CN111751713A - Chip high-temperature testing device and method - Google Patents
Chip high-temperature testing device and method Download PDFInfo
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- CN111751713A CN111751713A CN202010806909.1A CN202010806909A CN111751713A CN 111751713 A CN111751713 A CN 111751713A CN 202010806909 A CN202010806909 A CN 202010806909A CN 111751713 A CN111751713 A CN 111751713A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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Abstract
The invention relates to the technical field of semiconductors and discloses a high-temperature chip testing device and a high-temperature chip testing method. According to the chip high-temperature testing device and method, the chip product is accurately positioned firstly under the high-temperature environment state through the high-temperature heating control method, the high-temperature heat insulation material, the accurate positioning method of the chip and the reasonable structural arrangement of the testing mechanism, then the chip is electrically tested, so that the performance of the electronic element device is detected, and meanwhile, the chip contact is subjected to high-speed accurate contact testing through the high-speed accurate positioning method of the chip and the testing mechanism.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a device and a method for testing a chip at a high temperature.
Background
In order to test electronic components required by automobile electronic products, the electrical parameters of the products are tested under the environment state of high temperature (30-170 ℃) so as to detect the excellent performance of the electronic components. Under the high-temperature environment, the high-temperature heating control method, the high-temperature heat insulation material, the accurate positioning method of the chip and the reasonable structural arrangement of the testing mechanism have higher requirements. The traditional method is a manual or automatic mode, after a chip is heated, the chip is subjected to electrical parameter test and inspection, so that the error of test and detection temperature is large, the error of test performance parameters of electronic elements on a production vehicle is large, the production efficiency is low, the yield of finished products is low, and the actual production cost is high. However, the equipment price of the normal-high temperature integrated machine imported from abroad is high, the early investment of middle and small enterprises is large, and the development of the enterprises is severely restricted.
Therefore, a device and a method for testing a chip at a high temperature are provided to solve the above technical problems.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a device and a method for testing the high temperature of a chip, which are used for solving the technical problems.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a high-temperature chip testing device and a high-temperature chip testing method comprise a carrying disc support device, wherein a high-temperature testing mechanism is fixedly mounted on one side of the bottom end of the carrying disc support device, a carrying disc heating device is fixedly mounted on one side of the top end of the carrying disc support device, and a high-temperature positioning mechanism is arranged above the carrying disc heating device.
The tray support device comprises a bottom connecting plate, supporting guide rod columns are fixedly arranged on both sides of the top end of the bottom connecting plate, a horizontal adjusting plate is arranged on the outer side of the bottom end of the supporting guide rod column, the horizontal adjusting plate and the bottom connecting plate are fixedly installed through a horizontal adjusting bolt, the front surface of the level adjusting plate is provided with a test seat for in-place detection, the top end of the support guide rod column is fixedly provided with a top connecting plate, the top end of the top connecting plate is fixedly provided with a bottom heat insulation plate, the top end of the bottom heat insulation plate is fixedly provided with a side heat insulation plate, a left heat insulation plate and a right heat insulation plate are respectively arranged at the two sides of the top end of the bottom heat insulation plate, a heat insulation cover bracket is arranged above the bottom heat insulation plate, the heat shield support is characterized in that a turnover outer cover is arranged above the heat shield support, a front outer cover is arranged on the back face of the turnover outer cover, and the turnover outer cover is fixedly connected with the heat shield support in a limiting mode through a turnover cover.
The high-temperature testing mechanism comprises an XY adjusting base, a supporting connecting frame is arranged at the top end of the XY adjusting base, a testing lifting cylinder is arranged on the side surface of the supporting connecting frame, a cylinder transmission connecting rod is arranged at the top end of the testing lifting cylinder, a cylinder floating joint is fixedly arranged at the other end of the cylinder transmission connecting rod, a lifting tension spring is arranged on the front surface of the supporting connecting frame, a mechanism lifting slide rail is arranged on the side surface of the supporting connecting frame, a slide rail connecting plate is arranged on the side surface of the mechanism lifting slide rail, a direct-drive voice coil motor is fixedly connected to the other side of the slide rail connecting plate, a motor output push rod is arranged at the top end of the direct-drive voice coil motor, a bearing connecting seat is arranged at the other end of the motor output push rod, a lifting connecting rod seat is arranged at the top, and a chip carrying disc device is arranged at the top end of the test connection PCB.
