CN110752164B - Microscopic laser system for chip and substrate alignment and fine leveling - Google Patents
Microscopic laser system for chip and substrate alignment and fine leveling Download PDFInfo
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- CN110752164B CN110752164B CN201911144659.3A CN201911144659A CN110752164B CN 110752164 B CN110752164 B CN 110752164B CN 201911144659 A CN201911144659 A CN 201911144659A CN 110752164 B CN110752164 B CN 110752164B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
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Abstract
The invention discloses a micro laser system for aligning and precisely leveling a chip and a substrate, which solves the problem of how to combine a laser precise positioning system with a micro optical system to realize bonding precise positioning. The invention realizes the alignment of the chip and the substrate by reflecting the coaxial light rays emitted by the microscopic imaging camera with the coaxial light source through the chip target reflector and the substrate target reflector respectively and then returning the reflected coaxial light rays to the microscopic imaging camera for imaging, and forms three positioning laser points on three target reflectors on the chip through a double-path laser respectively by using the same light path system, thereby obtaining the accurate position of the horizontal plane of the chip, and forms three positioning laser points on three target reflectors on the substrate through the double-path laser respectively by using the same light path system, thereby obtaining the accurate position of the horizontal plane of the substrate, and further completing the accurate adjustment of the parallelism of the two planes.
Description
Technical Field
The invention relates to a manufacturing device of a large-scale integrated circuit device, in particular to a micro laser system for aligning and finely leveling a chip and a substrate in bonding process equipment for chip flip-chip.
Background
The flip chip bonding equipment is mainly used for the flip chip bonding process of manufacturing large-scale integrated circuit devices, and is used for completing direct interconnection bonding of chips and substrates, so that the package has more excellent circuit characteristics of high frequency, low delay and low crosstalk, and the reliability of assembly interconnection of circuits, components or systems can be effectively improved; the flip-chip bonding equipment mainly comprises three parts, namely a first part is a reading circuit substrate placing table arranged on a marble reference platform, the reading circuit substrate placing table can be adjusted in position along the X direction, in position along the Y direction and in rotation along a theta axis perpendicular to a plane formed by the X direction and the Y direction, a second part is a Z-direction lifting arm mechanism arranged right above the marble reference platform, a pitching and deflection platform is arranged at the lower end of the Z-direction lifting arm mechanism, a chip sucker is arranged on the pitching and deflection platform, the main function of the Z-direction lifting arm mechanism is to realize the bonding of the chip sucker and the substrate sucker through pressing down, before bonding, the leveling of the chip sucker and the substrate sucker is realized through the adjustment of pitching and deflection, a third part is an optical system which is arranged between the reading circuit substrate placing table and the Z-direction lifting arm mechanism, the optical system mainly bears whether the chip is aligned with the substrate and the substrate is detected in parallel, the bonded reading circuit substrate is placed on the theta positioning platform, the bonded chip sucker is arranged on the XY positioning platform is aligned with the substrate, the bonded chip is aligned with the substrate through the bonding, the bonding is aligned with the substrate through the positioning and the deflection platform, the bonding is enabled to be aligned with the substrate through the bonding, and the leveling is enabled, and the Z-direction lifting arm is pressed down to bond the bonded chip and the readout circuit substrate together by pressure, so that the flip-chip bonding process of the chip is completed.
The prior bonding process equipment is provided with an optical system, a microscopic system and a laser system are respectively arranged in the optical system, the parallelism of an adsorption chuck of a bonded chip and a chuck for placing a read-out circuit substrate is measured through the laser system in the optical system, according to the parallelism measurement result of the two chucks, the parallelism of the two chucks reaches the designed requirement of bonding parallelism through adjusting a pitching platform and a tilting platform, then a pre-bonded chip is adsorbed onto the chip adsorption chuck, the read-out circuit substrate is placed onto the read-out circuit substrate chuck with a reflecting mirror surface, the microscopic system is started, the chip adsorbed onto the chip adsorption chuck and the read-out circuit substrate adsorbed onto the substrate chuck are aligned, after the alignment is completed, a Z-direction lifting arm is pressed down, the chip and the read-out circuit substrate are bonded together through pressure welding, the prior optical system only detects and adjusts the parallelism of the chip adsorption chuck and the read-out circuit substrate chuck, but not detects and adjusts the parallelism of the two bonded chips and the read-out circuit substrate chuck, when the parallelism of the two bonded chips and the substrate chuck is not parallel to the designed to the optical system, and the optical system cannot meet the requirements of the prior optical system, and the performance is directly influenced by the optical system after the bonding system is arranged.
