CN110996491B - Circuit board assemblies and electronic equipment - Google Patents
Circuit board assemblies and electronic equipment Download PDFInfo
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- CN110996491B CN110996491B CN201911272371.4A CN201911272371A CN110996491B CN 110996491 B CN110996491 B CN 110996491B CN 201911272371 A CN201911272371 A CN 201911272371A CN 110996491 B CN110996491 B CN 110996491B
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- 230000017525 heat dissipation Effects 0.000 abstract description 37
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开一种电路板装置，其包括电路板以及设置在电路板上的电子器件，电路板装置还包括制冷组件和直流电源，制冷组件包括间隔设置在电路板上的至少两个半导体结构件，相邻的两个半导体结构件串联、且分别为N型半导体结构件和P型半导体结构件，制冷组件的冷端与电子器件通过绝缘结构件相连，直流电源与制冷组件电连接。与现有的散热方法相比，本发明公开的电路板装置无需添加散热风扇等结构，从而减少了对电子设备的结构的干涉，节约了空间，同时，利用半导体结构件的热量转移来替代传统的辐射散热和空气对流，大大提高了散热效率。本发明还公开了一种电子设备。
The invention discloses a circuit board device, which includes a circuit board and an electronic device arranged on the circuit board. The circuit board device also includes a refrigeration assembly and a DC power supply, and the refrigeration assembly includes at least two semiconductor structural components arranged on the circuit board at intervals. The two adjacent semiconductor structures are connected in series and are respectively an N-type semiconductor structure and a P-type semiconductor structure. The cold end of the refrigeration component is connected to the electronic device through the insulating structure, and the DC power supply is electrically connected to the refrigeration component. Compared with the existing heat dissipation method, the circuit board device disclosed in the present invention does not need to add a structure such as a heat dissipation fan, thereby reducing the interference to the structure of the electronic equipment, saving space, and at the same time, using the heat transfer of the semiconductor structure to replace the traditional The radiation heat dissipation and air convection greatly improve the heat dissipation efficiency. The invention also discloses an electronic device.
Description
Technical Field
The present invention relates to the field of communications devices, and in particular, to a circuit board device and an electronic device.
Background
With the development of 5G devices, electronic devices have more and more functions, and the electronic devices will inevitably generate more heat in the working process, so that the thermal management of the electronic devices is well processed, and the circuit performance deterioration and reliability reduction caused by high temperature can be avoided. The electric energy consumed by the electronic equipment during the operation is mostly converted into heat and dissipated besides useful work. The heat generated by the electronic equipment can quickly raise the internal temperature, if the heat is not dissipated in time, the equipment can continue to be heated, the device can lose efficacy due to overheating, and the reliability of the electronic equipment can be reduced. Nowadays, SMT (surface mount technology) increases the mounting density of electronic equipment, reduces the effective heat dissipation area, and seriously affects the reliability due to the temperature rise of the equipment. At present, in order to improve the heat dissipation effect, the best method for solving the heat dissipation is to improve the self heat dissipation capability of the direct contact with the heating element, and the heat dissipation through the PCB is one of the effective ways to solve the heat dissipation problem.
The PCB board widely used at present is a copper-clad/epoxy glass cloth substrate or a phenolic resin glass cloth substrate, which has excellent electrical performance and processability but poor heat dissipation performance, generally adopts heat dissipation from the surface of an element to the ambient air, circuit board parts are usually radiated outwards in a heat dissipation mode and flow in the ambient air, and other modes such as air cooling and water cooling, fans and the like are also provided, but as electronic products enter the times of component miniaturization, high-density installation and high-heat-generation assembly, the heat dissipation is very insufficient if only relying on the surface of the element with very small surface area. Meanwhile, due to the large use of the surface mounting elements, the heat generated by the elements is greatly transferred to the PCB.
