CN110213906A - A kind of chip shooter machine - Google Patents
A kind of chip shooter machine Download PDFInfo
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- CN110213906A CN110213906A CN201910486081.3A CN201910486081A CN110213906A CN 110213906 A CN110213906 A CN 110213906A CN 201910486081 A CN201910486081 A CN 201910486081A CN 110213906 A CN110213906 A CN 110213906A
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- 238000012216 screening Methods 0.000 claims abstract description 60
- 230000007246 mechanism Effects 0.000 claims description 112
- 230000005540 biological transmission Effects 0.000 claims description 59
- 238000001514 detection method Methods 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000012937 correction Methods 0.000 claims description 5
- 238000004064 recycling Methods 0.000 claims description 5
- 239000006096 absorbing agent Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000009183 running Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 241001062009 Indigofera Species 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000002493 microarray Methods 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
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- 230000005611 electricity Effects 0.000 description 2
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- 238000000354 decomposition reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/917—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Operations Research (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of chip shooter machines, including rack automatically controlled module, load plate hand basket lifting device is provided at the top of rack automatically controlled module, load plate hand basket lifting device side is provided with load plate grasp handling device, load plate grasp handling device side is provided with load plate automatic conveyor, load plate automatic conveyor is connected with screening XY θ compensation system, screening CCD video system side is provided with capstan head high speed clamping and placing system, capstan head high speed clamping and placing system side is provided with wafer XY θ compensation system, wafer CCD video system is provided at the top of wafer XY θ compensation system, XY self-correcting thimble system is provided in wafer XY θ compensation system, XY self-correcting thimble system side is provided with wafer grasp handling device, wafer grasp handling device side wafer hand basket lifting device.The present invention solves traditional chip mounter using simple pendulum arm, single suction mouth structure, and running precision can not be improved with production capacity speed, is not able to satisfy high speed, high-precision patch products manufacture the problem of requiring.
Description
Technical field
The invention belongs to technical field of automation in industry, and in particular to a kind of chip shooter machine.
Background technique
Chip mounter: also known as " placement equipment ", " surface mount system " (Surface Mount System), in production line,
It is configured after dispenser or screen process press, is that Surface Mount Component is accurately placed PCB by mobile mounting head
A kind of equipment on pad is divided into manual and two kinds full-automatic.
Traditional chip mounter, bonder class equipment, using simple pendulum arm, single suction mouth structure, since plant machinery structure limits,
Its running precision can not be improved with production capacity speed, and production efficiency low quality is unstable, bring difficulty for lower one of packaging process,
Influence package quality.Can be only applied to the not high product of some precision, rate request, but be not able to satisfy at high speed, high-precision,
The patch products manufacture of high reliability requires.With the development of semiconductor chip (LED) class, and country is to semiconductor industry
Support energetically, therefore demand of the market to semiconductor chip (LED) class wrapper class equipment is growing, while chip (LED)
External form increasingly minimizes or subminaturization, this is just higher and higher to the precision of equipment, speed, reliability requirement.However it is external
The equipment price of import is expensive, big to medium-sized and small enterprises up-front investment, serious to constrain the development of medium-sized and small enterprises.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the existing defects, provides a kind of rotary type tower patch, above-mentioned to solve
The traditional chip mounter proposed in background technique uses simple pendulum arm, single suction mouth structure, since plant machinery structure limits, operation
Precision can not be improved with production capacity speed, and production efficiency is low, not be able to satisfy the patch products of high speed, high-precision, high reliability
The problem of manufacture requires.
To achieve the above object, the invention provides the following technical scheme: a kind of chip shooter machine, including the automatically controlled mould of rack
Group, the rack automatically controlled module top are provided with load plate hand basket lifting device, and load plate hand basket lifting device side is provided with load plate
Grasp handling device, load plate grasp handling device side are provided with load plate automatic conveyor, load plate automatic conveyor and row
Piece XY θ compensation system is connected, and is provided with screening CCD video system, screening CCD video system at the top of the rack automatically controlled module
Side is provided with capstan head high speed clamping and placing system, and capstan head high speed clamping and placing system side is provided with wafer XY θ compensation system, wafer XY θ
Compensation system side is provided with CCD video system, is provided with wafer CCD video system, institute at the top of the wafer XY θ compensation system
It states and is provided with XY self-correcting thimble system in wafer XY θ compensation system, XY self-correcting thimble system side is provided with wafer crawl
Handling device, wafer grasp handling device side wafer hand basket lifting device, the capstan head high speed clamping and placing system bottom is provided with
Abandon recycling magazine.
Preferably, the load plate grasp handling device includes Z-direction driving motor, and Z-direction driving motor side is provided with belt wheel
Transmission device, the Z-direction driving motor right wall are provided with mobile supporting mechanism, and Z-direction driving motor right end is provided with lifting and inhales pawl
Mechanism and screening load plate, the Z-direction driving motor left wall are provided with towing chain device, and Z-direction driving motor bottom is provided with position
Detection sensor is set, is provided with directive slide track device on the inside of the Z-direction driving motor, Z-direction driving motor left end is provided with
Motor transmission mechanism.