The high-temperature positioning mechanism comprises a mechanism mounting base, an XY fine adjustment mechanism is fixedly mounted at the top end of the mechanism mounting base, a motor mounting plate is fixedly mounted at the top end of the XY fine adjustment mechanism, a downward pressing slide rail mounting block is fixedly mounted on the side surface of the mechanism mounting base, a downward pressing slide rail mounting block is arranged on the side surface of the mechanism mounting base, a spring positioning block is arranged at the bottom end of the downward pressing slide rail mounting block, a cam tensioning spring is fixedly connected to one side of the top end of the spring positioning block, a downward pressing linear slide rail is arranged on the side surface of the downward pressing slide rail mounting block, a transmission cam follower is arranged on the other side of the downward pressing linear slide rail, a downward pressing tension adjusting bolt is arranged on the side surface of the transmission cam follower, a downward pressing tension spring is fixedly connected to the bottom end of the downward pressing tension adjusting bolt, a tension overload slide rail is fixedly connected, the other end of the overload slide rail connecting piece is fixedly provided with an ejector pin tensioning spring, the bottom end of the ejector pin tensioning spring is fixedly provided with a positioning pin connecting piece, two sides of the bottom end of the positioning pin connecting piece are both fixedly provided with carrier plate positioning pins, a chip pressing ejector pin is arranged between the carrier plate positioning pins, and the back surface of the overload slide rail connecting piece is provided with an overload detection sensor.
Preferably, the top fixed mounting of upset dustcoat has the handle, the top of upset dustcoat openly is provided with the dustcoat fixed plate, pass through loose leaf swing joint between dustcoat fixed plate and the upset dustcoat.
Preferably, a test golden finger is fixedly installed on one side of the top end of the test connection PCB, and a test piece pressing block is fixedly installed on the top end of the test golden finger.
Preferably, a tension spring is fixedly installed on the front surface of the bearing coupling seat, a tension spring hook is fixedly connected to the other end of the tension spring, the tension spring hook is fixedly installed on the front surface of the bearing coupling seat, a limiting buffer rubber pad is installed on one side of the top end of the bearing coupling seat, and a linear bearing is installed on the other side of the top end of the bearing coupling seat.
Preferably, one side of the top end of the motor mounting plate is fixedly provided with a servo motor, one side of the bottom end of the motor mounting plate is fixedly provided with a cam positioning bearing, and the bottom end of the cam positioning bearing is fixedly provided with a rotary end face cam.
A chip high-temperature test method comprises the following steps:
firstly, putting the chip into a chip tray carrying device with a positioning reverse mould through a front-stage process.
And step two, the chip tray carrying device is used for carrying out test in the tray carrying heating device after the product is fully heated in the former process.
Thirdly, the high-temperature positioning mechanism rotates at a high speed through a servo motor, so that the cam pushes the cam follower to do vertical downward linear motion under the guiding action of the linear slide rail, and the positioning pin on the mechanism performs positioning correction on the corresponding positioning pin hole in the chip carrying disc device, thereby ensuring the position consistency of each chip. The positioning pin of the mechanism is provided with a pressure buffering device, and when the positioning pin is not aligned with the positioning hole of the carrying disc, a position sensor of the mechanism can detect and give an alarm for prompting.
And fourthly, the high-temperature testing mechanism carries out high-speed accurate contact test with a chip product contact through a golden finger on a PCB (printed circuit board) connected with a tester line under the thrust action of the voice coil motor, and because the voice coil motor is provided with strength size control, the problem of forced overload pressure deformation of pins of the chip product under a high-speed state is avoided.
