CN111606578B - Temperable low-reflection double-silver low-emissivity coated glass and preparation method thereof - Google Patents

Abstract

The invention discloses a temperable low-reflection double silver low-emissivity coated glass and a preparation method thereof. The temperable low-reflection double-silver low-emissivity coated glass includes a glass substrate and a composite film layer plated on the glass substrate. The composite film layer includes a first dielectric layer, a tungsten-copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, and a second dielectric layer, which are arranged in sequence. Seed layer, second functional layer, third protective layer, second AZO layer, third dielectric layer; the first dielectric layer is a SiN _x layer, and the second dielectric layer is a ZnO _x layer or SiN _x layer or a composite layer thereof , the third dielectric layer is a SiN _x layer or a SiO _x layer or a SiN _x O _y layer or a composite layer thereof, the first seed layer and the second seed layer are ZnO _x layers, the first functional layer and the third The second functional layer is an Ag layer, and the first protective layer, the second protective layer and the third protective layer are NiCr layers. The glass provided by the invention has the advantages of low reflectivity, neutral transmission color and stable color of the film layer.

Description

A kind of temperable low-reflection double silver low-emissivity coated glass and its preparation method

Technical field

The invention relates to the technical field of coated glass manufacturing, and in particular to a temperable low-reflection double silver low-emissivity coated glass and a preparation method thereof.

Background technique

In the existing technology, low-radiation coated glass generally refers to depositing a low-radiation functional layer on the surface of float glass, thereby reflecting the near-infrared rays in sunlight and the far-infrared rays in the living environment, thereby reducing the absorption and radiation of infrared rays by the glass. The effect is so called low-emissivity coated glass.

Low-emissivity coated glass can be used not only for home doors and windows, but also for glass curtain walls in shopping malls, office buildings, high-end hotels and other places where needed. With the large-scale use of traditional low-emissivity coated glass, due to its high reflectivity of visible light, "light pollution" has become an urgent problem that plagues urban residents. In order to reduce this "light pollution" phenomenon caused by the large-scale use of glass curtain walls, local governments have promulgated policies and regulations to restrict the external reflection of building glass.

Because the current low-emissivity coated glass that can be heat treated at high temperatures can be bent, it can better express the architectural design concept. On the other hand, it can also significantly reduce production and processing costs, so it has become a more common type on the market. product. Although recent buildings using tempered coated glass appear to vary in color when viewed from a distance, when viewed up close, they all appear to be a more obvious, unified blue-green or yellow-green color.

The reason why the transmitted color of temperable coating products is obviously greenish is that the composite nano-film layer they are plated needs to withstand high temperatures for a long time, so sufficient protective layers (such as silicon nitride SiN _x and NiCr alloy layer NiCr to protect the low-emissivity silver layer). These protective layers selectively transmit green light, causing the color of the common temperable coating products on the market to appear light green, affecting human visual effects.

Contents of the invention

The purpose of the present invention is to provide a temperable low-reflection double-silver low-emissivity coated glass and a preparation method thereof, aiming to solve the problem that the performance of the existing temperable low-emissivity coated glass still needs to be improved.

Embodiments of the present invention provide a temperable low-reflection double-silver low-emissivity coated glass, which includes a glass substrate and a composite film layer coated on the glass substrate. The composite film layer includes a first dielectric layer, a tungsten layer, and a tungsten layer. Copper alloy layer, first protective layer, first seed layer, first functional layer, second protective layer, first AZO layer, second dielectric layer, second seed layer, second functional layer, third protective layer, third The second AZO layer and the third dielectric layer;

The first dielectric layer is a SiN _x layer, the second dielectric layer is a ZnO _x layer or SiN _x layer or a composite layer thereof, and the third dielectric layer is a SiN _x layer or SiO _x layer or a SiN _x O _y layer or a composite layer thereof. Composite layer, the first seed layer and the second seed layer are ZnO _x layers, the first functional layer and the second functional layer are Ag layers, the first protective layer, the second protective layer and the third protective layer is the NiCr layer.

