CN110662397B - Heat dissipation design method of electronic equipment, heat dissipation structure and electronic equipment - Google Patents

Abstract

The invention relates to the technical field of heat dissipation of electronic products, and discloses a heat dissipation design method, a heat dissipation structure and an electronic device of an electronic device. The heat dissipation design method of electronic equipment includes the following steps: obtaining a heat distribution map of the working state of the PCB through thermal simulation; obtaining the heat source point according to the heat distribution map, laying heat dissipation copper foil around the heat source point on the PCB, Heat dissipation holes are opened on the PCB; a plurality of metal protrusions are set on the metal casing, some of which are used to fix the PCB, and the heat source is set close to the protrusion, and the other part of the protrusion is used to connect with the heat source point contact. In the present invention, the heat dissipated by the heat source point is conducted to the casing through the heat dissipation part, the heat is dissipated through the casing, the heat dissipation part has good contact with the heat source point, the heat dissipation area is large, and the heat dissipation reliability is good; The shell is easy to process, and the heat dissipation cost of the set-top box is reduced.

Description

Heat dissipation design method of electronic equipment, heat dissipation structure and electronic equipment

technical field

The invention relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation design method, a heat dissipation structure and an electronic device of an electronic device.

Background technique

With the rapid development of the electronic industry, the running speed of electronic components continues to increase, and a large amount of heat is generated during operation, which increases the temperature of itself and the system, which in turn affects the stability of the system. In order to ensure the normal operation of electronic components, a heat sink is usually installed on the electronic components to dissipate the heat generated by them.

However, the heat source points such as thermal devices mounted on the PCB of some electronic products are relatively small and flat in shape. Generally, the heat sink cannot effectively contact with it, and the cost of the special heat sink is relatively high. In the prior art, the method of PCB heat dissipation is to keep the heat-sensitive device or the heat-generating point away from the high heat flux density area, and cut the groove to cut off the heat conduction from the high heat flux density area to the heat-sensitive device or the heat-generating point and the heat dissipation on the hot spot of the heat-sensitive device. chip, the design of the PCB is limited. If a thermal pad is added from the bottom of the thermal device or the heating point to connect to the bottom of the electronic product, the thickness of the thermal pad is increased, the heat dissipation cost of the electronic product is increased, and the reliability is relatively low.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a heat dissipation design method, a heat dissipation structure and an electronic device for an electronic device, which reduces the heat dissipation cost of the electronic device and has high reliability.

For this purpose, the present invention adopts the following technical solutions:

A heat dissipation design method for electronic equipment, comprising the following steps:

Obtain the thermal distribution map of the PCB working state through thermal simulation;

Obtaining heat source points according to the heat distribution map, laying heat dissipation copper foil around the heat source points on the PCB, and opening heat dissipation vias on the PCB at the bottom of the heat source points;

A plurality of metal protruding parts are arranged on the metal casing. A part of the protruding parts is used for fixing the PCB, and the heat source is arranged close to the protruding part, and another part of the protruding parts is used for fixing the PCB. Make point contact with the heat source.

Preferably, the laying area of the heat dissipation copper foil is greater than or equal to three times the area of the heat source point.

A heat dissipation structure for an electronic device is produced by the above-mentioned heat dissipation design method for an electronic device, the heat dissipation structure includes a metal casing, and a surface of the casing is provided with a plurality of metal protrusions protruding toward the inside of the casing The protruding part includes a fixing part for fixing the PCB and at least one heat dissipation part in contact with a heat source point on the PCB, and the fixing part is arranged close to the heat source point. Preferably, the heat dissipation part includes a first convex hull formed by punching the outer surface of the casing to the inner side of the casing, and the heat source is in contact with the first convex hull.

Preferably, the first convex hull includes two symmetrically arranged first inclined plates and a first horizontal plate whose ends are connected to the two first inclined plates, and the heat source point is connected to the first horizontal plate. surface contact.

Preferably, a heat dissipation hole is opened on the first horizontal plate, and a heat conduction member is arranged in the heat dissipation hole.