Compared with the prior art, the invention provides a device and a method for testing the high temperature of a chip, which have the following beneficial effects:
1. according to the chip high-temperature testing device and method, the chip product is accurately positioned firstly under the high-temperature environment state through the high-temperature heating control method, the high-temperature heat insulation material, the accurate positioning method of the chip and the reasonable structural arrangement of the testing mechanism, then the chip is electrically tested, so that the performance of the electronic element device is detected, and meanwhile, the chip contact is subjected to high-speed accurate contact testing through the high-speed accurate positioning method of the chip and the testing mechanism.
2. By implementing the device and the method for testing the chip high temperature, the testing performance of the electronic element on the production vehicle is detected, so that the device and the method realize small high temperature error and small testing performance parameter error of the electronic element, save labor and improve the production efficiency.
3. The chip high-temperature testing device and the method have the advantages that the production and manufacturing cost is lower than that of foreign equipment in the aspect of equipment cost, the device and the method can be suitable for the fund bearing range of small and medium-sized manufacturing enterprises, and the development and production extension requirements of the small and medium-sized enterprises are facilitated
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
FIG. 2 is a schematic front view of the structure of the present invention;
FIG. 3 is an exploded view of the structure of the present invention;
FIG. 4 is a schematic view of a structure of a tray support apparatus according to the present invention;
FIG. 5 is a perspective view of the high temperature testing mechanism of the present invention;
FIG. 6 is a front view of the high temperature test mechanism of the present invention;
FIG. 7 is a perspective view of the high temperature positioning mechanism of the present invention;
FIG. 8 is a perspective view of the chip tray device according to the present invention.
Wherein: 100. a tray support device; 200. a high temperature testing mechanism; 300. a carrier plate heating device; 400. a high temperature positioning mechanism; 110. a bottom coupling plate; 120. supporting the guide rod column; 130. a level adjustment plate; 131. detecting the test seat in place; 140. a horizontal adjusting bolt; 150. a top coupling plate; 160. a bottom heat insulation plate; 161. side heat insulation plates; 162. a left insulation board; 163. a right insulating board; 170. a heat shield support; 180. turning over the outer cover; 181. a handle; 182. an outer cover fixing plate; 183. a loose leaf; 190. a front face housing; 191. limiting the turnover cover; 210. an XY adjustment base; 220. a support coupling frame; 221. a lifting tension spring; 222. the mechanism lifts the slide rail; 223. a slide rail coupling plate; 230. testing a lifting cylinder; 231. a cylinder drive link; 232. a cylinder floating joint; 240. a direct drive voice coil motor; 241. a motor output push rod; 250. a bearing coupling seat; 251. a tension spring; 252. tensioning the spring hook; 253. a limiting buffer rubber cushion; 254. a linear bearing; 260. a lifting link base; 270. testing the connection PCB; 271. testing the golden finger; 272. pressing the test piece into a block; 280. a chip tray carrying device; 410. a mechanism mounting base; 420. an XY fine adjustment mechanism; 430. a motor mounting plate; 431. a servo motor; 432. a cam positioning bearing; 433. rotating the end cam; 440. pressing down the slide rail mounting block; 441. a spring positioning block; 442. a cam tensioning spring; 443. pressing down the linear slide rail; 444. a drive cam follower; 445. pressing down the tension adjusting bolt; 446. pressing down the tension spring; 447. a tension overload slide rail; 448. an overload slide rail coupling member; 449. an overload detection sensor; 450. the thimble tensions the spring; 451. a locating pin coupling member; 452. a carrier positioning pin; 453. the chip compresses tightly the thimble.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 8, a device and a method for testing a chip at a high temperature include a tray support device 100, a high temperature testing mechanism 200 is fixedly installed at one side of a bottom end of the tray support device 100, a tray heating device 300 is fixedly installed at one side of a top end of the tray support device 100, and a high temperature positioning mechanism 400 is installed above the tray heating device 300.
