CN105783710B - A kind of method and device of location position - Google Patents
A kind of method and device of location position Download PDFInfo
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- CN105783710B CN105783710B CN201410822825.1A CN201410822825A CN105783710B CN 105783710 B CN105783710 B CN 105783710B CN 201410822825 A CN201410822825 A CN 201410822825A CN 105783710 B CN105783710 B CN 105783710B
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Abstract
The present invention provides a kind of method and device of location position, is applied in loading device, this method includes：Obtain first coordinate difference at the center of the first optical system and the center of preset calibrations plate, wherein the preset calibrations plate is moved to according to predetermined process track in the visual field of first optical system；Obtain second coordinate difference at the center of the second optical system and the center of the preset calibrations plate, wherein the preset calibrations plate is according to the predetermined process track from the field motion to the visual field of second optical system of first optical system；According to first coordinate difference and second coordinate difference, the distance between first optical system and second optical system and angle are determined so that the loading device can realize the calibration of chip position according to the distance and angle.Distance and angle between the optical system of calibration of the embodiment of the present invention provide guarantee for the precision of next step load technique, realize high-precision load.
Description
Technical Field
The invention relates to the field of chip mounting technology and optical technology, in particular to a position calibration method and device.
Background
With the rapid development of global electronic information technology, integrated circuit chips are continuously developed in the directions of high density, high performance, light weight, small size, and more bumps are required on the chips to meet the IC packaging requirements. With the increase of the number of the bumps, the chip mounting device in the prior art is challenged, and one of the main problems is how to mount the chip with high density and small-distance bumps with high precision. At present, chip loading is generally finished directly after a chip is picked in chip loading equipment, but the mode has a main problem that the chip is directly loaded without alignment after the chip is picked, so that possible micro deviation during picking cannot be eliminated, and the chip loading precision is difficult to improve.
Disclosure of Invention
The invention aims to provide a position calibration method and a position calibration device, which are used for calibrating a chip alignment position and a substrate mounting position before equipment process production, correcting the obtained deviation and meeting the requirement of high-precision chip mounting.
In order to achieve the above object, an embodiment of the present invention provides a position calibration method, applied to a die bonding apparatus, including:
acquiring a first coordinate difference between the center of a first optical system and the center of a preset calibration plate, wherein the preset calibration plate moves to the field of view of the first optical system according to a preset process track;
acquiring a second coordinate difference between the center of a second optical system and the center of a preset calibration plate, wherein the preset calibration plate moves from the view field of the first optical system to the view field of the second optical system according to the preset process track;
and determining the distance and the included angle between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference, so that the chip mounting equipment can realize the calibration of the chip position according to the distance and the included angle.
The obtaining of the first coordinate difference between the center of the first optical system and the center of the preset calibration plate specifically includes:
acquiring a first coordinate of the center of the first optical system in a preset three-dimensional coordinate system;
acquiring a second coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the first optical system;
and determining the first coordinate difference according to the first coordinate and the second coordinate.
Wherein, the obtaining a second coordinate difference between the center of the second optical system and the center of the preset calibration plate specifically includes:
acquiring a third coordinate of the center of the second optical system in the preset three-dimensional coordinate system;
acquiring a fourth coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the second optical system;
and determining the second coordinate difference according to the third coordinate and the fourth coordinate.
The first optical system comprises an industrial camera, a zoom or fixed-zoom lens and a turning prism, wherein one end of the zoom or fixed-zoom lens is connected with the industrial camera, and the turning prism is connected with the other end of the lens;
the second optical system comprises an industrial camera and a zoom or fixed-magnification lens connected with the industrial camera; wherein,
when the preset calibration plate is in the field of view of the first optical system, the center of the preset calibration plate is calibrated by the first optical system by adjusting the position of the turning prism;
when the preset calibration plate is in the field of view of the second optical system, the center of the preset calibration plate is calibrated by the second optical system by adjusting the positions of the lens and the industrial camera.