The on-site operation steps include that a read circuit substrate is placed on an XY theta positioning platform below, a bonded chip is adsorbed on a pitching deflection platform above, accurate alignment of the chip and the substrate is firstly carried out, then the read circuit substrate is parallel to the bonded chip through controlling the pitching deflection platform, finally a Z-direction lifting arm presses down the pitching deflection platform to bond the bonded chip and the read circuit substrate together through pressing, and therefore the flip-chip bonding process of the chip is completed, the existing leveling means is used for carrying out parallelism adjustment of the two suckers through a self-adaptive mode, namely pressing the chip sucker onto the substrate sucker in advance to carry out leveling setting, and the parallelism adjustment of the two suckers is completed according to the memory of the leveling setting.
Before bonding, the chip and the substrate are aligned and adjusted to ensure the coincidence of the pre-bonding positions of the chip and the substrate, so that the chip is accurately and inversely bonded together, and the parallelism of the chip sucker and the substrate sucker is only adjusted in place in the prior art, the parallelism adjustment of the chip and the substrate is not carried out, the laser precise positioning and leveling device has the advantages that no precise positioning and leveling are performed on positioning points on the chip and positioning points on the substrate, and how to combine the laser precise positioning with the micro optical system can reduce the occupied space of the optical system, and the precise positioning of bonding can be realized, so that the laser precise positioning and leveling device is a real problem to be solved on site.
Disclosure of Invention
The invention provides a micro laser system for aligning and precisely leveling a chip and a substrate, which solves the technical problem of how to combine a laser precise positioning system with a micro optical system to realize bonding precise positioning.
The invention solves the technical problems by the following technical proposal:
A bonding process device for flip chip comprises a marble Dan Jizhun platform, a Y-direction moving guide rail mounting base arranged on a marble reference platform, a positioning platform Y-direction moving platform guide rail arranged on the Y-direction moving guide rail mounting base, a positioning platform Y-direction moving slide block arranged on the positioning platform Y-direction moving platform guide rail, a positioning platform X-direction moving guide rail arranged on the top end surface of the positioning platform Y-direction moving slide block, a positioning platform X-direction moving slide block arranged on the positioning platform X-direction moving guide rail, a positioning platform X-direction moving slide block movably arranged on the positioning platform X-direction moving guide rail through the bottom surface of the rear side end of the positioning platform X-direction moving slide block, an air bearing support pad is arranged on the bottom surface of the front side end of the positioning platform X-direction moving slide block, the air bearing support pad is movably arranged on the top surface of the marble reference platform, a theta rotation platform and a rotary driving motor are respectively arranged on the top end surface of the positioning platform X-direction moving slide block, a reading circuit substrate placing table is arranged on the top surface of the theta rotation platform, a substrate sucker with a reflecting mirror surface is arranged on the reading circuit substrate placing table, a reading circuit substrate is arranged on the substrate sucker with the reflecting mirror surface, and a substrate parallelism adjusting mark point is arranged on the reading circuit substrate; a Z-direction lifting arm is arranged right above the theta rotation platform, a pitching deflection adjusting motor and a pitching deflection adjusting platform are respectively arranged at the bottom end of the Z-direction lifting arm, a chip adsorption platform is fixedly arranged on the lower bottom surface of the pitching deflection adjusting platform, a chip sucking disc with a reflecting mirror surface is adsorbed on the lower bottom surface of the chip adsorption platform, a chip is adsorbed on the lower bottom surface of the chip sucking disc with the reflecting mirror surface, the optical system comprises a reading circuit substrate placing table, a Z-direction lifting arm, an optical system operating box, a chip parallelism adjusting marking point, an XY-direction moving platform, an optical system operating box and a reading circuit substrate placing table.
The collimating light path is formed by a red LED point light source, a blue LED point light source, a semi-transparent semi-reflective mirror, a collimating objective lens, a reflecting mirror, a target image generating plate, a light filter, a substrate sucker with a reflecting mirror surface, a chip sucker with a reflecting mirror surface and a collimating imaging camera, an icon generated by irradiating the target image generating plate with light of the red LED point light source is reflected by the chip sucker with the reflecting mirror surface, a chip sucker position state image A is generated in the collimating imaging camera, and an icon generated by irradiating the target image generating plate with light of the blue LED point light source is reflected by the substrate sucker with the reflecting mirror surface, and a substrate sucker position state image B is generated in the collimating imaging camera.