Preferably, the load plate hand basket lifting device includes supporting platform, and limiting device is provided at the top of supporting platform, is opened
Tight mechanism and level detection sensor is arrived, wafer hand basket, the supporting platform top side setting are placed on the supporting platform
There is Z-direction transmission device, Z-direction transmission device includes drive lead screw, transmission belt and belt wheel, driving motor and linear guide, the Z-direction
Transmission device side wall is provided with towing chain device.
Preferably, the load plate automatic conveyor includes big travel displacement device, is provided on big travel displacement device
Position-detection sensor, the big travel displacement device top are provided with load plate limited block, small row are provided on load plate limited block
Journey gearshift, the pneumatic pawl clamping device, screening load plate, in place vibration absorber and directive slide track device.
Preferably, the bottom CCD video system includes camera adjusting mechanism, and high speed work is provided on camera adjusting mechanism
Industry camera, industrial camera lens are provided on high-speed industrial camera, and the camera adjusting mechanism bottom is provided with Z-direction adjustment machine
To adjustment mechanism and Y-direction adjustment mechanism, the camera adjusting mechanism side is provided with bottom secondary light source, bottom fill-in light by structure, X
Plane reflection microscope group is provided at the top of source, plane reflection microscope group top optical reflects microscope group, is provided at the top of optical reflection microscope group
Top of camera light source is provided with camera containment envelope on the camera adjusting mechanism.
Preferably, the screening XY θ compensation system includes Y-axis linear motor mould group, X-axis linear motor mould group, product row
Piece microscope carrier mechanism and θ axis correcting motor mould group, the wafer hand basket lifting device includes supporting platform, is provided on supporting platform
Position-detection sensor arrives level detection sensor and limiting device, is placed with Z-direction position sensor at the top of the supporting platform,
The supporting platform side is provided with strainer, drive lead screw, transmission belt and belt wheel, driving motor and linear guide, straight line
Guide rail side is provided with towing chain device.
Preferably, the capstan head high speed clamping and placing system includes Z-direction screening press mechanism, and Z-direction screening press mechanism bottom is set
It is equipped with DDR and directly drives rotating electric machine, DDR directly drives rotating electric machine bottom and is provided with swing arm linear guide, swing arm straight-line guidance dress
It sets side and is provided with chip pick-and-place oscillating arm mechanisms, be provided with Z-direction wafer press mechanism, Z-direction at the top of the Z-direction screening press mechanism
It is provided with wafer CCD video system at the top of wafer press mechanism, wafer CCD fine tuning dress is provided at the top of wafer CCD video system
It sets, the Z-direction screening press mechanism side is provided with screening CCD video mould group, and screening CCD video die set top is provided with screening
CCD micromatic setting, the Z-direction screening press mechanism bottom are provided with capstan head vacuum distributor gear.
Preferably, the wafer XY θ compensation system includes X-axis movement mould group, and X-axis movement die set top is provided with Y-axis fortune
Dynamic model group, Y-axis movement die set top are provided with θ axis straightening die group, and θ axis straightening die group includes θ axis supporting platform, and the support of θ axis carries
It is provided on platform and carries ring guide wheel device, θ axis positioning device, carry ring pressing device, transmission shield, carry ring guiding device, θ axis biography
Movable belt pulley, θ shaft position sensor and θ axis driving motor, the θ axis supporting platform top are provided with primary and secondary and carry ring supporting plate, primary and secondary
It carries and is provided with wafer primary and secondary load ring at the top of ring supporting plate.
Preferably, the XY self-correcting thimble system includes that thimble movement mechanism, the mobile transmission mould group of Z-direction and XY correction are flat
Platform mould group, the thimble movement mechanism include thimble reciprocating apparatus, thimble anticollision device, collision-prevention device, thimble guide runner, eccentric gearing machine
Structure and thimble driving motor, the mobile transmission mould group side of the Z-direction are provided with safty shield, the mobile transmission mould group of the Z-direction
Including supporting coupling arrangement, it is provided with Z axis directive slide track at the top of support coupling arrangement, Z-direction transmission is provided on Z axis directive slide track
Device and wafer hand basket, the Z axis directive slide track side wall are connected with Z-direction driving motor, and the XY dressing plate mould group includes XY
Dressing plate bottom plate, XY dressing plate bottom plate top are provided with X-axis driving motor, and the XY dressing plate bottom plate top side is set
Y-axis driving motor, eccentric wheel drive mechanism and Y-axis sized cross roller bearings are equipped with, are provided at the top of the XY dressing plate bottom plate
Spring thrust mechanism, mobile working platform and X-axis sized cross roller bearings.
Preferably, the wafer grasp handling device includes driving motor, and transmission support mechanism is provided on driving motor,
Transmission support mechanism side is provided with air lifter, and the driving motor side wall is provided with straight line screw rod mould group, the biography
The dynamic supporting mechanism other side is provided with towing chain device, and the driving motor side is provided with support post, the transmission support machine
Structure bottom is provided with snap finger mechanism, and described driving motor one end is provided with position-detection sensor.