And a lens is arranged between the second optical system and the preset calibration plate, and the calibration of the second optical system to the center of the preset calibration plate is realized by adjusting the position of the lens.
Wherein, according to the first coordinate difference and the second coordinate difference, determining a distance and an included angle between the first optical system and the second optical system specifically includes:
determining a coordinate difference between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference; wherein,
the coordinate difference includes: the distance between the first optical system and the second optical system in the X-axis direction of the preset three-dimensional coordinate system, the distance between the second optical system and the second optical system in the Y-axis direction of the preset three-dimensional coordinate system, and the included angle between the first optical system and the second optical system and the Z-axis of the preset three-dimensional coordinate system are determined.
The embodiment of the invention also provides a position calibration device, which is applied to the chip mounting equipment and comprises the following components:
the system comprises a first acquisition module, a second acquisition module and a third acquisition module, wherein the first acquisition module is used for acquiring a first coordinate difference between the center of a first optical system and the center of a preset calibration plate, and the preset calibration plate moves to the field of view of the first optical system according to a preset process track;
the second acquisition module is used for acquiring a second coordinate difference between the center of a second optical system and the center of the preset calibration plate, wherein the preset calibration plate moves from the view field of the first optical system to the view field of the second optical system according to the preset process track;
and the determining module is used for determining the distance and the included angle between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference, so that the chip mounting equipment can realize the calibration of the chip position according to the distance and the included angle.
Wherein the first obtaining module comprises:
the first acquisition submodule is used for acquiring a first coordinate of the center of the first optical system in a preset three-dimensional coordinate system;
the second obtaining submodule is used for obtaining a second coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the first optical system;
and the first determining submodule is used for determining the first coordinate difference according to the first coordinate and the second coordinate.
Wherein the second obtaining module comprises:
the third obtaining submodule is used for obtaining a third coordinate of the center of the second optical system in the preset three-dimensional coordinate system;
the fourth obtaining submodule is used for obtaining a fourth coordinate of the center of the preset calibrating plate in the preset three-dimensional coordinate system, wherein the center of the preset calibrating plate is calibrated by the second optical system;
and the second determining submodule is used for determining the second coordinate difference according to the third coordinate and the fourth coordinate.
The first optical system comprises an industrial camera, a zoom or fixed-zoom lens and a turning prism, wherein one end of the zoom or fixed-zoom lens is connected with the industrial camera, and the turning prism is connected with the other end of the lens;
the second optical system comprises an industrial camera and a zoom or fixed-magnification lens connected with the industrial camera; wherein,
when the preset calibration plate is in the field of view of the first optical system, the center of the preset calibration plate is calibrated by the first optical system by adjusting the position of the turning prism;
when the preset calibration plate is in the field of view of the second optical system, the center of the preset calibration plate is calibrated by the second optical system by adjusting the positions of the lens and the industrial camera.
And a lens is arranged between the second optical system and the preset calibration plate, and the calibration of the second optical system to the center of the preset calibration plate is realized by adjusting the position of the lens.
Wherein the determining module comprises:
a third determining submodule for determining a coordinate difference between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference; wherein,
the coordinate difference includes: the distance between the first optical system and the second optical system in the X-axis direction of the preset three-dimensional coordinate system, the distance between the second optical system and the second optical system in the Y-axis direction of the preset three-dimensional coordinate system, and the included angle between the first optical system and the second optical system and the Z-axis of the preset three-dimensional coordinate system are determined.
The technical scheme of the invention at least has the following beneficial effects:
in the position calibration method and device provided by the embodiment of the invention, the accurate distance and included angle between the first optical system and the second optical system are determined through the first coordinate difference and the second coordinate difference before the chip mounting equipment mounts the chip, so that the chip mounting equipment can realize the calibration of the chip position according to the distance and the included angle, the possible micro deviation generated in the chip pickup process is eliminated, and the higher chip mounting precision requirement is met; meanwhile, the problem that the coordinate systems of two optical systems are not uniform is solved, and the precision of the equipment is greatly improved, so that the deviation can be quickly, simply and accurately verified and corrected in the process production process.
