CN220963320U - Electronic equipment - Google Patents

Abstract

The utility model relates to the field of semiconductors, in particular to an electronic device, the electronic device (1) comprising a substrate (10); -at least one semiconductor device (20), the at least one semiconductor device (20) being arranged on the substrate (10) and generating heat in operation; -a heat dissipation structure (30), the heat dissipation structure (30) being configured to be adapted to dissipate heat from the substrate (10); a heat transfer structure (40) arranged in the substrate (10), the heat transfer structure (40) being configured to be adapted to conduct heat from the at least one semiconductor device (20) to the heat dissipating structure (30). By means of the solution of the utility model, complex mechanical design can be avoided, final assembly steps are reduced, good heat dissipation of the semiconductor device is ensured and the overall manufacturing cost of the electronic device is reduced. In addition, a particularly compact and attractive appearance structure can be realized by the scheme of the utility model.

Description

Electronic equipment

Technical Field

The utility model relates to the field of semiconductors, in particular to electronic equipment, and particularly relates to a controller.

Background

Currently, as electronic devices move toward miniaturization, high performance, and high integration, semiconductor devices for electronic devices are packaged as a unit in certain functional combinations and provide electrical and mechanical connections to simplify system integration. Such electronic devices are therefore widely used in the fields of vehicles, industrial equipment, household appliances, etc.

Semiconductor devices generally operate optimally at pre-designed temperatures. The temperature rise is caused during the operation of the semiconductor device, and thus it is necessary to reliably conduct away the heat generated by the semiconductor device.

In the prior art, it is necessary to mount the semiconductor device in a plastic connector and fix it in the connector with an adhesive and solder the connector together with the semiconductor device onto a PCB board. In order to conduct away the Heat of the semiconductor device, the semiconductor device is directly fixed to a Heat Sink (english: heat Sink) and an insulating pad/paper and a Heat dissipation material are filled therebetween. However, this construction is complex, costly to assemble and aesthetically undesirable.

Thus, there remains a need for an improvement in the above-described electronic devices that addresses many of the deficiencies in the prior art.

Disclosure of utility model

In order to overcome one of the above drawbacks and/or other drawbacks possible in the prior art not mentioned herein, it is an object of the present utility model to propose an improved electronic device.

According to a first aspect of the present utility model, there is provided an electronic device comprising:

A substrate;

At least one semiconductor device arranged on the substrate and generating heat in operation;

A heat dissipation structure configured to be adapted to dissipate heat from the substrate; and

A heat transfer structure disposed in the substrate, the heat transfer structure configured to be adapted to conduct heat from the at least one semiconductor device to the heat dissipation structure.

The basic idea of the utility model is that the heat generated by the semiconductor device arranged on the substrate of the electronic equipment is conducted to the heat dissipation structure through the substrate, so that the semiconductor device can effectively dissipate heat, and the normal function and the operation efficiency of the electronic equipment are ensured. In addition, the utility model can simplify the manufacturing process, reduce the assembly cost and realize a concise and attractive appearance structure.

Advantageous configurations of the solution according to the utility model can be obtained from the following alternative embodiments.

According to an alternative embodiment of the electronic device according to the utility model, the heat transfer structure is embedded in the substrate in the thickness direction of the substrate. Such an embodiment is simple in structure and easy to process.

According to an alternative embodiment of the electronic device according to the utility model, the substrate has a first surface and a second surface in its thickness direction, the first surface being opposite to the second surface, wherein the heat transfer structure extends from the first surface to the second surface. Such an embodiment enables the surface of the heat transfer structure to be flush with the surface of the substrate, thereby enabling an aesthetically pleasing and compact appearance, and simplifying manufacture and enabling efficient heat transfer.

According to an alternative embodiment of the electronic device of the utility model, the substrate has a first surface and a second surface in its thickness direction, the heat transfer structure extending from the first surface only to the inside of the substrate, wherein the semiconductor device is arranged offset from the heat transfer structure in the thickness direction of the substrate. Such an embodiment enables a compact, attractive and compact appearance.

According to an alternative embodiment of the electronic device according to the utility model, an electrically insulating layer for preventing the heat dissipating structure from being in electrical contact with the substrate is coated on the substrate, the electrically insulating layer at least partially overlapping the heat transfer structure in the thickness direction of the substrate. Such embodiments can effectively prevent electrical communication of the heat transfer structure with the heat dissipating structure, thereby improving safety of the electronic device when in operation.

