CN109734469A - The method for welding of ceramics and metal - Google Patents
The method for welding of ceramics and metal Download PDFInfo
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- CN109734469A CN109734469A CN201811650747.6A CN201811650747A CN109734469A CN 109734469 A CN109734469 A CN 109734469A CN 201811650747 A CN201811650747 A CN 201811650747A CN 109734469 A CN109734469 A CN 109734469A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 119
- 239000002184 metal Substances 0.000 title claims abstract description 119
- 239000000919 ceramic Substances 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000003466 welding Methods 0.000 title claims abstract description 34
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 238000005476 soldering Methods 0.000 claims abstract description 31
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 17
- 239000010936 titanium Substances 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 244000137852 Petrea volubilis Species 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052758 niobium Inorganic materials 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 238000010792 warming Methods 0.000 claims description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 5
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000003575 carbonaceous material Substances 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 20
- 230000008646 thermal stress Effects 0.000 abstract description 11
- 230000007704 transition Effects 0.000 abstract description 4
- 239000010931 gold Substances 0.000 description 15
- 238000005219 brazing Methods 0.000 description 9
- 239000010955 niobium Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000004575 stone Substances 0.000 description 5
- 208000037656 Respiratory Sounds Diseases 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052580 B4C Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- FFBGYFUYJVKRNV-UHFFFAOYSA-N boranylidynephosphane Chemical compound P#B FFBGYFUYJVKRNV-UHFFFAOYSA-N 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/55—Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
The present invention provides the method for welding of a kind of ceramics and metal, comprising: prepares ceramics to be welded and metal to be welded, and is surface-treated to ceramics to be welded, so that the surface of ceramics to be welded is formed as smooth surface；Metalized is carried out on the surface of ceramics to be welded, forms the intermediate metal layer with Ceramic bond to be welded, the thermal expansion coefficient of ceramics to be welded and the matched coefficients of thermal expansion of intermediate metal layer；Ceramics to be welded, metal solder are successively stacked and are brazed with metal to be welded.In the disclosure, solder can be good at infiltrating to be welded ceramics of the surface Jing Guo metalized, and intermediate metal layer can make ceramics and the soldering interface thermal expansion coefficient of metal that gradient transition be presented, the thermal expansion coefficient difference as caused by material difference between reduction interface, and then reduce connector thermal stress, improve performance.
Description
Technical field
The present invention is more particularly directed to the method for welding of a kind of ceramics and metal.
Background technique
Ceramics are as high-temperature structural material because it is with good biocompatibility, heat-resisting, corrosion-resistant and electric insulating quality
It can wait and be widely used in every field.But in practical applications, in order to solve ceramic hardness itself it is excessive caused by processing
Property difference problem, need by certain method to connect to form metal-ceramic composite structural member by ceramics and metal.
Currently, connection ceramics and the most common method of metal material are solderings.Being brazed has what heat affected area was small, is formed to connect
The advantages that reliable, the connection being highly suitable between dissimilar material.But since the wetability of ceramics itself is very poor, so that
It is difficult to form good connection between ceramics and metal material.And ceramics are larger with the mutual thermal expansion coefficient difference of metal,
It will lead to that thermal stress in connector is excessive, influence the performances such as intensity and the air-tightness of connector.
Summary of the invention
The present invention in view of the above-mentioned prior art situation and complete, its purpose is to provide one kind can reduce between interface
Because material it is different caused by thermal expansion coefficient difference, reduce connector thermal stress and improve the pricker of the ceramics and metal of air-tightness
Soldering method.
For this purpose, present disclose provides the method for welding of a kind of ceramics and metal, comprising: prepare ceramics to be welded and gold to be welded
Belong to, and the ceramics to be welded are surface-treated, so that the surface of ceramics to be welded is formed as smooth surface；Described to be welded
The surface of ceramics carries out metalized, forms the intermediate metal layer with the Ceramic bond to be welded, the heat of the ceramics to be welded
The matched coefficients of thermal expansion of the coefficient of expansion and the intermediate metal layer；And by it is described it is to be welded ceramics, metal solder and it is described to
Weldering metal is successively stacked and is brazed.