Compared with prior art, the present invention provides a kind of chip shooter machine, have it is following the utility model has the advantages that
The present invention held using plurality of pendulums arm, more nozzle structures with advanced DDR/DDL direct-drive high-speed motor cooperate high speed
The industrial camera video processing system of Computing control and high speed, and reasonable mechanism design, and have good man-machine
Interface, mechanism design, which is realized from wafer disks hand basket, automatically takes out wafer disks, chip is extracted through high speed rotation clamping and placing system, through work
Industry camera CCD video position compares, and accurately places chip in the specified region of client's load plate.
The present invention be it is a kind of continuously can accurately take crystalline substance from the wafer disks of blue film, while accurately by the discharge of chip
Enter the position that client specifies, to realize chip high speed space transfer, can be realized and continuously take brilliant, detection, patch from wafer disks
The processes such as piece, die bond, result can satisfy semiconductor chip high speed, high-precision, the patch products of high reliability production system
Make technique requirement.Meanwhile the equipment has a wafer hand basket automatic loading/unloading, realize wafer automatically supply with recycling function automatically with
And chip load plate mentions blue automatic loading/unloading, realizes that load plate automatically supplies and recycles function automatically, greatlys save manpower, improve life
Produce efficiency；In addition in terms of equipment cost, manufacturing cost is lower with respect to overseas equipment, can be suitable for middle-size and small-size manufacture and look forward to
Production demand is opened up in the fund tolerance range of industry, the development for being conducive to medium-sized and small enterprises.
It is not directed to part in the device to be the same as those in the prior art or can be realized by using the prior art, structure of the invention
It is scientific and reasonable, it is safe and convenient to use, it provides a great help for people.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention, in the accompanying drawings:
Fig. 1 is schematic perspective view proposed by the present invention；
Fig. 2 is overlooking structure diagram proposed by the present invention；
Fig. 3 is video CCD system structure diagram in bottom proposed by the present invention；
Fig. 4 is screening XY θ compensation system structural schematic diagram proposed by the present invention；
Fig. 5 is load plate automatic conveyor structural schematic diagram proposed by the present invention；
Fig. 6 is load plate grasp handling device schematic perspective view proposed by the present invention；
Fig. 7 is load plate grasp handling apparatus structure schematic diagram proposed by the present invention；
Fig. 8 is load plate hand basket lifting device structure schematic diagram proposed by the present invention；
Fig. 9 is capstan head high speed clamping and placing system structural schematic diagram proposed by the present invention；
Figure 10 is wafer XY θ compensation system schematic perspective view proposed by the present invention；
Figure 11 is that θ axis proposed by the present invention corrects mould splits solution structure schematic diagram；
Figure 12 is wafer grasp handling device schematic perspective view proposed by the present invention；
Figure 13 is wafer hand basket lifting device structure schematic diagram proposed by the present invention；
Figure 14 is XY self-correcting thimble system structure diagram proposed by the present invention；
Figure 15 is XY self-correcting thimble system decomposition structural schematic diagram proposed by the present invention；
Figure 16 is XY dressing plate mould group schematic perspective view proposed by the present invention；
Figure 17 is thimble movement mechanism schematic perspective view proposed by the present invention；
Figure 18 is the mobile transmission mould group schematic perspective view of Z-direction proposed by the present invention；
Figure 19 is schematic illustration proposed by the present invention；
Figure 20 is schematic illustration proposed by the present invention；
In figure: 1, rack automatically controlled module；2, load plate hand basket lifting device；3, load plate grasp handling device；4, load plate is automatic
Transmission device；5, screening XY θ compensation system；6, screening CCD video system；7, capstan head high speed clamping and placing system；8, bottom CCD video
System；9, wafer CCD video system；10, wafer XY θ compensation system；11, XY self-correcting thimble system；12, wafer grasp handling
Device；13, wafer hand basket lifting device；14, recycling magazine is abandoned；15, Y-axis linear motor mould group；16, X-axis linear motor mould
Group；17, product screening microscope carrier mechanism；18, θ axis correcting motor mould group；19, pneumatic pawl clamping device；20, small travel displacement dress
It sets；21, screening load plate；22, vibration absorber in place；23, big travel displacement device；24, load plate limited block；25, directive slide track fills
It sets；26, position-detection sensor；27, towing chain device；28, motor transmission mechanism；29, Xi Zhao mechanism is gone up and down；30, Z-direction transmission electricity
Machine；31, mobile supporting mechanism；32, belt wheel transmission device；33, Z-direction transmission device；34, wafer hand basket；35, limiting device；36,
Strainer；37, supporting platform；38, level detection sensor is arrived；39, drive lead screw；40, transmission belt and belt wheel；41, transmission electricity
Machine；42, linear guide；43, Z-direction adjustment mechanism；44, X is to adjustment mechanism；45, Y-direction adjustment mechanism；46, industrial camera lens；
47, camera containment envelope；48, high-speed industrial camera；49, camera adjusting mechanism；50, top of camera light source；51, optical mirror
