CN215871957U - Fine circuit flexible circuit board combining thick gold, immersion gold and OSP - Google Patents
Fine circuit flexible circuit board combining thick gold, immersion gold and OSP Download PDFInfo
- Publication number
- CN215871957U CN215871957U CN202121780927.3U CN202121780927U CN215871957U CN 215871957 U CN215871957 U CN 215871957U CN 202121780927 U CN202121780927 U CN 202121780927U CN 215871957 U CN215871957 U CN 215871957U
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- China
- Prior art keywords
- circuit board
- flexible circuit
- layer
- osp
- gold
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 56
- 239000010931 gold Substances 0.000 title claims abstract description 56
- 238000007654 immersion Methods 0.000 title claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 10
- 238000009423 ventilation Methods 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 7
- 238000007670 refining Methods 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 7
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses a thick gold, immersion gold and OSP combined fine circuit flexible circuit board which comprises a flexible circuit board, wherein a fine device is fixedly installed at the lower end of the flexible circuit board, an immersion gold layer is fixedly installed at the left part of the upper end of the flexible circuit board in an inserting mode, a thick gold layer is fixedly installed at the right part of the upper end of the flexible circuit board in an inserting mode, two connecting blocks are fixedly installed at the front part and the rear part of the upper end of the flexible circuit board, heat conducting devices are fixedly installed at the upper ends of the four connecting blocks in an inserting mode, and heat radiating devices are fixedly installed at the upper ends of the heat conducting devices. According to the fine circuit flexible circuit board combining the thick gold, the immersion gold and the OSP, the processing effect of the flexible circuit board is improved through the fine device, the using effect of the flexible circuit board is also improved, heat in the flexible circuit board can be taken away quickly through the heat dissipation device and the heat conduction device, and therefore the service life of the flexible circuit board is prolonged.
Description
Technical Field
The utility model relates to the technical field of flexible circuit boards, in particular to a fine circuit flexible circuit board combining thick gold, immersion gold and OSP.
Background
Flexible circuit boards are printed circuits made with flexible, insulating substrates. Flexible circuits provide excellent electrical performance, meet design requirements for smaller and higher density packaging, and also help reduce assembly processes and enhance reliability. The flexible connector can be freely bent, wound and folded, can bear millions of dynamic bending without damaging a lead, can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized. 1. The existing flexible circuit board is more and more widely applied, but the flexible circuit board is mostly processed by a single mode, for example, the whole board nickel electroplating mode has high gold cost, poor weldability, poor abrasion resistance in the OSP mode, and poor soldering tin strength in the chemical nickel immersion gold mode, so that the flexible circuit board still has certain defects; 2. most of the existing flexible circuit boards are subjected to heat dissipation through holes, however, the heat dissipation speed is low and the efficiency is low only by means of heat dissipation holes, and the flexible circuit boards still can be affected.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a fine circuit flexible circuit board combining thick gold, immersion gold and OSP, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a meticulous circuit flexible line way board that thick gold, heavy gold and OSP combined, includes the flexible line way board, flexible line way board lower extreme fixed mounting has the device that becomes more meticulous, flexible line way board upper end left part alternates fixed mounting has heavy gold layer, flexible line way board upper end right part alternates fixed mounting has thick gold layer, the anterior and the equal fixed mounting in upper end rear portion of flexible line way board upper end have two connecting blocks, four fixed mounting that alternate jointly on the connecting block has a heat-transfer device, heat-transfer device upper end fixed mounting has heat abstractor.
Preferably, the refining device comprises a copper foil layer, an OSP layer is fixedly mounted at the lower end of the copper foil layer, a PI layer is fixedly mounted at the lower end of the OSP layer, an elastic base layer is fixedly mounted at the lower end of the PI layer, and the copper foil layer is fixedly mounted at the lower end of the flexible circuit board.
Preferably, heat abstractor includes fixed frame, the equal threaded connection in fixed frame upper end left part and upper end right part has two fixed screws, the equal fixed mounting of fixed frame front end inner wall and rear end inner wall has the backup pad, two fixed mounting has radiator fan between the backup pad, fixed frame is through four fixed screw fixed mounting in the heat conduction device upper end.
Preferably, heat-conducting device includes the heat dissipation layer, it has a plurality of air channel to open heat dissipation layer upper end, the equal fixed mounting in heat dissipation layer upper end left part and upper end right part has two fixed columns, four the screw hole has all been opened to the fixed column upper end, heat dissipation layer interlude fixed mounting is in four connecting block upper ends.
Preferably, the lower end face of the heat radiation fan is higher than the upper end face of the flexible circuit board.