Drawings
FIG. 1 is a schematic diagram illustrating the basic steps of a method for position calibration according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a processing procedure of a position calibration method at a first optical system according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a processing procedure of a position calibration method at a second optical system according to an embodiment of the present invention;
FIG. 4 is a schematic direction diagram of a predetermined three-dimensional coordinate system in the position calibration method according to the embodiment of the invention;
fig. 5 is a block diagram showing a position calibration apparatus according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
The invention provides a position calibration method and a device aiming at the problems that chip mounting precision is not high because chip mounting is directly carried out without alignment in a chip pickup process of chip mounting equipment in the prior art, and micro deviation exists, wherein the precise distance and included angle between a first optical system and a second optical system are determined through a first coordinate difference and a second coordinate difference before the chip mounting equipment carries out the chip mounting, so that the chip mounting equipment can realize the calibration of the chip position according to the distance and the included angle, the micro deviation possibly generated in the chip pickup process is eliminated, and the higher chip mounting precision requirement is met; meanwhile, the problem that the coordinate systems of two optical systems are not uniform is solved, and the precision of the equipment is greatly improved, so that the deviation can be quickly, simply and accurately verified and corrected in the process production process.
As shown in fig. 1, an embodiment of the present invention provides a position calibration method, applied to a die bonding apparatus, including:
step 11, acquiring a first coordinate difference between the center of a first optical system and the center of a preset calibration plate, wherein the preset calibration plate moves to the view field of the first optical system according to a preset process track;
step 12, obtaining a second coordinate difference between the center of a second optical system and the center of the preset calibration plate, wherein the preset calibration plate moves from the view field of the first optical system to the view field of the second optical system according to the preset process track;
and step 13, determining the distance and the included angle between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference, so that the chip mounting equipment can realize the calibration of the chip position according to the distance and the included angle.
The embodiment of the invention utilizes the principle of optical imaging, the first optical system and the second optical system respectively collect images of the calibration plate in the field of view, and the high-precision image algorithm is used for identifying the central position of the calibration plate, so that the precise distance and included angle between the first optical system and the second optical system are obtained. The specific mounting process of the mounting device comprises the following steps: the external motor driving chip moves to the view field of the first optical system according to the preset process track, after the center of the chip is calibrated through the image recognition technology of the first optical system, the external motor driving chip moves the accurate distance and included angle between the first optical system and the second optical system obtained by the embodiment of the invention, the chip is positioned in the view field of the second optical system, and at the moment, the coordinate difference does not exist between the center of the second optical system and the center of the chip, and the position is the accurate position of chip mounting, so that high-precision chip mounting is realized.
It should be noted that the position calibration method provided by the embodiment of the present invention is related to the center of the image recognition calibration plate and the random error of motion, so that the distance and the included angle between the first optical system and the second optical system need to be calculated for many times, and a statistical method is used to obtain a more accurate distance and included angle; the statistical methods such as averaging, mean square error, normal distribution analysis, etc. are not particularly limited herein.
Meanwhile, in order to verify whether the one-time calibration is successful, the following method is adopted: the calibration plate is moved into the field of view of the first optical system and the imaging software calculates a first coordinate difference between the center of the first optical system and the center of the calibration plate, set to (Δ X)1a、ΔY1a、Δθ1a) After the distance and the included angle obtained by the external motor driving the calibration plate to move through the step 13 are set as (Δ X, Δ Y, Δ θ), the calibration plate is in the field of view of the second optical system, the image software calculates a second coordinate difference between the center of the second optical system and the center of the calibration plate, and the second coordinate difference is set as (Δ X, Δ Y, Δ θ)2a、ΔY2a、Δθ2a) Checking for Δ X2a＝0、ΔY2a＝0、Δθ2aIf the value is delta theta, successfully calibrating; otherwise, calibration is not successful, and re-calibration is needed.