The existing heat dissipation method has at least the following disadvantages: 1. the heat dissipation effect is poor according to the mode that the part radiates outwards and the ambient air flow; 2. the area of the parts and the circuit board is miniaturized, the metal area in direct contact with the original piece is smaller and smaller, and the heat dissipation effect is poorer and poorer; 3. the structure of the existing electronic equipment is greatly interfered by the circuit board adding device.
Disclosure of Invention
The invention discloses a circuit board device and electronic equipment, and aims to solve the problems that the existing heat dissipation mode is poor in heat dissipation effect and can interfere with the structure of the electronic equipment.
The embodiment of the invention is realized by the following steps:
based on the above purpose, the embodiment of the invention discloses a circuit board device, which comprises a circuit board and an electronic device arranged on the circuit board, and further comprises a refrigeration assembly and a direct current power supply, wherein the refrigeration assembly comprises at least two semiconductor structural members arranged on the circuit board at intervals, two adjacent semiconductor structural members are connected in series through a conductor, one of the two adjacent semiconductor structural members is an N-type semiconductor structural member, the other one of the two adjacent semiconductor structural members is a P-type semiconductor structural member, an insulation structural member is arranged at a cold end of the refrigeration assembly facing the electronic device, the refrigeration assembly is connected with the electronic device through the insulation structural member, and the direct current power supply is electrically connected with the refrigeration assembly.
Based on the above purpose, the embodiment of the invention also discloses an electronic device, which comprises the circuit board device.
The technical scheme adopted by the invention can achieve the following beneficial effects:
the circuit board device disclosed by the invention is characterized in that an electronic device in electronic equipment is connected with the cold end of a refrigeration assembly, when a direct current power supply is switched on, electrons in a semiconductor structural member can be transferred by current, in the processes of current transmission and electron transfer, the semiconductor structural member can generate temperature difference and heat transfer at a joint, the direction of heat transfer in the semiconductor structural member can be controlled by the flowing direction of the current, and the current direction of the direct current power supply is selectively controlled to enable the heat to move from one end, close to the electronic device, of the semiconductor structural member to the other end, so that the end, close to the electronic device, of the semiconductor structural member is cooled, and further the heat dissipation of the electronic device is realized. Compared with the existing heat dissipation method, the electronic equipment disclosed by the invention does not need to be added with a heat dissipation fan and other structures, so that the interference on the structure of the electronic equipment is reduced, the space is saved, meanwhile, the heat transfer of a semiconductor structural member is utilized to replace the traditional radiation heat dissipation and air convection, and the heat dissipation efficiency is greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a schematic diagram of a circuit board arrangement according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic view of a refrigeration assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic view of a first connection of a semiconductor structure according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a second connection of a semiconductor structure according to an embodiment of the present invention;
figure 6 is a third exemplary connection for a semiconductor structure according to embodiments of the present invention.
Description of reference numerals:
100-an electronic device; 200-a circuit board; 210-a via; 300-a refrigeration component; 310-a semiconductor structure; 311-P type semiconductor structures; 312-N type semiconductor structure; 320-a first electrical conductor; 330-a second electrical conductor; 400-an insulating layer; 500-a heat sink; 600-direct current power supply.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, the present embodiment discloses a circuit board apparatus, which includes a refrigeration component 300, a dc power supply 600, a circuit board 200, and an electronic device 100 disposed on the circuit board 200, wherein the refrigeration component 300 includes at least two semiconductor structures 310 disposed on the circuit board 200 at intervals, two adjacent semiconductor structures 310 are connected in series and are an N-type semiconductor structure 312 and a P-type semiconductor structure 311, respectively, an insulating structure is disposed on a side of the refrigeration component 300 facing the electronic device 100, the refrigeration component 300 is connected to the electronic device 100 through the insulating structure, so that a cold end of the refrigeration component 300 is disposed in an insulating manner and is connected to the electronic device 100 in a heat conducting manner, and the dc power supply 600 is electrically connected to the refrigeration component 300.