In the disclosure, the method for welding of ceramics and metal includes being surface-treated to ceramics to be welded, and to be welded
Metalized is passed through on the surface of ceramics, forms the intermediate metal layer with matched coefficients of thermal expansion, in this case, solder
It can be good at infiltrating to be welded ceramics of the surface Jing Guo metalized, and intermediate metal layer can make the pricker of ceramics with metal
Weld interface thermal expansion coefficient and gradient transition be presented, so as to reduce between interface because material it is different caused by coefficient of thermal expansion differences
It is different, reduce connector thermal stress and improves air-tightness.In addition, during the brazing process can also by select suitable brazing temperature and
Soaking time can improve the generation and distribution of brittlement phase between interface, and the thermal deformation for increasing intensity, reducing thermal stress and base material disappears
Except the crackle in weld seam, the air-tightness and intensity of ceramics with the soldering interface of metal are further promoted.
In addition, the roughness on the surface of the ceramics to be welded can be less than in the method for welding involved in the disclosure
0.05μm.In this case, the surface of ceramics to be welded can be made smooth and smooth, be conducive between subsequent ceramics and metal
Soldering.
In addition, in the method for welding involved in the disclosure, the method for the metalized can for sputtering, vapor deposition,
PVD, CVD, plating, high temperature sintering.Thereby, it is possible to the intermediate metal layer combined closely is formed on ceramic surface to be welded.
In addition, in the method for welding involved in the disclosure, the intermediate metal layer can selected from Nb, Au, Ti and they
At least one of alloy.Thereby, it is possible to so that metal solder is soaked the ceramics to be welded that surface has intermediate metal layer well.
In addition, in the method for welding involved in the disclosure, the metal solder can selected from Au, Ag, Ti, Nb and they
At least one of alloy.In this case, solder can be improved to the wetability of ceramics and metal to be welded to be welded.
In addition, the metal solder can be flake in the method for welding involved in the disclosure.In such case
Under, metal solder can preferably infiltrate material to be welded.
In addition, in the method for welding involved in the disclosure, optionally, before being brazed, to the metal to be welded into
Row surface treatment.In this case, the wetability of metal to be welded can be increased.
In addition, optionally, being polished step by step using sand paper come to the gold to be welded in the method for welding involved in the disclosure
Category is surface-treated.Thereby, it is possible to metallic surface to be welded is preferably polished into suitable roughness.
In addition, in the method for welding involved in the disclosure, optionally, in the soldering, with 1 DEG C/min to 50 DEG C/
The rate of heat addition of min is warming up to 1060 DEG C to 1150 DEG C, 1min to 30min is kept the temperature, then with the drop of 2 DEG C/min to 20 DEG C/min
Warm rate is cooled to 200 DEG C to 400 DEG C, then cools to 150 DEG C or less with the furnace.In this case, can improve between interface
The crackle in weld seam is eliminated in the generation and distribution of brittlement phase, the thermal deformation for increasing intensity, reducing thermal stress and base material, promotes pottery
The air-tightness and intensity of the soldering interface of porcelain and metal.
In addition, in the method for welding involved in the disclosure, the ceramics to be welded can by selected from aluminium oxide, zirconium oxide,
At least one of silica, carbon materials, silicon nitride, silicon carbide, titanium oxide, alumino-silicate or calcium aluminium system are constituted.This
In the case of, the ceramics to be welded with bio-compatibility can be obtained.
According to the disclosure, be capable of providing one kind can reduce between interface because material it is different caused by thermal expansion coefficient difference,
Reduce connector thermal stress and improves the method for welding of the ceramics and metal of air-tightness.
Detailed description of the invention
Fig. 1 shows the flow diagram of the method for welding of ceramics involved in embodiments of the present invention and metal.Fig. 2
Show the perspective view of jig involved in embodiments of the present invention.
Fig. 3 shows jig shown in Fig. 2 along the sectional view of line A-A'.