A bonding method for flip chip is characterized in that a microscopic light path for aligning a chip with a substrate is arranged in an optical system operation box, the microscopic light path consists of a semi-transparent semi-reflective mirror, a collimating objective lens, a reflecting mirror, a focusing objective lens, a pentagonal prism and a microscopic imaging camera with a light source, light source light rays in the microscopic imaging camera with the light source irradiate onto a reflecting surface at a marking point on the chip, reflected light rays image a chip marking point image C in the microscopic imaging camera, meanwhile, light source light rays in the microscopic imaging camera with the light source irradiate onto a reflecting surface at the marking point on the substrate, reflected light rays image a substrate marking point image D in the microscopic imaging camera, and if the chip marking point image C is not overlapped with the substrate marking point image D, a reading circuit substrate placing table is adjusted until the chip marking point image C is overlapped with the substrate marking point image D, and alignment of the chip and the reading circuit substrate is completed.
The collimating light path structure for adjusting the parallelism of the chip sucker and the substrate sucker comprises an optical system operation box, the chip sucker with a reflecting mirror surface and the substrate sucker with the reflecting mirror surface, wherein a red LED point light source is arranged in the optical system operation box, a first semi-transparent and semi-reflecting mirror is arranged on the right side of the red LED point light source, a first collimating lens is arranged on the right side of the first semi-transparent and semi-reflecting mirror, a target image generating plate is arranged on the right side of the first collimating lens, a first reflecting mirror forming an angle of 45 degrees with a horizontal plane is arranged on the right side of the target image generating plate, a second semi-transparent and semi-reflecting mirror is arranged under the first reflecting mirror, a second reflecting mirror forming an angle of 135 degrees with the horizontal plane is arranged on the right side of the second semi-transparent and semi-reflecting mirror, a first optical filter is arranged right side of the second semi-transparent and semi-reflecting mirror, a third reflecting mirror forming an angle of 135 degrees with the horizontal plane is arranged right side of the second semi-transparent and semi-reflecting mirror, a fifth reflecting mirror forming an angle of 45 degrees with the second semi-transparent and semi-reflecting mirror is arranged on the right side of the second semi-transparent and semi-reflecting mirror, and a fifth reflecting mirror forming an angle of 45 degrees with the second semi-transparent and semi-reflecting mirror is arranged under the second reflecting mirror, and a fifth reflecting mirror is arranged under the second reflecting mirror, and a third reflecting mirror forming an angle of the second reflecting mirror is arranged right side of the second reflecting mirror.
And respectively generating a target generation image A of which the target image is reflected by the chip sucker with the reflecting mirror surface and a target generation image B of which the target image is reflected by the substrate sucker with the reflecting mirror surface in the collimation imaging camera.
A method for adjusting parallelism of a chip sucker and a substrate sucker by utilizing a collimation light path is characterized by comprising the following steps:
The method comprises the steps that red light rays emitted by a red LED point light source are sequentially transmitted through a first semi-transparent semi-reflective mirror and a first collimating lens, target image red light rays are formed on a target image generation plate, the formed target image red light rays sequentially pass through the first reflective mirror, the second semi-transparent semi-reflective mirror and the second reflective mirror to be reflected, filtered by a first optical filter and then irradiated onto a reflective mirror surface of a chip sucker with a reflective mirror surface, and after being reflected by the reflective mirror surface, the target image generated by a target image reflected by the chip sucker with the reflective mirror surface in a collimating imaging camera sequentially passes through the first optical filter, the second reflective mirror to be reflected by the second semi-transparent semi-reflective mirror to be transmitted by a third reflective mirror to be reflected by a fourth reflective mirror to be transmitted by the second collimating lens;
Blue light rays emitted by a blue LED point light source sequentially pass through a first semi-transparent semi-reflective mirror and a first collimating lens to be transmitted, then target image blue light rays are formed on a target image generation plate, the formed target image blue light rays sequentially pass through the first semi-transparent semi-reflective mirror, the second semi-transparent semi-reflective mirror to be transmitted, the fifth reflective mirror to be reflected and the sixth reflective mirror to be reflected, and then are irradiated onto the reflecting mirror surface of a substrate sucker with a reflecting mirror surface after being filtered by a second optical filter, and then pass through the second optical filter to be filtered, the sixth reflective mirror to be reflected, the fifth reflective mirror to be reflected, the second semi-transparent semi-reflective mirror to be reflected, the third reflective mirror to be reflected and the fourth reflective mirror to be transmitted, and then target image B is generated in a collimating imaging camera after the target image is generated and is reflected by the substrate sucker with the reflecting mirror surface;
If the target generation image A and the target generation image B are not overlapped, the pitching deflection adjustment platform is adjusted, the posture of the chip sucker with the reflecting mirror surface is changed until the target generation image A after the target image is reflected by the chip sucker with the reflecting mirror surface is overlapped with the target generation image B after the target image is reflected by the substrate sucker with the reflecting mirror surface, and the adjustment operation of the parallelism of the chip sucker and the substrate sucker is completed.