In the circuit board apparatus disclosed in this embodiment, the electronic device 100 in the electronic device is connected to the cold end of the cooling module 300, when the dc power supply 600 is turned on, the current may transfer electrons in the semiconductor structure 310, and in the current transmission and electron transfer processes, the semiconductor structure 310 may generate a temperature difference and heat transfer at the joint, where the direction of heat transfer in the semiconductor structure 310 may be controlled by the flow direction of the current, and the current direction of the dc power supply 600 is selectively controlled to move heat from one end of the semiconductor structure 310 close to the electronic device 100 to the other end, so that one end of the semiconductor structure 310 close to the electronic device 100 is cooled, and heat dissipation of the electronic device 100 is further achieved. Compared with the existing method of adding heat dissipation, the circuit board device disclosed in the embodiment does not need to add a heat dissipation fan and other structures, thereby reducing the interference on the structure of the electronic equipment, saving the space, and simultaneously, the heat transfer of the semiconductor structural member 310 is utilized to replace the traditional radiation heat dissipation and air convection, thereby greatly improving the heat dissipation efficiency.
Referring to fig. 3, when a current flows in the semiconductor structure 310, the direction of heat transfer is determined by the direction of the current, that is, when a dc current flows in the semiconductor structure 310, heat flows from one end of the device to the other end, and the direction of the current is changed, so that the direction of heat flow can be changed, heat can be transferred to the other end, and the temperature of cooling is different by changing the magnitude of the current. In this embodiment, the direction of the current is controlled such that the end of the semiconductor structure 310 close to the electronic device 100 is a cold end, and the magnitude of the current can be adjusted according to different electronic devices 100, so that the electronic devices with different powers can all be sufficiently cooled.
The semiconductor structure 310 makes one end become a cold end and the other end become a hot end through heat transfer, when the semiconductor structure 310 continuously works, heat can be continuously accumulated at the hot end of the semiconductor structure 310, in order to avoid that the temperature of the hot end of the semiconductor structure 310 is too high, which affects the normal work of the semiconductor structure 310 or causes damage to electronic equipment due to the too high temperature, a heat sink 500 can be arranged at the hot end of the semiconductor structure 310, the arrangement of the heat sink 500 can help the hot end of the semiconductor to quickly dissipate heat, thereby avoiding the too high temperature of the hot end of the semiconductor structure 310, of course, the heat sink 500 and the semiconductor structure 310 should be in insulation connection, thus avoiding electric leakage.
In this embodiment, the circuit board 200 may be a PCB, and the PCB may be directly manufactured into a large pad or a large copper surface of the PCB, or may be laid in a grid copper manner, so as to prevent oxidation of the pad, and further perform a gold immersion surface treatment on the pad.
Referring to fig. 2, in some embodiments of the present invention, a through hole 210 may be formed in a circuit board 200, and then a semiconductor structure 310 may be mounted in the through hole 210. The semiconductor structure 310 can be integrated with the circuit board 200 by forming the through hole 210 to accommodate the semiconductor structure 310 at a position on the circuit board 200 where no circuit is located, so as to further save space and further reduce the influence of structural interference.
The number of the through holes 210 may be at least two, the number of the semiconductor structures 310 may be equal to the number of the through holes 210, and each semiconductor structure 310 is correspondingly installed in one through hole 210. When the circuit board 200 is provided with the through holes 210, the through holes 210 may be arranged in a row, that is, a plurality of through holes 210 are located on the same straight line, which simplifies the circuit and facilitates and orders the conduction of the semiconductor structure 310.
Further, both ends of the semiconductor structures 310 may extend to both ends of the through hole 210, respectively, or both ends of the semiconductor structures 310 may extend beyond both ends of the through hole 210, respectively, and then the adjacent semiconductor structures 310 may be connected to each other through the end portions. Thus, when the temperature of the semiconductor structure 310 is transferred, the cold end of the semiconductor structure 310 can perform sufficient heat exchange with the electronic device 100, and the hot end of the semiconductor structure 310 can transfer heat to a position outside the circuit board 200, so as to avoid heat accumulating on the circuit board 200, thereby avoiding influence on the normal operation of the circuit board 200.
