CN110190048B - Flip chip COB light source module with UV solidified purple light and common light source - Google Patents

Abstract

The present invention relates to a flip-chip COB light source module with UV curing purple light and ordinary light source, comprising a substrate and a plurality of LEDs, wherein each LED comprises at least one white light LED and at least one purple light LED, wherein the white light LED comprises an illumination LED chip fixed on the substrate and a phosphor layer attached to the illumination LED chip, and the purple light LED comprises a purple light LED chip fixed on the substrate. The flip-chip COB light source module has both illumination function and UV curing function, effectively expanding the application scope of the flip-chip COB light source module. Further, each purple light LED can be arranged in an annular illumination band formed by each white light LED. Compared with the layout of arranging each purple light LED on the periphery of the annular illumination band or arranging the purple light LED and the white light LED alternately, arranging each purple light LED in a concentrated manner on the inner side of the annular illumination band can make the purple light more focused, effectively improve the curing speed of the UV glue, and reduce the number of purple light LEDs, so it can be better suitable for the small volume of the flip-chip COB light source.

Description

Flip-chip COB light source module with UV curing purple light and ordinary light source

Technical Field

The invention belongs to the technical field of lighting, and in particular relates to a flip-chip COB light source module with UV-curing purple light and a common light source.

Background Art

COB light source is a high-efficiency integrated surface light source that directly attaches LED chips to a high-reflectivity mirror metal substrate. This technology eliminates the concept of a bracket and has no electroplating, reflow soldering, or patch processes. Therefore, the number of processes is reduced by nearly one-third and the cost is also saved by one-third.

The flip-chip COB light source is to adhere the bare chip to the interconnect substrate with conductive or non-conductive glue, and then perform wire bonding to achieve its electrical connection. The flip-chip COB light source has the following characteristics:

(1) Voltage: The flip-chip COB light source uses a low-voltage power supply, and the supply voltage is between 6-24V, which varies according to the product, so it is a safer power supply than using a high-voltage power supply, especially suitable for public places;

(2) Efficiency: Energy consumption is 80% less than that of an incandescent lamp with the same luminous efficacy;

(3) Applicability: Each unit flip-chip COB light source chip is 3-5 mm square, so it can be made into devices of various shapes and is applicable to a wide range of environments;

(4) Stability: 100,000 hours, light decay is 50% of the initial value;

(5) Response time: The response time of an incandescent lamp is in the millisecond level, while the response time of a flip-chip COB light source lamp is in the nanosecond level;

(6) Environmental pollution: no harmful metallic mercury;

(7) Color: Changing the current can change the color. Light-emitting diodes can easily adjust the band structure and band gap of the material through chemical modification methods to achieve red, yellow, green, blue and orange multi-color emission. For example, a flip-chip COB light source that is red at low current can change to orange, yellow, and finally green as the current increases.

(8) Price: The price of flip-chip COB light sources is relatively low. Compared with incandescent lamps, the price of several flip-chip COB light sources can be comparable to that of an incandescent lamp. Usually, each set of signal lights needs to be composed of 300 to 500 diodes.

Although the flip-chip COB light source has the above advantages, the existing light sources have a single function and basically only have the function of ordinary light source lighting, which limits its application scope.

Summary of the invention

The embodiment of the present invention relates to a flip-chip COB light source module with UV-curing purple light and ordinary light source, which can at least solve some defects of the prior art.

An embodiment of the present invention relates to a flip-chip COB light source module with UV-curable purple light and ordinary light source, including a substrate and a plurality of LEDs, each of the LEDs including at least one white light LED and at least one purple light LED, the white light LED including an illumination LED chip fixed on the substrate and a phosphor layer attached to the illumination LED chip, and the purple light LED including a purple light LED chip fixed on the substrate.

As one of the embodiments, there are a plurality of white light LEDs, and the white light LEDs are arranged in a ring to form a ring-shaped lighting belt.

As one of the embodiments, each of the purple LED chips is arranged within the ring of the annular lighting belt.

As one of the embodiments, the annular lighting belt corresponds to an output annular light emitting surface, each of the purple LEDs outputs a circular light emitting surface, and the circular light emitting surface fills the inner ring of the annular light emitting surface.

As one of the embodiments, there are a plurality of lighting LED chips, and the lighting LED chips are connected in parallel.

As one of the embodiments, the power of the white light LED is 10-15W.

As one of the embodiments, there are multiple purple LED chips, and the purple LED chips are connected in parallel.

As one of the embodiments, the power of the purple LED is 5-15W.

As one of the embodiments, a white photoelectric route and a purple photoelectric route are provided on the positive electrode pad of the substrate, the positive electrode of each lighting LED chip is connected to the white photoelectric route, the positive electrode of each purple LED chip is connected to the purple photoelectric route, and the negative electrode of each lighting LED chip and the negative electrode of each purple LED chip share the negative electrode pad of the substrate.