Group；52, plane reflection microscope group；53, bottom secondary light source；54, screening CCD video mould group；55, screening CCD micromatic setting；56,Z
To screening press mechanism；57, DDR directly drives rotating electric machine；58, capstan head vacuum distributor gear；59, wafer CCD micromatic setting；60,
Thimble driving motor；61, Z-direction wafer press mechanism；62, swing arm linear guide；63, chip picks and places oscillating arm mechanisms；64,θ
Axis straightening die group；65, Y-axis moves mould group；66, X-axis moves mould group；67, wafer primary and secondary carries ring；68, primary and secondary carries ring supporting plate；69,
Carry ring guide wheel device；70, θ axis positioning device；71, ring pressing device is carried；72, θ axis supporting platform；73, it is driven shield；74,
Carry ring guiding device；75, θ axis drive pulley；76, θ shaft position sensor；77, θ axis driving motor；78, support post；79, it passes
Dynamic supporting mechanism；80, air lifter；81, straight line screw rod mould group；82, snap finger mechanism；83, Z-direction position sensor；84, it pushes up
Needle movement mechanism；85, the mobile transmission mould group of Z-direction；86, XY dressing plate mould group；87, safty shield；88, Y-axis driving motor；
89, eccentric wheel drive mechanism；90, Y-axis sized cross roller bearings；91, X-axis driving motor；92, spring thrust mechanism；93, mobile work
Make platform；94, X-axis sized cross roller bearings；95, XY dressing plate bottom plate；96, thimble reciprocating apparatus；97, thimble anticollision device, collision-prevention device；
98, thimble guide runner；99, Z axis directive slide track；100, coupling arrangement is supported；101, eccentric drive mechanism.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-2 0 is please referred to, the present invention provides a kind of a kind of chip shooter machine technical solution: chip shooter machine, including
Rack automatically controlled module 1 is provided with load plate hand basket lifting device 2,2 side of load plate hand basket lifting device at the top of rack automatically controlled module 1
It is provided with load plate grasp handling device 3,3 side of load plate grasp handling device is provided with load plate automatic conveyor 4, and load plate is automatic
Transmission device 4 is connected with screening XY θ compensation system 5, and screening CCD video system 6 is provided at the top of rack automatically controlled module 1, row
6 side of piece CCD video system is provided with capstan head high speed clamping and placing system 7, and 7 side of capstan head high speed clamping and placing system is provided with wafer XY θ
Compensation system 10,10 side of wafer XY θ compensation system are provided with CCD video system 8, are arranged at the top of wafer XY θ compensation system 10
There is wafer CCD video system 9, XY self-correcting thimble system 11, XY self-correcting thimble system are provided in wafer XY θ compensation system 10
11 sides of uniting are provided with wafer grasp handling device 12, and 12 side wafer hand basket lifting device 13 of wafer grasp handling device turns
7 bottom of tower height speed clamping and placing system, which is provided with, abandons recycling magazine 14.
In the present embodiment, load plate grasp handling device 3 includes Z-direction driving motor 30, and 30 side of Z-direction driving motor is provided with
Belt wheel transmission device 32,30 right wall of Z-direction driving motor are provided with mobile supporting mechanism 31, and 30 right end of Z-direction driving motor is provided with
Lifting Xi Zhao mechanism 29 and screening load plate 21,30 left wall of Z-direction driving motor are provided with towing chain device 27,30 bottom of Z-direction driving motor
Portion is provided with position-detection sensor 26, and directive slide track device 25, Z-direction driving motor 30 are provided on the inside of Z-direction driving motor 30
Left end is provided with motor transmission mechanism 28.
In the present embodiment, load plate hand basket lifting device 2 includes supporting platform 37, and limit dress is provided at the top of supporting platform 37
It sets 35, strainer 36 and arrives level detection sensor 38, wafer hand basket 34,37 top of supporting platform are placed on supporting platform 37
Side is provided with Z-direction transmission device 33, and Z-direction transmission device 33 includes drive lead screw 39, transmission belt and belt wheel 40, driving motor 41
With linear guide 42,33 side wall of Z-direction transmission device is provided with towing chain device 27.
In the present embodiment, load plate automatic conveyor 4 includes big travel displacement device 23, is set on big travel displacement device 23
It is equipped with position-detection sensor 26, load plate limited block 24 is provided at the top of big travel displacement device 23, is set on load plate limited block 24
It is equipped with small travel displacement device 20, pneumatic pawl clamping device 19, screening load plate 21, in place vibration absorber 22 and directive slide track device
25。
In the present embodiment, bottom CCD video system 8 includes camera adjusting mechanism 49, is provided on camera adjusting mechanism 49
High-speed industrial camera 48 is provided with industrial camera lens 46 on high-speed industrial camera 48, and 49 bottom of camera adjusting mechanism is provided with Z
To adjustment mechanism 43, X to adjustment mechanism 44 and Y-direction adjustment mechanism 45,49 side of camera adjusting mechanism is provided with bottom fill-in light
Source 53 is provided with plane reflection microscope group 52 at the top of bottom secondary light source 53, and 52 top optical of plane reflection microscope group reflects microscope group 51,
It is provided with top of camera light source 50 at the top of optical reflection microscope group 51, camera containment envelope 47 is provided on camera adjusting mechanism 49.