Fig. 4 shows the sectional view that the jig of part to be welded is equipped with involved in embodiments of the present invention.
Fig. 5 shows the assembly structure figure of part to be welded involved in embodiments of the present invention.
Specific embodiment
Hereinafter, explaining the preferred embodiment of the disclosure in detail with reference to attached drawing.In the following description, for identical
Component assign identical symbol, the repetitive description thereof will be omitted.Scheme in addition, attached drawing is only schematical, the mutual ruler of component
Very little shape of ratio or component etc. can be with actual difference.
Fig. 1 shows the flow diagram of the method for welding of ceramics involved in embodiments of the present invention and metal.
The method for welding of ceramics involved in present embodiment and metal includes: to prepare to be welded ceramic 31 and metal to be welded
33, and be surface-treated to be welded ceramic 31, so that ceramic 31 surface to be welded is formed as smooth surface (step S10)；
Metalized is carried out on ceramic 31 surface to be welded, forms the intermediate metal layer that is combined with to be welded ceramic 31, to be welded ceramic 31
Thermal expansion coefficient and intermediate metal layer matched coefficients of thermal expansion (step S20)；By to be welded ceramic 31, metal solder 32 with to
Weldering metal 33 successively stacks and is brazed (step S30).In the present embodiment, part to be welded 30 may include ceramics to be welded
31, metal solder 32 and metal to be welded 33.The shape of part to be welded 30 is not particularly limited, and in some instances, part to be welded 30 can
Think cylindric.
In the method for welding of the ceramics involved in present embodiment and metal, the method for welding of ceramics and metal includes
It is surface-treated to be welded ceramic 31, and metalized is passed through on ceramic 31 surface to be welded, being formed has matching heat swollen
The intermediate metal layer of swollen coefficient, in this case, solder can be good at infiltrating to be welded pottery of the surface Jing Guo metalized
Porcelain 31, and intermediate metal layer can make ceramics and the soldering interface thermal expansion coefficient of metal that gradient transition be presented, so as to
Reduce between interface because material it is different caused by thermal expansion coefficient difference, reduce connector thermal stress and improve air-tightness.
In addition, in the method for welding involved in present embodiment, it during the brazing process can also be by selecting suitable soldering
Temperature and soaking time can improve the generation and distribution of brittlement phase between interface, the heat for increasing intensity, reducing thermal stress and base material
The crackle in weld seam is eliminated in deformation, promotes the air-tightness and intensity of ceramics with the soldering interface of metal.
In the present embodiment, in step slo, grinding and polishing treatment can be carried out to ceramic 31 surface to be welded extremely
Surface roughness is less than 0.05 μm.In this case, ceramic 31 surface to be welded is smooth and smooth, be conducive to it is subsequent ceramics with
Soldering between metal.In some instances, the roughness on ceramic 31 surface to be welded can be 0.04 μm, 0.03 μm, 0.02 μ
M, 0.01 μm etc..
In addition, in the present embodiment, in step slo, to be welded ceramic 31 can be by being selected from aluminium oxide (Al2O3), oxidation
Zirconium (ZrO2), silica (SiO2), carbon materials (C), silicon nitride (Si3N4), silicon carbide (SiC), titanium oxide (TiO2), aluminosilicate
Salt (Na2O·Al2O3·SiO2) or calcium aluminium system (CaOAl2O3) at least one of constitute.In this case, it can obtain
To be welded ceramic 31 with bio-compatibility.
In addition, in the present embodiment, to be welded ceramic 31 can be aluminium oxide (Al2O3) ceramics.In some instances, to
Aluminium oxide (the Al that weldering ceramics 31 are preferably 96% or more by mass fraction2O3) constitute.It is highly preferred that be welded ceramic 31 by quality
Aluminium oxide (the Al that score is 99% or more2O3) constitute, most preferably, to be welded ceramic 31 by mass fraction be 99.99% or more
Aluminium oxide (Al2O3) constitute.In general, in be welded ceramic 31, aluminium oxide (Al2O3) mass fraction increase, it can be made
Principal crystalline phase increases, and ceramic 31 physical property to be welded also can be improved, such as degree, bending strength, elasticity modulus also phase before resistance to compression
It improves with answering, it is possible thereby to think, the higher aluminium oxide (Al of mass fraction2O3) better bio-compatibility and long-term can be presented
Reliability.In other examples, to be welded ceramic 31 can also be zirconium oxide (ZrO2) ceramics.
