CN210866193U

CN210866193U - COB substrate

Info

Publication number: CN210866193U
Application number: CN201921610415.5U
Authority: CN
Inventors: 谢观逢; 林晓敏; 陈智波; 夏雪松
Original assignee: Guangzhou Ledteen Optoelectronics Co ltd
Current assignee: Silicon Energy Photoelectric Semiconductor Guangzhou Co ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2020-06-26
Anticipated expiration: 2029-09-25

Abstract

The utility model provides a COB base plate, this base plate include end liner, main positive electrode pad, main negative pole pad and a plurality of COB light source module. A plurality of COB light source module carries out series connection or parallel connection earlier, carries out electric connection with main positive electrode pad, main negative pole pad again to make COB light source and pedestal connection's wire can reduce to 2, and then simplified the structure of the lamps and lanterns that correspond and base. Secondly, design a plurality of light emitting surfaces on a complete base plate, fully utilized the position on the base plate to make on the base plate of the light emitting surface of the same size, the utility model provides a base plate size can design less relatively, and then makes supporting lamps and lanterns and the base structure size of using this base plate less relatively, easily installs, improves holistic light-emitting effect, reduce cost.

Description

COB substrate

Technical Field

The utility model relates to a LED encapsulation technology field especially relates to a COB base plate.

Background

COB Light source (i.e. Chip On Board Light) is a mirror substrate directly attaching LED Chip On high reflection rate, adopts COB packaging technology to pass through the high Light efficiency integrated area Light source of bonding lead wire and circuit Board to cover with resin in order to ensure the reliability, and it is for the LED Light source of other structures, has the advantages of stable electrical property, high color rendering, luminous even, the heat dissipation is fast, the grading of being convenient for, avoid reflow soldering, reduce lamps and lanterns design degree of difficulty etc., consequently obtains more and more extensive application in the LED packaging technology field.

The substrate used by the existing COB light source product is generally single, and only one light emitting surface is arranged. However, in some special applications, one luminaire may need to be equipped with multiple COB light sources. Therefore, a plurality of wires are needed to connect the COB light source and the base, so that the structure of the used base is complicated, and the structure of the lamp is also complicated; secondly, the increase of base plate for the size of lamps and lanterns and the base that correspond is great relatively, is difficult for the installation and influences holistic light-emitting effect, and the cost is higher.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a: the utility model provides a COB base plate, this base plate simple structure is applied to in the lamps and lanterns that contain a plurality of COB light sources, can simplify the structure of lamps and lanterns and base, reduces the space volume of lamps and lanterns and base, practices thrift the cost.

The purpose of the utility model is realized by adopting the following technical scheme:

a COB substrate comprises a bottom liner, a main anode bonding pad, a main cathode bonding pad and a plurality of COB light source modules; the main anode bonding pad is used for being electrically connected with the anode of a power supply, and the main cathode bonding pad is used for being electrically connected with the cathode of the power supply;

the COB light source module comprises a plurality of LED chips, a light emitting surface, a first bonding pad and a second bonding pad; the light emitting surface is used for packaging an LED chip, the first bonding pad and the second bonding pad form an open ring structure and surround the periphery of the light emitting surface, the first bonding pad is the anode of the COB light source module, and the second bonding pad is the cathode of the COB light source module;

the COB light source modules are connected in series, a first bonding pad of a first COB light source module is electrically connected with the main anode bonding pad, and a second bonding pad of a last COB light source module is electrically connected with the main cathode bonding pad; or, it is a plurality of COB light source module parallel connection, every COB light source module's first pad all with main anodal pad electric connection, the second pad all with main negative pole pad electric connection.

The utility model provides a COB base plate, including end liner, main positive electrode pad, main negative pole pad and a plurality of COB light source module. A plurality of COB light source module carries out series connection or parallel connection earlier, carries out electric connection with main positive electrode pad, main negative pole pad again to make COB light source and pedestal connection's wire can reduce to 2, and then simplified the structure of the lamps and lanterns that correspond and base. Secondly, design a plurality of light emitting surfaces on a complete base plate, fully utilized the position on the base plate to make on the base plate of the light emitting surface of the same size, the utility model provides a base plate size can design less relatively, and then makes supporting lamps and lanterns and the base structure size of using this base plate less relatively, easily installs, improves holistic light-emitting effect, reduce cost.

As a further embodiment, the COB light source module further includes a secondary positive pad and a secondary negative pad, the secondary positive pad is electrically connected to the first pad, and the secondary negative pad is electrically connected to the second pad;

a plurality of COB light source module series connection, the anodal pad of inferior of first COB light source module with anodal pad electric connection of main, the negative pole pad of inferior of last COB light source module with main negative pole pad electric connection.

In order to make when COB light source module series connection, it is more orderly that the connecting circuit arranges, adds the anodal pad of inferior and the negative pole pad of inferior.

As a further embodiment, the light emission surface is provided in a circular shape.

In this embodiment, the circular light emission surface has a relatively large area compared to other shapes, thereby more fully utilizing the position on the substrate; and secondly, the light emitting effect of the circular light emitting surface is better.