Further, the thickness of the first dielectric layer is 26-38 nm, the thickness of the second dielectric layer is 50-90 nm, and the thickness of the third dielectric layer is 40-60 nm.

Further, the thickness of the first seed layer and the second seed layer is 15-20 nm.

Further, the thickness of the first functional layer is 9-15 nm.

Further, the thickness of the second functional layer is 6 to 18 nm.

Further, the thickness of the first protective layer is 2-4 nm, the thickness of the second protective layer is 1-4 nm, and the thickness of the third protective layer is 1-6 nm.

Further, the thickness of the tungsten copper alloy layer is 6 to 12 nm.

Further, the thickness of the first AZO layer and the second AZO layer is 8-10 nm.

Embodiments of the present invention also provide a method for preparing temperable low-reflection double silver low-e coating glass as described above, which includes:

Plating a first dielectric layer on the glass substrate, the first dielectric layer being a SiN _x layer;

plating a tungsten copper alloy layer on the first dielectric layer;

Plating a first protective layer on the tungsten-copper alloy layer, the first protective layer being a NiCr layer;

Plating a first seed layer on the first protective layer, the first seed layer being a ZnO _x layer;

plating a first functional layer on the first seed layer, where the first functional layer is an Ag layer;

A second protective layer is plated on the first functional layer, and the second protective layer is a NiCr layer;

plating a first AZO layer on the first protective layer;

A second dielectric layer is plated on the first AZO layer, and the second dielectric layer is a ZnO _x layer or a SiN _x layer or a composite layer thereof;

Plating a second seed layer on the second dielectric layer, the second seed layer being a ZnO _x layer;

plating a second functional layer on the second seed layer, and the second functional layer is an Ag layer;

A third protective layer is plated on the second functional layer, and the third protective layer is a NiCr layer;

Plating a second AZO layer on the third protective layer;

A third dielectric layer is plated on the second AZO layer, and the third dielectric layer is a SiN _x layer or a SiO _x layer or a SiN _x O _y layer or a composite layer thereof.

Furthermore, the plating adopts magnetron sputtering process.

Embodiments of the present invention provide a temperable low-reflection double-silver low-emissivity coated glass and a preparation method thereof. The temperable low-reflection double-silver low-emissivity coated glass includes a glass substrate and a composite film layer plated on the glass substrate. , the composite film layer includes a first dielectric layer, a tungsten copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, The second seed layer, the second functional layer, the third protective layer, the second AZO layer, and the third dielectric layer; the first dielectric layer is a SiN _x layer, and the second dielectric layer is a ZnO _x layer or a SiN _x layer or a combination thereof. Composite layer, the third dielectric layer is a SiN _x layer or SiO _x layer or a SiN _x O _y layer or a composite layer thereof, the first seed layer and the second seed layer are ZnO _x layers, and the first functional layer The second functional layer is an Ag layer, and the first protective layer, the second protective layer and the third protective layer are NiCr layers. The glass provided by embodiments of the present invention has the advantages of low reflectivity, neutral transmission color, and stable color of the film layer.

Description of the drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention, which are of great significance to this field. Ordinary technicians can also obtain other drawings based on these drawings without exerting creative work.

Figure 1 is a schematic structural diagram of a temperable low-reflection double silver low-e coating glass provided by an embodiment of the present invention;

FIG. 2 is a schematic flow chart of a method for preparing temperable low-reflection double silver low-e coating glass according to an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

It should be understood that, when used in this specification and the appended claims, the terms "comprises" and "comprises" indicate the presence of described features, integers, steps, operations, elements and/or components but do not exclude the presence of one or The presence or addition of multiple other features, integers, steps, operations, elements, components and/or collections thereof.

It should also be understood that the terminology used in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly dictates otherwise.

It will be further understood that the term "and/or" as used in the specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items. .