In addition, in some instances, it can also be by being selected from silica (SiO according to use occasion, to be welded ceramic 312), oxygen
Change potassium (K2O), sodium oxide molybdena (Na2O), calcium oxide (CaO), magnesia (MgO), iron oxide (Fe2O3) at least one of constitute.
In addition, in the present embodiment, in step slo, metal 33 to be welded can be selected from Ti (titanium), Nb (niobium), Ni
At least one of (nickel), Zr (zirconium), Ta (tantalum) and their alloy.Thereby, it is possible to obtain with the to be welded of bio-compatibility
Metal 33.In addition, in one example, metal 33 to be welded can be pure Ti.In another example, metal 33 to be welded can be
Ti alloy.In addition, in yet another example, metal 33 to be welded can be iron-nickel alloy.
In addition, in some instances, metal 33 to be welded can also be selected from the metal without bio-compatibility.For example, to
Welding metal 33 can be by selected from least one of copper (Cu), iron (Fe), magnesium (Mg), lead (Pb), aluminium (Al) and their alloy
Deng.
In addition, can also include being surface-treated to metal 33 to be welded before step S20 in the present embodiment.
In some instances, metal 33 to be welded can be used sand paper and be polished step by step to be surface-treated to metal 33 to be welded.As a result, can
It is enough that the surface of metal 33 to be welded is preferably polished into suitable roughness, increase the wetability of metal 33 to be welded.For example, one
In a example, metal 33 to be welded can be polished step by step with #200, #400, #600, #1200, #2000 and #4000 sand paper.Another
In a example, metal 33 to be welded can be polished step by step with #100, #300, #500, #1000, #1500, #2500 and #4000 sand paper.
In addition, in yet another example, metal 33 to be welded can use #280, #400, #800, #1600, #2500, #3500 and #5000 sand
Paper is polished step by step.
In addition, may include being carried out clearly to the metal to be welded 33 after polishing before step S20 in the present embodiment
It washes.In some instances, 10min to 20min can be cleaned with ethyl alcohol to the metal to be welded 33 after polishing, then is cleaned with isopropanol
10min to 20min.For example, 15min can be cleaned with ethyl alcohol to the metal to be welded 33 after polishing, then cleaned with isopropanol
15min.Thereby, it is possible to remove the foreign matter on the surface to welding technology conducive to subsequent soldering.
In the present embodiment, in step S20, the method for metalized can be sputtering, vapor deposition, PVD (physics gas
Mutually deposit), CVD (chemical vapor deposition), plating or high temperature sintering.Thereby, it is possible to be formed to tie therewith on ceramic 31 surface to be welded
The intermediate metal layer of conjunction.In some instances, the method for metalized preferably sputters.
In addition, in the present embodiment, in step S20, intermediate metal layer can for selected from Nb, Au, Ti and they
At least one of alloy.To be welded ceramic 31 that there is intermediate metal layer thereby, it is possible to soak surface well.In some examples
In, intermediate metal layer can be for selected from one of Nb (niobium), Au (gold), Ti (titanium).For example, in one example, intermediate gold
Belonging to layer can be Nb.In addition.In another example, intermediate metal layer can be Au etc..
In addition, in the present embodiment, in step S20, ceramic 31 thermal expansion coefficient and intermediate metal layer to be welded
Matched coefficients of thermal expansion, the i.e. thermal expansion coefficient of intermediate metal layer can be between ceramic 31 thermal expansion coefficient to be welded and gold to be welded
Belong to 33 thermal expansion coefficient between, thus it enables that be welded ceramic 31 and metal to be welded 33 interface between thermal expansion coefficient present
Gradient transition reduces the thermal expansion coefficient difference as caused by material difference between joint interface, and then reduces the thermal stress at interface,
Improve performance.
