CN111272089A - In-situ gap detection device and detection method - Google Patents

Abstract

The invention discloses an in-situ gap detection device and a detection method. The device includes: a peripheral frame for supporting the overall structure; a workpiece stage module for precise positioning, leveling, gap control and carrying samples; a carrier module for loading the mother board and testing the leveling accuracy; for measuring in-situ In-situ gap detection module for gaps; control system for data acquisition, processing and feedback control. Based on the white light interference gap measurement method, the invention monitors the gap between the mother board and the sample through three peripheral points, and feeds back and controls the workpiece stage module to perform precise leveling and gap control. At the same time, combined with the white light interference gap measurement method and the microscopic imaging method, the in-situ gap detection with high lateral resolution and high detection accuracy is performed on the working area between the mother board and the sample.

Description

In-situ gap detection device and detection method

technical field

The invention belongs to the technical field of precision detection, and in particular relates to an in-situ gap detection device and a detection method between a mother board and a sample.

Background technique

With the development of technology, many fields require precise clearance detection and control of motherboards and samples, but often the detection position can only be in the non-working area. Due to the deviation of the processing surface shape of the mother board and the sample, assembly deformation, etc., it is often not feasible to control the clearance distribution of the working area through the detection data of the periphery of the working area. How to realize the work of not destroying the state of the working area and detecting the distribution of the gap in the working area has become an important research direction.

There are several critical requirements for the detection of the in-situ gap: first, non-contact measurement, without damaging the working area; second, the detection lateral resolution should be small, and the distribution of the in-situ gap should be detected to the maximum extent; third, after the detection is completed, it will not affect the normal development of work.

The invention is an in-situ gap detection device and detection method, which combines a white light interference gap measurement method and a microscopic imaging method, and can perform in-situ gap detection with high lateral resolution and high detection accuracy in the working area between the mother board and the sample.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to propose an in-situ gap detection device and a detection method. The invention is based on a white light interference gap measurement method, monitors the gap between the mother board and the sample through three peripheral points, and feeds back and controls the workpiece stage module. Perform precise leveling and clearance control. At the same time, combined with the white light interference gap measurement method and the microscopic imaging method, the in-situ gap detection with high lateral resolution and high detection accuracy is performed on the working area between the mother board and the sample.

The technical scheme adopted by the present invention to solve the above-mentioned technical problems is:

An in-situ gap detection device, the device includes

A perimeter frame for supporting the overall structure;

Workpiece stage modules for precise positioning, leveling, gap control and sample loading;

A carrier module for loading the motherboard and testing the leveling accuracy;

In-situ gap detection module for measuring in-situ gap;

Control system for data acquisition, processing and feedback control.

Among them, the peripheral frame should have good strength and rigidity, and at the same time, a vibration isolation platform should be installed to isolate the external disturbance to the greatest extent.

Wherein, the worktable module is installed on the lower substrate of the peripheral frame, and the worktable module includes: a six-axis precision displacement stage, a six-axis nano-displacement stage, a wafer-bearing stage and a sample. Among them, the six-axis precision displacement stage is used for positioning and attitude adjustment of the large stroke range of the sample; the six-axis nano-displacement stage is used for high-precision positioning and attitude adjustment, mainly including precise positioning, leveling and gap control.

Wherein, the carrying module is mounted on the upper substrate of the peripheral frame. The carrying module includes: a motherboard, a three-way measurement optical fiber and a fixed frame. Among them, the three-way measuring fibers are perpendicular to the mother board and are installed on the fixed frame. The three-way measuring fibers should be installed in the non-working area and distributed in a triangular shape for overall monitoring of the gap between the mother board and the sample; the mother board is vacuum-adsorbed. mounted on the fixed frame.