Please refer to Figure 1. A temperable low-reflection double-silver low-emissivity coated glass provided by an embodiment of the present invention includes a glass substrate 101 and a composite film layer coated on the glass substrate 101. The composite film layer includes in sequence The first dielectric layer 102, the tungsten copper alloy layer 103, the first protective layer 104, the first seed layer 105, the first functional layer 106, the second protective layer 107, the first AZO layer 108, the second dielectric layer 109, The second seed layer 110, the second functional layer 111, the third protective layer 112, the second AZO layer 113, and the third dielectric layer 114;

The first dielectric layer 102 is a SiN _x layer, the second dielectric layer 109 is a ZnO _x layer or a SiN _x layer or a composite layer thereof, and the third dielectric layer 114 is a SiN _x layer or SiO _x layer or SiN _x O _y layer or its composite layer, the first seed layer 105 and the second seed layer 110 are ZnO _x layers, the first functional layer 106 and the second functional layer 111 are Ag layers (i.e. silver layers), the first The protective layer 104, the second protective layer 107 and the third protective layer 112 are NiCr layers (ie, nickel-chromium alloy layers).

The embodiment of the present invention uses the tungsten-copper alloy layer 103 as a sandwich layer to reduce the reflectivity of LOW-E (low-emissivity) glass products and improve the transmittance color and emissivity of LOW-E glass products; Ag is used as the first functional layer 106 and the second functional layer 111 to improve the emissivity of LOW-E glass products, and ultimately achieve LOW-E glass products with ultra-low visible light reflectivity and neutral transmission color. In general, the glass provided by embodiments of the present invention has the advantages of low reflectivity, neutral transmission color, and stable color of the film layer.

Specifically, embodiments of the present invention use tungsten-copper alloy as the sandwich layer. Tungsten-copper alloy absorbs visible light rather than reflecting it, which can reduce the reflectance of visible light. In addition, metallic tungsten has full-spectrum absorption characteristics, so even adding tungsten-copper alloy will not cause the color of the glass to change greatly, which is beneficial to the stability of production.

In addition, copper has the effect of selectively absorbing visible light, which can make the transmission color of the glass provided in the embodiment of the present invention into a neutral tone, solving the problem of greenish transmission color of traditional tempered glass products.

In the embodiment of the present invention, a first protective layer 104 (NiCr layer) is plated on the tungsten-copper alloy layer 103, which can improve the anti-oxidation, anti-scratch and high-temperature resistance of the temperable low-reflection double silver low-emissivity coated glass. , and the NiCr layer makes the glass product have a good inhibitory effect on typical surface defects, such as disk printing, suction cup printing, pressure roller printing, etc.

In the embodiment of the present invention, using _ZnO The quality of the layers will be poorer, which will result in reduced performance of the low-e glass.

In the embodiment of the present invention, the second dielectric layer 109 can be a ZnO _x layer or a SiN _x layer, preferably a composite layer of ZnO _x and SiN _x . Since ZnO _x has the lowest extinction coefficient K value, ZnO _x is added to the dielectric layer. It can relatively increase the transmittance of the film layer and reduce the visible light reflectance.

Further, the thickness of the first dielectric layer 102 is 26-38 nm, the thickness of the second dielectric layer 109 is 50-90 nm, and the thickness of the third dielectric layer 114 is 40-60 nm. Using a dielectric layer of the above thickness, combined with other layers, can improve the performance of glass products.

Further, the thickness of the first seed layer 105 and the second seed layer 110 is 15-20 nm. Using a seed layer of the above thickness can improve the quality of the functional layer deposited thereon, thereby improving product performance.

Further, the thickness of the first functional layer 106 is 9-15 nm. The thickness of the second functional layer 111 is 6-18 nm. Functional layers of the above thickness are deposited on corresponding seed layers respectively, thereby improving the radiation rate.

Further, the thickness of the first protective layer 104 is 2-4 nm, the thickness of the second protective layer 107 is 1-4 nm, and the thickness of the third protective layer 112 is 1-6 nm. Using the protective layer with the above thickness can improve the protection effect for the corresponding tungsten copper alloy layer 103, the first functional layer 106 and the second functional layer 111.

Further, the thickness of the tungsten-copper alloy layer 103 is 6-12 nm. The tungsten-copper alloy layer 103 with this thickness can better improve the transmittance color and emissivity of LOW-E glass products.