Preferably, the thermally conductive member is thermally conductive silica gel injected into the heat dissipation hole.

Preferably, the heat dissipation part further includes at least one heat dissipation boss formed by stamping from the outer surface of the casing to the inner side of the casing, and a heat conduction gasket is arranged on the heat dissipation boss.

Preferably, a heat dissipation copper foil is laid around the heat source point on the PCB, and a heat dissipation via hole is opened on the heat dissipation copper foil.

An electronic device includes the above-mentioned heat dissipation structure of the electronic device.

The beneficial effects of the present invention: in the present invention, the heat dissipated by the heat source point is conducted to the casing through the protruding part, the heat is dissipated through the casing, the heat dissipation part is in good contact with the heat source point, the heat dissipation area is large, and the heat dissipation reliability is good. The protruding part can play the role of fixing the PCB and can also play the role of heat dissipation, which reduces the heat dissipation cost of the electronic device, and the protruding part is arranged on the casing to facilitate processing.

Description of drawings

1 is a flowchart of a heat dissipation design method for an electronic device provided by Embodiment 1 of the present invention;

2 is a schematic diagram of a connection structure between a PCB and a chassis of an electronic device provided in Embodiment 2 of the present invention;

3 is a schematic structural diagram of a casing provided in Embodiment 2 of the present invention;

Fig. 4 is the enlarged schematic diagram of the A place of Fig. 3;

FIG. 5 is an enlarged schematic view of B in FIG. 3 .

In the picture:

1. Chassis; 2. The first convex hull; 21. The first inclined plate; 22. The first horizontal plate; 42. Second horizontal plate; 5. Fixing hole; 6. PCB; 7. Heat source point; 8. Heat dissipation gasket; 9. Heat dissipation boss.

Detailed ways

In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clearly, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only the present invention. Some examples, but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, unless otherwise expressly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

Example 1

This embodiment provides a heat dissipation design method for an electronic device, as shown in FIG. 1 , which mainly includes the following steps:

Step 1: Obtain a thermal distribution diagram of the working state of the PCB 6 through thermal simulation.

Step 2: Obtain the heat source point 7 according to the heat distribution diagram, lay a heat dissipation copper foil around the heat source point 7 on the PCB 6, and open a heat dissipation via hole on the PCB 6 at the bottom of the heat source point 7.

Specifically, a heat source point 7 with a large amount of heat is obtained according to the heat distribution map, and the heat dissipation area needs to be additionally increased for the heat source point 7 with a large amount of heat. In order to increase the heat dissipation area of the heat source point 7 , a heat dissipation copper foil is laid around the heat source point 7 on the PCB 6 , and the area of the heat dissipation copper foil is greater than or equal to three times the area of the heat source point 7 . A heat dissipation via hole is provided on the PCB 6 at the bottom of the heat source point 7 , and the heat of the heat source point 7 is conducted to the side of the PCB 6 opposite to the heat source point 7 through the heat dissipation via hole. In this embodiment, the diameter of the heat dissipation via is set to 10-12 mil, and the distance between two adjacent heat dissipation vias is 40 mil.

Step 3. A plurality of metal protrusions are arranged on the metal casing 1, a part of the protrusions is used to fix the PCB 6, and the heat source point 7 is set close to the protrusion, and the other part of the protrusion is used to connect with the heat source point. 7 contacts.

Specifically, a part of the protruding part is provided with a fixing hole, the heat dissipation copper foil of the PCB 6 is provided with a threaded hole, the PCB 6 is fixed on the protruding part by bolts, and the heat radiated by the heat source point 7 is conducted to the PCB through the heat dissipation via hole 6, and then conduct heat to the bolt through the heat-dissipating copper foil, conduct the heat to the protruding part through the bolt, and then dissipate it through the casing 1.

Another part of the protrusion is directly in contact with the heat source point 7, and the heat of the heat source point 7 is conducted to the bottom of the PCB 6 through the heat dissipation hole, and then conducted to the protrusion part through the heat dissipation copper foil, and then dissipated through the casing 1. The outlet is directly used for heat dissipation of the heat source point 7 , which increases the heat dissipation area of the heat source point 7 .