According to an alternative embodiment of the electronic device according to the utility model, the at least one semiconductor device is soldered to the substrate by means of solder using a surface mount process (SMT), wherein the solder at least partly contacts and covers the heat transfer structure. Such an embodiment ensures that heat generated by the semiconductor device can be reliably conducted to the heat transfer structure via the solder and simplifies the mounting of the semiconductor device on the substrate.

According to an alternative embodiment of the electronic device according to the utility model, the at least one semiconductor device has a plurality of pins, a plurality of corresponding vias being structured on the substrate, the plurality of pins being inserted into the corresponding vias and soldered to the substrate using a via reflow soldering (THRS), respectively. Such an embodiment is simple and easy to manufacture.

According to an alternative embodiment of the electronic device according to the utility model, a thermal interface material for enhancing heat conduction is arranged between the electrically insulating layer and the heat dissipating structure, said thermal interface material being in surface contact with the electrically insulating layer and the heat transferring structure, respectively. Such an embodiment can effectively improve heat conduction, improve heat dissipation efficiency, and ensure reliable operation of the electronic device.

According to an alternative embodiment of the electronic device according to the utility model, the heat dissipating structure is configured as a housing, in which the substrate is fastened by means of screws. Such an embodiment is simple and easy to assemble.

According to an alternative embodiment of the electronic device according to the utility model, the heat dissipating structure comprises a cooler arranged on the heat dissipating structure and configured to be adapted to cool the heat dissipating structure. Such an embodiment improves the cooling effect and ensures reliable operation of the electronic device.

According to an alternative embodiment of the electronic device according to the utility model, the heat transfer structure is configured as a metal inlay, for example as a copper inlay. Such an embodiment has good thermal conductivity and is easy to manufacture.

According to an alternative embodiment of the electronic device according to the utility model, a plurality of fins or fin pins are constructed on the cooler. Such an embodiment further improves the cooling effect, ensuring a reliable operation of the electronic device.

According to an alternative embodiment of the electronic device according to the utility model, a liquid line is constructed in the cooler. Such an embodiment further improves the cooling effect, ensuring a reliable operation of the electronic device.

According to an alternative embodiment of the electronic device according to the utility model, the cooler comprises a fan. Such an embodiment again improves the cooling effect, ensuring a reliable operation of the electronic device.

According to an alternative embodiment of the electronic device according to the utility model, a plurality of semiconductor devices is provided to form an integrated circuit.

According to an alternative embodiment of the electronic device according to the utility model, the electronic device is configured as a controller. For example, the controller may be a controller for a vehicle, a sub-controller, a self-controller, or the like.

Further features of the utility model will become apparent from the claims, the drawings, and the description of the drawings. The features and feature combinations mentioned in the above description and those mentioned in the following description of the figures and/or shown only in the figures can be used not only in the respectively specified combination but also in other combinations without departing from the scope of the utility model. Accordingly, the following are also considered to be encompassed and disclosed by the present utility model: these are not explicitly shown in the figures and are not explicitly explained, but are derived from and result from a combination of separate features from the explained content. The following and combinations of features are also considered disclosed: which does not have all of the features of the original written independent claim. Furthermore, the following and combinations of features are considered to be disclosed, inter alia, by the foregoing: which exceeds or deviates from the combination of features defined in the reference relationships of the claims.

Drawings

Further optional details and features of the utility model result from the following description of preferred embodiments schematically shown in the drawings.

FIG. 1 shows a schematic diagram of one embodiment of an electronic device of the present utility model;

FIG. 2 shows a schematic diagram of another embodiment of the electronic device of the present utility model; and

Fig. 3 shows a schematic view of a further embodiment of the electronic device of the utility model.

List of reference numerals

1. Electronic equipment

10. Substrate board

11. A first surface

12. A second surface

13. Via hole

14. Connection boss

20. Semiconductor device with a semiconductor layer having a plurality of semiconductor layers

21. Pin

30. Heat dissipation structure

31. Cooling device

32. Bridging structure

40. Heat transfer structure

50. Electrically insulating layer

60. Solder material

70. Thermal interface material

80. And (5) a screw.

Detailed Description

In order to make the technical problems, technical solutions and advantageous technical effects to be solved by the present utility model more apparent, the present utility model will be further described in detail with reference to the accompanying drawings and a plurality of exemplary embodiments. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the utility model.