In the present embodiment, screening XY θ compensation system 5 includes Y-axis linear motor mould group 15, X-axis linear motor mould group 16, produces
Product screening microscope carrier mechanism 17 and θ axis correcting motor mould group 18, wafer hand basket lifting device 13 include supporting platform 37, supporting platform
It is provided with position-detection sensor 26 on 37, arrives level detection sensor 38 and limiting device 35, is placed with Z at the top of supporting platform 37
To position sensor 83,37 side of supporting platform is provided with strainer 36, drive lead screw 39, transmission belt and belt wheel 40, transmission
Motor 41 and linear guide 42,42 side of linear guide are provided with towing chain device 27.
In the present embodiment, capstan head high speed clamping and placing system 7 includes Z-direction screening press mechanism 56,56 bottom of Z-direction screening press mechanism
Portion is provided with DDR and directly drives rotating electric machine 57, and DDR directly drives 57 bottom of rotating electric machine and is provided with swing arm linear guide 62, swing arm
62 side of linear guide is provided with chip and picks and places oscillating arm mechanisms 63, is provided with Z-direction wafer at the top of Z-direction screening press mechanism 56
Press mechanism 61 is provided with wafer CCD video system 9 at the top of Z-direction wafer press mechanism 61, sets at the top of wafer CCD video system 9
It is equipped with wafer CCD micromatic setting 59,56 side of Z-direction screening press mechanism is provided with screening CCD video mould group 54, screening CCD view
As being provided with screening CCD micromatic setting 55 at the top of mould group 54,56 bottom of Z-direction screening press mechanism is provided with capstan head vacuum dispenser
Structure 58.
In the present embodiment, wafer XY θ compensation system 10 includes that X-axis moves mould group 66, is provided at the top of X-axis movement mould group 66
Y-axis moves mould group 65, and θ axis straightening die group 64 is provided at the top of Y-axis movement mould group 65, and θ axis straightening die group 64 includes that the support of θ axis carries
Platform 72 is provided on θ axis supporting platform 72 and carries that ring guide wheel device 69, θ axis positioning device 70, to carry ring pressing device 71, transmission anti-
Shield 73 carries ring guiding device 74, θ axis drive pulley 75, θ shaft position sensor 76 and θ axis driving motor 77, and the support of θ axis carries
It is provided with primary and secondary at the top of platform 72 and carries ring supporting plate 68, primary and secondary, which carries, is provided with wafer primary and secondary load ring 67 at the top of ring supporting plate 68.
In the present embodiment, XY self-correcting thimble system 11 includes thimble movement mechanism 84, the mobile transmission mould group 85 of Z-direction and XY
Dressing plate mould group 86, thimble movement mechanism 84 include thimble reciprocating apparatus 96, thimble anticollision device, collision-prevention device 97, thimble guide runner
98, eccentric drive mechanism 101 and thimble driving motor 60, mobile transmission 85 side of mould group of Z-direction are provided with safty shield 87, Z
Include support coupling arrangement 100 to mobile transmission mould group 85, supports and be provided with Z axis directive slide track 99, Z at the top of coupling arrangement 100
Z-direction transmission device 33 and wafer hand basket 34 are provided on axis directive slide track 99,99 side wall of Z axis directive slide track is connected with Z-direction transmission
Motor 30, XY dressing plate mould group 86 include XY dressing plate bottom plate 95, and X-axis transmission is provided at the top of XY dressing plate bottom plate 95
Motor 91,95 top side of XY dressing plate bottom plate are provided with Y-axis driving motor 88, eccentric wheel drive mechanism 89 and Y-axis and intersect
Roller bearing 90 is provided with spring thrust mechanism 92, mobile working platform 93 and X-axis at the top of XY dressing plate bottom plate 95 and intersects rolling
Axis of a cylinder holds 94.
In the present embodiment, wafer grasp handling device 12 includes driving motor 41, and transmission branch is provided on driving motor 41
Support mechanism 79,79 side of transmission support mechanism are provided with air lifter 80, and 41 side wall of driving motor is provided with straight line screw rod
Mould group 81,79 other side of transmission support mechanism are provided with towing chain device 27, and 41 side of driving motor is provided with support post 78, pass
Dynamic 79 bottom of supporting mechanism is provided with snap finger mechanism 82, and 41 one end of driving motor is provided with position-detection sensor 26.
The working principle of the invention and process for using:
Working principle: the turret system being made of DDR motor and more set (n set) die bond oscillating arm mechanisms and suction nozzle, Cheng Weixing
Shape distribution.DDR motor drives suction nozzle with 360/n degree rotating operation, successively chip is picked up from taking in brilliant position indigo plant film, through bottom video
CCD photograph to record offset parameter, record in conjunction with patch CCD to the load plate screening location parameter placed, are arranged by load plate
Piece XY θ 5 pairs of pasted chip positions of compensation system are modified compensation, and chip is precisely placed placement required for load plate by last suction nozzle
Position in, realize chip high speed space transfer high-speed paster technique requirement.