Embodiment 2

As shown in FIG. 2 and FIG. 3 , this embodiment provides a heat dissipation structure for an electronic device, including a metal casing, and a surface of the casing 1 is provided with a plurality of protruding parts protruding toward the inside of the casing 1 , The protruding portion is made of metal, and the protruding portion includes a fixing portion for fixing the PCB 6 and a heat dissipation portion in contact with the heat source point 7 on the PCB 6 . The heat source point 7 may be a key device, such as a thermally sensitive device or the like.

In this embodiment, after securing the PCB 6 with sufficient strength, the remaining protrusions can be used as heat conduction components, and the heat source point 7 on the PCB 6 can be designed to be above the heat conduction protrusions. And after the PCB 6 is installed, the heat source point 7 is in contact with the protruding part. The heat of the heat source point 7 can be conducted to the protruding portion through the heat dissipation via hole, and then conducted to the metal casing 1 through the protruding portion.

In this embodiment, heat dissipation copper foil is laid around the heat source point 7 on the PCB 6 , and heat dissipation via holes are opened on the PCB 6 at the bottom of the heat source point 7 . Some of the heat source points 7 can be set close to the fixed part. There are fixed holes on the heat dissipation copper foil. The PCB6 is installed on the fixed part through the fixed holes. The heat emitted by the heat source points 7 is fixed and conducted to the fixed part through the heat dissipation copper foil. The heat is then conducted to the casing 1 by the fixing part, and the heat is dissipated through the casing 1 . Some heat source points 7 are in contact with the heat dissipation part, and the heat dissipation part is in good contact with the heat source point 7, the heat dissipation area is large, and the heat dissipation reliability is good. The protruding part can play the role of fixing the PCB 6 and can also play the role of heat dissipation, which reduces the heat dissipation cost of the electronic device and reduces the heat dissipation cost of the electronic device, and the protruding part is arranged on the casing 1 for easy processing.

In this embodiment, referring to FIG. 3 and FIG. 4 , the fixing part includes at least one second boss 4 punched from the outer surface of the casing 1 to the inner side of the casing 1 , and the second boss 4 is provided with a fixing hole 5 . The second boss 4 formed by inward stamping on the casing 1 replaces the screw column for fixing the PCB 6 and plays the role of supporting and connecting the PCB 6. The second boss 4 is formed by stamping, which is convenient to process and reduces the installation of electronic equipment. cost.

In this embodiment, referring to FIG. 3 , the casing 1 is provided with three second convex hulls 4 , the three second convex hulls 4 are distributed on the casing 1 in a triangular shape, and the three second convex hulls 4 support the PCB 6 The PCB 6 is fixedly mounted on the casing 1 through the fixing hole 5 and the mounting hole on the PCB 6 through the connector. The arrangement of the three second convex hulls 4 improves the stability of fixing the PCB 6 and simplifies the mounting structure of the PCB 6 .

In this embodiment, referring to FIG. 4 , the second convex hull 4 includes two symmetrically arranged second inclined plates 41 and a second horizontal plate 42 connected with the second inclined plates 41 at both ends. One end is connected to the casing 1 , the other ends of the two second inclined plates 41 are both inclined inward, and the second horizontal plate 42 is provided with a fixing hole 5 . The structure is beautiful, and the inclined manner of the second inclined plate 41 provides sufficient space for assembling the PCB 6, thereby improving the installation efficiency.

In other embodiments, the inner surface of the casing 1 may also be provided with a boss protruding from the surface of the casing 1, and the boss may be integrally connected with the casing 1, or connected with the casing 1 by screws or other components, The PCB 6 is mounted on the boss, and the boss plays the role of supporting and fixing the PCB 6 .