Further, the thickness of the first AZO layer 108 and the second AZO layer 113 is 8-10 nm. AZO is aluminum doped with zinc oxide. Adding an AZO layer can improve the final performance of glass products.

Embodiments of the present invention also provide a method for preparing temperable low-reflection double silver low-e coating glass as described above, as shown in Figure 2, which includes:

S101. Plate a first dielectric layer on the glass substrate, and the first dielectric layer is a SiN _x layer;

S102. Plate a tungsten-copper alloy layer on the first dielectric layer;

S103. Plate a first protective layer on the tungsten-copper alloy layer, and the first protective layer is a NiCr layer;

S104. Plate a first seed layer on the first protective layer, and the first seed layer is a ZnO _x layer;

S105. Plate a first functional layer on the first seed layer, and the first functional layer is an Ag layer;

S106. Plate a second protective layer on the first functional layer, and the second protective layer is a NiCr layer;

S107. Plate the first AZO layer on the first protective layer;

S108. Plate a second dielectric layer on the first AZO layer, and the second dielectric layer is a ZnO _x layer or a SiN _x layer or a composite layer thereof;

S109. Plate a second seed layer on the second dielectric layer, and the second seed layer is a ZnO _x layer;

S110. Plate a second functional layer on the second seed layer, and the second functional layer is an Ag layer;

S111. Plate a third protective layer on the second functional layer, and the third protective layer is a NiCr layer;

S112. Plate the second AZO layer on the third protective layer;

S113. Plate a third dielectric layer on the second AZO layer, and the third dielectric layer is a SiN _x layer, a SiO _x layer, a SiN _x O _y layer, or a composite layer thereof.

Furthermore, the plating adopts magnetron sputtering process. The magnetron sputtering process has the advantages of high deposition rate, low substrate deposition temperature, good film adhesion, easy control, low cost, and can realize large-area film production.

The thickness of each layer involved in the above preparation method is the same as the thickness of the previous glass product, and will not be described again.

The temperable low-reflection double silver low-e coating glass obtained by the embodiment of the present invention can be tempered. The specific process of tempering treatment is:

Place the temperable low-reflection double silver low-e coating glass in a tempering furnace. The heating temperature of the coated surface of the glass substrate is 670-700°C. The heating temperature of the non-coated surface is lower than the coated surface temperature, which is 670-680°C. This is because The film layer is a low-emissivity coating, and its performance determines that the heat absorption capacity of the film layer is not as strong as that of the non-coated surface. In order to ensure that the heat absorption of the coated surface and the non-coated surface is consistent and to avoid the glass from being burned during the tempering process, the temperature of the coated surface needs to be high. on the non-coated surface.

Example:

The first dielectric layer is plated on the glass substrate using a magnetron sputtering process: under the control of a medium-frequency AC power supply, the silicon target is placed in a mixed atmosphere of argon and nitrogen (Ar:N ₂ =9:7, volume ratio, the same below) ), deposit a first dielectric layer (SiN _x layer) with a film thickness of 41nm;

A magnetron sputtering process is used to plate a tungsten-copper alloy layer on the first dielectric layer: under the control of a DC power supply, the tungsten-copper alloy target is sputtered and deposited in a pure argon atmosphere, and the tungsten copper layer with a thickness of 7.8nm is deposited. alloy layer;

The magnetron sputtering process is used to plate the first protective layer on the tungsten-copper alloy layer: under the control of the DC power supply, the NiCr target is sputtered and deposited in an argon atmosphere, and the first protective layer with a thickness of 3nm is deposited ( NiCr layer);

Using a magnetron sputtering process, the first seed layer is plated on the first protective layer: under the control of a medium-frequency AC power supply, the ZnAl target is placed in a mixed atmosphere of argon and oxygen (Ar:O ₂ =7:10, volume ratio, The same below) sputtering deposition, depositing the first seed layer (ZnO _x layer) with a film thickness of 17.3nm;

The magnetron sputtering process is used to plate the first functional layer on the first seed layer: under the control of a DC power supply, the Ag target is sputtered and deposited in a pure argon atmosphere, and the first functional layer is deposited with a film thickness of 12.5nm. layer (Ag layer);