Wherein, the in-situ gap detection module is installed on the upper substrate of the peripheral frame. The in-situ gap detection module includes: a three-axis precision displacement stage, an objective lens, a mounting plate, a microscopic imaging body, and an in-situ detection module. Among them, the three-axis precision stage includes X/Y horizontal movement axis and Z vertical lift axis, which are used to adjust the detection position and detection focus. At the same time, the in-situ gap detection module can be moved out of the working area through the large-stroke three-axis precision stage. , so as not to affect the normal operation of the mother board and the sample; the objective lens should be selected according to the lateral resolution and working distance constraints.

Wherein, the in-situ detection module is installed on the microscopic imaging main body of the in-situ gap detection module, and the in-situ detection module includes an adapter, an optical fiber head and a measurement optical fiber. The measurement fiber can be single-channel coupled into the in-situ detection module for single-point measurement, or multi-channel coupled into the in-situ detection module for multi-point measurement.

An in-situ gap detection method, using the above-mentioned device, comprising:

In step (a), the mother board is adsorbed and installed on the fixed frame, the sample is adsorbed and mounted on the support table, and the worktable module is controlled by the control system to be positioned to the detection area.

In step (b), the control system collects three-way measurement optical fiber signals, analyzes and processes the gap value, and feeds back the control table module to perform overall leveling and gap control.

In step (c), the in-situ gap detection module performs a small field of view and high-precision in-situ gap detection on the intermediate working area, and the in-situ gap distribution of the entire working area can be scanned and measured through the three-axis precision displacement stage. By scanning measurement data or multi-point measurement data, the workpiece table module can be controlled to correct the leveling state and clearance to ensure that the in-situ clearance distribution meets the work requirements.

In step (d), after the in-situ clearance detection and correction are completed, the in-situ clearance detection module can be moved out of the working area through a large-stroke three-axis precision displacement stage, so as to not affect the normal operation of the motherboard and the sample.

The principle of the present invention is:

1. Based on the white light interference gap measurement method, the gap between the motherboard and the sample is monitored through three peripheral points, and the workpiece stage module is fed back to control the precision leveling and gap control.

2. Combined with the white light interference gap measurement method and the microscopic imaging method, the in-situ gap detection with high lateral resolution and high detection accuracy is performed on the working area between the mother board and the sample.

The beneficial effects of the present invention are:

1. Realize the small field of view and high-precision in-situ gap detection in the middle working area, and the in-situ gap distribution of the entire working area can be measured by scanning or multi-point measurement.

2. The leveling state and clearance can be corrected by scanning measurement data or multi-point measurement data to ensure that the in-situ clearance distribution meets the work requirements.

3. After the detection is completed, the in-situ gap detection module can be removed from the working area, so as not to affect the normal operation of the motherboard and the sample.

Description of drawings

1 is a schematic structural diagram of an in-situ gap detection device according to the present invention;

Fig. 2 is the schematic diagram of the peripheral frame structure of the present invention;

3 is a schematic structural diagram of a workpiece table module of the present invention;

4 is a schematic structural diagram of a bearing module of the present invention;

5 is a schematic structural diagram of an in-situ gap detection module of the present invention;

FIG. 6 is a schematic diagram of two embodiments of the in-situ detection module of the present invention.

Reference number:

1 is the peripheral frame

2 is the workpiece table module

3 is the carrier module

4 is the in-situ gap detection module

5 is the control system

6 is the isolation platform

7 is the lower substrate

8 is the column

9 is the upper substrate

10 is a six-axis precision stage

11 is a six-axis nanostage

12 is the stage

13 is a sample

14 is the motherboard

15 is a three-way measurement fiber

16 is the fixed frame

17 is a three-axis precision stage

18 is the objective lens

19 is the mounting plate

20 is the microscopic imaging subject

21 is the in-situ detection module

21a is a single-channel in-situ detection module

21b is a three-way in-situ detection module

22 is the adapter

23 is the fiber head

24a is measuring fiber (single)

24b is measuring fiber (three-way)

Detailed ways

In order to make the objectives, technical solutions and advantages of the device of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings.