The tray support device 100 comprises a bottom connecting plate 110, supporting guide rod columns 120 are fixedly mounted on two sides of the top end of the bottom connecting plate 110, a level adjusting plate 130 is arranged on the outer side of the bottom end of each supporting guide rod column 120, the level adjusting plate 130 and the bottom connecting plate 110 are fixedly mounted through a level adjusting bolt 140, a test seat in-place detection 131 is arranged on the front surface of the level adjusting plate 130, a top connecting plate 150 is fixedly mounted on the top end of each supporting guide rod column 120, a bottom heat insulation plate 160 is fixedly mounted on the top end of the top connecting plate 150, a side heat insulation plate 161 is fixedly mounted on the top end of the bottom heat insulation plate 160, a left heat insulation plate 162 and a right heat insulation plate 163 are respectively mounted on two sides of the top end of the bottom heat insulation plate 160, a heat insulation cover support 170 is arranged above the bottom heat insulation plate 160, an overturning outer cover 180 is arranged above the heat insulation cover support 170, a front.
The high-temperature testing mechanism 200 comprises an XY adjusting base 210, a supporting connecting frame 220 is arranged at the top end of the XY adjusting base 210, a testing lifting cylinder 230 is arranged on the side surface of the supporting connecting frame 220, a cylinder transmission connecting rod 231 is arranged at the top end of the testing lifting cylinder 230, a cylinder floating joint 232 is fixedly arranged at the other end of the cylinder transmission connecting rod 231, a lifting tension spring 221 is arranged on the front surface of the supporting connecting frame 220, a mechanism lifting slide rail 222 is arranged on the side surface of the supporting connecting frame 220, a slide rail connecting plate 223 is arranged on the side surface of the mechanism lifting slide rail 222, a direct-drive voice coil motor 240 is fixedly connected to the other side of the slide rail connecting plate 223, a motor output push rod 241 is arranged at the top end of the direct-drive voice coil motor 240, a bearing connecting seat 250 is arranged at the other end of the motor push rod 241, a lifting, the top end of the test connection PCB board 270 is mounted with a chip tray unit 280.
The high-temperature positioning mechanism 400 comprises a mechanism mounting base 410, an XY fine adjustment mechanism 420 is fixedly mounted at the top end of the mechanism mounting base 410, a motor mounting plate 430 is fixedly mounted at the top end of the XY fine adjustment mechanism 420, a downward-pressing slide rail mounting block 440 is fixedly mounted on the side surface of the mechanism mounting base 410, a downward-pressing slide rail mounting block 440 is fixedly mounted on the lower side of the mechanism mounting base 440, a spring positioning block 441 is arranged at the bottom end of the downward-pressing slide rail mounting block 440, a cam tensioning spring 442 is fixedly connected to one side of the top end of the spring positioning block 441, a downward-pressing linear slide rail 443 is arranged on the side surface of the downward-pressing slide rail mounting block 440, a transmission cam follower 444 is arranged on the other side of the downward-pressing linear slide rail 443, a downward-pressing tension adjusting bolt 445 is arranged on the side surface of the transmission cam follower 444, a downward-pressing tension spring 446 is fixedly connected to the, a thimble tensioning spring 450 is fixedly mounted at the other end of the overload slide rail connector 448, a positioning pin connector 451 is fixedly mounted at the bottom end of the thimble tensioning spring 450, carrier disc positioning pins 452 are fixedly mounted at both sides of the bottom end of the positioning pin connector 451, a chip pressing thimble 453 is arranged between the carrier disc positioning pins 452, and an overload detection sensor 449 is arranged on the back of the overload slide rail connector 448.
Specifically, a handle 181 is fixedly mounted at the top end of the turnover outer cover 180, an outer cover fixing plate 182 is arranged on the front side of the top end of the turnover outer cover 180, and the outer cover fixing plate 182 is movably connected with the turnover outer cover 180 through a flap 183.
