CN205896749U - Full -angle light -emitting LED bulb lamp - Google Patents
Full -angle light -emitting LED bulb lamp Download PDFInfo
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- CN205896749U CN205896749U CN201620709122.2U CN201620709122U CN205896749U CN 205896749 U CN205896749 U CN 205896749U CN 201620709122 U CN201620709122 U CN 201620709122U CN 205896749 U CN205896749 U CN 205896749U
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- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000003466 welding Methods 0.000 claims abstract description 26
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 19
- 239000000084 colloidal system Substances 0.000 claims description 19
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 239000003292 glue Substances 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 description 12
- 239000000843 powder Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及一种球泡灯,尤其是涉及一种全角度发光的LED球泡灯。The utility model relates to a bulb lamp, in particular to an LED bulb lamp emitting light from all angles.
背景技术Background technique
LED 光源是以发光二极管为发光体的光源。LED 光源具有效率高、寿命长等优点,其寿命远长于普通白炽灯。随着国家推行节能减排政策,节能环保的LED产业发展速度加快,生活生产中越来越多的地方用上了LED照明灯。目前替代白炽灯的一种LED光源为灯丝灯,LED灯丝灯的光源由多条交叉排布于球泡内的LED灯丝组成。LED灯丝目前主要采用正装芯片工艺,整个制程需要固晶、焊线、正反面点胶、烘烤等一系列工序。固晶胶的导热系数不理想,焊线良率偏低,点胶一致性差,在球泡组装过程中容易造成灯丝断裂、金线断等系列问题照成整体良率偏低,都是需要解决的问题。每条LED灯丝在生产的时候就确定了各自的色温,在组成球泡时没法做到色温实时可调。即使在同一个球泡中组合采用不同色温的LED灯丝,也难以做到良好的混光。The LED light source is a light source in which light-emitting diodes are used as illuminants. LED light sources have the advantages of high efficiency and long life, and their life is much longer than that of ordinary incandescent lamps. As the country implements energy-saving and emission-reduction policies, the development of the energy-saving and environmentally-friendly LED industry is accelerating, and LED lighting is used in more and more places in life and production. A current LED light source that replaces incandescent lamps is a filament lamp. The light source of an LED filament lamp is composed of multiple LED filaments arranged crosswise in a bulb. Currently, the LED filament mainly adopts the front-mount chip process, and the whole process requires a series of processes such as die bonding, wire bonding, front and back dispensing, and baking. The thermal conductivity of the die-bonding adhesive is not ideal, the yield rate of the bonding wire is low, and the dispensing consistency is poor. During the bulb assembly process, it is easy to cause a series of problems such as filament breakage and gold wire breakage. The overall yield rate is low, which needs to be solved. The problem. Each LED filament has its own color temperature determined during production, and the color temperature cannot be adjusted in real time when forming a bulb. Even if LED filaments with different color temperatures are combined in the same bulb, it is difficult to achieve good light mixing.
发明内容Contents of the invention
本实用新型提供了一种在基板焊接有多个相互连接导通小型封装体的全角度发光的LED球泡灯;解决现有LED灯丝灯中导热能力差、焊线良率低、点胶一致性差、工艺制程复杂、色温不可调等问题。The utility model provides a full-angle light-emitting LED bulb lamp with a plurality of interconnected small packages welded on the substrate; it solves the problem of poor thermal conductivity, low welding yield and consistent dispensing in the existing LED filament lamps. Problems such as poor performance, complex process, and non-adjustable color temperature.