The microscopic laser system comprises a microscopic imaging camera with a coaxial light source, a two-way laser, a chip and a read-out circuit substrate, wherein the microscopic imaging camera with the coaxial light source is arranged in an optical system operation box, a first focusing objective lens is arranged on the right side of the microscopic imaging camera with the coaxial light source, a third collimating objective lens is arranged on the right side of the first focusing objective lens, a third semi-transparent and semi-reflecting mirror forming an angle of 45 degrees with a horizontal plane is arranged on the right side of the third collimating objective lens, a fourth semi-transparent and semi-reflecting mirror forming an angle of 135 degrees with the horizontal plane is arranged on the right side of the third semi-transparent and semi-reflecting mirror, a seventh reflecting mirror is arranged on the right side of the fourth semi-transparent and semi-reflecting mirror forming an angle of 135 degrees with the horizontal plane, a second focusing objective lens is arranged right above the seventh reflecting mirror, a chip is arranged on the chip, an eighth reflecting mirror is arranged under the third semi-transparent and semi-reflecting mirror, a fifth semi-transparent and semi-reflecting mirror is arranged on the right side of the eighth reflecting mirror, a fifth semi-transparent and semi-reflecting mirror is arranged on the right side of the fifth reflecting mirror, and a read-out circuit is arranged under the fifth semi-transparent and semi-reflecting mirror.
A right-angle prism is arranged between the fourth semi-transparent semi-reflective mirror and the fifth semi-transparent semi-reflective mirror, and a two-way laser is arranged on the right side of the right-angle prism.
The operation method of the micro laser system for aligning and finely leveling the chip and the substrate is characterized by comprising the following steps:
The mirror image C of the first chip target on the chip and the mirror image D of the first substrate target on the substrate are imaged in a microscopic imaging camera with a coaxial light source by moving an optical system operation box hung on an optical system XY direction moving platform, and the specific process is as follows:
After the coaxial light source light rays in the microscopic imaging camera with the coaxial light source are focused through the first focusing objective lens and transmitted through the third collimating objective lens;
a part of light is irradiated on a chip target reflector arranged on a chip after being sequentially transmitted through a third half-transmitting half-reflecting mirror, transmitted through a fourth half-transmitting half-reflecting mirror, reflected by a seventh reflecting mirror and focused by a second focusing objective lens, and then sequentially transmitted through the second focusing objective lens, reflected by the seventh reflecting mirror, transmitted through the fourth half-transmitting half-reflecting mirror, transmitted through the third half-transmitting half-reflecting mirror, transmitted through a third collimating objective lens and transmitted through the first focusing objective lens, and then a reflecting mirror image C of a first chip target is formed in a microscopic imaging camera with a coaxial light source;
The other part of light is sequentially reflected by a third half-mirror, reflected by an eighth mirror, transmitted by a fifth half-mirror, refracted by a pentagonal prism and focused by a third focusing objective lens, irradiated onto a substrate target mirror arranged on a read-out circuit substrate, reflected by the substrate target mirror, and sequentially transmitted by the third focusing objective lens, refracted by the pentagonal prism, transmitted by the fifth half-mirror, reflected by the eighth mirror, reflected by the third half-mirror, transmitted by a third collimating objective lens and transmitted by the first focusing objective lens, and then a first substrate target mirror image D is formed in a microscopic imaging camera with a coaxial light source;
starting a double-path laser, reflecting a first path of laser light on the double-path laser by an upper reflecting surface of a right-angle prism, sequentially reflecting by a fourth semi-transparent and semi-reflective mirror, reflecting by a seventh reflecting mirror and focusing by a second focusing objective lens, and irradiating the laser light on a chip target reflecting mirror arranged on a chip to form a laser spot on a first chip target reflecting mirror image C on the chip;
after being reflected by the lower side reflecting surface of the right-angle prism, the second path of laser light on the two-path laser sequentially passes through the fifth semi-transparent semi-reflecting mirror for reflection, the pentagonal prism for refraction and the third focusing objective lens for focusing, and irradiates on a substrate target reflecting mirror arranged on a read-out circuit substrate to form a laser spot on a first substrate target reflecting mirror image D;
Moving the optical system operation box hung on the optical system XY direction moving platform again, and repeating the steps from the first step to the fourth step to obtain a laser spot on a second chip target reflector image E on the chip and a second substrate target reflector image F on a substrate corresponding to the laser spot;
Continuing to move the operation of the optical system hung on the optical system XY direction moving platform, and repeating the steps from the first step to the fourth step to obtain a laser spot on a third chip target reflector image G on the chip and a third substrate target reflector image H on the substrate corresponding to the laser spot;
The laser point on the first chip target reflector image C, the laser point on the second chip target reflector image E and the laser point on the third chip target reflector image G are made into a plane, so that a chip horizontal state plane is obtained; the laser point on the first substrate target reflector image D, the laser point on the second substrate target reflector image F and the laser point on the third substrate target reflector image H are made into a plane, so that a substrate horizontal state plane is obtained;
Calculating the parallelism included angle between the horizontal plane of the chip and the horizontal plane of the substrate, finishing the fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, adjusting the pitching deflection adjusting platform if the parallelism included angle is larger than the design requirement index, and repeating the steps from the first step to the seventh step after the pitching deflection adjusting platform is adjusted until the parallelism included angle meets the design requirement index.
