CN111272089B - In-situ gap detection device and detection method - Google Patents

Abstract

The invention discloses an in-situ gap detection device and a detection method. The device includes: a peripheral frame for supporting the overall structure; a workpiece stage module for precise positioning, leveling, gap control and carrying samples; a carrier module for loading the mother board and testing the leveling accuracy; for measuring the in-situ In-situ gap detection module for gap; control system for data acquisition, processing and feedback control. Based on the white light interference gap measurement method, the invention monitors the gap between the mother board and the sample through three peripheral points, and feeds back and controls the workpiece stage module to perform precise leveling and gap control. At the same time, combined with the white light interference gap measurement method and the microscopic imaging method, the in-situ gap detection with high lateral resolution and high detection accuracy is performed on the working area between the mother board and the sample.

Description

In-situ gap detection device and detection method

technical field

The invention belongs to the technical field of precision detection, and in particular relates to an in-situ gap detection device and a detection method between a mother board and a sample.

Background technique

With the development of technology, many fields require precise clearance detection and control of motherboards and samples, but often the detection position can only be in the non-working area. Due to the deviation of the processing surface shape of the mother board and the sample, assembly deformation, etc., it is often not feasible to control the clearance distribution of the working area through the detection data of the periphery of the working area. How to realize the work of not destroying the state of the working area and detecting the distribution of the gap in the working area has become an important research direction.

There are several critical requirements for the detection of the in-situ gap: first, non-contact measurement, without destroying the state of the working area; second, the detection lateral resolution should be small, and the distribution of the in-situ gap should be detected to the maximum extent; third, after the detection is completed, it will not affect the normal development of work.

The invention is an in-situ gap detection device and detection method, which combines the white light interference gap measurement method and the microscopic imaging method, and can perform in-situ gap detection with high lateral resolution and high detection accuracy in the working area between the mother board and the sample.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to propose an in-situ gap detection device and a detection method. The invention is based on a white light interference gap measurement method, monitors the gap between the mother board and the sample through three peripheral points, and feeds back and controls the workpiece stage module. Perform precise leveling and clearance control. At the same time, combined with the white light interference gap measurement method and the microscopic imaging method, the in-situ gap detection with high lateral resolution and high detection accuracy is performed on the working area between the mother board and the sample.

The technical scheme adopted by the present invention to solve the above-mentioned technical problems is:

An in-situ gap detection device, the device includes

A perimeter frame for supporting the overall structure;

Workpiece stage modules for precise positioning, leveling, gap control and sample loading;

A carrier module for loading the motherboard and testing the leveling accuracy;

In-situ gap detection module for measuring in-situ gap;

Control system for data acquisition, processing and feedback control.

Among them, the peripheral frame should have good strength and rigidity, and at the same time, a vibration isolation platform should be installed to isolate the external disturbance to the greatest extent.

Wherein, the worktable module is installed on the lower substrate of the peripheral frame, and the worktable module includes: a six-axis precision displacement stage, a six-axis nano-displacement stage, a wafer-bearing stage and a sample. Among them, the six-axis precision displacement stage is used for positioning and attitude adjustment of the large stroke range of the sample; the six-axis nano-displacement stage is used for high-precision positioning and attitude adjustment, mainly including precise positioning, leveling and gap control.

Wherein, the carrying module is mounted on the upper substrate of the peripheral frame. The carrying module includes: a motherboard, a three-way measurement optical fiber and a fixed frame. Among them, the three-way measuring fibers are perpendicular to the mother board and are installed on the fixed frame. The three-way measuring fibers should be installed in the non-working area and distributed in a triangular shape for overall monitoring of the gap between the mother board and the sample; the mother board is vacuum-adsorbed. mounted on the fixed frame.

Wherein, the in-situ gap detection module is installed on the upper substrate of the peripheral frame. The in-situ gap detection module includes: a three-axis precision displacement stage, an objective lens, a mounting plate, a microscopic imaging body, and an in-situ detection module. Among them, the three-axis precision stage includes X/Y horizontal movement axis and Z vertical lift axis, which are used to adjust the detection position and detection focus. At the same time, the in-situ gap detection module can be moved out of the working area through the large-stroke three-axis precision stage. , so as not to affect the normal operation of the mother board and the sample; the objective lens should be selected according to the lateral resolution and working distance constraints.

Wherein, the in-situ detection module is installed on the microscopic imaging main body of the in-situ gap detection module, and the in-situ detection module includes an adapter, an optical fiber head and a measurement optical fiber. The measurement fiber can be single-channel coupled into the in-situ detection module for single-point measurement, or multi-channel coupled into the in-situ detection module for multi-point measurement.

An in-situ gap detection method, using the above-mentioned device, comprising:

In step (a), the mother board is adsorbed and installed on the fixed frame, the sample is adsorbed and mounted on the support table, and the worktable module is controlled by the control system to be positioned to the detection area.

In step (b), the control system collects three-way measurement optical fiber signals, analyzes and processes the gap value, and feeds back the control table module to perform overall leveling and gap control.