As a further embodiment, the first pad and the second pad are semicircular, and the first pad and the second pad form an annular structure with two openings, which is arranged around the periphery of the light emitting surface.

In this embodiment, the pad is provided in a semicircular shape with reference to the circular light emitting surface, thereby saving space and sufficiently utilizing the position on the substrate.

As a further embodiment, the plurality of LED chips on the light emitting surface are electrically connected in series, a first LED chip is electrically connected to the first bonding pad, and a last LED chip is electrically connected to the second bonding pad.

In this embodiment, the series connection of the LED chips is convenient and fast to operate.

As a further embodiment, the number of the COB light source modules is set to 4-6, and the COB light source modules are uniformly distributed on the substrate.

In this embodiment, with 4-6 COB light source module evenly distributed on the end liner, can improve holistic light-emitting effect better.

As further embodiment, the end liner is the square, be provided with 4 on the end liner COB light source module, 4 COB light source module evenly distributed in on the end liner.

In this embodiment, the square end liner is evenly divided into four to longitudinal axis, horizontal axis, and every is provided with a COB light source module. The setting mode is simple and convenient to operate; and the light is emitted uniformly, so that the light emitting effect is good.

As a further embodiment, the main positive pad and the main negative pad are respectively disposed at corners of the substrate, and the two corners are in a diagonal relationship.

In this embodiment, the main positive electrode pad and the main negative electrode pad are disposed in a diagonal relationship for later connection and mounting of the power supply wire.

Compared with the prior art, the beneficial effects of the utility model reside in that:

Drawings

Fig. 1 is a preferred embodiment of a serial COB substrate according to the present invention;

fig. 2 shows a preferred embodiment of the parallel COB substrate provided by the present invention.

In the figure: 1. a bottom lining; 2. a main positive electrode pad; 3. a main negative electrode pad; 4. a COB light source module; 41. an LED chip; 42. a light emitting surface; 43. a secondary positive electrode pad; 44. a sub-negative electrode pad; 45. a first pad; 46. a second pad; 5. and a copper wire.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

The utility model provides a COB base plate, including end liner 1, main positive electrode pad 2, main negative pole pad 3 and a plurality of COB light source module 4. The main positive electrode pad 2 is used for being electrically connected with a positive electrode of a power supply, and the main negative electrode pad 3 is used for being electrically connected with a negative electrode of the power supply. The COB light source module 4 includes a plurality of LED chips 41, a light emission surface 42, a sub-positive pad 43, a sub-negative pad 44, a first pad 45, and a second pad 46. The light emitting surface 42 is used for packaging the LED chip 41, the first bonding pad 45 and the second bonding pad 46 form an open ring structure and surround the light emitting surface 42, the sub-positive bonding pad 43 is electrically connected to the first bonding pad 45, and the sub-negative bonding pad 44 is electrically connected to the second bonding pad 46.

As shown in fig. 1, when the COB light source modules 4 are connected in series, the sub-positive pad 43 of the first COB light source module 4 is electrically connected to the main positive pad 2, and the sub-negative pad 44 of the last COB light source module 4 is electrically connected to the main negative pad 3. As shown in fig. 2, when the COB light source modules 4 are connected in parallel, the sub-positive pad 43 of each COB light source module 4 is electrically connected to the main positive pad 2, and the sub-negative pad 44 is electrically connected to the main negative pad 3. Preferably, the pad-to-pad electrical connection and the pad-to-pad electrical connection are connected by using a conductive metal, and the conductive metal is preferably copper.

In the COB base plate that above-mentioned embodiment provided, a plurality of COB light source module 4 carries out series connection or parallel connection earlier, carries out electric connection with main positive electrode pad 2, main negative electrode pad 3 again to make the wire of COB light source and pedestal connection can reduce to 2, and then simplified the structure of the lamps and lanterns that correspond and base. Secondly, design a plurality of light emitting surfaces 42 on a complete base plate, fully utilized the position on the base plate to make on the base plate of the light emitting surface 42 of the same size, the utility model provides a base plate size can design less relatively, and then makes supporting lamps and lanterns and the base structure size of using this base plate less relatively, and easily installation improves holistic light-emitting effect, reduce cost.

Secondly, because the COB substrate in the above embodiment includes the plurality of COB light source modules 4, a manufacturer can set the COB light source modules 4 with various different color temperatures on the COB substrate by combining the prior art, so that the lamp can realize the effect of color temperature adjustment; or, a plurality of different colors of COB light source modules 4 are provided, such as three primary colors (red, green and blue), and the lamps can adjust lights of various colors by controlling the instruments; or, set up the COB light source module 4 of multiple different luminance to make the regulation of lamps and lanterns can realize luminance. Compared with the prior art, the technical scheme is realized by using the COB substrate in the embodiment, and the corresponding matched lamp structure is simplified, so that the cost of the lamp and the cost of assembly are saved.