Preferably, the fixing column corresponds to the fixing screw up and down.
Compared with the prior art, the utility model has the following beneficial effects:
1. the OSP layer arranged on the refining device is used for preventing oxidation, thermal shock and moisture resistance and protecting the copper surface from further rusting in a normal environment, the processing modes of the flexible circuit board are diversified through the design of the thick gold layer and the immersion gold layer, and meanwhile, the PI layer has excellent high and low temperature resistance, electrical insulation, cohesiveness, radiation resistance and medium resistance, so that the processing effect of the flexible circuit board is improved, and the using effect of the flexible circuit board is also improved.
2. According to the fine circuit flexible circuit board combining the thick gold, the immersion gold and the OSP, the heat dissipation fan on the heat dissipation device blows, the ventilation groove is formed in the heat dissipation layer on the heat conduction device, and air blown by the heat dissipation fan is led out to the two sides of the heat dissipation layer through the ventilation groove, so that heat in the flexible circuit board is taken away quickly, and the service life of the flexible circuit board is prolonged.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a thick gold, immersion gold and OSP combined fine circuit flexible circuit board according to the present invention;
FIG. 2 is a schematic diagram of an overall structure of a refining apparatus of a fine circuit flexible circuit board combining a thick gold layer, a gold immersion layer and an OSP according to the present invention;
FIG. 3 is a schematic diagram of the overall structure of a heat dissipation device of a fine circuit flexible circuit board combining thick gold, immersion gold and OSP according to the present invention;
fig. 4 is a schematic diagram of the overall structure of a heat conduction device of a fine circuit flexible circuit board combining thick gold, immersion gold and OSP according to the present invention.
In the figure: 1. a flexible circuit board; 2. a refining device; 3. a heat sink; 4. a heat conducting device; 5. depositing a gold layer; 6. a thick gold layer; 7. connecting blocks; 20. a copper foil layer; 21. an OSP layer; 22. a PI layer; 23. an elastic base layer; 30. a fixed frame; 31. fixing screws; 32. a support plate; 33. a heat radiation fan; 40. a heat dissipation layer; 41. a ventilation slot; 42. fixing a column; 43. and (4) screw holes.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a meticulous circuit flexible line way board that thick gold, heavy gold and OSP combine, including flexible line way board 1, flexible line way board 1 lower extreme fixed mounting has device 2 that becomes more meticulous, flexible line way board 1 upper end left part interlude fixed mounting has heavy gold layer 5, flexible line way board 1 upper end right part interlude fixed mounting has thick gold layer 6, flexible line way board 1 upper end front portion and the equal fixed mounting in upper end rear portion have two connecting blocks 7, the common interlude fixed mounting in four connecting block 7 upper ends has heat abstractor 4, heat abstractor 4 upper end fixed mounting has heat abstractor 3.
The refining device 2 comprises a copper foil layer 20, an OSP layer 21 is fixedly mounted at the lower end of the copper foil layer 20, a PI layer 22 is fixedly mounted at the lower end of the OSP layer 21, an elastic base layer 23 is fixedly mounted at the lower end of the PI layer 22, the copper foil layer 20 is fixedly mounted at the lower end of the flexible circuit board 1, the processing modes of the flexible circuit board 1 are diversified through the design of the OSP layer 21, the thick gold layer 6 and the immersion gold layer 5, and meanwhile, the PI layer 22 has excellent high and low temperature resistance, electric insulation, cohesiveness, radiation resistance and medium resistance, so that the processing effect of the flexible circuit board 1 is improved, and the using effect of the flexible circuit board is also improved; the heat dissipation device 3 comprises a fixed frame 30, the left part and the right part of the upper end of the fixed frame 30 are in threaded connection with two fixing screws 31, the inner wall of the front end and the inner wall of the rear end of the fixed frame 30 are fixedly provided with supporting plates 32, a heat dissipation fan 33 is fixedly arranged between the two supporting plates 32, the fixed frame 30 is fixedly arranged at the upper end of the heat conduction device 4 through the four fixing screws 31 and is blown through the heat dissipation fan 33, and therefore wind is conveyed to a heat dissipation layer 40 on the heat conduction device 4; the heat conduction device 4 comprises a heat dissipation layer 40, the upper end of the heat dissipation layer 40 is provided with a plurality of ventilation grooves 41, the left part and the right part of the upper end of the heat dissipation layer 40 are fixedly provided with two fixing columns 42, the upper ends of the four fixing columns 42 are provided with screw holes 43, the heat dissipation layer 40 is fixedly arranged at the upper ends of the four connecting blocks 7 in an inserting manner, the ventilation grooves 41 are formed in the heat dissipation layer 40, and air blown out by the heat dissipation fan 33 is guided out to the two sides of the heat dissipation layer 40 through the ventilation grooves 41, so that heat in the flexible circuit board 1 is taken away quickly; the lower end surface of the heat radiation fan 33 is higher than the upper end surface of the flexible circuit board 1; the fixing post 42 corresponds to the fixing screw 31 up and down.
