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CN112735769B - A kind of aluminum FPC type coil structure and its manufacturing method - Google Patents

A kind of aluminum FPC type coil structure and its manufacturing method Download PDF

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Publication number
CN112735769B
CN112735769B CN202011544068.8A CN202011544068A CN112735769B CN 112735769 B CN112735769 B CN 112735769B CN 202011544068 A CN202011544068 A CN 202011544068A CN 112735769 B CN112735769 B CN 112735769B
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coil
aluminum
manufacturing
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fpc
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CN112735769A (en
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满方明
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Shanghai Amphenol Airwave Communication Electronics Co Ltd
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Shanghai Amphenol Airwave Communication Electronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14Inductive couplings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J7/50

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The invention provides an aluminum FPC type coil structure and a manufacturing method thereof, wherein the coil structure comprises: a dielectric insulating film, a first coil, a second coil, and a conduction column; wherein: the first coil and the second coil are respectively arranged on two sides of the dielectric insulating film; the first coil is communicated with the second coil through the conducting column; the first coil and the second coil are both made of aluminum. The first coil and the second coil are respectively adhered to the dielectric insulating film. The conduction column is made of tin alloy. Compared with the prior art, the invention uses the aluminum foil to replace the copper foil, uses the tin alloy conduction column to replace the copper conduction between the coils, and uses the manufacturing method which is different from the traditional FPC type coil, thereby reducing the manufacturing cost of manufacturers.