Specifically, in the embodiment of the present invention, step 11 specifically includes:
step 111, acquiring a first coordinate of the center of the first optical system in a preset three-dimensional coordinate system;
step 112, obtaining a second coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the first optical system;
step 113, determining the first coordinate difference according to the first coordinate and the second coordinate, and setting the first coordinate difference as (Δ X)1、ΔY1、Δθ1)。
The step 12 specifically includes:
step 121, acquiring a third coordinate of the center of the second optical system in the preset three-dimensional coordinate system;
step 122, obtaining a fourth coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the second optical system;
step 123, determining the second coordinate difference according to the third coordinate and the fourth coordinate, and setting the second coordinate difference as (Δ X)2、ΔY2、Δθ2)。
In particular, according to the first coordinate difference Δ X1、ΔY1、Δθ1) And a second coordinate difference (Δ X)2、ΔY2、Δθ2) The distance and the included angle between the first optical system and the second optical system are (Δ X, Δ Y, Δ θ) — (X)1+X2、Y1+Y2、θ1+θ2). In practical application, values (delta X, delta Y and delta theta) obtained by calibration through the method of the embodiment of the invention are stored in a program in a parameter mode, and in the process of technological production, after a certain number of products are processed, the distance and included angle between the first optical system and the second optical system can be verified accurately, so that possible deviation can be made up in time, and the requirement of high-precision chip mounting is met. The embodiment of the invention creatively leads the calibration process to be run through the actual process production, and realizes the functions of verifying deviation and correcting deviation more simply, conveniently, quickly and accurately in the production process.
It should be noted that, in practical application, the first optical system is a downward-looking optical system, and the second optical system is an upward-looking optical system; the method of position calibration according to the embodiment of the present invention is further described below with reference to fig. 2 and 3 (wherein all coordinates are vectors (positive and negative), X is positive to the left, Y is positive to the outside, and Z is positive to the bottom, as shown in fig. 4):
firstly, as shown in fig. 2, a preset calibration plate 4 for visual identification is installed at the lower end of a calibration jig 3, then the calibration jig 3 is installed on an external motor driving mechanism, the external motor drives the calibration plate 4 to move to the view field of an upward-looking optical system 2, the center of the calibration plate 4 is automatically aligned through an image identification algorithm, and an included angle between the center of the upward-looking optical system 2 (i.e. the position of a motor) and the center of the calibration plate 4 is recorded to obtain a first coordinate difference (Δ X)1、ΔY1、Δθ1)；
As shown in fig. 3, the calibration jig 3 with the calibration plate 4 installed thereon is driven by an external motor to move into the view field of the downward-looking optical system 1, the center of the calibration plate 4 is automatically aligned by an image recognition algorithm, and an included angle between the center of the downward-looking optical system 1 (i.e., the position of the motor) and the center of the calibration plate is recorded to obtain a second coordinate difference (Δ X)2、ΔY2、Δθ2)；
The distance and included angle between the upper and lower alignment systems are:
(ΔX、ΔY、Δθ)＝(X1+X2、Y1+Y2、θ1+θ2). Specifically, the final value is obtained by a statistical method after a plurality of measurements are required, and the description is not repeated here.
Specifically, in practical application of the present invention, as shown in fig. 2 and 3, the first optical system includes an industrial camera, a zoom or fixed-zoom lens having one end connected to the industrial camera, and a turning prism connected to the other end of the lens;
the second optical system comprises an industrial camera and a zoom or fixed-magnification lens connected with the industrial camera; wherein,
when the preset calibration plate is in the field of view of the first optical system, the center of the preset calibration plate is calibrated by the first optical system by adjusting the position of the turning prism;
when the preset calibration plate is in the field of view of the second optical system, the center of the preset calibration plate is calibrated by the second optical system by adjusting the positions of the lens and the industrial camera. The upper-view optical system can adopt a mode of processing a camera in the industry of zoom or fixed-zoom lenses, a turning prism is added at the front end to realize that the optical system is horizontally placed, and the position of the prism is adjusted to obtain a clear image. The lower-view optical system can adopt a mode of a zoom or fixed-zoom lens processing industry camera to adjust the height of the optical system to obtain a clear image.
