CN111212521A - Multilayer circuit board with embedded plane resistance ceramic powder filled with hydrocarbon resin - Google Patents
Multilayer circuit board with embedded plane resistance ceramic powder filled with hydrocarbon resin Download PDFInfo
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- CN111212521A CN111212521A CN202010189155.XA CN202010189155A CN111212521A CN 111212521 A CN111212521 A CN 111212521A CN 202010189155 A CN202010189155 A CN 202010189155A CN 111212521 A CN111212521 A CN 111212521A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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Abstract
A multilayer circuit board with embedded planar resistance ceramic powder filled with hydrocarbon resin comprises two double-sided copper-clad plates with resistance foils and a high-frequency bonding sheet positioned between the two double-sided copper-clad plates with resistance foils; the double-sided copper-clad plate with the resistance foil comprises a first substrate layer positioned in the middle, a first electrolytic copper foil layer positioned on one side of the first substrate layer and a composite electrode layer with the resistance foil positioned on the other side of the first substrate layer; the composite electrode layers of the two double-sided copper-clad plates with the resistance foils face the high-frequency bonding sheet; the composite electrode layer comprises a film resistance layer close to the first base material layer and a second electrolytic copper foil layer far away from the first base material layer; the first substrate layer is a hydrocarbon resin layer filled with ceramic powder, and the high-frequency bonding sheet comprises a polytetrafluoroethylene resin layer and thermosetting resin layers positioned on two side faces of the polytetrafluoroethylene resin layer. Therefore, the cost is lower, the production process is simple, the production reject ratio is lower, and the reliability is higher.
Description
Technical Field
The invention relates to the field of electronic devices, in particular to a hydrocarbon resin multilayer circuit board filled with embedded planar resistor ceramic powder.
Background
According to statistics of engineering technicians in an authoritative electronic circuit industry, in the design of an integrated circuit, the resistance accounts for about 30%, the capacitance accounts for about 40%, and other components account for about 30% in total. Because the resistor and the capacitor occupy most of components, the trouble is added to the assembly and connection process of the printed board, such as plug-in mounting and surface mounting process. In addition, if resistors are placed on the surface of the circuit board and connected to the circuit by wires, the complexity of the circuit is greatly increased and the performance of the circuit is degraded. Therefore, the embedded plane resistor is produced at the same time, which brings an unprecedented technical revolution to the design and manufacture of the printed board. The buried resistor, also called buried resistor or thin film resistor, is a technology of pressing a special resistor material on an insulating substrate, then forming an inner (outer) layer material with a designed required resistance value through processes of printing, etching and the like, and then pressing the inner (outer) layer material in (on) a printed board to form a planar resistor layer. With the trend of continuous and rapid miniaturization and multi-functionalization of electronic products, the number of passive components and the size of a printed board are required to be reduced as much as possible, and through the application of the planar embedded resistor manufacturing process technology, the functionality, better reliability and lower product cost of the printed board can be increased. On the other hand, high-temperature resistant printed boards such as high-frequency microwave boards have gained significant attention in recent years as indispensable supporting products for the high-tech and new-technology industries of electronic information. In order to meet the rapid development of modern communication technology, the manufacture of high-temperature resistant printed boards such as microwave high frequency boards and the like is not met in the production of simple single-sided boards and double-sided boards, and the requirement on the manufacture of microwave multilayer printed boards is more and more urgent. Although the polytetrafluoroethylene glass cloth high-frequency multilayer circuit board has good high-frequency effect, the reliability is lower, meanwhile, the material price is high, and the requirement on the production process is high.
Disclosure of Invention
In view of the above, the invention provides a multilayer circuit board with hydrocarbon resin filled with ceramic powder for embedded plane resistor, which has the advantages of low cost, simple production process, low production reject ratio and high reliability, so as to solve the above problems.