Process for using: the indigo plant that mentions equipped with wafer is placed in wafer hand basket lifting device 13, wafer hand basket lifting device by 1.
13 automatic runnings to setting position, waiting takes wafer disks.
2. sensor detects wafer disks, wafer grasp handling device 3 grabs wafer disks and send to wafer XY θ compensation system 10
Workbench.
3. the indigo plant that mentions equipped with load plate is placed in load plate hand basket lifting device 2, load plate hand basket lifting device 2 is by automatic running
To setting position, waiting takes load plate.
4. sensor detects load plate, load plate automatic conveyor, load plate is taken out a piece of from hand basket, is grabbed by load plate
Handling device 3 is taken, crawl load plate is sent to screening XY θ compensation system workbench.
5. 10 workbench of wafer XY θ compensation system detects wafer disks, wafer disks are first subjected to clamping fastener.According to crystalline substance
The position parameter data that circle CCD video system 9 provides, 10 workbench of wafer XY θ compensation system carry out that brilliant front position is taken to compensate
Correction.
6.XY self-correcting thimble system 11 carries out XY position correction and thimble fortune according to the position of oscillating arm mechanisms suction nozzle
It goes to holding fix.
7. the swing arm suction nozzle body of capstan head high speed clamping and placing system 7, under the action of Z-direction wafer press mechanism, suction nozzle is pushed
Contact to chip position, thimble jacks up chip, and press mechanism lifts, nozzle pick chip.
8. the swing arm suction nozzle microarray strip of capstan head high speed clamping and placing system 7, is sent to bottom CCD video system, through bottom video
CCD take pictures flutter catch record core be in offset parameter in suction nozzle, it will be supplied to screening XY θ compensation system workbench as position
Set compensation reference.
9. the swing arm suction nozzle microarray strip of capstan head high speed clamping and placing system 7 is sent to 5 workbench of screening XY θ compensation system, row
Piece CCD video system 6 in advance to the position of required screening, carry out location parameter flutter catch and with preceding process bottom CCD video system
Parameter integration makees position compensation and correction to 5 workbench of screening XY θ compensation system.
10. swing arm suction nozzle microarray strip is above screening load plate, under the action of Z-direction wafer press mechanism.Chip, which is mended, to be moved
It is implanted on screening load plate.
11. each chips and so on, successively from blue film coring piece, it is put in screening load plate.
12. capstan head suction nozzle is run to clear material recyclable device, clear to expect that recyclable device function is when equipment midway is shut down or equipment
When reset, the device of institute's band on capstan head suction nozzle is subjected to clearing and retrieving and avoids mixing.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of chip shooter machine, including rack automatically controlled module (1), it is characterised in that: at the top of the rack automatically controlled module (1)
It is provided with load plate hand basket lifting device (2), load plate hand basket lifting device (2) side is provided with load plate grasp handling device (3), carries
Disk grasp handling device (3) side is provided with load plate automatic conveyor (4), and load plate automatic conveyor (4) and screening XY θ are mended
It repays system (5) to be connected, is provided with screening CCD video system (6), screening CCD video system at the top of the rack automatically controlled module (1)
System (6) side is provided with capstan head high speed clamping and placing system (7), and capstan head high speed clamping and placing system (7) side is provided with wafer XY θ compensation system
It unites (10), wafer XY θ compensation system (10) side is provided with CCD video system (8), wafer XY θ compensation system (10) top
Portion is provided with wafer CCD video system (9), and XY self-correcting thimble system is provided on the wafer XY θ compensation system (10)
(11), XY self-correcting thimble system (11) side is provided with wafer grasp handling device (12), wafer grasp handling device (12)
Side wafer hand basket lifting device (13), capstan head high speed clamping and placing system (7) bottom, which is provided with, abandons recycling magazine (14).
2. a kind of chip shooter machine according to claim 1, it is characterised in that: the load plate grasp handling device (3)
Including Z-direction driving motor (30), Z-direction driving motor (30) side is provided with belt wheel transmission device (32), the Z-direction driving motor
(30) right wall is provided with mobile supporting mechanism (31), and Z-direction driving motor (30) right end is provided with lifting Xi Zhao mechanism (29) and arranges
Piece load plate (21), Z-direction driving motor (30) left wall are provided with towing chain device (27), Z-direction driving motor (30) bottom
It is provided with position-detection sensor (26), is provided with directive slide track device (25), the Z on the inside of the Z-direction driving motor (30)
Driving motor (30) left end is provided with motor transmission mechanism (28).
3. a kind of chip shooter machine according to claim 1, it is characterised in that: the load plate hand basket lifting device (2)
Including supporting platform (37), it is provided with limiting device (35), strainer (36) and detection in place at the top of supporting platform (37) and passes
Sensor (38) is placed with wafer hand basket (34) on the supporting platform (37), and supporting platform (37) top side is provided with Z
To transmission device (33), Z-direction transmission device (33) includes drive lead screw (39), transmission belt and belt wheel (40), driving motor (41)
With linear guide (42), Z-direction transmission device (33) side wall is provided with towing chain device (27).