The magnetron sputtering process is used to plate a second protective layer on the first functional layer: under the control of a DC power supply, the NiCr target is sputtered and deposited in an argon atmosphere, and a second protective layer with a film thickness of 2.6nm is deposited. (NiCr layer);

The first AZO layer is plated on the second protective layer using a magnetron sputtering process: under the control of a medium-frequency AC power supply, the AZO target is sputtered and deposited in an argon atmosphere, and the first AZO layer with a film thickness of 9.2nm is deposited. layer;

Using a magnetron sputtering process, a second dielectric layer is plated on the first AZO layer: under the control of a medium-frequency AC power supply, the silicon target is sputtered in a mixed atmosphere of argon and nitrogen (Ar:N ₂ =9:7) Deposition, deposit a second dielectric layer (SiN _x layer) with a film thickness of 75.3nm;

Using a magnetron sputtering process, a second seed layer is plated on the second dielectric layer: under the control of a medium-frequency AC power supply, the Zn target is sputtered in a mixed atmosphere of argon and oxygen (Ar:O ₂ =7:10) Deposition, depositing a second seed layer (ZnO _x layer) with a film thickness of 13.8nm;

The magnetron sputtering process is used to plate the second functional layer on the second seed layer: under the control of the DC power supply, the Ag target is sputtered and deposited in a pure argon atmosphere, and the second functional layer is deposited with a film thickness of 13.2nm. layer (Ag layer);

The magnetron sputtering process is used to coat the third protective layer on the second functional layer: under the control of a DC power supply, the NiCr target is sputtered and deposited in an argon atmosphere, and a third protective layer with a film thickness of 3.2nm is deposited. (NiCr layer);

The magnetron sputtering process is used to coat the second AZO layer on the second protective layer: under the control of a medium-frequency AC power supply, the AZO target is sputtered and deposited in an argon atmosphere, and the second AZO layer with a film thickness of 8.5nm is deposited. layer;

The magnetron sputtering process is used to coat the third dielectric layer on the second AZO layer: under the control of a medium-frequency AC power supply, the silicon target is sputtered and deposited in a mixed atmosphere of argon and nitrogen (Ar:N ₂ =9:7) , deposit a third dielectric layer (SiN _x layer) with a film thickness of 53.4nm;

The color of the glass prepared in this embodiment before tempering is shown in Table 1: the color after tempering is shown in Table 2.

Among them, the "tempered front glass surface" in Table 1 refers to the uncoated side of the prepared low-e glass before tempering, the "pre-tempered film surface" refers to the coated side of the prepared low-e glass before tempering, and "transparent before tempering" It refers to the visible light transmittance of the prepared low-emissivity glass before tempering (color transmission: for example, if you look at a colorless or white object through coated glass, the object will appear colored), and the "tempered front side" refers to the prepared low-emissivity glass. The side of the radiant glass before tempering. Where R refers to the visible light reflectance, g is the abbreviation of glass (glass), here refers to the glass surface, for example: R%g refers to the visible light reflectance of the glass surface, f is the abbreviation of film (film), here refers to the film surface, for example: R%f refers to the visible light reflectance of the film surface, T refers to the visible light transmittance, c refers to the side, for example: R%c refers to the visible light reflectance of the side, L* is the metric brightness, The size is between 0 and 100; a*b* is a metric chromaticity, the a* axis is the red and green axis, positive is red, negative is green, the b* axis is the yellow and blue axis, positive is yellow, and negative is blue. Correspondingly, the data in Table 2 are test data after tempering.

Table 1

Table 2

Optical performance test:

Before tempering, the emissivity of a single piece of low-e coating glass is 0.031, the glass surface reflectance is 5.03%, and the visible light transmittance is 43.2%;

The test results after tempering show that the emissivity of a single piece of low-emissivity coated glass is 0.025, the glass surface reflectance is 6.95%, and the visible light transmittance is 52.47%; after tempering, a*t=-0.67, b*t=0.12, as shown in It can be seen that the reflectivity after tempering is low, there is basically no light pollution, and the transmitted color is also very neutral.