In addition, may include to be welded ceramic 31 with intermediate metal layer in step S20 in the present embodiment
It is cleaned.Thereby, it is possible to remove the foreign matter on ceramic 31 surface to be welded conducive to subsequent soldering.It in some instances, can be with
3min to 5min is cleaned with ethyl alcohol to be welded ceramic 31 with intermediate metal layer, then cleans 3min to 5min with isopropanol.Example
Such as, in one example, 4min can be cleaned with ethyl alcohol to be welded ceramic 31 with intermediate metal layer, then is cleaned with isopropanol
4min。
In the present embodiment, in step s 30, metal solder 32 can be for selected from Au, Ag, Ti, Nb and their times
At least one of meaning alloy.In this case, it can be realized solder to be welded ceramic 31 and the wetting of metal 33 to be welded.Separately
Outside, in some instances, metal solder 32 can be at least one of Au base solder, Ag base solder.For example, in an example
In, metal solder 32 can be pure Au.
In addition, in the present embodiment, in step s 30, metal solder 32 can be flake.In this case,
Metal solder 32 can preferably infiltrate material to be welded.But present embodiment is without being limited thereto, and in some instances, metal solder
32 can be powdered, paste, filiform, strip etc..For example, in one example, metal solder 32 can be powdered.Separately
Outside, in another example, metal solder 32 can be paste.
In addition, may include being pre-processed to metal solder 32 in step s 30 in the present embodiment.Some
In example, metal solder 32 can be used sand paper and be polished step by step to be surface-treated to metal solder 32.Thereby, it is possible to remove
The oxidation film on surface.For example, in one example, metal solder 32 can use #200, #400, #600, #1200, #2000 and #
4000 sand paper are polished step by step.In another example, metal solder 32 can use #100, #300, #500, #1000, #1500, #
2500 and #4000 sand paper is polished step by step.In addition, in yet another example, metal solder 32 can use #280, #400, #800, #
1600, #2500, #3500 and #5000 sand paper are polished step by step.
Hereinafter, describing controlling for soldering used in step 30 involved in present embodiment in detail in conjunction with diagram
Tool.
Fig. 2 shows the perspective views of jig involved in embodiments of the present invention.Fig. 3 shows jig shown in Fig. 2
Along the sectional view of line A-A'.In Fig. 3, the structure of objective table 1 is indicated for convenience, and the lid cooperated with objective table 1 is omitted
Body.
In the present embodiment, the jig (below sometimes referred to as " jig ") 1 of soldering can have objective table 10 and with load
The briquetting 20 that object platform 10 cooperates.In step s 30, by by part to be welded 30 (to be welded ceramic 31, metal solder 32 and metal to be welded
33) it is sequentially placed into objective table 10, and by the briquetting 20 cooperated with objective table 10 configuration on part to be welded 30, so as to realize
Part to be welded 30 realizes soldering.
In addition, in some instances, objective table 10 can be in semi-cylindrical.In this case, it can preferably carry out
Soldering.For example, the objective table 10 of semi-cylindrical can be placed in the soldering tube furnace (not shown) with columned furnace body pipe
It is brazed.In addition, the shape of objective table 10 can be matched with the shape of the furnace body pipe of soldering tube furnace.In this case,
Be conducive to fixation of the jig in soldering tube furnace, can be preferably brazed.For example, the furnace body pipe of soldering tube furnace can be with
In prism-shaped, objective table 10 can also be in prism-shaped.
In addition, in the present embodiment, soldering tube furnace can connect vacuum pump (not shown).In some instances, pricker
Vacuum degree in Welded pipe type furnace (not shown) can be 10-4pa.It is true in soldering tube furnace (not shown) in other examples
Reciprocal of duty cycle can be 10-3pa.In addition, in another example, the vacuum degree in soldering tube furnace (not shown) can be 10-2pa。
In addition, in some instances, according to the solder (metal solder 32) of selection, being brazed true in tube furnace (not shown)
Reciprocal of duty cycle can also be 8 × 10-3pa、5×10-3pa、3×10-3pa、7×10-2pa、5×10-2pa、2×10-2Pa or 1pa.