Normally, a heat source point 7 is installed on the PCB 6 of an electronic device. Due to the small size of the heat source point 7 , it is inconvenient to connect components with heat dissipation functions such as a heat sink to the heat source point 7 . In this embodiment, in addition to the heat source point 7 being disposed close to the second convex hull, with reference to FIG. 3 and FIG. 5 , in order to solve the problem of heat dissipation from the heat source point 7, the heat source point 7 on the PCB 6 can be connected with the heat dissipation part. Contact, the heat radiated by the heat source point 7 is radiated through the heat dissipation part. The structure of the heat dissipation part is the same as that of the fixed part. After ensuring that the PCB 6 is stably installed on the casing 1, the protruding part provided on the casing 1 is used as a heat dissipation part, and the heat dissipation part and the heat source point on the PCB 6 are used. corresponding settings. The heat dissipation part includes at least one first convex hull 2 punched from the outer surface of the casing 1 to the inner side of the casing 1 , and the heat source point 7 is in contact with the first convex hull 2 . The first convex hull 2 and the casing 1 are integrally formed, with a simple structure and convenient processing.

In order to improve the heat dissipation efficiency, the casing 1 is made of metal material. Preferably, the casing 1 is made of iron, which has good thermal conductivity. The iron first convex hull 2 is used to contact the heat source point 7 on the PCB 6 to reduce the heat flux density of the PCB 6 and control its temperature rise. The heat radiated by the heat source point 7 on the PCB 6 is conducted to the first convex hull 2 through the heat dissipation via holes on the PCB 6, and the first convex hull 2 conducts the heat to the casing 1, and the heat is dissipated through the casing 1 to dissipate heat. The effect is good, the heat dissipation structure is simple, and the heat dissipation cost of the electronic device is reduced.

In this embodiment, as shown in FIG. 5 , the first convex hull 2 includes two symmetrically arranged first inclined plates 21 and a first horizontal plate 22 whose two ends are connected to the first inclined plates 21 . The surfaces of the first transverse plate 22 are in contact. The structure of the first convex hull 2 is the same as that of the second convex hull 4 , the first convex hull 2 and the second convex hull 4 can be processed by the same processing tool, which simplifies the processing flow, and the structure is simple and convenient for processing.

In other embodiments, the inner surface of the casing 1 can also be provided with a heat dissipation boss 9 protruding from the surface of the casing 1, and the heat dissipation boss 9 can be integrally connected with the casing 1, or can be connected with the casing 1 through screws. In order to connect other components, the material of the heat dissipation boss 9 is preferably metal iron, which is consistent with the material of the casing 1 . The heat-dissipating boss 9 is provided with a heat-conducting pad 8, and the heat source point 7 of the PCB 6 is in contact with the heat-conducting pad 8, and the heat is transmitted to the casing 1 through the heat-conducting pad 8 and the heat-dissipating boss 9 in turn, and the casing 1 dissipates the heat. go out.

In order to reduce the contact thermal resistance between the PCB 6 and the first convex hull 2, as shown in FIG. 5, a heat dissipation hole 23 is opened on the first horizontal plate 22 of the first convex hull 2, and a heat dissipation member is provided in the heat dissipation hole 23 3. The heat conducting member 3 can also assist in conducting the heat from the heat source point 7 to the first convex hull 2 .

In this embodiment, the thermally conductive member 3 is thermally conductive silica gel, and the thermally conductive silica gel is injected into the heat dissipation hole 23 . The thermally conductive silica gel has the characteristics of quick drying. After the thermally conductive silica gel is dried, the thermally conductive silica gel can not only assist in dissipating heat, but also connect the PCB 6 and the first convex hull 2, which improves the stability of the connection between the PCB 6 and the chassis 1.

In this embodiment, the heat source point 7 on the PCB 6 dissipates heat through the first convex hull 2 integrally formed with the casing 1, and thermally conductive silica gel is injected into the heat dissipation hole 23, which can reduce the distance between the heat source point 7 and the first convex hull 2. At the same time, the viscosity of thermally conductive silica gel can play a fixed role, which improves the stability of the structure and reduces the production cost of electronic equipment. In addition, the structure has a good heat dissipation effect, the temperature rise of the PCB 6 can be reduced from the original 17°C to 15.7°C, and the heat dissipation effect is remarkable.