The invention realizes the alignment of a chip and a substrate by reflecting coaxial light rays emitted by a microscopic imaging camera with a coaxial light source through a chip target reflector and a substrate target reflector respectively and then returning the reflected coaxial light rays to the microscopic imaging camera for imaging, and the three positioning laser points are respectively formed on three target reflectors on the chip by a double-path laser through the same light path system, so that the accurate position of a horizontal plane where the chip is positioned is obtained, the three positioning laser points are respectively formed on three target reflectors on the substrate by the double-path laser through the same light path system, the accurate position of the horizontal plane where the substrate is positioned is obtained, the included angle formed by the two planes is calculated, finally the included angle of the parallelism of the two planes is obtained, and the obtained included angle of the parallelism is compared with a design requirement index, so that the accurate adjustment of the parallelism of the two planes is completed.
Drawings
FIG. 1 is a schematic view of a laser microscope two-in-one optical path structure of the invention;
FIG. 2 is a schematic view of the microscopic optical path structure of the present invention;
FIG. 3 is a schematic view of the laser path structure of the present invention;
FIG. 4 is a diagram of a collimated light path for adjusting the parallelism of a chip chuck and a substrate chuck in accordance with the present invention;
FIG. 5 is a schematic general structural view of a bonding process apparatus for flip chip according to the present invention;
fig. 6 is a schematic structural view of the xyθ stage on the marble reference stage 21 of the present invention;
FIG. 7 is a schematic diagram of the optical system operating platform of the present invention;
Fig. 8 is a schematic structural view of the Z-direction lift arm mechanism of the present invention.
Detailed Description
The invention is described in detail below with reference to the attached drawing figures:
The bonding process equipment for flip chip comprises a marble reference platform 21, wherein a Y-direction moving guide rail mounting base 9 is arranged on the marble reference platform 21, a positioning platform Y-direction moving platform guide rail 8 is arranged on the Y-direction moving guide rail mounting base 9, a positioning platform Y-direction moving slide block 7 is arranged on the positioning platform Y-direction moving platform guide rail 8, a positioning platform X-direction moving guide rail 6 is arranged on the top end surface of the positioning platform Y-direction moving slide block 7, a positioning platform X-direction moving slide block 22 is arranged on the positioning platform X-direction moving guide rail 6, the positioning platform X-direction moving slide block 22 is movably arranged on the positioning platform X-direction moving guide rail 6 through the bottom surface of the rear end of the positioning platform X-direction moving slide block 22, an air bearing support pad 10 is movably arranged on the top surface of the marble reference platform 21, a theta rotation platform 3 and a rotation driving motor 11 are respectively arranged on the top end surface of the positioning platform X-direction moving slide block 22, a read circuit substrate 1 is arranged on the top surface of the theta rotation platform Y-direction moving slide block 7, a read circuit substrate is arranged on the top surface of the theta rotation platform 3, a mirror surface is arranged on the read substrate is arranged on the mirror surface 4, a mirror surface is arranged on the read substrate, and a mirror surface is arranged on the circuit substrate 4, and a mirror surface is arranged on the mirror surface 4, and is parallel to the circuit substrate is arranged; a Z-direction lifting arm 17 is arranged right above the theta rotation platform 3, a pitching deflection adjusting motor 18 and a pitching deflection adjusting platform 12 are respectively arranged at the bottom end of the Z-direction lifting arm 17, a chip adsorption platform 13 is fixedly arranged on the lower bottom surface of the pitching deflection adjusting platform 12, a chip sucker 14 with a reflecting mirror surface is adsorbed on the lower bottom surface of the chip adsorption platform 13, the chip 15 is adsorbed on the lower bottom surface of the chip sucker 14 with the reflecting mirror surface, a chip parallelism adjusting mark point 16 is arranged on the lower bottom surface of the chip 15, an XY direction moving platform 19 of an optical system is movably arranged between the reading circuit substrate placing table 1 and the Z direction lifting arm 17, and an optical system operation box 20 is hung on the XY direction moving platform 19 of the optical system.