Specifically, a test golden finger 271 is fixedly mounted on one side of the top end of the test connecting PCB 270, and a test piece pressing block 272 is fixedly mounted on the top end of the test golden finger 271.
Specifically, a tension spring 251 is fixedly installed on the front surface of the bearing coupling seat 250, the other end of the tension spring 251 is fixedly connected with a tension spring hook 252, the tension spring hook 252 is fixedly installed on the front surface of the bearing coupling seat 250, a limit buffer rubber pad 253 is installed on one side of the top end of the bearing coupling seat 250, and a linear bearing 254 is installed on the other side of the top end of the bearing coupling seat 250.
Specifically, a servo motor 431 is fixedly mounted on one side of the top end of the motor mounting plate 430, a cam positioning bearing 432 is fixedly mounted on one side of the bottom end of the motor mounting plate 430, and a rotary end cam 433 is fixedly mounted on the bottom end of the cam positioning bearing 432.
A chip high-temperature test method comprises the following steps:
first, the chip is placed into a chip tray 280 having a positioning cavity by a front stage process.
And secondly, after the chip tray loading device 280 fully heats the product in the front-stage process, the product is tested in the tray loading heating device 300.
Thirdly, the high temperature positioning mechanism 400 rotates at a high speed through the servo motor 431, so that the cam pushes the cam follower to make vertical and downward linear motion under the guiding action of the linear slide rail, and the positioning pins on the mechanism perform positioning correction on the corresponding positioning pin holes in the chip tray loading device 280, thereby ensuring that the positions of all chips are consistent. The positioning pin of the mechanism is provided with a pressure buffering device, and when the positioning pin is not aligned with the positioning hole of the carrying disc, a position sensor of the mechanism can detect and give an alarm for prompting.
And fourthly, the high-temperature testing mechanism 200 carries out high-speed accurate contact test with a chip product contact through a golden finger on a PCB (printed circuit board) connected with a tester line under the thrust action of the voice coil motor, and avoids the problem of forced overload pressure deformation of pins of the chip product under a high-speed state because the voice coil motor is controlled by strength.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A chip high-temperature testing device and method comprises a carrying disc support device (100), and is characterized in that: a high-temperature testing mechanism (200) is fixedly mounted on one side of the bottom end of the disc-carrying support device (100), a disc-carrying heating device (300) is fixedly mounted on one side of the top end of the disc-carrying support device (100), and a high-temperature positioning mechanism (400) is arranged above the disc-carrying heating device (300);
the tray carrying support device (100) comprises a bottom connecting plate (110), supporting guide rod columns (120) are fixedly installed on two sides of the top end of the bottom connecting plate (110), a horizontal adjusting plate (130) is arranged on the outer side of the bottom end of each supporting guide rod column (120), the horizontal adjusting plate (130) and the bottom connecting plate (110) are fixedly installed through a horizontal adjusting bolt (140), a testing seat in-place detection seat (131) is arranged on the front surface of the horizontal adjusting plate (130), a top connecting plate (150) is fixedly installed on the top end of each supporting guide rod column (120), a bottom heat insulating plate (160) is fixedly installed on the top end of each top connecting plate (150), a side heat insulating plate (161) is fixedly installed on the top end of each bottom heat insulating plate (160), and a left heat insulating plate (162) and a right heat insulating plate (163) are respectively installed on two sides of the, a heat shield support (170) is arranged above the bottom heat shield (160), a turnover outer cover (180) is arranged above the heat shield support (170), a front outer cover (190) is arranged on the back of the turnover outer cover (180), and the turnover outer cover (180) is fixedly connected with the heat shield support (170) through a turnover cover limiting position (191);