Physical properties:

In accordance with GB9656-2003, the tempered film will not peel off after wiping, and the impact test, radiation resistance test, and heat and humidity cycle test can all meet the requirements. After testing, the knocking test level is level 4.

The embodiment of the present invention adopts the temperable low-reflection double silver low-emissivity coated glass prepared by the above method, which can effectively improve the transmittance color and emissivity of LOW-E glass products; ultimately achieving ultra-low visible light reflectance and neutral transmittance color Sexy LOW-E glass products. In general, the glass provided by embodiments of the present invention has the advantages of low reflectivity, neutral transmission color, and stable color of the film layer.

Each embodiment in the specification is described in a progressive manner. Each embodiment focuses on its differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. As for the structure disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple. For relevant details, please refer to the description in the method section. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the scope of the claims of the present invention.

It should also be noted that in this specification, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations There is no such actual relationship or sequence between operations. Furthermore, the terms "comprises," "comprises," or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article, or device that includes the stated element.

Claims (2)

1. A temperable low-reflection double-silver low-emissivity coated glass, characterized in that it includes a glass substrate and a composite film layer plated on the glass substrate. The composite film layer includes a first dielectric layer, a tungsten layer, and a tungsten layer. Copper alloy layer, first protective layer, first seed layer, first functional layer, second protective layer, first AZO layer, second dielectric layer, second seed layer, second functional layer, third protective layer, third The second AZO layer and the third dielectric layer; The first dielectric layer is a SiN _x layer, the second dielectric layer is a composite layer of a ZnO _x layer and a SiN _x layer, and the third dielectric layer is a SiN _x layer or SiO _x layer or SiN _x O _y layer or a composite thereof. layer, the first seed layer and the second seed layer are ZnO _x layers, the first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer are NiCr layer; The thickness of the first dielectric layer is 26-38nm, the thickness of the second dielectric layer is 50-90nm, and the thickness of the third dielectric layer is 40-60nm; The thickness of the first seed layer and the second seed layer is 15-20 nm; The thickness of the first functional layer is 9-15nm; The thickness of the second functional layer is 6 to 18 nm; The thickness of the first protective layer is 2 to 4 nm, the thickness of the second protective layer is 1 to 4 nm, and the thickness of the third protective layer is 1 to 6 nm; The thickness of the tungsten-copper alloy layer is 6 to 12 nm; The thickness of the first AZO layer and the second AZO layer is 8-10nm; when the temperable low-reflection double silver low-emissivity coated glass is tempered, the heating temperature of the coated surface is 670-700°C, and the non-coated surface is 670-700°C. The heating temperature of the surface is 670~680℃. 2. A method for preparing temperable low-reflection double silver low-e coating glass as claimed in claim 1, characterized in that it includes: Plating a first dielectric layer on the glass substrate, the first dielectric layer being a SiN _x layer; plating a tungsten copper alloy layer on the first dielectric layer; Plating a first protective layer on the tungsten-copper alloy layer, the first protective layer being a NiCr layer; Plating a first seed layer on the first protective layer, the first seed layer being a ZnO _x layer; plating a first functional layer on the first seed layer, where the first functional layer is an Ag layer; A second protective layer is plated on the first functional layer, and the second protective layer is a NiCr layer; plating a first AZO layer on the first protective layer; A second dielectric layer is plated on the first AZO layer, and the second dielectric layer is a composite layer of a ZnO _x layer and a SiN _x layer; Plating a second seed layer on the second dielectric layer, the second seed layer being a ZnO _x layer; plating a second functional layer on the second seed layer, and the second functional layer is an Ag layer; A third protective layer is plated on the second functional layer, and the third protective layer is a NiCr layer; Plating a second AZO layer on the third protective layer; A third dielectric layer is plated on the second AZO layer, and the third dielectric layer is a SiN _x layer or a SiO _x layer or a SiN _x O _y layer or a composite layer thereof; The coating equipment adopts magnetron sputtering process. When the temperable low-reflection double silver low-emissivity coated glass is tempered, the heating temperature of the coated surface is 670-700°C, and the heating temperature of the non-coated surface is 670-700°C. 670～680℃.