In addition, in the present embodiment, objective table 10 can have the groove 11 and and groove for placing part to be welded
The through hole 12 (referring to fig. 4) of 11 bottom 11a perforation.In addition, in some instances, objective table 10 can have at least one
It groove (such as the groove 11 in Fig. 3, Fig. 3 show the example of four grooves) and is passed through from the bottom 11a of groove (groove 11)
Wear the through hole (through hole 12) of objective table 10.Wherein, groove 11 can be used for placing part to be welded 30 (including to be welded ceramic 31,
Metal solder 32 and metal 33 to be welded), and can cooperate with briquetting 20.In the case where multiple grooves are arranged in objective table 10,
It is able to carry out batch brazing, improves operating efficiency.
In the jig 1 involved in the disclosure, as described above, objective table 10 has the groove 11 for placing part to be welded 30
And the through hole 12 of the bottom 11a of perforation groove 11, in addition the groove 11 in briquetting 20 and objective table 10 cooperates, and briquetting
20 have venthole 21.In this case, gas flowing can be formed in through hole 12 and venthole 21, therefore be brazed
It can make 1 uniformity of temperature profile of jig in journey and be heated evenly part to be welded 30, and brazing process can be discharged in venthole 21
In the impurity such as generated metallic vapour, so that part to be welded 30 be avoided to be contaminated.
In some instances, the bottom 11a of groove 11 can be flat condition (referring to Fig. 3).As a result, in the bottom of groove 11
11a can smoothly place part to be welded 30.
In some instances, groove 11 can be in cylindrical shape.It in this case, can be especially suitable for also
Cylindric part to be welded 30.But present embodiment is without being limited thereto, in some instances, groove 11 can also be in prism-shaped etc..Example
Such as, in one example, groove 11 can also be in a rectangular parallelepiped shape.In another example, groove 11 can also be in cube-shaped.
In addition, in some instances, can have the flowing of hot gas in through hole 12, so as to make to carry in brazing process
Uniformity of temperature profile in object platform 10, and then make 30 thermally equivalent of part to be welded.In addition, the presence of through hole 12 can also be more easily
Clean groove 11.In addition, groove 11 can be used for placing part to be welded since through hole 12 can penetrate through the bottom 11a of groove 11
30, therefore through hole 12 can be conducive to pickup.
In addition, in some instances, jig 1 can also include the lid (not shown) of covering objective table 10.In this feelings
Under condition, atmosphere when soldering can be protected, vacuum degree can be maintained well.
In addition, in some instances, objective table 10 can have the groove 13 around groove 11, the side of lid (not shown)
Edge can cooperate with groove 13.Lid (not shown) can cover objective table 10 as a result,.In some instances, the edge of lid
It can engage with groove 13.
In the present embodiment, as shown in Figures 2 and 3, briquetting 20 can be the combination of two different cylindrical bodies of internal diameter
Body.In this briquetting 20, the diameter of the small cylindrical body of internal diameter is small, thus can cooperate with groove 11, and the cylinder that internal diameter is big
The diameter of body is big, thus can cover groove.In this case, applying to part to be welded 30 can be realized by briquetting 20
Pressure.In another example, briquetting 20 can be prism.In addition, in yet another example, briquetting 20 can be rotary table.Separately
Outside, in some instances, briquetting 20 is integrally formed.
In the present embodiment, venthole 21 can be set in briquetting 20.In addition, in some instances, briquetting 20
It can have multiple ventholes 21, such as briquetting 20 can have 2,3 ventholes 21.In this case, due to ventilation
Gas flowing can be formed in hole 21, so as to make uniformity of temperature profile in objective table 10 in brazing process, and then made to be welded
30 thermally equivalent of part.In addition, venthole 21 can also help that the impurity such as generated metallic vapour in brazing process are discharged, thus
Avoid part to be welded contaminated.