A multilayer circuit board with embedded planar resistance ceramic powder filled with hydrocarbon resin comprises two double-sided copper-clad plates with resistance foils and a high-frequency bonding sheet positioned between the two double-sided copper-clad plates with resistance foils; the double-sided copper-clad plate with the resistance foil comprises a first substrate layer positioned in the middle, a first electrolytic copper foil layer positioned on one side of the first substrate layer and a composite electrode layer with the resistance foil positioned on the other side of the first substrate layer; the composite electrode layers of the two double-sided copper-clad plates with the resistance foils face the high-frequency bonding sheet; the composite electrode layer comprises a film resistance layer close to the first base material layer and a second electrolytic copper foil layer far away from the first base material layer; the first substrate layer is a hydrocarbon resin layer filled with ceramic powder, and the high-frequency bonding sheet comprises a polytetrafluoroethylene resin layer and thermosetting resin layers positioned on two side faces of the polytetrafluoroethylene resin layer.
Further, the film resistance layer is a nickel-phosphorus alloy film.
Furthermore, a plurality of mounting and positioning through holes are formed in the multilayer circuit board filled with hydrocarbon resin and made of the embedded plane resistance ceramic powder, and a first conducting layer is plated on the inner side walls of the mounting and positioning through holes.
Furthermore, a plurality of equipotential wiring combined terminals are arranged on the embedded plane resistance ceramic powder filled hydrocarbon resin multilayer circuit board; on one side of the embedded plane resistance ceramic powder filled hydrocarbon resin multilayer circuit board, the equipotential wiring combined terminal is provided with a first through hole, a first isolating ring which is arranged on a first electrolytic copper foil layer and around the first through hole, and a plurality of first circumferential positioning holes which are arranged around the first isolating ring, wherein a second conducting layer is plated on the inner side wall of the first through hole, the second conducting layer is connected with the second electrolytic copper foil layers on the two double-sided copper clad plates with the resistance foils, and a third conducting layer is plated on the inner side wall of each first circumferential positioning hole; and a second isolating ring is arranged on the other side of the embedded plane resistance ceramic powder filled hydrocarbon resin multilayer circuit board and around the first through hole of the equipotential wiring combined terminal.
Furthermore, a plug terminal is connected with the equal-potential wiring combined terminal, a conductive column is arranged in the middle of the plug terminal, a plurality of positioning columns are arranged around the conductive column, the conductive column is movably plugged in the first through hole, and the positioning columns are movably plugged in the first circumferential positioning holes.
Furthermore, a plurality of signal wiring combined terminals are arranged on the multilayer circuit board of the embedded plane resistance ceramic powder filled hydrocarbon resin; on one side of the hydrocarbon resin multilayer circuit board filled with the embedded planar resistance ceramic powder, the signal wiring combined terminal is provided with a step groove, a copper sheet terminal connected with a second electrolytic copper foil layer on any double-sided copper-clad plate with the resistance foil, a second through hole penetrating through the middle part of the copper sheet terminal, and a plurality of second circumferential positioning holes positioned around the step groove, wherein a fourth conducting layer is plated on the inner side wall of each second circumferential positioning hole; and a third isolating ring is arranged on the other side of the embedded plane resistance ceramic powder filled hydrocarbon resin multilayer circuit board and around the second through hole of the signal wiring combined terminal.
Furthermore, a plug terminal is connected with the signal wiring combined terminal, a conductive column is arranged in the middle of the plug terminal, a plurality of positioning columns are arranged around the conductive column, an insulating needle is further arranged in the middle of the tail end of the conductive column in a protruding mode, the conductive column is movably located in the stepped groove and abutted against the copper sheet terminal, the insulating needle is movably inserted into the second through hole, and the positioning columns are movably inserted into the second circumferential positioning holes.
Compared with the prior art, the multilayer circuit board filled with hydrocarbon resin and embedded with the planar resistance ceramic powder comprises two double-sided copper-clad plates with resistance foils and a high-frequency bonding sheet positioned between the two double-sided copper-clad plates with resistance foils; the double-sided copper-clad plate with the resistance foil comprises a first substrate layer positioned in the middle, a first electrolytic copper foil layer positioned on one side of the first substrate layer and a composite electrode layer with the resistance foil positioned on the other side of the first substrate layer; the composite electrode layers of the two double-sided copper-clad plates with the resistance foils face the high-frequency bonding sheet; the composite electrode layer comprises a film resistance layer close to the first base material layer and a second electrolytic copper foil layer far away from the first base material layer; the first substrate layer is a hydrocarbon resin layer filled with ceramic powder, and the high-frequency bonding sheet comprises a polytetrafluoroethylene resin layer and thermosetting resin layers positioned on two side faces of the polytetrafluoroethylene resin layer. Therefore, the cost is lower, the production process is simple, the production reject ratio is lower, and the reliability is higher.