In step (c), the in-situ gap detection module performs a small field of view and high-precision in-situ gap detection on the intermediate working area, and the in-situ gap distribution of the entire working area can be scanned and measured through the three-axis precision displacement stage. By scanning measurement data or multi-point measurement data, the workpiece table module can be controlled to correct the leveling state and clearance to ensure that the in-situ clearance distribution meets the work requirements.

In step (d), after the in-situ clearance detection and correction are completed, the in-situ clearance detection module can be moved out of the working area through a large-stroke three-axis precision displacement stage, so as to not affect the normal operation of the motherboard and the sample.

The principle of the present invention is:

1. Based on the white light interference gap measurement method, the gap between the motherboard and the sample is monitored through three peripheral points, and the workpiece stage module is fed back to control the precision leveling and gap control.

2. Combined with the white light interference gap measurement method and the microscopic imaging method, the in-situ gap detection with high lateral resolution and high detection accuracy is performed on the working area between the mother board and the sample.

The beneficial effects of the present invention are:

1. Realize the small field of view and high-precision in-situ gap detection in the middle working area, and the in-situ gap distribution of the entire working area can be measured by scanning or multi-point measurement.

2. The leveling state and clearance can be corrected by scanning measurement data or multi-point measurement data to ensure that the in-situ clearance distribution meets the work requirements.

3. After the detection is completed, the in-situ gap detection module can be removed from the working area, so as not to affect the normal operation of the motherboard and the sample.

Description of drawings

1 is a schematic structural diagram of an in-situ gap detection device according to the present invention;

Fig. 2 is the schematic diagram of the peripheral frame structure of the present invention;

3 is a schematic structural diagram of a workpiece table module of the present invention;

4 is a schematic structural diagram of a bearing module of the present invention;

5 is a schematic structural diagram of an in-situ gap detection module of the present invention;

FIG. 6 is a schematic diagram of two embodiments of the in-situ detection module of the present invention.

Reference number:

1 is the peripheral frame

2 is the workpiece table module

3 is the carrier module

4 is the in-situ gap detection module

5 is the control system

6 is the isolation platform

7 is the lower substrate

8 is the column

9 is the upper substrate

10 is a six-axis precision stage

11 is a six-axis nanostage

12 is the stage

13 is a sample

14 is the motherboard

15 is a three-way measurement fiber

16 is the fixed frame

17 is a three-axis precision stage

18 is the objective lens

19 is the mounting plate

20 is the microscopic imaging subject

21 is the in-situ detection module

21a is a single-channel in-situ detection module

21b is a three-way in-situ detection module

22 is the adapter

23 is the fiber head

24a is measuring fiber (single)

24b is measuring fiber (three-way)

Detailed ways

In order to make the objectives, technical solutions and advantages of the device of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings.

Referring to Figures 1 and 2, an in-situ gap detection device includes a peripheral frame 1 for supporting the overall structure; a workpiece stage module 2 for precise positioning, leveling, gap control and bearing samples; A bearing module 3 for detecting leveling accuracy; an in-situ gap detection module 4 for measuring in-situ gap; a control system 5 for data acquisition, processing and feedback control. The peripheral frame 1 should have good strength and rigidity, and at the same time, a seismic isolation platform 6 should be installed to isolate external disturbances to the greatest extent.

3 , the stage module 2 is mounted on the lower substrate 7 of the peripheral frame 1 , and includes: a six-axis precision displacement stage 10 , a six-axis nano-displacement stage 11 , a wafer stage 12 and a sample wafer 13 . Among them, the six-axis precision displacement stage 10 is used for positioning and attitude adjustment of the sample 13 in a large stroke range; the six-axis nano-displacement stage 11 is used for high-precision positioning and attitude adjustment, mainly including precise positioning, leveling and gap control.

Referring to FIG. 4 , the carrier module 3 is mounted on the upper substrate 9 of the peripheral frame 1 . Including: motherboard 14 , three-way measurement optical fiber 15 and fixed frame 16 . Among them, the three-way measuring optical fibers 15 are perpendicular to the motherboard 14 and are installed on the fixed frame 16. The three-way measuring optical fibers 15 should be installed in the non-working area and are distributed in a triangular shape for overall monitoring of the gap between the motherboard and the sample; the motherboard 14 is mounted on the fixed frame 16 by means of vacuum adsorption.

Referring to FIG. 5 , the in-situ gap detection module 4 is mounted on the upper substrate 9 of the peripheral frame 1 . It includes: a three-axis precision displacement stage 17 , an objective lens 18 , a mounting plate 19 , a microscopic imaging body 20 , and an in-situ detection module 21 . Among them, the three-axis precision displacement stage 17 includes an X/Y horizontal movement axis and a Z vertical lift axis, which are used to adjust the detection position and detection focus. At the same time, the in-situ gap detection module can also be moved away through the large-stroke three-axis precision displacement stage 17 working area, so as not to affect the normal work of the mother board and the sample; the objective lens 18 should be selected according to the lateral resolution and working distance constraints.

6 , the shown in-situ detection module 21 is installed on the microscopic imaging main body 20 of the in-situ gap detection module 4 , and includes an adapter 22 , an optical fiber head 23 and a measurement optical fiber 24 . The measurement fiber 24 can be single-channel coupled into the in-situ detection module 21 for single-point measurement, or multiple-channel coupled into the in-situ detection module 21 for multi-point measurement.