In some instances, in multiple ventholes 21, it can have the venthole 21 alongst penetrated through.At this
In the case of kind, the heated uniformity of part to be welded can be further increased, and can preferably avoid part to be welded contaminated.
In addition, in some instances, part to be welded 30 can be located between the bottom 11a and briquetting 20 of groove 11.As a result, can
It is fixed on part to be welded 30 well in groove 11.
In addition, in the present embodiment, the material of objective table 10 can be selected from graphite, silicon, compound stone, boron carbide, carbonization
At least one of silicon, boron nitride, silicon nitride, boron phosphide, phosphatization silicon are constituted.In one example, the material of objective table 10 can
Think graphite.In another example, the material of objective table 10 can be compound stone.
In addition, in the present embodiment, the material of briquetting 20 can selected from graphite, silicon, compound stone, boron carbide, silicon carbide,
At least one of boron nitride, silicon nitride, boron phosphide, phosphatization silicon are constituted.In one example, the material of briquetting 20 can be stone
Ink.In another example, the material of briquetting 20 can be compound stone.
In addition, in some instances, the temperature that the length and groove 11 of jig 1 can be distributed in soldering tube furnace is uniform
Warm area.Thereby, it is possible to be brazed well to multiple parts to be welded 30 simultaneously.
Fig. 4 shows the sectional view that the jig of part to be welded is equipped with involved in embodiments of the present invention.Fig. 5 is shown
The assembly structure figure of part to be welded involved in embodiments of the present invention.
In addition, in the present embodiment, in step s 30, as shown in figure 4, part to be welded 30 can be placed in objective table
In groove 11 on 10, then with briquetting 20 part to be welded 30 is pushed down, assembly can be completed.Then, the objective table 10 that assembles, pressure
Block 20 and part to be welded 30 are sent into such as soldering tube furnace and are brazed.In some instances, objective table 10, the briquetting 20 assembled
The uniform warm area of temperature of soldering tube furnace is admitted to part to be welded 30.Thereby, it is possible to carry out very to multiple parts to be welded 30 simultaneously
It is brazed well.
In addition, in some instances, the gap H between the side wall of the groove 11 of briquetting 20 and objective table 10 can be
0.05mm to 0.06mm (referring to fig. 4) can smoothly take out weldment when being brazed and completing in this case.In addition, such as
Upper described, objective table 10 can have multiple grooves 11, and thus, it is possible to be brazed simultaneously to multiple parts to be welded 30.For example, removing
Outside the diagram of Fig. 2 and Fig. 3, it can have 4,12,16 or 20 grooves in objective table 10.
In addition, in some instances, the sequence that each component of part to be welded 30 stacks from below to up in groove 11 can for
Weldering ceramics 31, metal solder 32 and metal 33 to be welded (referring to Fig. 5).For example, each component of part to be welded 30 in groove 11 from lower and
On the sequence that stacks can be circle Al2O3Ceramic bases, pure Au solder ring and pure Ti becket, and circle Al2O3Ceramic base
Bottom, pure Au solder ring are roughly the same with the overall diameter of pure Ti becket.
In addition, in the present embodiment, in step s 30, can be added to part to be welded 30 with 1 DEG C/min to 50 DEG C/min
Hot rate is warming up to 1060 DEG C to 1150 DEG C, 1min to 30min is kept the temperature, then with the rate of temperature fall of 2 DEG C/min to 20 DEG C/min
200 DEG C to 400 DEG C are cooled to, then cools to 150 DEG C or less with the furnace.Wherein, it can be used as soldering temperature for 1060 DEG C to 1150 DEG C
Degree.In this case, the generation and distribution of brittlement phase between interface can be improved, increase intensity, reduce thermal stress and base material
The crackle in weld seam is eliminated in thermal deformation, promotes the air-tightness and intensity of ceramics with the soldering interface of metal.