Features in embodiments of the utility model may be combined with each other without conflict. In the different drawings, the same components are denoted by the same reference numerals, and other components are omitted for the sake of brevity, which does not indicate that the technical solution of the present utility model cannot include other components. It should be understood that the dimensions, proportions, and number of parts of the figures are not intended to limit the utility model.

Hereinafter, an embodiment of the present utility model will be described in detail with reference to fig. 1 to 3.

Fig. 1 shows a schematic view of an embodiment of an electronic device 1 of the utility model. According to this embodiment, the electronic apparatus 1 is configured as a controller, for example, a domain controller for a vehicle.

As shown in fig. 1, the electronic device 1 includes a substrate 10, the substrate 10 being configured as a PCB board and having a metal coating, such as a copper coating or an aluminum coating, applied thereon. In addition, the electronic apparatus 1 further includes a semiconductor device 20. In fig. 1, only one semiconductor device 20 is exemplarily shown for simplicity. However, a plurality of semiconductor devices 20, which may be semiconductor elements such as diodes, insulated Gate Bipolar Transistors (IGBTs), metal Oxide Semiconductor Field Effect Transistors (MOSFETs), thyristors, etc., are included in the electronic apparatus 1, and are arranged on the substrate 10 at intervals to form an integrated circuit.

The substrate 10 has a first surface 11 and a second surface 12 in its thickness direction, the first surface 11 being opposite to the second surface 12.

According to one embodiment, the semiconductor device 20 is soldered to the first surface 11 of the substrate 10 by means of solder 60 using surface mount SMT, wherein the solder 60 contacts and covers the heat transfer structure 40.

Alternatively, according to another embodiment, the semiconductor device 20 may be adhesively fixed on the substrate 10 with an adhesive applied between the semiconductor device 20 and the substrate 10.

The semiconductor device 20 has a plurality of pins 21, a plurality of corresponding vias 13 are configured on the substrate 10, and the plurality of pins 21 are inserted into the corresponding vias 13, respectively, and soldered to the substrate 10 by using a via reflow soldering method THRS.

According to one embodiment, the plurality of pins 21 are coated with an electrically insulating coating. Such an electrically insulating coating can protect the semiconductor device 20 from short circuits caused by creepage under high-voltage environments.

When the electronic device 1 is in operation, the semiconductor component 20 generates heat as a power element, which heat needs to be conducted away in order to ensure reliable operation of the electronic device 1.

Thus, according to this embodiment, the electronic apparatus 1 further includes the heat dissipation structure 30, and the heat dissipation structure 30 is capable of conducting away the heat of the semiconductor device 20. A heat transfer structure 40 is arranged in the substrate 10, the heat transfer structure 40 being for conducting heat from the semiconductor device 20 to the heat dissipating structure 30. Thus, the heat of the semiconductor device 20 is conducted via the substrate 10 or via the heat transfer structure 40 in the substrate 10 to the heat dissipating structure 30 and then cooled by convection and/or radiation.

According to one embodiment, the heat transfer structure 40 is embedded in the substrate 10 in the thickness direction of the substrate 10 and extends from the first surface 11 to the second surface 12 of the substrate 10. That is, in this embodiment, the heat transfer structure 40 is embedded in the substrate 10 in a penetrating manner and the surfaces (upper and lower surfaces in fig. 1) of the heat transfer structure 40 are flush with the first surface 11 and the second surface 12, respectively. Thus, a neat and compact appearance is formed. According to one embodiment, the heat transfer structure 40 is configured as a metal inlay, for example a copper inlay, which has good heat conductivity and thus ensures reliable heat conduction.

According to one embodiment, the heat dissipating structure 30 is configured as a housing. For example, a connection boss 14 is constructed on the bottom of the inside of the case, and a screw hole to be engaged with the screw 80 is constructed in the connection boss 14. Through holes are provided in the edge of the base plate 10, through which screws 80 are screwed with the connection boss 14 to fasten the base plate 10 in the housing or on the bottom of the housing.