As one of the embodiments, the plate size of the substrate is (17-20) mm×(17-20) mm, and the thickness of the substrate is 0.1-1.5 mm.

The embodiments of the present invention have at least the following beneficial effects:

The flip-chip COB light source module provided by the present invention has white light LEDs and purple light LEDs arranged on a substrate, thereby having both lighting function and UV curing function, thereby effectively expanding the application range of the flip-chip COB light source module.

The embodiments of the present invention further have the following beneficial effects:

The flip-chip COB light source module provided by the present invention arranges each purple LED chip in the annular lighting band formed by each white LED, and the UV curing purple light output by each purple LED is located in the light output surface formed by the annular lighting band. On the one hand, the purple LED and the white LED can be arranged on the substrate at the same time, making full use of the limited space of the substrate to ensure the stable output of the lighting function and the UV curing function; on the other hand, it can achieve a high light source density design and improve the uniformity of light output, ensuring the use effect of the flip-chip COB light source module. Compared with the layout of arranging each purple LED on the periphery of the annular lighting band or arranging the purple LED and the white LED alternately or the number of purple LED and the number of white LED each accounting for half, arranging each purple LED concentratedly on the inner side of the annular lighting band can make the purple light more focused, effectively improve the curing speed of the UV glue, and reduce the number of purple LEDs, so it can be better suitable for the small size of the flip-chip COB light source.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

FIG1 is a schematic structural diagram of a flip-chip COB light source module provided by an embodiment of the present invention;

FIG. 2 is a schematic diagram of a light emitting surface of a flip-chip COB light source module provided in an embodiment of the present invention.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

As shown in Figure 1, an embodiment of the present invention provides a flip-chip COB light source module with UV-curable purple light and ordinary light source, including a substrate 1 and a plurality of LEDs, each of the LEDs including at least one white light LED 2 and at least one purple light LED 3, the white light LED 2 including an illumination LED chip fixed on the substrate 1 and a phosphor layer attached to the illumination LED chip, and the purple light LED 3 including a purple light LED 3 chip fixed on the substrate 1.

Among them, the above-mentioned substrate 1, lighting LED chip, purple light LED3 chip, etc. are all existing components, and the specific structure is not described here.

Generally, the lighting LED chip can be adhered to the substrate 1 by conductive glue or non-conductive glue; the phosphor layer can be coated on the lighting LED chip, and the lighting LED chip and the phosphor layer can cooperate to realize the white light LED 2 to emit white light. This is a conventional technology in the art. For example, the lighting LED chip is a blue light LED chip, which excites the yellow-green phosphor to emit white light. Similarly, the above-mentioned purple light LED 3 chip can be adhered to the substrate 1 by conductive glue or non-conductive glue. Obviously, the lighting LED chip and the purple light LED 3 chip are both flip chips.

The flip-chip COB light source module provided in this embodiment is provided with a white light LED 2 and a purple light LED 3 on a substrate 1, so that it has both lighting function and UV curing function, effectively expanding the application range of the flip-chip COB light source module. For example, in engineering applications, it is often necessary to perform UV glue curing operations in dark pipes, and conventionally, it is necessary to wear a lighting flashlight and a UV curing light source. However, the flip-chip COB light source module provided in this embodiment is integrated into a flashlight or similar device, and only a flashlight or similar device with the flip-chip COB light source module is required, which is convenient for operation.

To further optimize the above embodiment, as shown in FIG. 1 , there are a plurality of white light LEDs 2 , and the white light LEDs 2 are arranged in a ring to form a ring-shaped lighting belt, wherein, as shown in FIG. 2 , the ring-shaped lighting belt corresponds to an output ring-shaped light emitting surface 200 .

Further, as shown in FIG1 , each of the purple LED 3 chips is arranged in the ring of the annular lighting belt. Then, the UV curing purple light output by each purple LED 3 is located in the light output surface formed by the annular lighting belt. Based on the above structure, on the one hand, the purple LED 3 and the white LED 2 can be arranged on the substrate 1 at the same time, and the limited space of the substrate 1 is fully utilized to ensure the stable output of the lighting function and the UV curing function; on the other hand, a high light source density design can be achieved and the light output uniformity can be improved to ensure the use effect of the flip-chip COB light source module; in particular, compared with the layout of arranging each purple LED 3 on the periphery of the annular lighting belt or arranging the purple LED 3 and the white LED 2 alternately or the number of the purple LED 3 and the white LED 2 each accounting for half, arranging each purple LED 3 in a concentrated manner on the inner side of the annular lighting belt can make the purple light more focused, effectively improve the curing speed of the UV glue, and reduce the number of purple LEDs 3, so it can be better suitable for the small size of the flip-chip COB light source.