本实用新型的上述技术问题主要是通过下述技术方案得以解决的:一种全角度发光的LED球泡灯,包括有灯头座和灯泡壳,灯泡壳内设有的发光光源,其特征在于:所述的发光光源包括有基板和分布在基板表面的小型封装体,基板上设有若干可与小型封装体焊接且使各小型封装体相互连接导通的连接电路,所述的小型封装体包括有倒装芯片,倒装芯片上设有焊接电极,倒装芯片的表面且除焊接电极所对应的面之外涂覆设置有荧光胶体。发光光源包括有基板和分布在基板表面的小型封装体,小型封装体包括有倒装芯片,倒装芯片上设有焊接电极,焊接电极可直接和基板上的电路共晶焊接,无需焊线,导热性能远高于固晶胶,可以为芯片提供良好散热。小型封装体之间通过电极直接和基板上的线路进行连接,无需焊线,工艺简单,可靠性高。倒装芯片的表面且除焊接电极所对应的面之外涂覆设置有荧光胶体,不需要正反面点胶覆盖,工艺简单,且可以根据应用需求自由调整各小型封装体的荧光粉颜色,便于调节色温或显指。小型封装体发光角度大,排布较为集中,光斑均匀,不存在暗区。因此,本实用新型具有易散热,无需焊线点胶, 360°全发光,色温可调的优点。The above-mentioned technical problems of the utility model are mainly solved by the following technical solutions: a full-angle light-emitting LED bulb lamp, including a lamp holder and a bulb shell, and a light-emitting light source provided in the bulb shell, which is characterized in that: The light-emitting light source includes a substrate and small packages distributed on the surface of the substrate. The substrate is provided with a number of connecting circuits that can be welded with the small packages and make the small packages connected to each other. The small packages include There are flip-chips, welding electrodes are arranged on the flip-chips, and fluorescent colloid is coated on the surface of the flip-chips except the surface corresponding to the welding electrodes. The light source includes a substrate and a small package distributed on the surface of the substrate. The small package includes a flip chip, and the flip chip is provided with a welding electrode. The welding electrode can be directly eutectically welded to the circuit on the substrate without welding wires. The thermal conductivity is much higher than that of die-bonding adhesive, which can provide good heat dissipation for the chip. The small packages are directly connected to the lines on the substrate through the electrodes, without welding wires, the process is simple, and the reliability is high. The surface of the flip chip is coated with fluorescent colloid except for the surface corresponding to the welding electrode. It does not need to be covered with glue on the front and back sides. The process is simple, and the color of the phosphor powder of each small package can be freely adjusted according to the application requirements, which is convenient. Adjust color temperature or finger display. The small package has a large luminous angle, concentrated arrangement, uniform light spot, and no dark area. Therefore, the utility model has the advantages of easy heat dissipation, no need for welding wire dispensing, full 360° light emission, and adjustable color temperature.
封装体通过molding或模压成型后切割,倒装芯片四周荧光粉胶体厚度均匀,荧光粉在胶体中也均匀分散。在工艺上保证了小型封装体的光斑和色温的一致性;其五面发光的特点也保证了容易实现大角度发光和良好的混光效果,器件光斑一致性好。而且只是芯片周围涂覆有荧光粉胶体可以大幅度降低材料的用量,降低成本。The package body is cut after molding or compression molding, the thickness of the phosphor colloid around the flip chip is uniform, and the phosphor powder is also uniformly dispersed in the colloid. In terms of technology, the consistency of the light spot and color temperature of the small package is guaranteed; the characteristics of its five-sided light emission also ensure that it is easy to achieve large-angle light emission and good light mixing effect, and the device has good light spot consistency. And only coating the phosphor colloid around the chip can greatly reduce the consumption of materials and reduce the cost.
作为优选,所述的小型封装体包括有第一小型封装体和第二小型封装体两种类型,第一小型封装体中的荧光胶体内含有高色温荧光粉,第二小型封装体中的荧光胶体内含有低色温荧光粉,且第一小型封装体和第二小型封装体为各自独立受控发光设置。基板上焊接有内含有高色温荧光粉的第一小型封装体和内含有低色温荧光粉的第二小型封装体,通过独立控制第一小型封装和第二小型封装体单独工作发出不同色温的光,两种色温的光可以混合匹配出所需的色温要求,通过调节电流大小可控制整体色温的变化,实现色温的可调。Preferably, the small package includes two types: the first small package and the second small package, the fluorescent colloid in the first small package contains high color temperature phosphor, and the fluorescent gel in the second small package The colloid contains low color temperature fluorescent powder, and the first small package body and the second small package body are respectively independently controlled to emit light. A first small package containing high color temperature phosphor and a second small package containing low color temperature phosphor are welded on the substrate, and the first small package and the second small package work independently to emit light with different color temperatures , The lights of two color temperatures can be mixed and matched to obtain the required color temperature requirements, and the change of the overall color temperature can be controlled by adjusting the current, so that the color temperature can be adjusted.
作为优选,所述的第一小型封装体和第二小型封装体在基板上的位置分布呈交错分布。使得混合调出的光更加容易混合均匀。Preferably, the positions of the first small packages and the second small packages on the substrate are distributed in a staggered manner. It makes it easier to mix the mixed light evenly.
作为优选,所述的小型封装体包括有第三小型封装体和第四小型封装体两种类型,第三小型封装体中的荧光胶体内只含有绿色荧光粉,第四小型封装体中的荧光胶体内只含有红色荧光粉。通过两种颜色光的合理混合即可达到高显指高光效的产品方案。Preferably, the small package includes two types: the third small package and the fourth small package, the fluorescent colloid in the third small package only contains green phosphor, and the phosphor in the fourth small package The colloid contains only red phosphor. A product solution with high CRI and high light efficiency can be achieved through the reasonable mixing of two colors of light.