Referring to fig. 4, in some embodiments of the present embodiment, if there are only two semiconductor structures 310, only one first electrical conductor 320 may be used to connect the two semiconductor structures 310. The first electrical conductor 320 may be installed at either end of the semiconductor structure 310, such that a "U" shape is formed between the two semiconductor structures 310 and the first electrical conductor 320, such that one end of the semiconductor structure 310 near the electronic device 100 forms a cold end, and the other end of the semiconductor structure 310 forms a hot end, thereby dissipating heat. Of course, in this embodiment, the first conductor 320 may not be disposed between the two semiconductor structures 310, when the two semiconductor structures 310 are disposed in an inclined manner and one ends of the two semiconductor structures 310 are connected to each other in a close manner, so that a "V" shape is formed between the two semiconductor structures 310, or a series connection between the two semiconductor structures 310 may be formed and a hot end and a cold end are formed for heat dissipation, and at this time, the two semiconductor structures 310 may form such a structure by disposing the through holes 210 on the circuit board 200 to be inclined to each other and communicate with each other.
Referring to fig. 5 and 6, when the number of the semiconductor structures 310 is three or more, if the first conductor 320 is not disposed between the semiconductor structures 310, the semiconductor structures 310 may be inclined to each other so that the plurality of semiconductor structures 310 form a "W" shape. If the semiconductor structures 310 are arranged in parallel, a first electrical conductor 320 needs to be installed between the semiconductor structures 310, where one end of the semiconductor structure 310 facing the insulating layer 400 is a first end, one end of the semiconductor structure 310 facing away from the insulating layer 400 is a second end, the plurality of semiconductor structures 310 are arranged at intervals, the first end of the semiconductor structure 310 is electrically connected to the first end of an adjacent semiconductor structure 310 through the first electrical conductor 320, and the second end of the semiconductor structure 310 is electrically connected to the second end of another adjacent semiconductor structure 310 through the first electrical conductor 320. That is, a plurality of semiconductor structures 310 are connected end to form a series connection, so that when current flows through the semiconductor structures 310, if current flows in from the second end of a first semiconductor structure 310, the current flows out from the first end of the semiconductor structure 310, flows in from the first end of a second semiconductor structure 310, flows out from the second end of the second semiconductor structure 310, and flows in from the second end of a third semiconductor structure 310 to the third semiconductor structure 310, thereby making the first ends of all the semiconductor structures 310 cold and making the second end of the semiconductor structure 310 hot.
When semiconductor structure 310 is mounted in via 210 on circuit board 200, first electrical conductor 320 may be positioned at the port of via 210.
The through holes 210 include a first end facing the electronic device 100 and a second end facing away from the electronic device 100, a first conductor 320 is disposed between the first end of the through hole 210 and the first end of the adjacent through hole 210, and a second conductor 330 is disposed between the second end of the through hole 210 and the second end of another adjacent through hole 210, so that a plurality of semiconductor structures 310 are connected in series.
In some embodiments of the present embodiment, the first conductor 320 and the second conductor 330 are both metal conductors, and the metal conductors are exposed on the surfaces of the two adjacent semiconductor structures 310 while conducting, for example, the metal conductors may be conductive substances such as conductive coatings or conductive plating layers directly attached to the circuit board 200. Such a first conductor 320 is small in size, and can make full use of the blank portion of the circuit board 200, so that the connection between the semiconductor structures 310 is more stable, and the interference with the structure of the electronic device is less.