Meanwhile, in order to shorten the working distance between the second optical system and the calibration plate and realize the collection of images of the calibration plate at the same height and different positions (namely, the determination of the center of the calibration plate), a lens is arranged between the second optical system and the preset calibration plate, and the calibration of the second optical system on the center of the preset calibration plate is realized by adjusting the position of the lens.
Preferably, in the above embodiment of the present invention, step 13 specifically includes:
step 131, determining a coordinate difference between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference; wherein,
the coordinate difference includes: the distance between the first optical system and the second optical system in the X-axis direction of the preset three-dimensional coordinate system, the distance between the second optical system and the second optical system in the Y-axis direction of the preset three-dimensional coordinate system, and the included angle between the first optical system and the second optical system and the Z-axis of the preset three-dimensional coordinate system are determined.
The specific embodiment of the invention respectively collects the images of the calibration plate in the view field thereof through the upward-looking optical system and the downward-looking optical system, and identifies the central position of the calibration plate by using a high-precision image algorithm to obtain the precise distance and included angle between the upward-looking optical system and the downward-looking optical system, thereby providing guarantee for the precision of the next process production; meanwhile, the invention eliminates possible micro deviation in the chip pick-up process by adding the upward-looking optical system to accurately align the position of the chip after pick-up, thereby meeting the requirement of higher chip mounting precision.
In order to better achieve the above object, as shown in fig. 5, an embodiment of the present invention further provides a position calibration apparatus, which is applied to a die bonding apparatus, and includes:
a first obtaining module 51, configured to obtain a first coordinate difference between a center of a first optical system and a center of a preset calibration plate, where the preset calibration plate moves into a field of view of the first optical system according to a preset process track;
a second obtaining module 52, configured to obtain a second coordinate difference between a center of a second optical system and a center of the preset calibration plate, where the preset calibration plate moves from the field of view of the first optical system to the field of view of the second optical system according to the preset process trajectory;
and the determining module 53 is configured to determine a distance and an included angle between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference, so that the chip mounting device can calibrate a chip position according to the distance and the included angle.
Specifically, in the foregoing embodiment of the present invention, the first obtaining module 51 includes:
the first acquisition submodule is used for acquiring a first coordinate of the center of the first optical system in a preset three-dimensional coordinate system;
the second obtaining submodule is used for obtaining a second coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the first optical system;
and the first determining submodule is used for determining the first coordinate difference according to the first coordinate and the second coordinate.
Specifically, in the foregoing embodiment of the present invention, the second obtaining module 52 includes:
the third obtaining submodule is used for obtaining a third coordinate of the center of the second optical system in the preset three-dimensional coordinate system;
the fourth obtaining submodule is used for obtaining a fourth coordinate of the center of the preset calibrating plate in the preset three-dimensional coordinate system, wherein the center of the preset calibrating plate is calibrated by the second optical system;
and the second determining submodule is used for determining the second coordinate difference according to the third coordinate and the fourth coordinate.
Specifically, in the above embodiment of the present invention, the first optical system includes an industrial camera, a zoom or constant magnification lens having one end connected to the industrial camera, and a turning prism connected to the other end of the lens;
the second optical system comprises an industrial camera and a zoom or fixed-magnification lens connected with the industrial camera; wherein,
when the preset calibration plate is in the field of view of the first optical system, the center of the preset calibration plate is calibrated by the first optical system by adjusting the position of the turning prism;
when the preset calibration plate is in the field of view of the second optical system, the center of the preset calibration plate is calibrated by the second optical system by adjusting the positions of the lens and the industrial camera.
Specifically, in the above embodiment of the present invention, a lens is disposed between the second optical system and the preset calibration plate, and the calibration of the second optical system to the center of the preset calibration plate is achieved by adjusting the position of the lens.