Description

Aluminum FPC (flexible printed circuit) type coil structure and manufacturing method thereof
Technical Field
The invention relates to an FPC (flexible printed circuit) type coil for wireless charging of a mobile phone, in particular to an aluminum FPC type coil structure and a manufacturing method thereof.
Background
The structure of the current wireless charging receiving coil of the mobile phone is approximately a coil stacked on a soft magnetic shielding sheet, and the type of the wireless charging receiving coil is divided into an FPC type coil and a self-adhesive enameled wire wound type coil according to the coil manufacturing process.
An FPC (Flexible Printed Circuit) is a Printed Circuit.
The traditional FPC coil lamination structure is roughly that a copper coil is attached to each of two sides of a PI-based dielectric insulating film, and the coils on the two sides are connected through a via hole formed by electroplated copper materials.
The traditional FPC coil is manufactured by using a PI film double-sided copper clad Foil (FCCL) as a base material and using an FPC process technology, and comprises the main processing steps of cutting a substrate, drilling a via hole, removing glue residues by plasma, forming a copper via hole by black hole of the via hole, electroplating copper in a whole plate, transferring an anti-corrosion dry film pattern, etching, removing an anti-corrosion dry film, windowing a PI protective film, covering the PI protective film on the surface of a coil by hot pressing, plating nickel and gold on a copper coil connecting disc, punching the appearance and the like.
The cost of the FPC coil has a large relation with the coil substrate, and the traditional FPC coil adopts a flexible PI double-sided copper-clad laminated substrate, so that a substitute material needs to be searched for in the face of reducing the cost pressure.
Disclosure of Invention
In order to reduce the coil cost, the invention aims to provide an aluminum FPC type coil structure and a manufacturing method thereof. The technical scheme of the invention is as follows:
an aluminum FPC-type coil structure comprising: a dielectric insulating film, a first coil, a second coil, and a conductive via; wherein: the first coil and the second coil are respectively arranged on two sides of the dielectric insulating film; the first coil is communicated with the second coil through the conducting column; the first coil and the second coil are both made of aluminum.
Optionally, the first coil and the second coil are respectively adhered to the dielectric insulating film.
Optionally, the conductive via is made of a tin alloy material.
A manufacturing method of an aluminum FPC type coil structure is applied to the aluminum FPC type coil structure and comprises the following steps:
s1: respectively bonding two rolls of aluminum foils to two sides of one roll of dielectric insulating film to form a composite base material; the two rolls of aluminum foils correspond to the first coil and the second coil respectively;
s2: screen printing resist ink patterns on the aluminum foil surface on both sides of the composite substrate, wherein the patterns comprise: a first coil line pattern, a second coil line pattern;
s3: etching the aluminum foils on the two sides of the composite base material by acid to manufacture aluminum coil circuits on the two sides of the composite base material, namely forming a first coil and a second coil respectively;
s4: removing the resist ink;
s5: respectively covering a PI protective film on the surface of the first coil and the surface of the second coil in a hot-pressing manner;
s6: drilling a through hole in the coil semi-finished product formed in the step S5;
s7: stripping a PI protective film on the surface of the aluminum circuit in the connecting disc area of the first coil or the second coil by using laser energy;
s8: removing the glue residues by plasma;
s9: conducting hole screen printing and aluminum solder paste welding;
s10: and melting the solder paste by a heating furnace to form a conduction column connected with the first coil and the second coil.
Optionally, the method further comprises:
s11: silk-screen printing character ink on the surfaces of the PI protective film and the conduction column;
s12: sticking a double-sided adhesive tape and a reinforcing plate;
s13: and (5) blanking the coil appearance.
Compared with the prior art, the invention has the following beneficial effects:
the invention uses aluminum foil to replace copper foil, uses tin alloy conduction column to replace copper conduction between coils, and uses a manufacturing method different from the traditional FPC type coil, thereby reducing the manufacturing cost of manufacturers.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic front structure diagram of an aluminum FPC-type coil structure according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a reverse structure of an aluminum FPC-type coil structure according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for manufacturing an aluminum FPC-type coil structure according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will aid those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any manner. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the concept of the invention. All falling within the scope of the present invention.
As shown in fig. 1 and 2, the present embodiment discloses an aluminum FPC-type coil structure, including: a dielectric insulating film 1, a first coil 2, a second coil 3, and a conductive via 4; wherein: the first coil 2 and the second coil 3 are respectively arranged on two sides of the dielectric insulating film 1; the first coil 2 is communicated with the second coil 3 through the conduction column 4; the first coil 2 and the second coil 3 are both made of aluminum.
In this embodiment, the first coil 2 and the second coil 3 are respectively adhered to the front surface and the back surface of the dielectric insulating film. The conductive via 4 is made of tin alloy.
The dielectric insulating film 1 is a dielectric insulating adhesive film, and may be one of a PI film (polyimide film), a TPI film (thermoplastic PI adhesive film), an epoxy film, an acrylic film, and the like.
In this embodiment, the dielectric insulating film 1 is a 15um thick PI-based thermosetting epoxy film. The first coil and the second coil are both 70um thick aluminum coils, and the coil circuit diagrams refer to fig. 1 and 2. Two-sided aluminum coil circuit
Figure BDA0002855109410000031
The tin alloy conduction column is connected, and the coil is covered with a PI protective film with the thickness of 12.5 um. One end of the conduction column is covered with insulating ink.
In the present embodiment, the wiring of the first coil 2 and the second coil 3 adopts the wiring pattern of the copper coil of the conventional FPC. In addition, the coils (including the shape, the number of turns, and other characteristics) in fig. 1 and 2 are only examples, and the specific shape, the number of turns, and other characteristics of the first coil 2 and the second coil 3 are not limited.
As shown in fig. 3, the present embodiment also discloses a manufacturing method of an aluminum FPC type coil structure, which is applied to the aluminum FPC type coil structure, and includes the following steps:
s1: respectively bonding two rolls of 70um thick aluminum foils on two sides of a roll of 15um thick PI-based thermosetting epoxy adhesive film to form a composite base material;
s2: screen printing resist ink patterns on the aluminum foil surface on both sides of the composite substrate, the patterns comprising: a first coil line pattern, a second coil line pattern;
s3: etching the aluminum foils on the two sides of the composite base material by acid to manufacture aluminum coil circuits on the two sides of the composite base material, namely forming a first coil and a second coil respectively;
s4: removing the resist ink from the composite substrate;
s5: respectively covering a layer of PI protective film with the thickness of 12.5um on the surface of the first coil and the surface of the second coil in a hot pressing manner;
s6: drilling a through hole in the coil semi-finished product formed in the step S5; in this embodiment, five or six via holes need to be drilled; and are positioned at the inner end and the outer end of the coil;
s7: stripping the PI protective film on the surface of the aluminum circuit in the connecting disc area of the first coil or the second coil by using laser energy; the lands are part of a conductive pattern, which is typically a spring connector element on the PCB that directly contacts the battery terminals. Compared with the manufacturing method of the copper FPC coil in the prior art, the connecting disc is not plated with nickel and gold in the embodiment, so that the cost of nickel and gold plating can be saved.
S8: removing the glue residue on the composite base material by plasma;
s9: conducting holes are screen-printed with soldering aluminum and tin paste, namely the soldering paste is plugged in the conducting holes;
s10: melting the solder paste by a heating furnace to form a conduction column connected with the first coil and the second coil;
s11: silk-screen printing character ink on the surfaces of the PI protective film and the end of the conduction column;
s12: sticking double-sided adhesive tape, reinforcing plate and other accessories;
s13: and (5) blanking the coil appearance.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (2)