the high-temperature testing mechanism (200) comprises an XY adjusting base (210), a supporting connecting frame (220) is arranged at the top end of the XY adjusting base (210), a testing lifting cylinder (230) is arranged on the side surface of the supporting connecting frame (220), a cylinder transmission connecting rod (231) is arranged at the top end of the testing lifting cylinder (230), a cylinder floating joint (232) is fixedly arranged at the other end of the cylinder transmission connecting rod (231), a lifting tension spring (221) is arranged on the front surface of the supporting connecting frame (220), a mechanism lifting slide rail (222) is arranged on the side surface of the supporting connecting frame (220), a slide rail connecting plate (223) is arranged on the side surface of the mechanism lifting slide rail (222), a voice coil direct-drive motor (240) is fixedly connected to the other side of the slide rail connecting plate (223), and a motor output push rod (241) is arranged at the top end, the other end of the motor output push rod (241) is provided with a bearing connecting seat (250), the top end of the bearing connecting seat (250) is provided with a lifting connecting rod seat (260), the top end of the lifting connecting rod seat (260) is fixedly connected with a test connecting PCB (270), and the top end of the test connecting PCB (270) is provided with a chip tray loading device (280);
the high-temperature positioning mechanism (400) comprises a mechanism mounting base (410), an XY fine adjustment mechanism (420) is fixedly mounted at the top end of the mechanism mounting base (410), a motor mounting plate (430) is fixedly mounted at the top end of the XY fine adjustment mechanism (420), a downward pressing slide rail mounting block (440) is fixedly mounted on the side face of the mechanism mounting base (410), the downward pressing slide rail mounting block (440) is arranged at the bottom end of the downward pressing slide rail mounting block (440) and is provided with a spring positioning block (441), a cam tensioning spring (442) is fixedly connected to one side of the top end of the spring positioning block (441), a downward pressing linear slide rail (443) is arranged on the side face of the downward pressing slide rail mounting block (440), a transmission cam follower (444) is arranged on the other side of the downward pressing linear slide rail (443), and a downward pressing tension adjusting bolt (445) is arranged on the side face of the, the bottom fixedly connected with of pushing down tension adjusting bolt (445) pushes down tension spring (446), the other end fixedly connected with tension of pushing down tension spring (446) transships slide rail (447), the other end fixedly connected with of tension transships slide rail (447) transships slide rail coupling piece (448), the other end fixed mounting of transshipping slide rail coupling piece (448) has thimble tensioning spring (450), the bottom fixed mounting of thimble tensioning spring (450) has locating pin coupling piece (451), the equal fixed mounting in bottom both sides of locating pin coupling piece (451) has year dish locating pin (452), it compresses tightly thimble (453) to be provided with the chip between year dish locating pin (452), the back of transshipping slide rail coupling piece (448) is provided with overload detection sensor (449).
2. The device and the method for testing the high temperature of the chip according to claim 1, wherein: the handle (181) is fixedly installed at the top end of the turnover outer cover (180), an outer cover fixing plate (182) is arranged on the front face of the top end of the turnover outer cover (180), and the outer cover fixing plate (182) is movably connected with the turnover outer cover (180) through a movable leaf (183).
3. The device and the method for testing the high temperature of the chip according to claim 1, wherein: a test gold finger (271) is fixedly installed on one side of the top end of the test connection PCB (270), and a test piece pressing block (272) is fixedly installed on the top end of the test gold finger (271).
4. The device and the method for testing the high temperature of the chip according to claim 1, wherein: the front surface of the bearing coupling seat (250) is fixedly provided with a tension spring (251), the other end of the tension spring (251) is fixedly connected with a tension spring hook (252), the tension spring hook (252) is fixedly arranged on the front surface of the bearing coupling seat (250), one side of the top end of the bearing coupling seat (250) is provided with a limiting buffer rubber pad (253), and the other side of the top end of the bearing coupling seat (250) is provided with a linear bearing (254).