In other embodiments, in addition to injecting thermally conductive silica gel into the heat dissipation holes 23 of the first convex shell 2, the heat dissipation holes 23 can also be set as threaded holes, and the first convex shell 2 and the PCB 6 are connected by metal screws, and the heat source point 7 emits heat. The heat can be transferred to the first convex hull 2 through metal screws, and then transferred to the casing 1. The metal screws not only play the role of heat dissipation, but also play the role of fixing the PCB 6.

In other embodiments, a heat-conducting member may also be provided on the first convex hull 2, and the heat source point 7 is in contact with the heat-conducting member. Especially under the premise that the heat source point 7 is relatively large in volume, a first convex hull 2 matching the heat source point 7 is set on the casing 1, and then a heat conducting member for heat dissipation is disposed on the inner side of the first convex hull 2. .

This embodiment also provides an electronic device, including the above-mentioned heat dissipation structure of the electronic device.

Obviously, the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those of ordinary skill in the art, changes or modifications in other different forms can also be made on the basis of the above description. There is no need and cannot be exhaustive of all implementations here. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included within the protection scope of the claims of the present invention.

Claims (9)

1. A heat dissipation design method of electronic equipment is characterized by comprising the following steps:

obtaining a thermal distribution map of the working state of the PCB (6) through thermal simulation;

acquiring a heat source point (7) according to the thermal distribution map, paving a heat dissipation copper foil on the periphery of the heat source point (7) on the PCB (6), and forming a heat dissipation through hole on the PCB (6) at the bottom of the heat source point (7);

a plurality of metal bulges are arranged on the metal casing (1), one part of the bulges is used for fixing the PCB (6) and enabling the heating source point (7) to be close to the bulges, and the other part of the bulges is used for contacting with the heating source point (7).

2. The heat dissipation design method of an electronic device according to claim 1, wherein a layout area of the heat dissipation copper foil is three times or more an area of the heat generation source point (7).

3. A heat dissipation structure of an electronic device, characterized by being manufactured by the heat dissipation design method of the electronic device according to any one of claims 1 to 2;

the heat dissipation structure comprises a metal casing (1), wherein a plurality of metal protruding parts protruding towards the inner side of the casing (1) are arranged on the surface of the casing (1), each protruding part comprises a fixing part for fixing a PCB (6) and a heat dissipation part in contact with a heat source point (7) on the PCB (6), and the fixing parts are arranged close to the heat source points (7);

and a heat dissipation copper foil is laid on the periphery of the heat source point (7) on the PCB (6), and a heat dissipation through hole is formed in the heat dissipation copper foil.

4. The heat dissipation structure of electronic equipment according to claim 3, wherein the heat dissipation part comprises a first convex hull (2) formed by stamping from the outer surface of the casing (1) to the inner side of the casing (1), and the heat source point (7) is in contact with the first convex hull (2).

5. The heat dissipation structure of electronic equipment according to claim 4, wherein the first convex hull (2) comprises two first inclined plates (21) symmetrically arranged and a first horizontal plate (22) having two ends connected to the two first inclined plates (21), and the heat source point (7) is in contact with a surface of the first horizontal plate (22).

6. The heat dissipation structure of electronic equipment according to claim 5, wherein the first horizontal plate (22) is provided with heat dissipation holes (23), and the heat dissipation holes (23) are provided with heat conducting members (3).

7. The heat dissipation structure of electronic equipment according to claim 6, wherein the heat conducting member (3) is a heat conducting silicone injected into the heat dissipation hole (23).

8. The heat dissipation structure of electronic equipment according to claim 3, wherein the heat dissipation part further comprises at least one heat dissipation boss (9) formed by stamping the outer surface of the casing (1) towards the inner side of the casing (1), and the heat dissipation boss (9) is provided with a heat conduction gasket (8).

9. An electronic device characterized by comprising the heat dissipation structure of the electronic device according to any one of claims 3 to 8.

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