The heat dissipation structure 30 is made of metal, such as aluminum. To prevent the heat dissipating structure 30 from making electrical contact with the heat transfer structure 40, an electrically insulating layer 50 is coated on the substrate 10. Such an electrically insulating layer 50 can prevent the substrate 10 and the heat transfer structure 40 from being electrically connected to the heat dissipation structure 30 while ensuring heat conduction, thereby ensuring operational reliability of the electronic device 1. As shown in fig. 1, the electrically insulating layer 50 overlaps the heat transfer structure 40 in the thickness direction of the substrate 10.

In fig. 1, an electrically insulating layer 50 is coated on the second surface 12 of the substrate 10 and is in facial contact with the bottom surface of the heat dissipating structure 30. Thereby, heat from the semiconductor device 20 is conducted via the substrate 10 or via the heat transfer structure 40 in the substrate 10 and the electrically insulating layer 50 to the heat dissipation structure 30 configured as a housing, whereby heat exchange is performed between the entire surface of the housing and the outside air to achieve heat dissipation of the semiconductor device 20.

Fig. 2 shows a schematic view of another embodiment of the electronic device 1 of the utility model. The electronic device 1 in fig. 2 is constructed similarly to the electronic device 1 in fig. 1, and thus, the same elements are not repeated.

The embodiment of fig. 2 differs from the embodiment of fig. 1 in that a thermal interface material 70 for enhancing the heat conduction is also arranged between the electrically insulating layer 50 and the heat dissipating structure 30, the thermal interface material 70 being in surface-wise, in particular surface-wise, contact with the electrically insulating layer 50 and the heat dissipating structure 30 (in fig. 2 the bottom of the heat dissipating structure 30), respectively.

Such thermal interface materials 70 are typically composed of materials having a high thermal conductivity or a low interfacial thermal resistance. This can further improve the heat conduction efficiency and the heat dissipation effect.

Further, according to another embodiment, the heat dissipation structure 30 includes a cooler 31, and the cooler 31 is made of metal. As shown in fig. 2, a cooler 31 is disposed on an outer surface of the heat radiation structure 30 (an upper portion of the heat radiation structure 30 is disposed in fig. 2) and serves to actively cool the heat radiation structure 30.

Illustratively, a plurality of fins or fin pins (not shown in detail) are configured on the cooler 31, which are configured along the lengthwise direction of the cooler 31. Thereby further increasing the heat dissipation area of the cooler 31.

Further, the cooler 31 includes a fan (not shown in detail) that accelerates the flow of air over the cooler 31 and further improves the heat dissipation effect.

Alternatively or additionally, a fluid channel (not shown in detail) is formed in the cooler 31, in which a cooling medium, for example cooling water, flows. The cooler 31 is in contact with the heat radiation structure 30 and performs heat exchange, thereby further securing the heat radiation effect of the electronic apparatus 1.

Fig. 3 shows a schematic view of a further embodiment of the electronic device 1 of the utility model. Unlike the embodiment of fig. 1 and 2, in this embodiment, the substrate 10 has a first surface 11 and a second surface 12 in the thickness direction thereof, and the heat transfer structure 40 extends from the first surface 11 only to the inside of the substrate 10 in the thickness direction of the substrate 10. That is, the upper surface of the heat transfer structure 40 is flush with the first surface 11, and the lower surface of the heat transfer structure 40 is located in the substrate 10.

As shown in fig. 3, the semiconductor device 20 and the heat transfer structure 40 are arranged offset in the thickness direction of the substrate 10. At the first surface 11 of the substrate 10, an electrical insulation layer 50 for preventing the heat dissipation structure 30 from electrically contacting the substrate 10 is coated on the staggered position of the semiconductor device 20 and the heat transfer structure 40, and the electrical insulation layer 50 overlaps the heat transfer structure 40 in the thickness direction of the substrate 10.

According to one embodiment, the heat dissipating structure 30 is configured as a housing and further comprises a bridge structure 32, the bridge structure 32 being for conducting heat from the substrate 10 to the housing via the electrically insulating layer 50. In this embodiment, the bridging structure 32 is of the same material as the housing.

Similar to the embodiment of fig. 2, a thermal interface material 70 for enhancing thermal conduction is arranged between the electrically insulating layer 50 and the bridging structure 32, the thermal interface material 70 being in planar, in particular planar contact with the electrically insulating layer 50 and the bridging structure 32, respectively, thereby improving the efficiency of the thermal conduction.