5. The device and the method for testing the high temperature of the chip according to claim 1, wherein: the servo motor (431) is fixedly mounted on one side of the top end of the motor mounting plate (430), the cam positioning bearing (432) is fixedly mounted on one side of the bottom end of the motor mounting plate (430), and the rotary end face cam (433) is fixedly mounted on the bottom end of the cam positioning bearing (432).
6. The method for testing the chip at the high temperature according to claim 1, wherein the method comprises the following steps: the method comprises the following steps:
s1, placing the chip into the chip tray 280 having positioning and reverse mold through the previous step.
S2, the chip tray loading device (280) heats the product fully in the front stage, and then the test is carried out in the tray loading heating device 300.
S3, the high-temperature positioning mechanism 400 rotates at high speed through the servo motor 431, so that the cam pushes the cam follower to make vertical and downward linear motion under the guiding action of the linear slide rail, and the positioning pins on the mechanism perform positioning correction on the corresponding positioning pin holes in the chip tray loading device 280, thereby ensuring the position consistency of each chip. The positioning pin of the mechanism is provided with a pressure buffering device, and when the positioning pin is not aligned with the positioning hole of the carrying disc, a position sensor of the mechanism can detect and give an alarm for prompting.
S4, the high temperature testing mechanism 200, under the thrust action of the voice coil motor, through the golden finger on the PCB connected by the tester line, carries out high-speed accurate contact test with the chip product contact, because the voice coil motor has strength control, the problem of forced overload pressure deformation to the pin of the chip product under the high-speed state is avoided.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010806909.1A CN111751713B (en) | 2020-08-12 | 2020-08-12 | Chip high-temperature testing device and method |
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| CN202010806909.1A CN111751713B (en) | 2020-08-12 | 2020-08-12 | Chip high-temperature testing device and method |
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| CN111751713A true CN111751713A (en) | 2020-10-09 |
| CN111751713B CN111751713B (en) | 2024-04-26 |
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| CN113820593A (en) * | 2021-11-22 | 2021-12-21 | 深圳市诺泰芯装备有限公司 | SOIC encapsulation high temperature test device |
| CN114496866A (en) * | 2022-01-20 | 2022-05-13 | 无锡昌鼎电子有限公司 | Chip constant temperature carries a set mechanism |
| CN114791558A (en) * | 2022-04-27 | 2022-07-26 | 泉州兰姆达仪器设备有限公司 | A laser chip test bench mechanism and its working method |
| CN116106722A (en) * | 2022-12-19 | 2023-05-12 | 上海赢朔电子科技股份有限公司 | Chip high-low temperature test machine |
| CN118584307A (en) * | 2024-08-05 | 2024-09-03 | 华恒半导体设备(苏州)有限公司 | New semiconductor clamp test station |
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| CN113820593A (en) * | 2021-11-22 | 2021-12-21 | 深圳市诺泰芯装备有限公司 | SOIC encapsulation high temperature test device |
| CN114496866A (en) * | 2022-01-20 | 2022-05-13 | 无锡昌鼎电子有限公司 | Chip constant temperature carries a set mechanism |
| CN114496866B (en) * | 2022-01-20 | 2023-03-28 | 无锡昌鼎电子有限公司 | Chip constant temperature carries a set mechanism |
| CN114791558A (en) * | 2022-04-27 | 2022-07-26 | 泉州兰姆达仪器设备有限公司 | A laser chip test bench mechanism and its working method |
| CN116106722A (en) * | 2022-12-19 | 2023-05-12 | 上海赢朔电子科技股份有限公司 | Chip high-low temperature test machine |
| CN116106722B (en) * | 2022-12-19 | 2023-12-15 | 上海赢朔电子科技股份有限公司 | Chip high-low temperature test machine |
| CN118584307A (en) * | 2024-08-05 | 2024-09-03 | 华恒半导体设备(苏州)有限公司 | New semiconductor clamp test station |
| CN118584307B (en) * | 2024-08-05 | 2025-02-18 | 华恒半导体设备(苏州)有限公司 | New semiconductor clamp test station |
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