Specifically, in the foregoing embodiment of the present invention, the determining module 53 includes:
a third determining submodule for determining a coordinate difference between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference; wherein,
the coordinate difference includes: the distance between the first optical system and the second optical system in the X-axis direction of the preset three-dimensional coordinate system, the distance between the second optical system and the second optical system in the Y-axis direction of the preset three-dimensional coordinate system, and the included angle between the first optical system and the second optical system and the Z-axis of the preset three-dimensional coordinate system are determined.
The position calibration device in the embodiment of the invention is arranged on the chip mounting mechanism, calibrates the chip alignment position and the substrate mounting position before the equipment process production, corrects the obtained deviation and meets the requirement of high-precision chip mounting. Specifically, the device realizes high-resolution and high-precision identification and positioning of two different positions after picking up a chip and before mounting a substrate, accurately calibrates the distance and the included angle of two optical systems by a related calibration method, accurately calibrates the chip again by an upward-looking optical system in the high-precision aligned optical system after picking up the chip, accurately aligns the substrate mounting position by a downward-looking optical system, and finishes mounting the chip according to the distance and the angle value obtained by the calibration method, thereby realizing high-precision mounting of the chip.
It should be noted that, the position calibration apparatus provided in the embodiments of the present invention is an apparatus applying the above position calibration method, and all embodiments of the above method are applicable to the apparatus and can achieve the same or similar beneficial effects.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A position calibration method is applied to a chip mounting device and is characterized by comprising the following steps:
acquiring a first coordinate difference between the center of a first optical system and the center of a preset calibration plate, wherein the preset calibration plate moves to the field of view of the first optical system according to a preset process track;
acquiring a second coordinate difference between the center of a second optical system and the center of a preset calibration plate, wherein the preset calibration plate moves from the view field of the first optical system to the view field of the second optical system according to the preset process track;
determining the distance and the included angle between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference, so that the chip mounting equipment can realize the calibration of the chip position according to the distance and the included angle;
the obtaining of the first coordinate difference between the center of the first optical system and the center of the preset calibration plate specifically includes:
acquiring a first coordinate of the center of the first optical system in a preset three-dimensional coordinate system;
acquiring a second coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the first optical system;
determining the first coordinate difference according to the first coordinate and the second coordinate;
wherein, the obtaining a second coordinate difference between the center of the second optical system and the center of the preset calibration plate specifically includes:
acquiring a third coordinate of the center of the second optical system in the preset three-dimensional coordinate system;
acquiring a fourth coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the second optical system;
and determining the second coordinate difference according to the third coordinate and the fourth coordinate.
2. The method of position calibration according to claim 1, wherein the first optical system comprises an industrial camera, a zoom or constant magnification lens connected with the industrial camera at one end and a turning prism connected with the other end of the lens;
the second optical system comprises an industrial camera and a zoom or fixed-magnification lens connected with the industrial camera; wherein,
when the preset calibration plate is in the field of view of the first optical system, the center of the preset calibration plate is calibrated by the first optical system by adjusting the position of the turning prism;
when the preset calibration plate is in the field of view of the second optical system, the center of the preset calibration plate is calibrated by the second optical system by adjusting the positions of the lens and the industrial camera.
3. The method according to claim 2, wherein a lens is disposed between the second optical system and the preset calibration plate, and the calibration of the center of the preset calibration plate by the second optical system is achieved by adjusting the position of the lens.
4. The method according to claim 1, wherein the determining the distance and the included angle between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference specifically includes:
determining a coordinate difference between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference; wherein,
the coordinate difference includes: the distance between the first optical system and the second optical system in the X-axis direction of the preset three-dimensional coordinate system, the distance between the second optical system and the second optical system in the Y-axis direction of the preset three-dimensional coordinate system, and the included angle between the first optical system and the second optical system and the Z-axis of the preset three-dimensional coordinate system are determined.