4. a kind of chip shooter machine according to claim 1, it is characterised in that: the load plate automatic conveyor (4)
Including big travel displacement device (23), it is provided with position-detection sensor (26) on big travel displacement device (23), the big row
It is provided with load plate limited block (24) at the top of journey gearshift (23), small travel displacement device is provided on load plate limited block (24)
(20), the pneumatic pawl clamping device (19), screening load plate (21), in place vibration absorber (22) and directive slide track device (25).
5. a kind of chip shooter machine according to claim 1, it is characterised in that: bottom CCD video system (8) packet
It includes camera adjusting mechanism (49), is provided on camera adjusting mechanism (49) high-speed industrial camera (48), high-speed industrial camera (48)
On be provided with industrial camera lens (46), camera adjusting mechanism (49) bottom is provided with Z-direction adjustment mechanism (43), X to tune
Complete machine structure (44) and Y-direction adjustment mechanism (45), camera adjusting mechanism (49) side are provided with bottom secondary light source (53), bottom
It is provided with plane reflection microscope group (52) at the top of portion's secondary light source (53), plane reflection microscope group (52) top optical reflects microscope group
(51), it is provided with top of camera light source (50) at the top of optical reflection microscope group (51), is provided on the camera adjusting mechanism (49)
Camera containment envelope (47).
6. a kind of chip shooter machine according to claim 1, it is characterised in that: screening XY θ compensation system (5) packet
Include Y-axis linear motor mould group (15), X-axis linear motor mould group (16), product screening microscope carrier mechanism (17) and θ axis correcting motor mould
Group (18), the wafer hand basket lifting device (13) include supporting platform (37), and supporting platform is provided with position detection on (37)
Sensor (26) arrives level detection sensor (38) and limiting device (35), is placed with Z-direction position at the top of the supporting platform (37)
Sensor (83), supporting platform (37) side are provided with strainer (36), drive lead screw (39), transmission belt and belt wheel
(40), driving motor (41) and linear guide (42), linear guide (42) side are provided with towing chain device (27).
7. a kind of chip shooter machine according to claim 1, it is characterised in that: the capstan head high speed clamping and placing system (7)
Including Z-direction screening press mechanism (56), Z-direction screening press mechanism (56) bottom is provided with DDR and directly drives rotating electric machine (57), DDR
Straight rotating electric machine (57) bottom of driving is provided with swing arm linear guide (62), and swing arm linear guide (62) side is provided with
Chip picks and places oscillating arm mechanisms (63), is provided with Z-direction wafer press mechanism (61), Z-direction at the top of the Z-direction screening press mechanism (56)
It is provided with wafer CCD video system (9) at the top of wafer press mechanism (61), is provided with wafer at the top of wafer CCD video system (9)
CCD micromatic setting (59), Z-direction screening press mechanism (56) side are provided with screening CCD video mould group (54), screening CCD
Screening CCD micromatic setting (55) is provided at the top of video mould group (54), Z-direction screening press mechanism (56) bottom, which is provided with, to be turned
Tower vacuum distributor gear (58).
8. a kind of chip shooter machine according to claim 1, it is characterised in that: the wafer XY θ compensation system (10)
Mould group (66) are moved including X-axis, Y-axis movement mould group (65) is provided at the top of X-axis movement mould group (66), Y-axis moves mould group (65)
Top is provided with θ axis straightening die group (64), and θ axis straightening die group (64) includes θ axis supporting platform (72), θ axis supporting platform (72)
On be provided with carry ring guide wheel device (69), θ axis positioning device (70), carry ring pressing device (71), transmission shield (73), carry ring
Guiding device (74), θ axis drive pulley (75), θ shaft position sensor (76) and θ axis driving motor (77), the θ axis support carry
It is provided with primary and secondary at the top of platform (72) and carries ring supporting plate (68), primary and secondary, which carries, is provided with wafer primary and secondary load ring (67) at the top of ring supporting plate (68).
9. a kind of chip shooter machine according to claim 1, it is characterised in that: the XY self-correcting thimble system (11)
Including thimble movement mechanism (84), mobile transmission mould group (85) of Z-direction and XY dressing plate mould group (86), the thimble movement mechanism
It (84) include thimble reciprocating apparatus (96), thimble anticollision device, collision-prevention device (97), thimble guide runner (98), eccentric drive mechanism (101)
With thimble driving motor (60), mobile transmission mould group (85) side of the Z-direction is provided with safty shield (87), and the Z-direction is moved
Dynamic transmission mould group (85) includes support coupling arrangement (100), is provided with Z axis directive slide track at the top of support coupling arrangement (100)
(99), Z-direction transmission device (33) and wafer hand basket (34), the Z axis directive slide track (99) are provided on Z axis directive slide track (99)
Side wall is connected with Z-direction driving motor (30), and the XY dressing plate mould group (86) includes XY dressing plate bottom plate (95), XY correction
It is provided with X-axis driving motor (91) at the top of platform floor (95), XY dressing plate bottom plate (95) top side is provided with Y-axis
Driving motor (88), eccentric wheel drive mechanism (89) and Y-axis sized cross roller bearings (90), XY dressing plate bottom plate (95) top
Portion is provided with spring thrust mechanism (92), mobile working platform (93) and X-axis sized cross roller bearings (94).