Referring to Figures 1 and 2, an in-situ gap detection device includes a peripheral frame 1 for supporting the overall structure; a workpiece stage module 2 for precise positioning, leveling, gap control and bearing samples; A bearing module 3 for detecting leveling accuracy; an in-situ gap detection module 4 for measuring in-situ gap; a control system 5 for data acquisition, processing and feedback control. The peripheral frame 1 should have good strength and rigidity, and at the same time, a seismic isolation platform 6 should be installed to isolate external disturbances to the greatest extent.

3 , the stage module 2 is mounted on the lower substrate 7 of the peripheral frame 1 , and includes: a six-axis precision displacement stage 10 , a six-axis nano-displacement stage 11 , a wafer stage 12 and a sample wafer 13 . Among them, the six-axis precision displacement stage 10 is used for positioning and attitude adjustment of the sample 13 in a large stroke range; the six-axis nano-displacement stage 11 is used for high-precision positioning and attitude adjustment, mainly including precise positioning, leveling and gap control.

Referring to FIG. 4 , the carrier module 3 is mounted on the upper substrate 9 of the peripheral frame 1 . Including: motherboard 14 , three-way measurement optical fiber 15 and fixed frame 16 . Among them, the three-way measuring optical fibers 15 are perpendicular to the motherboard 14 and are installed on the fixed frame 16. The three-way measuring optical fibers 15 should be installed in the non-working area and are distributed in a triangular shape for overall monitoring of the gap between the motherboard and the sample; the motherboard 14 is mounted on the fixed frame 16 by means of vacuum adsorption.

Referring to FIG. 5 , the in-situ gap detection module 4 is mounted on the upper substrate 9 of the peripheral frame 1 . It includes: a three-axis precision displacement stage 17 , an objective lens 18 , a mounting plate 19 , a microscopic imaging body 20 , and an in-situ detection module 21 . Among them, the three-axis precision displacement stage 17 includes an X/Y horizontal movement axis and a Z vertical lift axis, which are used to adjust the detection position and detection focus. At the same time, the in-situ gap detection module can also be moved away through the large-stroke three-axis precision displacement stage 17 working area, so as not to affect the normal work of the mother board and the sample; the objective lens 18 should be selected according to the lateral resolution and working distance constraints.

6 , the shown in-situ detection module 21 is installed on the microscopic imaging main body 20 of the in-situ gap detection module 4 , and includes an adapter 22 , an optical fiber head 23 and a measurement optical fiber 24 . The measurement fiber 24 can be single-channel coupled into the in-situ detection module 21 for single-point measurement, or multiple-channel coupled into the in-situ detection module 21 for multi-point measurement.

Referring to FIG. 1, FIG. 4, and FIG. 5, using the above-mentioned device, an in-situ gap detection method includes:

(a) The motherboard 14 is adsorbed and installed on the fixed frame 16 , the sample 13 is adsorbed and mounted on the wafer stage 12 , and the worktable module 2 is controlled by the control system 5 to be positioned to the detection area.

(b) The control system 5 collects the signals of the three-way measuring optical fibers 15, analyzes and processes the gap value, and feeds back and controls the workbench module 2 to perform overall leveling and gap control.

(c) The in-situ gap detection module 4 performs small field of view and high-precision in-situ gap detection on the intermediate working area, and the in-situ gap distribution of the entire working area can be scanned and measured through the three-axis precision displacement stage 17 . By scanning measurement data or multi-point measurement data, the workpiece stage module 2 can be controlled to correct the leveling state and clearance, so as to ensure that the in-situ clearance distribution meets the work requirements.

(d) After the in-situ gap detection and correction are completed, the in-situ gap detection module can be moved out of the working area through the large-stroke three-axis precision displacement stage 17, so as to not affect the normal operation of the motherboard and the sample.