The invention relates to a method for adjusting the pitch and deflection degrees of a chip sucker by comparing whether two images are overlapped or not to achieve the parallelism of the two suckers, and the invention comprises the following steps of adjusting the pitch and deflection degrees of the chip sucker by using a collimation imaging camera after an icon generated by radiating light of a red LED point light source to the target image generating plate is reflected by the chip sucker 14 with a reflection mirror surface, generating a chip sucker position state image A in the collimation imaging camera and generating a substrate sucker position state image B in the collimation imaging camera after the icon generated by radiating light of a blue LED point light source to the target image generating plate is reflected by the substrate sucker 2 with the reflection mirror surface.
A bonding method for flip chip is characterized in that a microscopic light path for aligning a chip with a substrate is arranged in an optical system operation box 20, the microscopic light path consists of a semi-transparent semi-reflective mirror, a collimating objective lens, a reflecting mirror, a focusing objective lens, a pentagonal prism and a microscopic imaging camera with a light source, light source light rays in the microscopic imaging camera with the light source irradiate onto a reflecting surface at a mark point on the chip, reflected light rays image a chip mark point image C in the microscopic imaging camera, meanwhile, light source light rays in the microscopic imaging camera with the light source irradiate onto a reflecting surface at the mark point on the substrate, reflected light rays image a substrate mark point image D in the microscopic imaging camera, if the chip mark point image C is not overlapped with the substrate mark point image D, a reading circuit substrate placing table 1 is adjusted until the chip mark point image C is overlapped with the substrate mark point image D, and alignment work of the chip and a reading circuit substrate is completed.
The collimating light path structure for adjusting the parallelism of the chip sucking disc and the substrate sucking disc comprises an optical system operation box 20, a chip sucking disc 14 with a reflecting mirror surface and a substrate sucking disc 2 with a reflecting mirror surface, wherein a red LED point light source 23 is arranged in the optical system operation box 20, a first half-reflecting mirror 24 is arranged on the right side of the red LED point light source 23, a first collimating lens 25 is arranged on the right side of the first half-reflecting mirror 24, a target image generating plate 26 is arranged on the right side of the first collimating lens 25, a first reflecting mirror 27 which forms an angle of 45 degrees with a horizontal plane is arranged on the right side of the target image generating plate 26, a second half-reflecting mirror 28 is arranged under the first reflecting mirror 27, a second reflecting mirror 29 which forms an angle of 135 degrees with the horizontal plane is arranged on the right side of the second half-reflecting mirror 28, a first optical filter 30 is arranged right above the second reflecting mirror 29, the chip sucking disc 14 with the reflecting mirror surface is arranged on the right side of the first half-reflecting mirror 24, a third reflecting mirror 135 is arranged on the left side of the second half-reflecting mirror 28, a third reflecting mirror 31 which forms an angle of 135 degrees with the horizontal plane is arranged under the fourth reflecting mirror 33, and a fourth collimating lens 32 is arranged on the left side of the second reflecting mirror 33; a blue LED point light source 35 is arranged right below the first half-transmitting half-reflecting mirror 24, a fifth reflecting mirror 36 which forms an angle of 45 degrees with the horizontal plane is arranged right below the second half-transmitting half-reflecting mirror 28, a sixth reflecting mirror 37 which forms an angle of 45 degrees with the horizontal plane is arranged on the right side of the fifth reflecting mirror 36, a second optical filter 38 is arranged right below the sixth reflecting mirror 37, a substrate chuck 2 having a mirror surface is provided directly under the second filter 38.
A target generation image a in which a target image is reflected by the chip chuck 14 with a mirror surface and a target generation image B in which a target image is reflected by the substrate chuck 2 with a mirror surface are generated in the collimator imaging camera 34, respectively.
