CN107818934A - A kind of device of double-pendulum arms correcting working table - Google Patents
A kind of device of double-pendulum arms correcting working table Download PDFInfo
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Abstract
本发明公开了一种双摆臂校正工作台的装置,其特征在于,包括取芯部分、校正部分、精摆部分、控制部分;取芯部分、校正部分、精摆部分分别与控制部分连接。本发明实现了半导体设备的高精度位移修正、高精度旋转修正、高精度位置重列、高速度精确摆位;降低了半导体设备的设计、制造、使用、维护成本,提升了设备运行速率,提高了IC生产、制造效率;实现了半导体设备精确、高速取放芯片的动作要求。
The invention discloses a device for correcting a workbench with double swing arms, which is characterized in that it comprises a coring part, a correction part, a fine pendulum part and a control part; the coring part, the correction part and the fine pendulum part are respectively connected with the control part. The invention realizes high-precision displacement correction, high-precision rotation correction, high-precision position rearrangement, and high-speed precise positioning of semiconductor equipment; reduces the design, manufacture, use, and maintenance costs of semiconductor equipment, improves the operating speed of equipment, and improves Improve IC production and manufacturing efficiency; realize the precise and high-speed operation requirements of semiconductor equipment to pick and place chips.
Description
技术领域technical field
本发明属于半导体加工、制造领域,具体是一种双摆臂校正工作台的装置。The invention belongs to the field of semiconductor processing and manufacturing, in particular to a device for correcting a workbench with double swing arms.
背景技术Background technique
集成电路IC制造的后段封装工序,半导体设备贯穿整个封装流程,包括来料检验Wafer IQC(Incoming Quality Control)、表面贴装SMT(Surface Mounted Technology)、芯片粘贴Die Attach、引线键合Wire Bond等。双摆臂校正工作台的装置将已检晶圆重新进行高精度排序,完成膜对膜或膜对模组的芯片重排重列,实现半导体晶圆的高精度排片、高精度粘片,晶圆级封装(WLP,Wafer Level Package)的新型Fan-out封装形态。The back-end packaging process of integrated circuit IC manufacturing, semiconductor equipment runs through the entire packaging process, including incoming inspection Wafer IQC (Incoming Quality Control), surface mount SMT (Surface Mounted Technology), chip paste Die Attach, wire bonding Wire Bond, etc. . The double-swing arm calibration table device re-sorts the inspected wafers with high precision, completes the film-to-film or film-to-module chip rearrangement, and realizes high-precision wafer placement and high-precision bonding of semiconductor wafers. A new Fan-out package form of WLP (Wafer Level Package).
现有两种技术:There are two techniques available:
1、三轴联动焊臂+单校正摄像头+双定位摄像头+双X-Y工作台,如图3所示:1. Three-axis linkage welding arm + single calibration camera + double positioning camera + double X-Y workbench, as shown in Figure 3:
该装置膜对膜移动晶圆时,采用校正摄像头完成对晶圆的检测与校正数据计算,通过三轴联动焊臂移动、旋转完成晶圆的重新排列。When the device moves the wafer film-to-film, the calibration camera is used to complete the detection and calibration data calculation of the wafer, and the rearrangement of the wafer is completed through the movement and rotation of the three-axis linkage welding arm.
该装置能够实现工作要求,但由于其对机械器件的动作要求高、精度要求高,造成机械部件设计、维修复杂,设备制造、维护成本高,设备使用、运动速率慢,工业生产效率低等不足。The device can meet the work requirements, but due to its high requirements for the action and precision of mechanical components, it causes complex design and maintenance of mechanical components, high equipment manufacturing and maintenance costs, slow equipment use and movement speed, and low industrial production efficiency. .
2、单摆臂+双定位摄像头+双X-Y工作台,如图4所示:2. Single swing arm + double positioning camera + double X-Y workbench, as shown in Figure 4:
该装置为原发明,膜对膜移动晶圆时,采用单摆臂-双定位摄像头模式,由双定位摄像头采集图像,对图像数据处理后,由单摆臂完成晶圆的重排和膜对膜的移动摆位动作。This device is an original invention. When film-to-film moves wafers, it adopts the single swing arm-dual positioning camera mode, and the dual positioning cameras collect images. After image data processing, the single swing arm completes the wafer rearrangement and film pairing. The movement and positioning action of the membrane.