At this time, since the first conductor 320 is a metal conductor and its surface is exposed, an insulating structure, which may be the insulating layer 400, needs to be disposed between the refrigeration assembly 300 and the electronic device 100, and the insulating layer 400 may be an insulating substance with good thermal conductivity, such as a ceramic sheet or rubber. The insulating layer 400 mainly covers the semiconductor structure 310 and the metal conductor, and may be open at other positions to facilitate electrical connection between the electronic device 100 and the circuit board 200. Because the insulating layer 400 is an integral structure, heat can be transferred more quickly and uniformly inside the insulating layer 400. When the electronic device 100 is mounted on the insulating layer 400, since the insulating layer 400 is connected to the cold end of the cooling module 300, the temperature of the insulating layer 400 may be lower than that of the electronic device 100 in a heat generating state, and the insulating layer 400 may be in full contact with the entire bottom of the electronic device 100, so that the electronic device 100 has a larger heat dissipation surface, and thus the electronic device 100 has a faster heat dissipation speed.
In other embodiments of this embodiment, the first conductor 320 and the second conductor 330 are both configured as the first conductor 320 such as a wire wrapped with an insulator, and the insulator on the periphery of the wire can be regarded as an insulating structural member between the refrigeration assembly 300 and the electronic device 100, and at this time, the first conductor 320 can be arbitrarily arranged on the circuit board 200 without worrying about influencing the circuit of the circuit board 200 itself, so that when connecting two semiconductor insulators, the shortest line can be used for connection, thereby reducing the loss of electric energy. In this case, even if the insulating layer 400 is not provided, the semiconductor structure 310 and the electronic component 100 can be insulated from each other by the wire, thereby functioning as heat dissipation. Of course, in order to make the heat dissipation of the electronic device 100 more rapid and uniform, and to improve the insulation safety between the semiconductor structure 310 and the electronic device 100, the insulating layer 400 may be disposed between the conductive wires and the electronic device 100.
The embodiment further discloses an electronic device, which includes the circuit board device as described above, and the electronic device provided in the embodiment does not need to add a heat dissipation fan or other structures, thereby reducing interference to the structure of the electronic device, saving space, and meanwhile, utilizing heat transfer of the semiconductor structure 310 to replace traditional radiation heat dissipation and air convection, thereby greatly improving heat dissipation efficiency.
The electronic device disclosed by the embodiment of the invention can be a mobile phone, a tablet computer, an electronic book reader, a game machine, an intelligent watch and other devices, and the embodiment of the invention does not limit the specific types of the electronic devices.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. A circuit board arrangement comprising a circuit board (200) and an electronic component (100) arranged on the circuit board (200), characterized in that the circuit board device also comprises a refrigeration component (300) and a direct current power supply (600), the refrigeration assembly (300) comprises at least two semiconductor structural components (310) arranged on the circuit board (200) at intervals, two adjacent semiconductor structural components (310) are connected in series, one of the two adjacent semiconductor structure parts is an N-type semiconductor structure part (312), the other one is a P-type semiconductor structure part (311), the cold end of the refrigeration component (300) facing the electronic device (100) is provided with an insulating structure, the refrigeration assembly (300) is connected with the electronic device (100) through the insulating structural part, and the direct current power supply (600) is electrically connected with the refrigeration assembly (300);
the semiconductor structural parts (310) comprise a first end facing the electronic device (100) and a second end facing away from the electronic device (100), a first electric conductor (320) is electrically connected between the first end of the semiconductor structural part (310) and the first end of the adjacent semiconductor structural part (310), and a second electric conductor (330) is electrically connected between the second end of the semiconductor structural part (310) and the second end of the adjacent other semiconductor structural part (310);
the first conductor (320) and the second conductor (330) are conductive substances with a conductive coating or plating directly attached to the circuit board (200).
2. The circuit board arrangement according to claim 1, wherein the circuit board (200) has a through hole (210) formed therein, and the semiconductor structure (310) is mounted in the through hole (210).
3. The circuit board arrangement according to claim 2, wherein the number of the through holes (210) is at least two, the number of the semiconductor structures (310) is equal to the number of the through holes (210), and each semiconductor structure (310) is correspondingly mounted in one of the through holes (210).