5. A position calibration device is applied to a piece mounting device and is characterized by comprising:
the system comprises a first acquisition module, a second acquisition module and a third acquisition module, wherein the first acquisition module is used for acquiring a first coordinate difference between the center of a first optical system and the center of a preset calibration plate, and the preset calibration plate moves to the field of view of the first optical system according to a preset process track;
the second acquisition module is used for acquiring a second coordinate difference between the center of a second optical system and the center of the preset calibration plate, wherein the preset calibration plate moves from the view field of the first optical system to the view field of the second optical system according to the preset process track;
the determining module is used for determining the distance and the included angle between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference, so that the chip mounting equipment can realize the calibration of the chip position according to the distance and the included angle;
wherein the first obtaining module comprises:
the first acquisition submodule is used for acquiring a first coordinate of the center of the first optical system in a preset three-dimensional coordinate system;
the second obtaining submodule is used for obtaining a second coordinate of the center of the preset calibration plate in the preset three-dimensional coordinate system, wherein the center of the preset calibration plate is calibrated by the first optical system;
the first determining submodule is used for determining the first coordinate difference according to the first coordinate and the second coordinate;
wherein the second obtaining module comprises:
the third obtaining submodule is used for obtaining a third coordinate of the center of the second optical system in the preset three-dimensional coordinate system;
the fourth obtaining submodule is used for obtaining a fourth coordinate of the center of the preset calibrating plate in the preset three-dimensional coordinate system, wherein the center of the preset calibrating plate is calibrated by the second optical system;
and the second determining submodule is used for determining the second coordinate difference according to the third coordinate and the fourth coordinate.
6. The apparatus for position calibration according to claim 5, wherein the first optical system comprises an industrial camera, a zoom or constant magnification lens connected with the industrial camera at one end and a turning prism connected with the other end of the lens;
the second optical system comprises an industrial camera and a zoom or fixed-magnification lens connected with the industrial camera; wherein,
when the preset calibration plate is in the field of view of the first optical system, the center of the preset calibration plate is calibrated by the first optical system by adjusting the position of the turning prism;
when the preset calibration plate is in the field of view of the second optical system, the center of the preset calibration plate is calibrated by the second optical system by adjusting the positions of the lens and the industrial camera.
7. The apparatus according to claim 6, wherein a lens is disposed between the second optical system and the pre-calibration plate, and the calibration of the center of the pre-calibration plate by the second optical system is achieved by adjusting the position of the lens.
8. The apparatus for position calibration according to claim 5, wherein the determining module comprises:
a third determining submodule for determining a coordinate difference between the first optical system and the second optical system according to the first coordinate difference and the second coordinate difference; wherein,
the coordinate difference includes: the distance between the first optical system and the second optical system in the X-axis direction of the preset three-dimensional coordinate system, the distance between the second optical system and the second optical system in the Y-axis direction of the preset three-dimensional coordinate system, and the included angle between the first optical system and the second optical system and the Z-axis of the preset three-dimensional coordinate system are determined.
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| CN201410822825.1A CN105783710B (en) | 2014-12-24 | 2014-12-24 | A kind of method and device of location position |
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| CN201410822825.1A CN105783710B (en) | 2014-12-24 | 2014-12-24 | A kind of method and device of location position |
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| CN106524910B (en) * | 2016-10-31 | 2018-10-30 | 潍坊路加精工有限公司 | Executing agency's vision alignment method |
| CN108508680B (en) * | 2018-04-10 | 2020-08-04 | 珠海博明视觉科技有限公司 | Method for aligning center of calibration plate of camera module automatic focusing device with center of photosensitive chip |
| CN110111383B (en) * | 2018-05-08 | 2022-03-18 | 广东聚华印刷显示技术有限公司 | Glass substrate offset correction method, device and system |
| CN109061672B (en) * | 2018-09-04 | 2020-08-07 | 南京牧镭激光科技有限公司 | Angle measuring method and system |
| CN111121743B (en) * | 2018-10-30 | 2023-11-24 | 阿里巴巴集团控股有限公司 | Position calibration method and device and electronic equipment |
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