A method for adjusting parallelism of a chip sucker and a substrate sucker by utilizing a collimation light path is characterized by comprising the following steps:
The red light emitted by the red LED point light source 23 is sequentially transmitted through the first half-reflecting mirror 24 and the first collimating lens 25, then target image red light is formed on the target image generating plate 26, the formed target image red light is sequentially reflected through the first reflecting mirror 27, the second half-reflecting mirror 28 and the second reflecting mirror 29, filtered by the first optical filter 30 and then irradiated onto the reflecting mirror surface of the chip sucking disc 14 with the reflecting mirror surface, and after being reflected by the reflecting mirror surface, the target image A is generated in the collimating imaging camera 34 after being reflected by the chip sucking disc 14 with the reflecting mirror surface, sequentially transmitted through the first optical filter 30, the second reflecting mirror 29, the second half-reflecting mirror 28, the third reflecting mirror 31, the fourth reflecting mirror 32 and the second collimating lens 33;
Blue light emitted by the blue LED point light source 35 sequentially passes through the first semi-transparent semi-reflective mirror 24 and the first collimating lens 25 to be transmitted, a target image blue light is formed on the target image generating plate 26, the formed target image blue light sequentially passes through the first reflecting mirror 27 to be reflected, the second semi-transparent semi-reflective mirror 28 to be transmitted, the fifth reflecting mirror 36 to be reflected and the sixth reflecting mirror 37 to be reflected, and is filtered by the second optical filter 38 to be irradiated onto the reflecting mirror surface of the substrate chuck 2 with the reflecting mirror surface, and the target image B is generated in the collimating imaging camera 34 after being reflected by the substrate chuck 2 with the reflecting mirror surface and sequentially passes through the second optical filter 38 to be filtered, the sixth reflecting mirror 37 to be reflected, the fifth reflecting mirror 36 to be reflected, the second semi-transparent semi-reflective mirror 28 to be reflected, the third reflecting mirror 31 to be reflected, the fourth reflecting mirror 32 to be transmitted and the second collimating lens 33 to be reflected;
If the target generation image A and the target generation image B are not overlapped, the pitching deflection adjustment platform 12 is adjusted, the posture of the chip sucker 14 with the reflecting mirror surface is changed until the target generation image A after the target image is reflected by the chip sucker 14 with the reflecting mirror surface is overlapped with the target generation image B after the target image is reflected by the substrate sucker 2 with the reflecting mirror surface, and the adjustment operation of the parallelism of the chip sucker and the substrate sucker is completed.
The microscopic laser system comprises a microscopic imaging camera 39 with a coaxial light source, a two-way laser 51, a chip 15 and a readout circuit substrate 4, wherein the microscopic imaging camera 39 with the coaxial light source is arranged in an optical system operation box 20, a first focusing objective lens 40 is arranged on the right side of the microscopic imaging camera 39 with the coaxial light source, a third collimating objective lens 41 is arranged on the right side of the first focusing objective lens 40, a third semi-transparent mirror 42 forming an angle of 45 degrees with a horizontal plane is arranged on the right side of the third collimating objective lens 41, a fourth semi-transparent mirror 43 forming an angle of 135 degrees with the horizontal plane is arranged on the right side of the third semi-transparent mirror 42, a seventh semi-transparent mirror 44 is arranged on the right side of the fourth semi-transparent mirror 43 forming an angle of 135 degrees with the horizontal plane, a second focusing objective lens 45 is arranged right above the seventh semi-transparent mirror 44, a chip 15 is arranged on the right side of the first focusing objective lens 40, a third semi-transparent mirror 42 is arranged under the third semi-transparent mirror 42, a fifth semi-transparent mirror 46 is arranged under the fifth semi-transparent mirror 47, and a readout circuit is arranged on the right side of the fifth semi-transparent mirror 46.
A right-angle prism 50 is provided between the fourth half mirror 43 and the fifth half mirror 47, and a two-way laser 51 is provided on the right side of the right-angle prism 50.
The operation method of the micro laser system for aligning and finely leveling the chip and the substrate is characterized by comprising the following steps:
The mirror image C of the first chip target on the chip 15 and the mirror image D of the first substrate target on the substrate are imaged in the microimaging camera 39 with coaxial light source by moving the optical system operation box 20 suspended on the optical system XY direction moving platform 19, specifically as follows:
After the coaxial light source light rays in the microscopic imaging camera 39 with the coaxial light source are focused by the first focusing objective lens 40 and transmitted by the third collimating objective lens 41;
a part of light is irradiated on a chip target reflector arranged on the chip 15 after being sequentially transmitted through a third half-reflecting mirror 42, a fourth half-reflecting mirror 43, a seventh reflecting mirror 44 and a second focusing objective 45, and then is sequentially transmitted through the second focusing objective 45, the seventh reflecting mirror 44, the fourth half-reflecting mirror 43, the third half-reflecting mirror 42, the third collimating objective 41 and the first focusing objective 40, and a reflecting mirror image C of a first chip target is formed in a microscopic imaging camera 39 with a coaxial light source;