As shown in fig. 1 and 2, the light emission surface 42 is provided in a circular shape. The area of the circular light emission surface 42 is relatively large compared to other shapes, thereby more fully utilizing the position on the substrate; secondly, the light emitting effect of the circular light emitting surface 42 is better. Correspondingly, the first bonding pad 45 and the second bonding pad 46 are semicircular, and the first bonding pad 45 and the second bonding pad 46 form an annular structure with two openings, which is arranged around the periphery of the light emitting surface 42. The pads are arranged in a semicircular shape with reference to the circular light emitting surface 42, thereby saving space better and making full use of the position on the substrate.

Further, the LED chips 41 on the light emitting surface 42 are electrically connected in series, the first LED chip 41 is electrically connected to the first bonding pad 45, and the last LED chip 41 is electrically connected to the second bonding pad 46. In this embodiment, the LED chips 41 are connected in series, which is convenient and fast to operate. It should be noted that, according to actual needs, the LED chips 41 may also be electrically connected in parallel.

Further, COB light source module 4's quantity sets up to 4-6, evenly distributed on end liner 1, can improve holistic light-emitting effect better. As shown in fig. 1-2, the substrate 1 is square, the longitudinal axis and the transverse axis divide the square substrate 1 into four pieces, each piece is provided with one COB light source module 4, that is, 4 COB light source modules 4 are arranged on the substrate 1, and the 4 COB light source modules 4 are uniformly distributed on the substrate 1. The setting mode is simple and convenient to operate; and the light is emitted uniformly, so that the light emitting effect is good. At this time, the main positive electrode pad 2 and the main negative electrode pad 3 are respectively disposed at corners of the square substrate 1, and the two corners are in a diagonal relationship, so that the power supply lead can be connected and mounted later.

As shown in fig. 1, when 4 COB light source modules 4 are connected in series, the sub-positive pad 43 of the first COB light source module 4 is electrically connected to the main positive pad 2, the sub-negative pad 44 of the first COB light source module 4 is electrically connected to the sub-positive pad 43 of the second COB light source module 4 through a copper line, and so on, and the sub-negative pad 44 of the last COB light source module 4 is electrically connected to the main negative pad 3.

When the 4 COB light source modules 4 are connected in parallel, in order to more reasonably utilize the space on the substrate, the sub-positive pads 43 (or the sub-negative pads 44) of the COB light source modules 4 on the same side may be connected together, and then connected to the main positive pad 2 (or the main negative pad 3). More simply, as shown in fig. 2, the copper lines 5 may be directly used to connect the anodes (i.e., the first pads 45) of the COB light source modules 4 on the same side together, and then electrically connect with the main anode pad 2 without providing a pad; similarly, the cathodes (i.e., the second pads 46) of the COB light source modules 4 on the same side are connected together and then electrically connected to the main cathode pad 3, but no pad is provided.

In practical use, the 4 light emitting surfaces 42 can be all conducted only by respectively connecting the positive electrode and the negative electrode of the power supply to the main positive electrode bonding pad 2 and the main negative electrode bonding pad 3; when each light emitting and emitting surface 42 needs to be tested independently, the light emitting and emitting surfaces can be conducted independently by connecting the positive bonding pad and the negative bonding pad which are close to the bonding pads (for example, the positive and negative electrodes of a power supply are respectively connected to the main positive bonding pad 2 and the secondary negative bonding pad 44 of the first COB light source module 4, so that the light emitting and emitting surface 42 of the first COB light source module 4 can be conducted independently), and similarly, the other light emitting and emitting surfaces 42 can be conducted according to the method.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. A COB base plate which characterized in that: the COB light source module comprises a bottom liner, a main anode bonding pad, a main cathode bonding pad and a plurality of COB light source modules; the main anode bonding pad is used for being electrically connected with the anode of a power supply, and the main cathode bonding pad is used for being electrically connected with the cathode of the power supply;

2. The COB substrate of claim 1, wherein: the COB light source module further comprises a secondary anode bonding pad and a secondary cathode bonding pad, the secondary anode bonding pad is electrically connected with the first bonding pad, and the secondary cathode bonding pad is electrically connected with the second bonding pad;

3. The COB substrate of claim 1, wherein: the light emitting surface is provided in a circular shape.

4. The COB substrate of claim 3, wherein: the first bonding pad and the second bonding pad are semicircular, and the first bonding pad and the second bonding pad form a circular ring structure with two openings and are arranged around the periphery of the light emitting surface.

5. The COB substrate of claim 1, wherein: a plurality of LED chips on the emergent surface are electrically connected in a series connection mode, a first LED chip is electrically connected with the first bonding pad, and a last LED chip is electrically connected with the second bonding pad.

6. The COB substrate of claim 1, wherein: the quantity of COB light source module sets up to 4-6, evenly distributed in on the end liner.

7. The COB substrate of claim 6, wherein: the end liner is the square, be provided with 4 on the end liner COB light source module, 4 COB light source module evenly distributed in on the end liner.

8. The COB substrate of claim 7, wherein: the main anode bonding pad and the main cathode bonding pad are respectively arranged at two corners of the bottom lining, and the two corners are in a diagonal relation.