CN110475467A - 输送装置、安装装置、输送方法 - Google Patents

输送装置、安装装置、输送方法 Download PDF

Info

Publication number: CN110475467A
Authority: CN; China
Prior art keywords: substrate; buffer; substrates; carry; sensor
Prior art date: 2018-05-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201910388965.5A

Other languages

English (en)

Chinese (zh)

Inventor

佐藤祐太

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Juki Corp

Original Assignee

Juki Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-05-10

Filing date

2019-05-10

Publication date

2019-11-19

2019-05-10 Application filed by Juki Corp filed Critical Juki Corp

2019-11-19 Publication of CN110475467A publication Critical patent/CN110475467A/zh

Status Pending legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Operations Research (AREA)
Supply And Installment Of Electrical Components (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

CN201910388965.5A 2018-05-10 2019-05-10 输送装置、安装装置、输送方法 Pending CN110475467A (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2018-091043		2018-05-10
JP2018091043A JP7164319B2 (ja)	2018-05-10	2018-05-10	搬送装置、実装装置、搬送方法

Publications (1)

Publication Number	Publication Date
CN110475467A true CN110475467A (zh)	2019-11-19

Family

ID=68507403

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201910388965.5A Pending CN110475467A (zh)	2018-05-10	2019-05-10	输送装置、安装装置、输送方法

Country Status (2)

Country	Link
JP (1)	JP7164319B2 (ja)
CN (1)	CN110475467A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN111417299A (zh) *	2020-04-13	2020-07-14	温州职业技术学院	电路基板主体制作方法
CN113120505A (zh) *	2019-12-30	2021-07-16	细美事有限公司	输送装置和输送方法
CN115577739A (zh) *	2021-09-22	2023-01-06	不二输送机工业株式会社	计数装置以及计数方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6799193B1 (ja) *	2020-07-29	2020-12-09	株式会社アルバック	搬送駆動機構
KR102792639B1 (ko) *	2020-12-31	2025-04-08	세메스 주식회사	기판 처리 장치 및 방법
CN116779501B (zh) *	2022-06-14	2025-04-25	武汉帝尔激光科技股份有限公司	一种片材物料传送方法及装置

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JP2000114799A (ja) *	1998-10-06	2000-04-21	Yamaha Motor Co Ltd	表面実装機
CN1599552A (zh) *	2003-09-16	2005-03-23	重机公司	电子部件安装装置
CN101939831A (zh) *	2008-03-28	2011-01-05	芝浦机械电子株式会社	电子部件的安装装置及安装方法
CN103974608A (zh) *	2013-02-06	2014-08-06	Juki株式会社	基板输送装置、基板的输送方法
CN105407701A (zh) *	2014-09-10	2016-03-16	松下知识产权经营株式会社	元件安装装置
CN105813447A (zh) *	2015-01-20	2016-07-27	Juki株式会社	安装系统、安装装置以及安装方法

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Publication number	Priority date	Publication date	Assignee	Title
JP4439693B2 (ja) *	2000-07-28	2010-03-24	パナソニック株式会社	プリント基板搬送方法及び装置
JP2007173553A (ja) *	2005-12-22	2007-07-05	Matsushita Electric Ind Co Ltd	基板搬送装置
JP5059362B2 (ja) *	2006-09-01	2012-10-24	Ｊｕｋｉ株式会社	部品実装装置
JP6164863B2 (ja) *	2013-02-18	2017-07-19	Juki株式会社	電子部品実装システム及び電子部品実装システムの基板搬送方法

2018
- 2018-05-10 JP JP2018091043A patent/JP7164319B2/ja active Active
2019
- 2019-05-10 CN CN201910388965.5A patent/CN110475467A/zh active Pending

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000114799A (ja) *	1998-10-06	2000-04-21	Yamaha Motor Co Ltd	表面実装機
CN1599552A (zh) *	2003-09-16	2005-03-23	重机公司	电子部件安装装置
CN101939831A (zh) *	2008-03-28	2011-01-05	芝浦机械电子株式会社	电子部件的安装装置及安装方法
CN103974608A (zh) *	2013-02-06	2014-08-06	Juki株式会社	基板输送装置、基板的输送方法
CN105407701A (zh) *	2014-09-10	2016-03-16	松下知识产权经营株式会社	元件安装装置
CN105813447A (zh) *	2015-01-20	2016-07-27	Juki株式会社	安装系统、安装装置以及安装方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN113120505A (zh) *	2019-12-30	2021-07-16	细美事有限公司	输送装置和输送方法
CN111417299A (zh) *	2020-04-13	2020-07-14	温州职业技术学院	电路基板主体制作方法
CN111417299B (zh) *	2020-04-13	2021-03-23	温州职业技术学院	电路基板主体制作方法
CN115577739A (zh) *	2021-09-22	2023-01-06	不二输送机工业株式会社	计数装置以及计数方法
CN115577739B (zh) *	2021-09-22	2023-07-14	不二输送机工业株式会社	计数装置以及计数方法

Also Published As

Publication number	Publication date
JP7164319B2 (ja)	2022-11-01
JP2019197815A (ja)	2019-11-14

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Legal Events

Date	Code	Title	Description
2019-11-19	PB01	Publication
2019-11-19	PB01	Publication
2021-04-23	SE01	Entry into force of request for substantive examination
2021-04-23	SE01	Entry into force of request for substantive examination
2024-05-31	RJ01	Rejection of invention patent application after publication
2024-05-31	RJ01	Rejection of invention patent application after publication	Application publication date: 20191119