Drawings
Embodiments of the invention are described below with reference to the accompanying drawings, in which:
fig. 1 is a schematic side-sectional view of a planar-embedded resistive ceramic powder-filled hydrocarbon resin multilayer circuit board according to the present invention.
Fig. 2 is a bottom view of the double-sided copper-clad plate with the resistor foil in fig. 1.
Fig. 3 is a partial perspective view of fig. 2.
Fig. 4 is a schematic perspective view of a first viewing angle of the multilayer circuit board of the invention filled with hydrocarbon resin and embedded with planar resistive ceramic powder.
Fig. 5 is a perspective view of a second viewing angle of the planar resistance ceramic powder-filled hydrocarbon resin multilayer circuit board according to the present invention.
Detailed Description
Specific embodiments of the present invention will be described in further detail below based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1, the multilayer circuit board filled with hydrocarbon resin and embedded with planar resistive ceramic powder provided by the invention comprises two double-sided copper-clad plates 10 with resistive foils and a high-frequency bonding sheet 20 positioned between the two double-sided copper-clad plates 10 with resistive foils.
The double-sided copper-clad plate with the resistance foil 10 comprises a first substrate layer 11 located in the middle, a first electrolytic copper foil layer 12 located on one side of the first substrate layer 11 and a composite electrode layer 13 located on the other side of the first substrate layer 11 and provided with the resistance foil. The composite electrode layers 13 of the two double-sided copper-clad plates 10 with the resistance foils face the high-frequency bonding sheet 20. The first substrate layer 11 is a hydrocarbon resin layer filled with ceramic powder.
The thermal collision coefficient of the ceramic powder filled hydrocarbon resin layer is matched with copper, the formed metal through hole is high in reliability, the ceramic powder filled hydrocarbon resin layer is good in heat conduction performance and favorable for heat dissipation, and meanwhile, the ceramic powder filled hydrocarbon resin layer has excellent high-frequency performance and temperature stability and low dielectric loss, is suitable for manufacturing radio frequency electronic equipment, and is low in cost, simple in production process, low in production reject ratio and high in reliability.
The composite electrode layer 13 includes a film resistance layer 131 close to the first substrate layer 11 and a second electrolytic copper foil layer 132 far from the first substrate layer 11.
The high-frequency adhesive sheet 20 includes a polytetrafluoroethylene resin layer 201 and thermosetting resin layers 202 located on both sides of the polytetrafluoroethylene resin layer 201.
The film resistance layer 131 is a nickel-phosphorus alloy film.
Referring to fig. 2 and fig. 3, the first etching is performed on the side surface of the double-sided copper-clad plate with resistive foil 10 having the composite electrode layer 13, and the second electrolytic copper foil layer 132 in the non-circuit area 135 is etched away; then, performing a second etching on the non-circuit region 135 to etch away the film resistance layer 131 of the non-circuit region 135; then, the third etching is performed at the position where the resistor is to be formed, the second electrolytic copper foil layer 132 at the position where the resistor is to be formed is etched away, and the remaining film resistor layer 131 forms the embedded resistor 134.
In the portion of the film resistor layer 131 having the second electrolytic copper foil layer 132, since the resistance value of the film resistor layer 131 is much larger than that of the second electrolytic copper foil layer 132, an electrical signal is transmitted in the second electrolytic copper foil layer 132, and the second electrolytic copper foil layer 132 forms a microstrip line; at the embedded resistor 134, since the second electrolytic copper foil layer 132 is not present, an electrical signal will be transmitted in the film resistor layer 131.
The composite electrode layer 13 is formed with the above-described lines having the microstrip lines and the embedded resistors 134.