作为优选,所述的第三小型封装体和第四小型封装体在基板上的位置分布呈交错分布。使得混合调出的光更加容易混合均匀。Preferably, the positions of the third small packages and the fourth small packages on the substrate are distributed in a staggered manner. It makes it easier to mix the mixed light evenly.
作为优选,所述的基板的上下表面上均设有小型封装体。基板的上下表面上均设有小型封装体,即可实现光源的360°全发光。Preferably, small packages are provided on the upper and lower surfaces of the substrate. Both the upper and lower surfaces of the substrate are provided with small packages, so that 360° full illumination of the light source can be realized.
作为优选,基板与灯头座为同轴设置。基板与灯头座为同轴设置,使基板上产生的光线可以以近似垂直的角度通过灯泡壳,可以减少光线损失以及避免折射,使得光照效果较好。Preferably, the base plate and the lamp holder are arranged coaxially. The base plate and the lamp base are coaxially arranged, so that the light generated on the base plate can pass through the bulb shell at an approximately vertical angle, which can reduce light loss and avoid refraction, so that the lighting effect is better.
作为优选,所述的灯泡壳内填充有用于导热的惰性气体。灯泡壳内填充有用于导热的惰性气体,有助于内部热量的发散,加强散热性。Preferably, the bulb shell is filled with an inert gas for heat conduction. The bulb shell is filled with inert gas for heat conduction, which helps to dissipate internal heat and enhance heat dissipation.
作为优选,所述基板为对称形状。基板为对称形状,基板具体为圆形或正多边形,也可以是环形或者环的其中一段结构或类似结构,这些结构的光源产生的光均匀对称,光斑效果好。Preferably, the substrate has a symmetrical shape. The substrate is a symmetrical shape. The substrate is specifically a circle or a regular polygon. It can also be a ring or a segment of a ring or a similar structure. The light generated by the light source of these structures is uniform and symmetrical, and the light spot effect is good.
因此,本实用新型相比现有技术具有以下特点:1.发光光源包括有基板和分布在基板表面的小型封装体,小型封装体包括有倒装芯片,倒装芯片上设有焊接电极,焊接电极可直接和基板上的电路共晶焊接,无需焊线,散热性能好;2.小型封装体之间通过电极直接和基板上的线路进行连接,无需焊线,工艺简单,可靠性高;3.倒装芯片的表面且除焊接电极所对应的面之外涂覆设置有荧光胶体,无需后道的点胶工艺,可以根据应用需求自由调整各小型封装体的荧光粉颜色,便于调节色温或显指;4.小型封装体发光角度大,排布较为集中,光斑均匀,不存在暗区。Therefore, the utility model has the following characteristics compared with the prior art: 1. The luminescent light source includes a substrate and a small package body distributed on the surface of the substrate, the small package body includes a flip chip, and the flip chip is provided with welding electrodes. The electrodes can be directly eutectically welded to the circuit on the substrate without welding wires, and the heat dissipation performance is good; 2. The small packages are directly connected to the lines on the substrate through the electrodes, without welding wires, the process is simple and the reliability is high; 3 .The surface of the flip chip is coated with fluorescent colloid except for the surface corresponding to the welding electrode, so there is no need for subsequent dispensing process, and the color of the phosphor powder of each small package can be freely adjusted according to the application requirements, which is convenient for adjusting the color temperature or Significant; 4. The small package body has a large luminous angle, the arrangement is relatively concentrated, the light spot is uniform, and there is no dark area.
附图说明Description of drawings
附图1是本实用新型的实施例1的结构示意图;Accompanying drawing 1 is the structural representation of embodiment 1 of the present utility model;
附图2是本实用新型的小型封装体的结构示意图;Accompanying drawing 2 is the structural representation of the small package body of the present utility model;
附图3是本实用新型的小型封装体的剖视图;Accompanying drawing 3 is the sectional view of the small package of the present utility model;
附图4是本实用新型的实施例1去掉灯泡壳后的结构示意图;Accompanying drawing 4 is the structural representation after removing bulb shell of embodiment 1 of the present utility model;
附图5是连接电路的结构示意图;Accompanying drawing 5 is the structural representation of connection circuit;
附图6是本实用新型的实施例2去掉灯泡壳后的结构示意图。Accompanying drawing 6 is the structure diagram after removing the bulb shell of embodiment 2 of the present utility model.