The other part of light is reflected by the third half-reflecting mirror 42, reflected by the eighth reflecting mirror 46, transmitted by the fifth half-reflecting mirror 47, refracted by the pentagonal prism 48, focused by the third focusing objective lens 49, irradiated onto a substrate target reflecting mirror arranged on the readout circuit substrate 4, reflected by the substrate target reflecting mirror, transmitted by the third focusing objective lens 49, refracted by the pentagonal prism 48, transmitted by the fifth half-reflecting mirror 47, reflected by the eighth reflecting mirror 46, reflected by the third half-reflecting mirror 42, transmitted by the third collimating objective lens 41, transmitted by the first focusing objective lens 40, and then formed into a first substrate target reflecting mirror image D in the microscopic imaging camera 39 with the coaxial light source;
starting the two-way laser 51, reflecting the first path of laser light on the two-way laser 51 by the upper side reflecting surface of the right-angle prism 50, reflecting by the fourth semi-transparent and semi-reflective mirror 43, reflecting by the seventh reflecting mirror 44 and focusing by the second focusing objective lens 45, and irradiating the laser light on a chip target reflecting mirror arranged on the chip 15 to form a laser spot on a first chip target reflecting mirror image C on the chip;
After being reflected by the lower reflecting surface of the right-angle prism 50, the second laser light on the two-way laser 51 is reflected by the fifth semi-transparent semi-reflecting mirror 47, refracted by the pentagonal prism 48 and focused by the third focusing objective lens 49, and irradiates on a substrate target reflecting mirror arranged on the readout circuit substrate 4 to form a laser spot on a first substrate target reflecting mirror image D;
Moving the optical system operation box 20 hung on the optical system XY direction moving platform 19 again, and repeating the steps from the first step to the fourth step to obtain a laser spot on a second chip target mirror image E on the chip and a second substrate target mirror image F on the substrate corresponding to the laser spot;
continuing to move an optical system operation box 20 hung on an optical system XY direction moving platform 19, and repeating the steps from the first step to the fourth step to obtain a laser spot on a third chip target mirror image G on the chip and a third substrate target mirror image H on a substrate corresponding to the laser spot;
The laser point on the first chip target reflector image C, the laser point on the second chip target reflector image E and the laser point on the third chip target reflector image G are made into a plane, so that a chip horizontal state plane is obtained; the laser point on the first substrate target reflector image D, the laser point on the second substrate target reflector image F and the laser point on the third substrate target reflector image H are made into a plane, so that a substrate horizontal state plane is obtained;
calculating the parallelism included angle between the horizontal plane of the chip and the horizontal plane of the substrate, finishing the fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, adjusting the pitching deflection adjusting platform 12 if the parallelism included angle is larger than the design requirement index, and repeating the steps from the first step to the seventh step after the pitching deflection adjusting platform is adjusted until the parallelism included angle meets the design requirement index.
Claims (2)
1. The micro laser system for aligning and precisely leveling the chip and the substrate comprises a micro imaging camera (39) with a coaxial light source, a double-path laser (51), the chip (15) and a readout circuit substrate (4), and is characterized in that the micro imaging camera (39) with the coaxial light source is arranged in an optical system operation box (20), a first focusing objective (40) is arranged on the right side of the micro imaging camera (39) with the coaxial light source, a third collimating objective (41) is arranged on the right side of the first focusing objective (40), a third semi-transparent mirror (42) forming an angle of 45 DEG with a horizontal plane is arranged on the right side of the third collimating objective (41), a fourth semi-transparent mirror (43) forming an angle of 135 DEG with the horizontal plane is arranged on the right side of the third semi-transparent mirror (42), a seventh semi-transparent mirror (44) forming an angle of 135 DEG with the horizontal plane is arranged on the right side of the fourth semi-transparent mirror (43), a second focusing objective (45) is arranged right above the seventh mirror (44), a third semi-transparent mirror (42) is arranged on the right side of the third collimating objective (41), a third semi-transparent mirror (15) forming an angle of the horizontal plane is arranged on the right side of the third semi-transparent mirror (46), a fifth semi-transparent mirror (46) is arranged on the right side of the chip (15), a pentagonal prism (48) is arranged on the right side of the fifth semi-transparent semi-reflective mirror (47), a third focusing objective lens (49) is arranged below the pentagonal prism, a reading circuit substrate (4) is arranged right below the third focusing objective lens (49), and a substrate target mirror is arranged on the reading circuit substrate (4).
2. A micro laser system for aligning and fine leveling a chip and a substrate according to claim 1, wherein a right-angle prism (50) is arranged between the fourth half mirror (43) and the fifth half mirror (47), and a two-way laser (51) is arranged on the right side of the right-angle prism (50).
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| CN210628249U (en) * | 2019-11-20 | 2020-05-26 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Micro-laser system for chip and substrate alignment and fine-leveling |
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| JP4234661B2 (en) * | 2004-09-30 | 2009-03-04 | 株式会社カイジョー | Ball inspection method in wire bonding |
| KR101113850B1 (en) * | 2005-08-11 | 2012-02-29 | 삼성테크윈 주식회사 | Method for flip chip bonding and flip chip bonder implementing the same |
| CN106253049A (en) * | 2016-08-23 | 2016-12-21 | 中国电子科技集团公司第二研究所 | The chip adsorbing mechanism of Laser Devices full-automatic eutectic chip mounter |
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