Further, as shown in Figure 2, each of the purple LEDs 3 outputs a circular light-emitting surface 300, and the circular light-emitting surface 300 fills the inner ring of the annular light-emitting surface 200, that is, the diameter of the circular light-emitting surface 300 is the same as the inner ring diameter of the annular light-emitting surface 200, and the circular light-emitting surface 300 is concentric with the annular light-emitting surface 200, thereby ensuring that the two are perfectly pieced together to maximize the output of both purple light and white light.

Obviously, the shape of the light emitting surface output by the above-mentioned annular lighting belt and the shape of the light emitting surface output by each purple LED 3 are determined by factors such as the corresponding number and arrangement structure of LEDs. Then, the number and arrangement structure of the purple LEDs 3 should ensure that each purple LED 3 combination outputs a circular light emitting surface 300, and the circular light emitting surface 300 should be able to fill the inner ring of the annular light emitting surface 200, as shown in Figure 1. In this embodiment, preferably, 3 purple LEDs 3 are included, and the 3 purple LEDs 3 are arranged in an equilateral triangle. In an optional embodiment, the above-mentioned white light LEDs 2 are 22.

When there are a plurality of the above-mentioned lighting LED chips, the lighting LED chips can be connected in series or in parallel. In this embodiment, the lighting LED chips are connected in parallel.

When there are multiple purple LED 3 chips, the purple LED 3 chips can be connected in series or in parallel. In this embodiment, the purple LED 3 chips are connected in parallel.

In a specific application embodiment, the power of the white light LED 2 is 10 to 15 W; the power of the purple light LED 3 is 5 to 15 W. The application effect of the flip-chip COB light source module is better.

In a specific application embodiment, the surface size of the substrate 1 is (17-20) mm×(17-20) mm, and the thickness of the substrate 1 is 0.1-1.5 mm; for example, the surface size of the substrate 1 is 19 mm×19 mm, and the thickness of the substrate 1 is 1 mm.

In a specific application embodiment, the above-mentioned lighting function and UV curing function are independently controlled and realized, for example, each white light LED 2 is independently powered, and each purple light LED 3 is independently powered. Specifically, as shown in FIG1 , a white photoelectric route and a purple photoelectric route are provided on the positive electrode pad of the substrate 1, and the positive electrode of each lighting LED chip is connected to the white photoelectric route, and the positive electrode of each purple light LED 3 chip is connected to the purple photoelectric route, and the negative electrode of each lighting LED chip and the negative electrode of each purple light LED 3 chip share the negative electrode pad of the substrate 1. During use, the lighting function or the UV curing function can be selected to be used alone according to actual needs, or both can be used at the same time.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides a flip-chip COB light source module with UV solidification purple light and ordinary light source, includes base plate and a plurality of LED, its characterized in that: each LED comprises at least one white light LED and at least one purple light LED, wherein the white light LED comprises an illumination LED chip fixed on the substrate and a fluorescent powder layer attached to the illumination LED chip, and the purple light LED comprises a purple light LED chip fixed on the substrate;

The white light LEDs are multiple, and each white light LED is annularly arranged to form an annular illumination band;

the purple light LED chips are uniformly distributed in the ring of the annular lighting belt;

The annular illumination belt correspondingly outputs an annular light-emitting surface, each purple light LED outputs a circular light-emitting surface, and the circular light-emitting surface is filled with an inner ring of the annular light-emitting surface;

The LED lamp comprises a plurality of LED lamp chips, wherein each LED lamp chip is connected in parallel.

2. The flip chip COB light source module of claim 1 having a UV cured violet light and a common light source, wherein: the power of the white light LED is 10-15W.

3. The flip chip COB light source module of claim 1 having a UV cured violet light and a common light source, wherein: the number of the purple light LED chips is multiple, and the purple light LED chips are connected in parallel.

4. The flip-chip COB light source module of claim 3 having a UV cured violet light and a common light source wherein: the power of the purple light LED is 5-15W.

5. The flip chip COB light source module of claim 1 having a UV cured violet light and a common light source, wherein: the LED lamp comprises a substrate, wherein a white light circuit line and a purple light circuit line are arranged on a positive electrode bonding pad of the substrate, the positive electrode of each illumination LED chip is connected with the white light circuit line, the positive electrode of each purple light LED chip is connected with the purple light circuit line, and the negative electrode of each illumination LED chip and the negative electrode of each purple light LED chip share the negative electrode bonding pad of the substrate.

6. The flip chip COB light source module of claim 1 having a UV cured violet light and a common light source, wherein: the plate surface size of the substrate is (17-20) mm x (17-20) mm, and the thickness of the substrate is 0.1-1.5 mm.