1. A manufacturing method of an aluminum FPC type coil structure is characterized by comprising the following steps:
s1: respectively bonding two rolls of aluminum foils to two sides of one roll of dielectric insulating film to form a composite base material; the two rolls of aluminum foils correspond to the first coil and the second coil respectively;
s2: screen printing resist ink patterns on the aluminum foil surface on both sides of the composite substrate, wherein the patterns comprise: a first coil line pattern, a second coil line pattern;
s3: etching the aluminum foils on the two sides of the composite base material by acid to manufacture aluminum coil circuits on the two sides of the composite base material, namely forming a first coil and a second coil respectively;
s4: removing the resist ink;
s5: respectively covering a layer of PI protective film on the surface of the first coil and the surface of the second coil in a hot-pressing manner;
s6: drilling a through hole in the coil semi-finished product formed in the step S5;
s7: stripping a PI protective film on the surface of the aluminum circuit in the connecting disc area of the first coil or the second coil by using laser energy, wherein the connecting disc is not plated with nickel and gold;
s8: removing glue residues by using plasma;
s9: conducting hole screen printing and welding aluminum solder paste;
s10: and melting the solder paste by a heating furnace to form a conduction column connected with the first coil and the second coil.
2. The method of manufacturing of claim 1, further comprising:
s11: silk-screen printing character ink on the surfaces of the PI protective film and the end of the conduction column;
s12: pasting a double-sided adhesive tape and a reinforcing plate;
s13: and (5) blanking the coil appearance.
CN202011544068.8A 2020-12-23 2020-12-23 A kind of aluminum FPC type coil structure and its manufacturing method Active CN112735769B (en)

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Application Number Priority Date Filing Date Title
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Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001188891A (en) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd Non-contact type IC card
JP2010199393A (en) * 2009-02-26 2010-09-09 Fujikura Ltd Method of manufacturing both-sided flexible wiring board
TWI604480B (en) * 2012-03-23 2017-11-01 Lg伊諾特股份有限公司 Wireless power receiver and portable terminal comprising the same
CN103659791B (en) * 2012-09-26 2016-03-02 电装波动株式会社 Wireless power supply and possess the direct-driving type system of this device
CN104093278B (en) * 2014-07-10 2018-01-16 上海英内物联网科技股份有限公司 The manufacture method of one side and two-sided aluminium etching FPC
CN206727226U (en) * 2015-01-30 2017-12-08 株式会社村田制作所 Antenna device and electronic equipment
JP6332252B2 (en) * 2015-12-09 2018-05-30 トヨタ自動車株式会社 Power receiving device and power transmitting device
CN108712817A (en) * 2018-07-17 2018-10-26 江西比亚迪电子部品件有限公司 A kind of wireless charging FPC multi-layer boards and its manufacture craft
CN109195326B (en) * 2018-09-27 2021-04-09 赣州市深联电路有限公司 A method of manufacturing a flexible circuit board for wireless charging of mobile phones
CN110828156B (en) * 2019-11-05 2021-08-13 上海安费诺永亿通讯电子有限公司 Wireless charging receiving coil and manufacturing method thereof

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