具体实施方式detailed description
下面通过实施例,并结合附图,对本实用新型的技术方案作进一步具体的说明。The technical solutions of the present utility model will be further specifically described below through the embodiments and in conjunction with the accompanying drawings.
实施例1:见图1、图2、图3、图5,一种全角度发光的LED球泡灯,包括有灯头座1和灯泡壳2,灯泡壳2内设有的发光光源,发光光源包括有基板3和分布在基板3表面的小型封装体4,基板3上设有若干可与小型封装体4共晶焊接且使各小型封装体4相互连接导通的连接电路31,小型封装体4包括有倒装芯片41,倒装芯片41上设有焊接电极411,倒装芯片41的表面且除焊接电极411所对应的面之外涂覆设置有荧光胶42。发光光源包括有基板和分布在基板表面的小型封装体,小型封装体包括有倒装芯片,倒装芯片上设有焊接电极,其中连接电路31均包括有两个导电焊盘311,两个导电焊盘311之间通过导电线路312相连,焊接电极可直接和基板上的导电焊盘311共晶焊接,无需焊线,导热性能远高于固晶胶,可以为芯片提供良好散热。小型封装体之间通过电极直接和基板上的线路进行连接,无需焊线,工艺简单,可靠性高。倒装芯片的表面且除焊接电极所对应的面之外涂覆设置有荧光胶体,不需要正反面点胶覆盖,工艺简单,且可以根据应用需求自由调整各小型封装体的荧光粉颜色,便于调节色温或显指。小型封装体发光角度大,排布较为集中,光斑均匀,不存在暗区。因此,本实用新型具有易散热,无需焊线点胶, 360°全发光,色温可调的优点。Embodiment 1: see Fig. 1, Fig. 2, Fig. 3, Fig. 5, a kind of full-angle light-emitting LED bulb lamp, including a lamp base 1 and a bulb shell 2, a light-emitting light source provided in the light-bulb shell 2, a light-emitting light source It includes a substrate 3 and small packages 4 distributed on the surface of the substrate 3. The substrate 3 is provided with a number of connection circuits 31 that can be eutectically welded with the small packages 4 and make the small packages 4 interconnected. The small package 4 includes a flip chip 41 on which a welding electrode 411 is provided, and the surface of the flip chip 41 except the surface corresponding to the welding electrode 411 is coated with fluorescent glue 42 . The luminescent light source includes a substrate and a small package distributed on the surface of the substrate. The small package includes a flip chip, and welding electrodes are arranged on the flip chip. The connecting circuit 31 includes two conductive pads 311, two conductive pads 311 The electric pads 311 are connected by conductive lines 312, and the welding electrodes can be eutectically welded directly to the conductive pads 311 on the substrate without welding wires, and the thermal conductivity is much higher than that of the die-bonding adhesive, which can provide good heat dissipation for the chip. The small packages are directly connected to the lines on the substrate through the electrodes, without welding wires, the process is simple, and the reliability is high. The surface of the flip chip is coated with fluorescent colloid except for the surface corresponding to the welding electrode. It does not need to be covered with glue on the front and back sides. The process is simple, and the color of the phosphor powder of each small package can be freely adjusted according to the application requirements, which is convenient. Adjust color temperature or finger display. The small package has a large luminous angle, concentrated arrangement, uniform light spot, and no dark area. Therefore, the utility model has the advantages of easy heat dissipation, no need for welding wire dispensing, full 360° light emission, and adjustable color temperature.
见图4,小型封装体4包括有第一小型封装体4a和第二小型封装体4b两种类型,第一小型封装体4a中的荧光胶体42内含有高色温荧光粉,第二小型封装体4b中的荧光胶体42内含有低色温荧光粉,且第一小型封装体4a和第二小型封装体4b为各自独立受控发光设置。基板上焊接有内含有高色温荧光粉的第一小型封装体和内含有低色温荧光粉的第二小型封装体,通过独立控制第一小型封装和第二小型封装体单独工作发出不同色温的光,两种色温的光可以混合匹配出所需的色温要求,通过调节电流大小可控制整体色温的变化,实现色温的可调。As shown in Fig. 4, the small package 4 includes two types: a first small package 4a and a second small package 4b, the fluorescent gel 42 in the first small package 4a contains a high color temperature phosphor, and the second small package The fluorescent colloid 42 in 4b contains low color temperature fluorescent powder, and the first small package 4a and the second small package 4b are respectively independently controlled to emit light. A first small package containing high color temperature phosphor and a second small package containing low color temperature phosphor are welded on the substrate, and the first small package and the second small package work independently to emit light with different color temperatures , The lights of two color temperatures can be mixed and matched to obtain the required color temperature requirements, and the change of the overall color temperature can be controlled by adjusting the current, so that the color temperature can be adjusted.