Referring to fig. 4 and 5, the planar resistance ceramic powder filled hydrocarbon resin multilayer circuit board provided by the present invention is provided with a plurality of mounting and positioning through holes 21, and the inner side walls of the mounting and positioning through holes 21 are plated with a first conductive layer. The mounting and positioning through hole 21 is convenient for mounting and positioning, and also has the function of signal shielding.
The multilayer circuit board filled with the planar resistance ceramic powder and the hydrocarbon resin is also provided with a plurality of equal-potential wiring combined terminals 22 and a plurality of signal wiring combined terminals 23.
On one side of the multilayer circuit board filled with hydrocarbon resin by the embedded planar resistive ceramic powder, the equipotential wiring combined terminal 22 has a first through hole 221, a first isolation ring 223 on the first electrolytic copper foil layer 12 and around the first through hole 221, and a plurality of first circumferential positioning holes 224 around the first isolation ring 223.
The inner side wall of the first through hole 221 is plated with a second conductive layer 222, and the second conductive layer 222 is connected to the second electrolytic copper foil layer 132 on the two resistance foil double-sided copper clad laminates 10.
The first separator ring 223 is a blank ring formed by peeling off the first electrolytic copper foil layer 12.
The inner sidewall of the first circumferential positioning hole 224 is plated with a third conductive layer.
On the other side of the multilayer circuit board filled with hydrocarbon resin and provided by the invention, the equipotential wiring combined terminal 22 is provided with a second isolation ring 235 around the first through hole 221, and the second isolation ring 235 is a blank ring formed by stripping the first electrolytic copper foil layer 12.
The equipotential wiring harness terminal 22 is used to connect the power supply or the ground of the wiring on the composite electrode layer 13.
On one side of the multilayer circuit board filled with hydrocarbon resin by the planar resistance ceramic powder provided by the invention, the signal wiring combined terminal 23 is provided with a step groove 231, a copper sheet terminal 232 connected with the second electrolytic copper foil layer 132 on any one double-sided copper-clad plate 10 with resistance foil, a second through hole 233 penetrating through the middle part of the copper sheet terminal 232, and a plurality of second circumferential positioning holes 234 positioned around the step groove 231.
The second through hole 233 and the inner sidewall of the stepped groove 231 are not plated with a conductive layer. The stepped groove 231 can penetrate through the first electrolytic copper foil layer 12 and the first substrate layer 11 of the double-sided copper-clad plate with resistive foil 10, and the second electrolytic copper foil layer 132 is connected with the composite electrode layer 13 of the double-sided copper-clad plate with resistive foil 10; the stepped groove 231 may also penetrate through one resistive foil double-sided copper-clad plate 10 and the high-frequency bonding sheet 20, and the second electrolytic copper foil layer 132 is connected to the composite electrode layer 13 of the other resistive foil double-sided copper-clad plate 10.
The inner side wall of the second circumferential positioning hole 234 is plated with a fourth conductive layer.
On the other side of the multilayer circuit board filled with hydrocarbon resin by using the planar resistance ceramic powder provided by the present invention, a third isolation ring 235 is disposed around the second through hole 233 of the signal wiring combination terminal 23, and the third isolation ring 235 is a blank ring formed by peeling off the first electrolytic copper foil layer 12.
The middle of the plug terminal for connecting with the equal-potential wiring combination terminal 22 or the signal wiring combination terminal 23 is provided with a conductive column, a plurality of positioning columns are arranged around the conductive column, the conductive column is used for being inserted into the first through hole 221 or the stepped groove 231, and the positioning columns are used for being inserted into the first circumferential positioning hole 224 or the second circumferential positioning hole 234. The first circumferential positioning hole 224 and the second circumferential positioning hole 234 improve the stability of insertion.
The middle of the end of the conductive post of the plug terminal for connecting with the signal wire combination terminal 23 is further provided with an insulating pin in a protruding manner, and the insulating pin is used for being inserted into the second through hole 233, so that the conductive post is connected with only the copper sheet terminal 232.