4. A circuit board arrangement according to claim 3, characterized in that both ends of the semiconductor structure (310) extend to both ends of the through hole (210), respectively, or both ends of the semiconductor structure (310) extend beyond both ends of the through hole (210), respectively.
5. A circuit board arrangement according to claim 1, characterized in that the first electrical conductor (320) is a metal conductor and the second electrical conductor (330) is a metal conductor.
6. The circuit board arrangement according to claim 1, wherein the insulating structure is an insulating layer (400), the insulating layer (400) being located between the cooling assembly (300) and the electronic device (100), the cold end of the cooling assembly (300) being connected to the electronic device (100) through the insulating layer (400).
7. A circuit board arrangement according to claim 1, characterized in that two adjacent semiconductor structures (310) are connected in series by means of a wire.
8. The circuit board arrangement according to any of claims 1 to 7, characterized in that the circuit board arrangement further comprises a heat sink (500), the heat sink (500) being arranged at a side of the cooling assembly (300) facing away from the electronic device (100).
9. An electronic device, characterized in that it comprises a circuit board arrangement according to any one of claims 1 to 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911272371.4A CN110996491B (en) | 2019-12-12 | 2019-12-12 | Circuit board assemblies and electronic equipment |
| PCT/CN2020/134476 WO2021115249A1 (en) | 2019-12-12 | 2020-12-08 | Circuit board apparatus and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911272371.4A CN110996491B (en) | 2019-12-12 | 2019-12-12 | Circuit board assemblies and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
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| CN110996491B (en) * | 2019-12-12 | 2021-03-23 | 维沃移动通信有限公司 | Circuit board assemblies and electronic equipment |
| CN111726934B (en) * | 2020-07-02 | 2022-11-11 | 西安电子科技大学芜湖研究院 | Heat dissipation drive plate utilizing semiconductor for cooling |
| CN112584610A (en) * | 2020-12-14 | 2021-03-30 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201680648U (en) * | 2010-04-27 | 2010-12-22 | 上海市七宝中学 | Refrigerator |
| KR20160068280A (en) * | 2014-12-05 | 2016-06-15 | 엘지전자 주식회사 | Printed Circuit Board |
| CN209605100U (en) * | 2019-05-15 | 2019-11-08 | 深圳市同一方光电技术有限公司 | A kind of long-life outdoor golden yellow LED lamp bead |
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| EP0834930B1 (en) * | 1990-04-20 | 2001-10-17 | Matsushita Electric Industrial Co., Ltd. | Thermoelectric semiconductor deaerated into a vacuum and thermoelectric panel using p-type and n-type thermoelectric semiconductors |
| CN203478683U (en) * | 2013-07-05 | 2014-03-12 | 赖耀华 | Semiconductor cooler |
| CN105890066B (en) * | 2016-06-03 | 2019-07-16 | 海信（山东）空调有限公司 | A kind of frequency-variable air conditioner outdoor machine circuit board radiating device and electric-controlled box |
| CN209590755U (en) * | 2019-01-15 | 2019-11-05 | 新乡职业技术学院 | A kind of computer hardware cooling device |
| CN110620869A (en) * | 2019-10-29 | 2019-12-27 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN110996491B (en) * | 2019-12-12 | 2021-03-23 | 维沃移动通信有限公司 | Circuit board assemblies and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201680648U (en) * | 2010-04-27 | 2010-12-22 | 上海市七宝中学 | Refrigerator |
| KR20160068280A (en) * | 2014-12-05 | 2016-06-15 | 엘지전자 주식회사 | Printed Circuit Board |
| CN209605100U (en) * | 2019-05-15 | 2019-11-08 | 深圳市同一方光电技术有限公司 | A kind of long-life outdoor golden yellow LED lamp bead |
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| WO2021115249A1 (en) | 2021-06-17 |
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