其技术缺陷为:由于半导体晶圆所使用蓝膜或UV膜的粘度不均匀,膜的拉伸形变不均匀,易造成芯片脱膜时发生位移或旋转,移位放置后位置不准确。Its technical defects are: due to the uneven viscosity of the blue film or UV film used on the semiconductor wafer, the stretching deformation of the film is uneven, which may easily cause displacement or rotation of the chip when it is removed from the film, and the position after the shift is placed is not accurate.
发明内容Contents of the invention
本发明目的在于克服现有技术的不足,提供一种双摆臂校正工作台的装置,该装置实现了半导体设备的高精度位移修正、高精度旋转修正、高精度位置重列、高速度精确摆位;该装置运用高精度部件,通过简单的机械设计实现了芯片高精度、高速度的拾取、校正、拾放等工作要求,降低了半导体设备的设计、制造、使用、维护成本,提升了设备运行速率,提高了IC生产、制造效率;该装置在机械部件设计上化繁为简,通过正确调整、配合各部件的真空吸放时间,实现了半导体设备的精确、高速取放芯片的动作要求。The purpose of the present invention is to overcome the deficiencies of the prior art and provide a device for correcting the worktable with double swing arms, which realizes high-precision displacement correction, high-precision rotation correction, high-precision position rearrangement, and high-speed precise swing of semiconductor equipment. The device uses high-precision components, and through simple mechanical design, it realizes the high-precision, high-speed pick-up, calibration, pick-and-place work requirements of the chip, reduces the design, manufacture, use, and maintenance costs of semiconductor equipment, and improves the equipment. The operating speed improves IC production and manufacturing efficiency; the device simplifies the design of mechanical parts, and through correct adjustment and matching the vacuum suction and release time of each part, the precise and high-speed chip pick-and-place action requirements of semiconductor equipment are realized. .
实现本发明目的的技术方案是:The technical scheme that realizes the object of the present invention is:
一种双摆臂校正工作台的装置,包括取芯部分、校正部分、精摆部分、控制部分;取芯部分、校正部分、精摆部分分别与控制部分连接。A device for correcting a workbench with double swing arms comprises a coring part, a correction part, a fine pendulum part and a control part; the coring part, the correction part and the fine pendulum part are respectively connected with the control part.
所述的控制部分为控制系统。The control part is a control system.
所述的取芯部分,包括第一定位摄像头、第一摆臂、第一X-Y工作台;第一定位摄像头设置在第一X-Y工作台的正上方;第一摆臂与第一X-Y工作台相连接;第一定位摄像头、第一摆臂、第一X-Y工作台分别与控制部分的控制系统连接。The coring part includes a first positioning camera, a first swing arm, and a first X-Y worktable; the first positioning camera is arranged directly above the first X-Y workbench; the first swing arm is connected to the first X-Y worktable Connection; the first positioning camera, the first swing arm, and the first X-Y worktable are respectively connected to the control system of the control part.
所述的校正部分,包括校正摄像头、X-Y-θ校正工作台;校正摄像头设置在X-Y-θ校正工作台的正上方;校正摄像头、X-Y-θ校正工作台分别与控制部分的控制系统连接;X-Y-θ校正工作台还与取芯部分的第一摆臂相连接。The correction part includes a correction camera and an X-Y-θ correction workbench; the correction camera is arranged directly above the X-Y-θ correction workbench; the correction camera and the X-Y-θ correction workbench are respectively connected to the control system of the control part; the X-Y The -θ correction table is also connected with the first swing arm of the coring section.
所述的X-Y-θ校正工作台上设置有θ电机,校正摄像头设置在θ电机的正上方,θ电机可以在X-Y-θ校正工作台上旋转。The X-Y-θ correction table is provided with a θ motor, the calibration camera is arranged directly above the θ motor, and the θ motor can rotate on the X-Y-θ correction table.
所述的精摆部分,包括第二定位摄像头、第二摆臂、第二X-Y工作台;第二定位摄像头设置在第二X-Y工作台的正上方;第二摆臂与第二X-Y工作台相连接;第二定位摄像头、第二摆臂、第二X-Y工作台分别与控制部分的控制系统连接;第二摆臂还与校正部分的X-Y-θ校正工作台相连接。The fine swing part includes a second positioning camera, a second swing arm, and a second X-Y worktable; the second positioning camera is arranged directly above the second X-Y worktable; the second swing arm is connected to the second X-Y worktable Connection; the second positioning camera, the second swing arm, and the second X-Y workbench are respectively connected to the control system of the control part; the second swing arm is also connected to the X-Y-θ correction workbench of the correction part.