In contrast to the embodiment of fig. 1 and 2, in the embodiment of fig. 3, the heat transfer structure 40 is not embedded through in the thickness direction of the substrate 10. Thus, the electrically insulating layer 50 and the thermal interface material 70 are arranged at the first surface 11 of the substrate 10 and on the same side of the substrate 10 as the semiconductor device 20. Thereby, a more compact (thinner) structure and a more compact appearance of the electronic apparatus 1 can be achieved. In addition, since the electric insulating layer 50 and the thermal interface material 70 are both disposed on the same side as the semiconductor device 20, the manufacturing process can be further simplified, and the cost can be reduced.

In this specification, the terms "disposed," "connected," "coupled" and "connected" are to be construed broadly, unless explicitly stated or limited otherwise. For example, it may be a fixed connection, a removable connection, or an integral connection; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intermediate members, or may be in communication with the interior of two elements. The expressions "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying an indication of the number of technical features indicated. Features defining "first", "second" or "first" may be expressed or implied as including at least one such feature. The meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to circumstances.

Claims (10)

1. An electronic device, characterized in that the electronic device (1) comprises:

a substrate (10);

-at least one semiconductor device (20), the at least one semiconductor device (20) being arranged on the substrate (10) and generating heat in operation;

-a heat dissipation structure (30), the heat dissipation structure (30) being configured to be adapted to dissipate heat from the substrate (10); and

A heat transfer structure (40) arranged in the substrate (10), the heat transfer structure (40) being configured to be adapted to conduct heat from the at least one semiconductor device (20) to the heat dissipating structure (30).

2. The electronic device according to claim 1, characterized in that the heat transfer structure (40) is embedded in the substrate (10) in the thickness direction of the substrate (10).

3. The electronic device according to claim 2, characterized in that the substrate (10) has a first surface (11) and a second surface (12) in its thickness direction, the first surface (11) being opposite to the second surface (12), wherein the heat transfer structure (40) extends from the first surface (11) to the second surface (12).

4. The electronic device according to claim 2, characterized in that the substrate (10) has a first surface (11) and a second surface (12) in its thickness direction, the heat transfer structure (40) extending from the first surface (11) only to the interior of the substrate (10), wherein the semiconductor component (20) is arranged offset from the heat transfer structure (40) in the thickness direction of the substrate (10).

5. The electronic device of any one of claim 1 to 4, wherein,

-Coating the substrate (10) with an electrically insulating layer (50) for preventing the heat dissipating structure (30) from being in electrical contact with the substrate (10), the electrically insulating layer (50) at least partially overlapping the heat transfer structure (40) in the thickness direction of the substrate (10); and/or

The at least one semiconductor component (20) is soldered to the substrate (10) by means of a solder (60) using a surface mount method, wherein the solder (60) at least partially contacts and covers the heat transfer structure (40).

6. The electronic device according to any one of claims 1 to 4, characterized in that the at least one semiconductor component (20) has a plurality of pins (21), a plurality of corresponding vias (13) being structured on the substrate (10), the plurality of pins (21) being inserted into the corresponding vias (13) respectively and soldered to the substrate (10) using a via reflow soldering method.

7. Electronic device according to claim 5, characterized in that a thermal interface material (70) for enhancing thermal conduction is arranged between the electrically insulating layer (50) and the heat dissipating structure (30), the thermal interface material (70) being in surface contact with the electrically insulating layer (50) and the heat transferring structure (40), respectively.

8. The electronic device according to any one of claims 1 to 4 and 7, characterized in that,

The heat dissipation structure (30) is configured as a housing, in which the base plate (10) is fastened by means of screws (80); and/or

The heat dissipating structure (30) comprises a cooler (31), the cooler (31) being arranged on the heat dissipating structure (30) and being configured to be adapted to cool the heat dissipating structure (30).

9. The electronic device of claim 8, wherein the electronic device comprises a memory device,

The heat transfer structure (40) is configured as a metal inlay; and/or

-A plurality of fins or fin pins are configured on the cooler (31); and/or

-A liquid line is formed in the cooler (31); and/or

-The cooler (31) comprises a fan; and/or

A plurality of semiconductor devices (20) are provided to form an integrated circuit.

10. The electronic device according to any one of claims 1 to 4, 7 and 9, characterized in that the electronic device (1) is configured as a controller.