. In this embodiment, the first unit is annular and the bottom is beveled 24'. The probe is fixed to the inclined surface of the first fixed unit. Cantilever probe 30β One end is electrically connected to the circuit of the second surface 12 of the circuit board 10, and the other end extends to a position below the first fixing unit 20A. In the present embodiment, the 'mix 1() still has - minus 13, The position above the job f 13 has a lens group 50 and a light unit 6〇. In summary, the probe card for testing an image sensing chip of the present invention mainly has a window at a circuit board, and a lens group of 8 degrees can be adjusted at different height positions above the window. A properly integrated lighting unit. In this way, in addition to the test of the image sensing chip, after the light is processed and focused by the lens group, the light can be projected into the optimal range of the image sensing chip to provide the brightness and quality of the best tested light. . In addition, the probe card can also be composed of a spring-type probe, a vertical flexible probe or a cantilever probe to meet the needs of different users. 0 12 200949256 However, the above is only the comparison of the present invention. The preferred embodiments are intended to be within the scope of the invention as defined by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic cross-sectional view of a first embodiment of the present invention; the second drawing is a preferred embodiment of the probe card of the present invention for testing an image sensing chip; 2 is a schematic cross-sectional view showing a structure of a second embodiment of the present invention; and FIG. 4 is a schematic cross-sectional view showing a structure of a third embodiment of the present invention. [Main component symbol description] A probe card 10 circuit board 11 first surface 12 second surface 13 window 20 first fixing unit 21 first fixing member 211 first positioning hole 22 second fixing member 221 second positioning hole 23 Third fixing member 231 Third positioning hole 20A First fixing unit 21A First fixing member 211A First positioning hole 22A Second fixing member 23A Third fixing member 231A Third positioning hole 13 200949256 20B First fixing unit 24 Bevel 30 probe 31 first contact 32 second contact 30A probe 30B probe 40 second fixing unit 41 joint block 411 inner threaded hole 42 gap 43 gap 50 lens group 51 external thread 60 light unit 61 light source 90 image sensing wafer 91 optical sensing area
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