所述的X-Y-θ校正工作台、第二摆臂、第二X-Y工作台,根据目标精度要求,分别选择不同精度的X-Y-θ校正工作台、第二摆臂、第二X-Y工作台。For the X-Y-θ calibration table, second swing arm, and second X-Y table, according to the target accuracy requirements, X-Y-θ calibration table, second swing arm, and second X-Y table with different precisions are selected respectively.
所述的精度,包括高、中、低精度。Said precision includes high, medium and low precision.
所述的取芯部分、校正部分、精摆部分分别与控制部分连接,通过控制系统运算、控制,实现芯片的修正、旋转等校正动作,并在控制系统的显示器将信息进行显示。The coring part, correction part and fine pendulum part are respectively connected with the control part, through the operation and control of the control system, correction actions such as chip correction and rotation are realized, and the information is displayed on the display of the control system.
有益效果:本发明提供的一种双摆臂校正工作台的装置,该装置实现了半导体设备的高精度位移修正、高精度旋转修正、高精度位置重列、高速度精确摆位;降低了半导体设备的设计、制造、使用、维护成本,提升了设备运行速率,提高了IC生产、制造效率;实现了半导体设备高精度、高速度的拾取、校正、拾放芯片的工作要求。该装置将检测达标的半导体晶圆重新进行高精度排序,并完成膜对膜或膜对模组的芯片重排重列。Beneficial effects: the present invention provides a device for correcting workbenches with double swing arms, which realizes high-precision displacement correction, high-precision rotation correction, high-precision position rearrangement, and high-speed precise positioning of semiconductor equipment; The design, manufacture, use, and maintenance costs of the equipment have increased the operating speed of the equipment, improved the efficiency of IC production and manufacturing, and realized the work requirements of high-precision, high-speed pick-up, calibration, and pick-and-place chips for semiconductor equipment. The device re-sorts the semiconductor wafers that meet the standards with high precision, and completes the chip rearrangement of film-to-film or film-to-module.
附图说明Description of drawings
图1为本发明的一种双摆臂校正工作台的装置的结构框图;Fig. 1 is a structural block diagram of a device for correcting a workbench with double swing arms of the present invention;
图2为本发明的一种双摆臂校正工作台的装置的工作时示意图;Fig. 2 is the working schematic diagram of the device of a kind of double swing arm correction workbench of the present invention;
图3是三轴联动焊臂+单校正摄像头+双定位摄像头+双X-Y工作台;Figure 3 is a three-axis linkage welding arm + single calibration camera + double positioning camera + double X-Y table;
图4是单摆臂+双定位摄像头+双X-Y工作台;Figure 4 is a single swing arm + double positioning camera + double X-Y workbench;
图1中,1.取芯部分 1-1.第一定位摄像头 1-2.第一摆臂 1-3.第一X-Y工作台 2.校正部分 2-1.校正摄像头 2-2.X-Y-θ校正工作台 2-3.θ电机 3.精摆部分 3-1.第二定位摄像头 3-2.第二摆臂 3-3.第二X-Y工作台 4.控制部分 4-1.控制系统。In Figure 1, 1. Coring part 1-1. First positioning camera 1-2. First swing arm 1-3. First X-Y table 2. Correction part 2-1. Correction camera 2-2. X-Y- θ correction table 2-3. θ motor 3. Fine pendulum part 3-1. Second positioning camera 3-2. Second swing arm 3-3. Second X-Y table 4. Control part 4-1. Control system .
具体实施方式Detailed ways
下面结合附图和实施例对本发明作进一步阐述,但不是对本发明的限定。The present invention will be further described below in conjunction with the accompanying drawings and embodiments, but the present invention is not limited thereto.
实施例:Example:
如图1所示,一种双摆臂校正工作台的装置,包括取芯部分1、校正部分2、精摆部分3、控制部分4;取芯部分1、校正部分2、精摆部分3分别与控制部分4连接。As shown in Figure 1, a device for correcting a workbench with double swing arms includes a coring part 1, a correction part 2, a fine pendulum part 3, and a control part 4; the coring part 1, the correction part 2, and the fine pendulum part 3 are respectively Connect with control section 4.
所述的控制部分4为控制系统4-1。The control part 4 is a control system 4-1.