Compared with the prior art, the multilayer circuit board filled with hydrocarbon resin and embedded with the planar resistance ceramic powder comprises two double-sided copper-clad plates 10 with resistance foils and a high-frequency bonding sheet 20 positioned between the two double-sided copper-clad plates 10 with resistance foils; the double-sided copper-clad plate with the resistance foil 10 comprises a first substrate layer 11 positioned in the middle, a first electrolytic copper foil layer 12 positioned on one side of the first substrate layer 11 and a composite electrode layer 13 with the resistance foil positioned on the other side of the first substrate layer 11; the composite electrode layers 13 of the two double-sided copper-clad plates 10 with the resistance foils face the high-frequency bonding sheet 20; the composite electrode layer 13 comprises a film resistance layer 131 close to the first substrate layer 11 and a second electrolytic copper foil layer 132 far away from the first substrate layer 11; the first substrate layer 11 is a ceramic powder filled hydrocarbon resin layer, and the high-frequency bonding sheet 20 includes a polytetrafluoroethylene resin layer and thermosetting resin layers located on both sides of the polytetrafluoroethylene resin layer. Therefore, the cost is lower, the production process is simple, the production reject ratio is lower, and the reliability is higher.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.
Claims (7)
1. A multilayer circuit board with embedded planar resistor ceramic powder filled with hydrocarbon resin is characterized in that: the high-frequency bonding piece is positioned between the two double-sided copper-clad plates with the resistance foils; the double-sided copper-clad plate with the resistance foil comprises a first substrate layer positioned in the middle, a first electrolytic copper foil layer positioned on one side of the first substrate layer and a composite electrode layer with the resistance foil positioned on the other side of the first substrate layer; the composite electrode layers of the two double-sided copper-clad plates with the resistance foils face the high-frequency bonding sheet; the composite electrode layer comprises a film resistance layer close to the first base material layer and a second electrolytic copper foil layer far away from the first base material layer; the first substrate layer is a hydrocarbon resin layer filled with ceramic powder, and the high-frequency bonding sheet comprises a polytetrafluoroethylene resin layer and thermosetting resin layers positioned on two side faces of the polytetrafluoroethylene resin layer.
2. The multilayer printed circuit board of claim 1, wherein the multilayer printed circuit board comprises: the film resistance layer is a nickel-phosphorus alloy film.
3. The multilayer printed circuit board of claim 1, wherein the multilayer printed circuit board comprises: a plurality of mounting and positioning through holes are formed in the multilayer circuit board filled with hydrocarbon resin and made of the planar resistance ceramic powder, and a first conducting layer is plated on the inner side walls of the mounting and positioning through holes.
4. The multilayer printed circuit board of claim 1, wherein the multilayer printed circuit board comprises: a plurality of equipotential wiring combined terminals are arranged on the multilayer circuit board of the embedded plane resistance ceramic powder filled hydrocarbon resin; on one side of the embedded plane resistance ceramic powder filled hydrocarbon resin multilayer circuit board, the equipotential wiring combined terminal is provided with a first through hole, a first isolating ring which is arranged on a first electrolytic copper foil layer and around the first through hole, and a plurality of first circumferential positioning holes which are arranged around the first isolating ring, wherein a second conducting layer is plated on the inner side wall of the first through hole, the second conducting layer is connected with the second electrolytic copper foil layers on the two double-sided copper clad plates with the resistance foils, and a third conducting layer is plated on the inner side wall of each first circumferential positioning hole; and a second isolating ring is arranged on the other side of the embedded plane resistance ceramic powder filled hydrocarbon resin multilayer circuit board and around the first through hole of the equipotential wiring combined terminal.
5. The multilayer printed circuit board of claim 4, wherein the multilayer printed circuit board comprises: and the plug-in terminal is connected with the equal-potential wiring combined terminal, the middle part of the plug-in terminal is provided with a conductive column, a plurality of positioning columns are arranged around the conductive column, the conductive column can be movably plugged in the first through hole, and the positioning columns can be movably plugged in the first circumferential positioning holes.