Claims (2)

1. An in-situ gap detection device, characterized in that: the device includes:

a peripheral frame (1) for supporting the unitary structure;

the workpiece table module (2) is used for precisely positioning, leveling, gap controlling and bearing the sample wafer;

a bearing module (3) used for loading a mother board and detecting the leveling precision;

an in-situ gap detection module (4) for measuring an in-situ gap;

a control system (5) for data acquisition, processing and feedback control;

the peripheral frame (1) has better strength and rigidity, and a shock insulation platform (6) is arranged to isolate external disturbance to the maximum extent;

workstation module (2) are installed on infrabasal plate (7) of peripheral frame (1), workstation module (2) include: the device comprises a six-axis precision displacement platform (10), a six-axis nanometer displacement platform (11), a wafer bearing platform (12) and a sample wafer (13), wherein the six-axis precision displacement platform (10) is used for positioning and posture adjustment of the sample wafer (13) within a large stroke range; the six-axis nanometer displacement table (11) is used for high-precision positioning and attitude adjustment, and mainly comprises precision positioning, leveling and clearance control;

the bearing module (3) is arranged on an upper substrate (9) of the peripheral frame (1), and the bearing module (3) comprises: the device comprises a motherboard (14), three measuring optical fibers (15) and a fixed frame (16), wherein the three measuring optical fibers (15) are perpendicular to the motherboard (14) and are arranged on the fixed frame (16), and the three measuring optical fibers (15) are arranged in a non-working area and distributed in a triangular shape and used for overall monitoring the gap between the motherboard and a sample wafer; the motherboard (14) is arranged on the fixed frame (16) in a vacuum adsorption mode;

the in-situ gap detection module (4) is installed on an upper substrate (9) of the peripheral frame (1), and the in-situ gap detection module (4) comprises: the device comprises a three-axis precision displacement platform (17), an objective lens (18), a mounting plate (19), a microscopic imaging main body (20) and an in-situ detection module (21), wherein the three-axis precision displacement platform (17) comprises an X/Y horizontal moving shaft and a Z vertical lifting shaft and is used for adjusting a detection position and a detection focus, and the in-situ gap detection module can be moved away from a working area through the large-stroke three-axis precision displacement platform (17) so that the normal work of a mother board and a sample wafer is not influenced; the objective (18) should be selected according to lateral resolution and working distance limitations;

the in-situ detection module (21) is arranged on a microscopic imaging main body (20) of the in-situ gap detection module (4), and the in-situ detection module (21) comprises: adapter (22), optic fibre head (23) and measurement optic fibre (24), measurement optic fibre (24) can be single-channel coupling and get into in situ detection module (21) and carry out the single-point measurement, also can be multichannel coupling and get into in situ detection module (21) and carry out the multiple spot measurement.

2. An in-situ gap detection method using the in-situ gap detection apparatus according to claim 1, characterized in that: the method comprises the following steps:

step (a), a mother board (14) is arranged on a fixed frame (16) in an absorption mode, a sample wafer (13) is arranged on a wafer bearing table (12) in an absorption mode, and a control system (5) controls a workbench module (2) to be positioned in a detection area;

step (b), the control system (5) collects signals of the three measuring optical fibers (15), analyzes and processes the signals to obtain a clearance value, and feeds back the clearance value to the workbench module (2) for overall leveling and clearance control;

step (c), the in-situ gap detection module (4) performs small-view-field and high-precision in-situ gap detection on the middle working area, the in-situ gap distribution condition of the whole working area can be scanned and measured through the three-axis precision displacement table (17), and the workpiece table module (2) can be controlled to correct the leveling state and the gap through scanning measurement data or multi-point measurement data so as to ensure that the in-situ gap distribution meets the working requirement;

and (d) after the in-situ gap detection and correction are finished, the in-situ gap detection module can be moved away from the working area through a large-stroke three-axis precision displacement table (17), so that the normal work of the mother board and the sample wafer is not influenced.

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