所述的取芯部分1,包括第一定位摄像头1-1、第一摆臂1-2、第一X-Y工作台1-3;第一定位摄像头1-1设置在第一X-Y工作台1-3的正上方;第一摆臂1-2与第一X-Y工作台1-3相连接;第一定位摄像头1-1、第一摆臂1-2、第一X-Y工作台1-3分别与控制部分4的控制系统4-1连接。The coring part 1 includes a first positioning camera 1-1, a first swing arm 1-2, and a first X-Y table 1-3; the first positioning camera 1-1 is set on the first X-Y table 1- directly above 3; the first swing arm 1-2 is connected with the first X-Y table 1-3; the first positioning camera 1-1, the first swing arm 1-2, and the first X-Y table 1-3 are respectively connected to The control system 4-1 of the control section 4 is connected.
所述的校正部分2,包括校正摄像头2-1、X-Y-θ校正工作台2-2;校正摄像头2-1设置在X-Y-θ校正工作台2-2的正上方;校正摄像头2-1、X-Y-θ校正工作台2-2分别与控制部分4的控制系统4-1连接;X-Y-θ校正工作台2-2还与取芯部分1的第一摆臂1-2相连接。The correction part 2 includes a correction camera 2-1, an X-Y-θ correction workbench 2-2; the correction camera 2-1 is arranged directly above the X-Y-θ correction workbench 2-2; the correction camera 2-1, The X-Y-θ correction table 2-2 is respectively connected with the control system 4-1 of the control part 4; the X-Y-θ correction table 2-2 is also connected with the first swing arm 1-2 of the coring part 1.
所述的X-Y-θ校正工作台上设置有θ电机2-3,校正摄像头2-1设置在θ电机2-3的正上方,θ电机2-3可以在X-Y-θ校正工作台2-2上旋转。The X-Y-θ correction table is provided with a θ motor 2-3, the correction camera 2-1 is arranged directly above the θ motor 2-3, and the θ motor 2-3 can be placed on the X-Y-θ correction table 2-2 up spin.
所述的精摆部分3,包括第二定位摄像头3-1、第二摆臂3-2、第二X-Y工作台3-3;第二定位摄像头3-1设置在第二X-Y工作台3-3的正上方;第二摆臂3-2与第二X-Y工作台3-3相连接;第二定位摄像头3-1、第二摆臂3-2、第二X-Y工作台3-3分别与控制部分4的控制系统4-1连接;第二摆臂3-2还与校正部分2的X-Y-θ校正工作台2-2相连接。The fine swing part 3 includes a second positioning camera 3-1, a second swing arm 3-2, and a second X-Y worktable 3-3; the second positioning camera 3-1 is arranged on the second X-Y worktable 3- 3 directly above; the second swing arm 3-2 is connected with the second X-Y workbench 3-3; the second positioning camera 3-1, the second swing arm 3-2, and the second X-Y workbench 3-3 are respectively connected to The control system 4-1 of the control part 4 is connected; the second swing arm 3-2 is also connected with the X-Y-θ correction table 2-2 of the correction part 2.
所述的X-Y-θ校正工作台2-2、第二摆臂3-2、第二X-Y工作台3-3,根据目标精度要求,分别选择不同精度的X-Y-θ校正工作台2-2、第二摆臂3-2、第二X-Y工作台3-3。The X-Y-θ correction workbench 2-2, the second swing arm 3-2, and the second X-Y workbench 3-3, according to the target accuracy requirements, respectively select different precision X-Y-θ correction workbenches 2-2, The second swing arm 3-2, the second X-Y workbench 3-3.
所述的精度,包括高、中、低精度。Said precision includes high, medium and low precision.
所述的取芯部分1、校正部分2、精摆部分3分别与控制部分4连接,通过控制系统4-1运算、控制,实现芯片的修正、旋转等校正动作,并在控制系统4-1的显示器将信息进行显示。The coring part 1, correction part 2, and fine pendulum part 3 are respectively connected to the control part 4, and through the calculation and control of the control system 4-1, corrective actions such as chip correction and rotation are realized, and in the control system 4-1 The display will display the information.
本发明的装置工作流程如下:Device workflow of the present invention is as follows:
如图2所示,工作流程从装置的取芯部分1开始,将芯片放入第一X-Y工作台1-3,控制系统4-1通过处理第一定位摄像头1-1采集芯片的图像坐标数据,控制第一X-Y工作台1-3移动至第一摆臂1-2的坐标原点;控制系统4-1对数据进行处理,控制第一摆臂1-2在第一X-Y工作台1-3上准备拾取芯片;控制系统4-1正确调整第一摆臂1-2吸嘴的真空吸放时间完成芯片拾取。As shown in Figure 2, the work flow starts from the coring part 1 of the device, and the chip is put into the first X-Y workbench 1-3, and the control system 4-1 collects the image coordinate data of the chip by processing the first positioning camera 1-1 , control the first X-Y table 1-3 to move to the coordinate origin of the first swing arm 1-2; the control system 4-1 processes the data, and controls the first swing arm 1-2 to move to the first X-Y table 1-3 Prepare to pick up the chip; the control system 4-1 correctly adjusts the vacuum suction and release time of the suction nozzle of the first swing arm 1-2 to complete the chip pickup.