10. a kind of chip shooter machine according to claim 1, it is characterised in that: the wafer grasp handling device
(12) include driving motor (41), be provided on driving motor (41) transmission support mechanism (79), transmission support mechanism (79) one
Side is provided with air lifter (80), and driving motor (41) side wall is provided with straight line screw rod mould group (81), the transmission
Supporting mechanism (79) other side is provided with towing chain device (27), and driving motor (41) side is provided with support post (78),
Transmission support mechanism (79) bottom is provided with snap finger mechanism (82), and described driving motor (41) one end is provided with position detection
Sensor (26).
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|---|---|---|---|
| CN201910486081.3A CN110213906A (en) | 2019-06-05 | 2019-06-05 | A kind of chip shooter machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910486081.3A CN110213906A (en) | 2019-06-05 | 2019-06-05 | A kind of chip shooter machine |
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| CN110213906A true CN110213906A (en) | 2019-09-06 |
Family
ID=67790955
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910486081.3A Pending CN110213906A (en) | 2019-06-05 | 2019-06-05 | A kind of chip shooter machine |
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| CN110589492A (en) * | 2019-09-19 | 2019-12-20 | 东莞市凯格精密机械有限公司 | A high-speed LED solid crystal equipment and its automatic loading and unloading device |
| CN111751713A (en) * | 2020-08-12 | 2020-10-09 | 深圳市诺泰芯装备有限公司 | Chip high-temperature testing device and method |
| CN111916375A (en) * | 2020-08-12 | 2020-11-10 | 深圳市诺泰芯装备有限公司 | Turret chip glueless die bonding machine |
| CN112278857A (en) * | 2020-11-12 | 2021-01-29 | 成都云绎智创科技有限公司 | A high-speed flexible sorting and placement equipment |
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| CN113600505A (en) * | 2021-08-02 | 2021-11-05 | 深圳市诺泰芯装备有限公司 | Sensor element detects sorting facilities |
| CN113607755A (en) * | 2021-08-26 | 2021-11-05 | 厦门柯尔自动化设备有限公司 | Automatic detection device for wafer |
| CN113644182A (en) * | 2021-08-03 | 2021-11-12 | 深圳市诺泰芯装备有限公司 | High-speed paster equipment of photoelectric display product |
| CN114334783A (en) * | 2021-12-31 | 2022-04-12 | 深圳新益昌科技股份有限公司 | Wafer mounting device |
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| CN111343847B (en) * | 2020-04-26 | 2021-06-11 | 方强 | Ultra-high-speed chip mounting method and chip mounting head |
| CN111751713A (en) * | 2020-08-12 | 2020-10-09 | 深圳市诺泰芯装备有限公司 | Chip high-temperature testing device and method |
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| CN112599445A (en) * | 2020-12-13 | 2021-04-02 | 无锡英诺赛思科技有限公司 | Reverse fool-proof device for wafer of semiconductor chip mounter |
| CN112718395B (en) * | 2020-12-29 | 2021-10-26 | 深圳宝创电子设备有限公司 | HP-X3 full-automatic lens chip mounter |
| CN112718395A (en) * | 2020-12-29 | 2021-04-30 | 深圳宝创电子设备有限公司 | HP-X3 full-automatic lens chip mounter |
| CN113437003B (en) * | 2021-04-02 | 2022-04-01 | 科尔迅智能科技(深圳)有限公司 | High-speed sheet arranging machine |
| CN113437003A (en) * | 2021-04-02 | 2021-09-24 | 科尔迅智能科技(深圳)有限公司 | High-speed sheet arranging machine |
| CN113600505A (en) * | 2021-08-02 | 2021-11-05 | 深圳市诺泰芯装备有限公司 | Sensor element detects sorting facilities |
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| CN113644182B (en) * | 2021-08-03 | 2023-01-03 | 深圳市诺泰芯装备有限公司 | High-speed paster equipment of photoelectric display product |
| CN113607755A (en) * | 2021-08-26 | 2021-11-05 | 厦门柯尔自动化设备有限公司 | Automatic detection device for wafer |
| CN114334783A (en) * | 2021-12-31 | 2022-04-12 | 深圳新益昌科技股份有限公司 | Wafer mounting device |
| CN115303796A (en) * | 2022-08-17 | 2022-11-08 | 深圳市鹏乐智能系统有限公司 | A pick-and-place mechanism for wafer-bearing iron original sheets in a basket |
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Effective date of registration: 20211115 Address after: 518000 south side of block D, four floors, building 1, Wanfeng Huafeng Pioneer Park, Shajing street and community 1, Bao'an District, Shenzhen, Guangdong Province Applicant after: Shenzhen Nuotai Equipment Co.,Ltd. Address before: 518000 No. 1, floor 2, building 34, Ma'anshan second industrial zone, Shajing street, Bao'an District, Shenzhen, Guangdong Applicant before: SHENZHEN NORTECH AUTOMATION CO.,LTD. |
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Application publication date: 20190906 |