6. The multilayer printed circuit board of claim 1, wherein the multilayer printed circuit board comprises: a plurality of signal wiring combined terminals are arranged on the multilayer circuit board of the embedded plane resistance ceramic powder filled hydrocarbon resin; on one side of the hydrocarbon resin multilayer circuit board filled with the embedded planar resistance ceramic powder, the signal wiring combined terminal is provided with a step groove, a copper sheet terminal connected with a second electrolytic copper foil layer on any double-sided copper-clad plate with the resistance foil, a second through hole penetrating through the middle part of the copper sheet terminal, and a plurality of second circumferential positioning holes positioned around the step groove, wherein a fourth conducting layer is plated on the inner side wall of each second circumferential positioning hole; and a third isolating ring is arranged on the other side of the embedded plane resistance ceramic powder filled hydrocarbon resin multilayer circuit board and around the second through hole of the signal wiring combined terminal.
7. The multilayer printed circuit board of claim 6, wherein the multilayer printed circuit board comprises: and the inserting terminal is connected with the signal wiring combined terminal, the middle part of the inserting terminal is provided with a conductive column, a plurality of positioning columns are arranged around the conductive column, the middle part of the tail end of the conductive column is also provided with an insulating needle in a protruding manner, the conductive column is movably positioned in the stepped groove and is abutted against the copper sheet terminal, the insulating needle is movably inserted into the second through hole, and the positioning columns are movably inserted into the second circumferential positioning holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010189155.XA CN111212521B (en) | 2020-03-18 | 2020-03-18 | Multilayer circuit board with buried plane resistor ceramic powder filled with hydrocarbon resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010189155.XA CN111212521B (en) | 2020-03-18 | 2020-03-18 | Multilayer circuit board with buried plane resistor ceramic powder filled with hydrocarbon resin |
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| Publication Number | Publication Date |
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| CN111212521A true CN111212521A (en) | 2020-05-29 |
| CN111212521B CN111212521B (en) | 2024-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010189155.XA Active CN111212521B (en) | 2020-03-18 | 2020-03-18 | Multilayer circuit board with buried plane resistor ceramic powder filled with hydrocarbon resin |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113307541A (en) * | 2021-06-03 | 2021-08-27 | 中国振华集团云科电子有限公司 | Hydrocarbon resin ceramic bonding sheet and batch production process thereof |
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| CN205430783U (en) * | 2016-04-06 | 2016-08-03 | 浙江万正电子科技有限公司 | Hole metallization hydrocarbon pottery high frequency multilayer backplate |
| CN206422974U (en) * | 2017-02-15 | 2017-08-18 | 浙江万正电子科技有限公司 | Bury planar resistor high-frequency multilayer wiring board |
| CN109733021A (en) * | 2019-02-27 | 2019-05-10 | 浙江九通电子科技有限公司 | Buried plane resistance modified polyphenylene ether glass cloth high-frequency multilayer backplane and method of making the same |
| CN211297156U (en) * | 2020-03-18 | 2020-08-18 | 浙江万正电子科技有限公司 | Multilayer circuit board with embedded plane resistance ceramic powder filled with hydrocarbon resin |
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2020
- 2020-03-18 CN CN202010189155.XA patent/CN111212521B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205430783U (en) * | 2016-04-06 | 2016-08-03 | 浙江万正电子科技有限公司 | Hole metallization hydrocarbon pottery high frequency multilayer backplate |
| CN206422974U (en) * | 2017-02-15 | 2017-08-18 | 浙江万正电子科技有限公司 | Bury planar resistor high-frequency multilayer wiring board |
| CN109733021A (en) * | 2019-02-27 | 2019-05-10 | 浙江九通电子科技有限公司 | Buried plane resistance modified polyphenylene ether glass cloth high-frequency multilayer backplane and method of making the same |
| CN211297156U (en) * | 2020-03-18 | 2020-08-18 | 浙江万正电子科技有限公司 | Multilayer circuit board with embedded plane resistance ceramic powder filled with hydrocarbon resin |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113307541A (en) * | 2021-06-03 | 2021-08-27 | 中国振华集团云科电子有限公司 | Hydrocarbon resin ceramic bonding sheet and batch production process thereof |
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| CN111212521B (en) | 2024-07-12 |
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