控制系统4-1通过校正部分2的校正摄像头2-1与X-Y-θ校正工作台2-2计算芯片的目标定位,控制第一摆臂1-2完成180°旋转,将芯片摆送至校正部分2的X-Y-θ校正工作台2-2中央的θ电机2-3上;第一摆臂1-2复位,校正摄像头2-1采集芯片的坐标位移、偏转等参数,控制系统4-1对数据进行处理,控制X-Y-θ校正工作台2-2进行X轴、Y轴的坐标调整和θ角度的旋转调整,完成芯片坐标的精确校正。The control system 4-1 calculates the target positioning of the chip through the calibration camera 2-1 and the X-Y-θ calibration table 2-2 of the calibration part 2, controls the first swing arm 1-2 to complete the 180° rotation, and sends the chip to the calibration The X-Y-θ calibration of part 2 is on the θ motor 2-3 in the center of the workbench 2-2; the first swing arm 1-2 is reset, and the camera 2-1 is corrected to collect the coordinate displacement, deflection and other parameters of the chip, and the control system 4-1 Process the data, control the X-Y-θ correction workbench 2-2 to adjust the coordinates of the X-axis and Y-axis and the rotation adjustment of the θ angle, and complete the precise correction of the chip coordinates.
控制系统4-1控制第二摆臂3-2完成180°旋转,正确调整第二摆臂3-2吸嘴与X-Y-θ校正工作台2-2的真空吸放时间,将芯片从X-Y-θ校正工作台2-2精确吸取至第二摆臂3-2;控制系统4-1通过第二定位摄像头3-1采集的图像数据计算芯片的目标坐标,控制第二X-Y工作台3-3精确调整芯片的目标定位,等待目标芯片拾放;控制系统4-1控制第二摆臂3-2完成180°旋转,将已校正芯片摆送至第二X-Y工作台3-3的新膜或新模组中,实现芯片高精度、高速度的重排重列功能。The control system 4-1 controls the second swing arm 3-2 to complete the 180° rotation, correctly adjusts the vacuum suction and release time of the second swing arm 3-2 suction nozzle and the X-Y-θ correction table 2-2, and moves the chip from X-Y- The θ correction table 2-2 is accurately sucked to the second swing arm 3-2; the control system 4-1 calculates the target coordinates of the chip through the image data collected by the second positioning camera 3-1, and controls the second X-Y table 3-3 Accurately adjust the target positioning of the chip, and wait for the target chip to be picked and placed; the control system 4-1 controls the second swing arm 3-2 to complete the 180° rotation, and sends the calibrated chip to the new film or the second X-Y workbench 3-3 In the new module, the high-precision and high-speed rearrangement function of the chip is realized.
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CN110213906A (en) * | 2019-06-05 | 2019-09-06 | 深圳市诺泰自动化设备有限公司 | A kind of chip shooter machine |
CN111086906A (en) * | 2019-11-26 | 2020-05-01 | 矽电半导体设备(深圳)股份有限公司 | Position correction method for placing core particles on sorting film and core particle sorting method |
CN115732378A (en) * | 2021-08-30 | 2023-03-03 | 深圳市智立方自动化设备股份有限公司 | Automatic calibration system and method for suction nozzle |
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JP2000252303A (en) * | 1999-02-26 | 2000-09-14 | Shibaura Mechatronics Corp | Pellet bonding method |
CN207651454U (en) * | 2017-12-05 | 2018-07-24 | 桂林立德爱博半导体装备有限公司 | A kind of device of double-pendulum arms correcting working table |
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JPH11135995A (en) * | 1997-10-31 | 1999-05-21 | Victor Co Of Japan Ltd | Parts mounting device |
JP2000252303A (en) * | 1999-02-26 | 2000-09-14 | Shibaura Mechatronics Corp | Pellet bonding method |
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CN110213906A (en) * | 2019-06-05 | 2019-09-06 | 深圳市诺泰自动化设备有限公司 | A kind of chip shooter machine |
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