Referring to FIG. 1, FIG. 4, and FIG. 5, using the above-mentioned device, an in-situ gap detection method includes:

(a) The motherboard 14 is adsorbed and installed on the fixed frame 16 , the sample 13 is adsorbed and mounted on the wafer stage 12 , and the worktable module 2 is controlled by the control system 5 to be positioned to the detection area.

(b) The control system 5 collects the signals of the three-way measuring optical fibers 15, analyzes and processes the gap value, and feeds back and controls the workbench module 2 to perform overall leveling and gap control.

(c) The in-situ gap detection module 4 performs small field of view and high-precision in-situ gap detection on the intermediate working area, and the in-situ gap distribution of the entire working area can be scanned and measured through the three-axis precision displacement stage 17 . By scanning measurement data or multi-point measurement data, the workpiece stage module 2 can be controlled to correct the leveling state and clearance, so as to ensure that the in-situ clearance distribution meets the work requirements.

(d) After the in-situ gap detection and correction are completed, the in-situ gap detection module can be moved out of the working area through the large-stroke three-axis precision displacement stage 17, so as to not affect the normal operation of the motherboard and the sample.

Claims (2)

1. An in-situ gap detection device, characterized in that: the device comprises: a peripheral frame (1) for supporting the overall structure; Workpiece stage module (2) for precise positioning, leveling, gap control and sample loading; A carrier module (3) for loading the motherboard and testing the leveling accuracy; In-situ gap detection module (4) for measuring in-situ gap; A control system (5) for data acquisition, processing and feedback control; Among them, the peripheral frame (1) should have good strength and rigidity, and at the same time, a vibration isolation platform (6) should be installed to isolate the external disturbance to the greatest extent; The workpiece stage module (2) is mounted on the lower substrate (7) of the peripheral frame (1), and the workpiece stage module (2) comprises: a six-axis precision displacement stage (10), a six-axis nano-displacement stage (11) , a support table (12) and a sample (13), of which the six-axis precision stage (10) is used for positioning and attitude adjustment of the sample (13) in a large stroke range; the six-axis nano-stage (11) is used for high-precision Positioning and attitude adjustment, mainly including precise positioning, leveling and clearance control; The carrying module (3) is mounted on the upper substrate (9) of the peripheral frame (1), and the carrying module (3) comprises: a motherboard (14), a three-way measurement optical fiber (15) and a fixed frame ( 16), wherein the three-way measuring optical fiber (15) is perpendicular to the motherboard (14), and is installed on the fixed frame (16), and the three-way measuring optical fiber (15) should be installed in the non-working area and distributed in a triangle for overall monitoring. the gap between the mother board and the sample; the mother board (14) is mounted on the fixed frame (16) by means of vacuum adsorption; The in-situ gap detection module (4) is mounted on the upper substrate (9) of the peripheral frame (1), and the in-situ gap detection module (4) comprises: a three-axis precision displacement stage (17), an objective lens ( 18), a mounting plate (19), a microscopic imaging body (20), and an in-situ detection module (21), wherein the three-axis precision stage (17) includes an X/Y horizontal movement axis and a Z vertical lift axis for adjustment Detect the position and focus, and at the same time move the in-situ gap detection module out of the working area through the large-stroke three-axis precision stage (17), so as not to affect the normal operation of the motherboard and the sample; the three-axis precision stage (17) scans and measures In-situ gap distribution in the entire working area; objective lens (18) should be selected according to lateral resolution and working distance limitations; The in-situ detection module (21) is installed on the microscopic imaging body (20) of the in-situ gap detection module (4), and the in-situ detection module (21) comprises: an adapter (22), an optical fiber head (23) and a measurement fiber (24), the measurement fiber (24) is single-channel coupled into the in-situ detection module (21) for single-point measurement, or multi-channel coupled into the in-situ detection module (21) for multi-point measurement. 2. An in-situ gap detection method, utilizing the in-situ gap detection device according to claim 1, characterized in that: comprising: In step (a), the mother board (14) is adsorbed and installed on the fixed frame (16), the sample (13) is adsorbed and mounted on the wafer stage (12), and the positioning of the workpiece stage module (2) is controlled by the control system (5). to the detection area; In step (b), the control system (5) collects the signals of the three-way measuring optical fibers (15), analyzes and processes the gap value, and feeds back and controls the workpiece stage module (2) to perform overall leveling and gap control; In step (c), the in-situ gap detection module (4) performs a small field of view and high-precision in-situ gap detection on the intermediate working area, and scans and measures the in-situ gap distribution of the entire working area through the three-axis precision displacement stage (17). Scanning measurement data or multi-point measurement data controls the workpiece stage module (2) to correct the leveling state and gap to ensure that the in-situ gap distribution meets the work requirements; In step (d), after the in-situ clearance detection and correction are completed, the in-situ clearance detection module is moved out of the working area through a large-stroke three-axis precision displacement stage (17), so as not to affect the normal operation of the motherboard and the sample.

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