见图4,第一小型封装体4a和第二小型封装体4b在基板3上的位置分布呈交错分布。各个第一小型封装体4a位于同一圆环上均匀分布,各个第二小型封装体4b位于同一圆环上均匀分布,且第一小型封装体4a和第二小型封装体4b分别设置在同圆心的两个内外圆环上,且第一小型封装体4a和第二小型封装体4b的个数相同,每一个第一小型封装体4a均位于一对相邻的第二小型封装体4b之间,第一小型封装体和第二小型封装体按照上述排列形成交错分布,使得混合调出的光更加容易混合均匀。Referring to FIG. 4 , the positions of the first small packages 4 a and the second small packages 4 b on the substrate 3 are distributed in a staggered manner. Each first small package body 4a is located on the same circular ring and is evenly distributed, and each second small package body 4b is located on the same circular ring and is evenly distributed, and the first small package body 4a and the second small package body 4b are respectively arranged on concentric circles. On the two inner and outer rings, and the number of the first small packages 4a and the second small packages 4b is the same, each first small package 4a is located between a pair of adjacent second small packages 4b, The first small package body and the second small package body form a staggered distribution according to the above arrangement, so that the mixed light can be mixed evenly more easily.
见图1,基板3与灯头座1为同轴设置。基板与灯头座为同轴设置,使基板上产生的光线可以以近似垂直的角度通过灯泡壳,可以减少光线损失以及避免折射,使得光照效果较好。灯泡壳2内填充有用于导热的惰性气体。灯泡壳内填充有用于导热的惰性气体,有助于内部热量的发散,加强散热性。As shown in FIG. 1 , the base plate 3 and the lamp base 1 are arranged coaxially. The base plate and the lamp base are coaxially arranged, so that the light generated on the base plate can pass through the bulb shell at an approximately vertical angle, which can reduce light loss and avoid refraction, so that the lighting effect is better. The bulb shell 2 is filled with an inert gas for heat conduction. The bulb shell is filled with inert gas for heat conduction, which helps to dissipate internal heat and enhance heat dissipation.
见图1,基板3的上下表面上均设有小型封装体4。基板的上下表面上均设有小型封装体,即可实现光源的360°全发光。Referring to FIG. 1 , small packages 4 are provided on the upper and lower surfaces of the substrate 3 . Both the upper and lower surfaces of the substrate are provided with small packages, so that 360° full illumination of the light source can be realized.
见图4,基板3为对称形状。基板具体为圆形或正多边形,也可以是环形或者环的其中一段结构或类似结构,这些结构的光源产生的光均匀对称,光斑效果好。Referring to Fig. 4, the substrate 3 has a symmetrical shape. The substrate is specifically a circle or a regular polygon, and may also be a ring or a part of a ring or a similar structure. The light generated by the light source of these structures is uniform and symmetrical, and the light spot effect is good.
实施例2:见图6,小型封装体4包括有第三小型封装体4c和第四小型封装体4d两种类型,第三小型封装体4c中的荧光胶体42内只含有绿色荧光粉,第四小型封装体4d中的荧光胶体42内只含有红色荧光粉。通过两种颜色光的合理混合即可达到高显指高光效的产品方案。Embodiment 2: see Fig. 6, the small package body 4 includes two types of the third small package body 4c and the fourth small package body 4d, the fluorescent colloid 42 in the third small package body 4c only contains green fluorescent powder, and the second small package body 4c contains only green fluorescent powder. The fluorescent colloid 42 in the four small packages 4d only contains red fluorescent powder. A product solution with high CRI and high light efficiency can be achieved through the reasonable mixing of two colors of light.
见图6,第三小型封装体4c和第四小型封装体4d在基板3上的位置分布呈交错分布。使得混合调出的光更加容易混合均匀。Referring to FIG. 6 , the positions of the third small packages 4c and the fourth small packages 4d on the substrate 3 are distributed in a staggered manner. It makes it easier to mix the mixed light evenly.
其余部分与实施例1相同。All the other parts are identical with embodiment 1.
本实用新型可改变为多种方式对本领域的技术人员是显而易见的,这样的改变不认为脱离本实用新型的范围。所有这样的对所述领域技术人员显而易见的修改将包括在本权利要求的范围之内。It is obvious to those skilled in the art that the present utility model can be changed in many ways, and such changes are not considered to depart from the scope of the present utility model. All such modifications obvious to those skilled in the art are intended to be included within the scope of this claim.
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