It should be noted that the utility model is a fine circuit flexible circuit board combining thick gold, immersion gold and OSP, through the OSP layer 21 arranged on the fine device 2, it has oxidation resistance, thermal shock resistance, moisture resistance, it is used to protect the copper surface from rusting continuously in the normal environment, and through the design of the thick gold layer 6 and the immersion gold layer 5, the processing mode of the flexible circuit board 1 becomes diversified, meanwhile, through the PI layer 22 has excellent high and low temperature resistance, electrical insulation, cohesiveness, radiation resistance, medium resistance, not only the processing effect of the flexible circuit board 1 is improved, but also the using effect is improved, when the flexible circuit board 1 is overheated, and when it is difficult to cool down rapidly and effectively, it is blown by the heat dissipation fan 33 on the heat dissipation device 3, so as to convey the wind to the heat dissipation layer 40 on the heat conduction device 4, at the same time, through the ventilation slot 41 arranged on the heat dissipation layer 40, the air blown out by the heat dissipation fan 33 is guided out to the two sides of the heat dissipation layer 40 through the ventilation slot 41, so that the heat in the flexible circuit board 1 is quickly taken away, the flexible circuit board 1 is prevented from being burnt out due to overheating, and the service life of the flexible circuit board 1 is prolonged.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. A kind of meticulous circuit flexible line board that the thick gold, heavy gold and OSP combine, including flexible line board (1), characterized by that: device (2) become more meticulous is installed to flexible line way board (1) lower extreme fixed mounting, flexible line way board (1) upper end left part alternates fixed mounting and sinks golden layer (5), flexible line way board (1) upper end right part alternates fixed mounting and has thick golden layer (6), flexible line way board (1) upper end front portion and the equal fixed mounting in upper end rear portion have two connecting blocks (7), four connecting block (7) upper end alternates fixed mounting jointly has heat abstractor (4), heat abstractor (4) upper end fixed mounting has heat abstractor (3).
2. The fine line flexible circuit board of claim 1, wherein said thick gold, immersion gold and OSP are combined, and wherein: the refining device (2) comprises a copper foil layer (20), an OSP layer (21) is fixedly mounted at the lower end of the copper foil layer (20), a PI layer (22) is fixedly mounted at the lower end of the OSP layer (21), an elastic base layer (23) is fixedly mounted at the lower end of the PI layer (22), and the copper foil layer (20) is fixedly mounted at the lower end of the flexible circuit board (1).
3. The fine line flexible circuit board of claim 1, wherein said thick gold, immersion gold and OSP are combined, and wherein: heat abstractor (3) is including fixed frame (30), fixed frame (30) upper end left part and the equal threaded connection in upper end right part have two fixed screws (31), fixed frame (30) front end inner wall and the equal fixed mounting in rear end inner wall have backup pad (32), two fixed mounting has radiator fan (33) between backup pad (32), fixed frame (30) are through four fixed screws (31) fixed mounting in heat-transfer device (4) upper end.
4. The fine line flexible circuit board of claim 1, wherein said thick gold, immersion gold and OSP are combined, and wherein: heat-conducting device (4) are including heat dissipation layer (40), open heat dissipation layer (40) upper end has a plurality of ventilation groove (41), the equal fixed mounting in heat dissipation layer (40) upper end left part and upper end right part has two fixed columns (42), four fixed column (42) upper end has all opened screw hole (43), heat dissipation layer (40) alternates fixed mounting in four connecting block (7) upper ends.
5. The fine line flexible circuit board of claim 3, wherein said thick gold, immersion gold and OSP are combined, and further comprising: the lower end face of the heat radiation fan (33) is higher than the upper end face of the flexible circuit board (1).
6. The fine line flexible circuit board of claim 4, wherein said thick gold, immersion gold and OSP are combined, and further comprising: the fixing column (42) corresponds to the fixing screw (31) up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121780927.3U CN215871957U (en) | 2021-08-02 | 2021-08-02 | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121780927.3U CN215871957U (en) | 2021-08-02 | 2021-08-02 | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215871957U true CN215871957U (en) | 2022-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121780927.3U Active CN215871957U (en) | 2021-08-02 | 2021-08-02 | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215871957U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
-
2021
- 2021-08-02 CN CN202121780927.3U patent/CN215871957U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
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