In addition, in some instances, in step s 30,1060 DEG C can be warming up to the rate of heat addition of 20 DEG C/min, protected
Warm 1min, is then cooled to 400 DEG C with the rate of temperature fall of 10 DEG C/min, then cools to 150 DEG C with the furnace.In other examples
In, it can be warming up to 1065 DEG C with the rate of heat addition of 15 DEG C/min, keep the temperature 3min, then cooled down with the rate of temperature fall of 12 DEG C/min
To 250 DEG C, 140 DEG C are then cooled to the furnace.In addition, in another example, can be warming up to the rate of heat addition of 30 DEG C/min
1100 DEG C, 5min is kept the temperature, then 300 DEG C is cooled to the rate of temperature fall of 8 DEG C/min, then cools to 120 DEG C with the furnace.
In addition, according to the solder (metal solder 32) of selection, brazing temperature can also for 850 DEG C, 900 DEG C, 950 DEG C,
1000 DEG C, 1050 DEG C, 1150 DEG C, 1200 DEG C etc..
Although above combine drawings and embodiments the disclosure is illustrated, it will be appreciated that on state
It is bright not limit the disclosure in any form.Those skilled in the art are without departing from the connotation and range of the disclosure
It can according to need and the disclosure is deformed and is changed, these deformations and variation are each fallen in the scope of the present disclosure.
Claims (10)
1. a kind of method for welding of ceramics and metal, it is characterised in that:
Include:
Prepare ceramics to be welded and metal to be welded, and the ceramics to be welded are surface-treated, so that the ceramics to be welded
Surface is formed as smooth surface；
Metalized is carried out on the surface of the ceramics to be welded, forms the intermediate metal layer with the Ceramic bond to be welded, institute
State the thermal expansion coefficient of ceramics to be welded and the matched coefficients of thermal expansion of the intermediate metal layer；And
The ceramic, metal solder to be welded is successively stacked and is brazed with the metal to be welded.
2. method for welding as described in claim 1, it is characterised in that:
The roughness on the surface of the ceramics to be welded is less than 0.05 μm.
3. method for welding as described in claim 1, it is characterised in that:
The method of the metalized is sputtering, vapor deposition, PVD, CVD, plating or high temperature sintering.
4. method for welding as described in claim 1, it is characterised in that:
The intermediate metal layer is selected from least one of Nb, Au, Ti and their alloy.
5. method for welding as described in claim 1, it is characterised in that:
The metal solder is selected from least one of Au, Ag, Ti, Nb and their alloy.
6. method for welding as described in claim 1, it is characterised in that:
The metal solder is flake.
7. method for welding as described in claim 1, it is characterised in that:
Before being brazed, the metal to be welded is surface-treated.
8. method for welding as claimed in claim 7, it is characterised in that:
It is polished step by step using sand paper to be surface-treated to the metal to be welded.
9. method for welding as described in claim 1, it is characterised in that:
In the soldering, 1060 DEG C to 1150 DEG C are warming up to the rate of heat addition of 1 DEG C/min to 50 DEG C/min, heat preservation 1min is extremely
30min, is then cooled to 200 DEG C to 400 DEG C with the rate of temperature fall of 2 DEG C/min to 20 DEG C/min, then cools to 150 DEG C with the furnace
Below.
10. method for welding as described in claim 1, it is characterised in that:
The ceramics to be welded are by being selected from aluminium oxide, zirconium oxide, silica, carbon materials, silicon nitride, silicon carbide, titanium oxide, sial
At least one of hydrochlorate or calcium aluminium system are constituted.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811650747.6A CN109734469A (en) | 2018-12-31 | 2018-12-31 | The method for welding of ceramics and metal |
| CN201922231700.2U CN211522037U (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
| CN201911266054.1A CN110776329A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
| CN201911268867.4A CN110776330A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
| CN201911268811.9A CN110734298A (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
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| CN201911268811.9A Pending CN110734298A (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
| CN201911266054.1A Pending CN110776329A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
| CN201911268867.4A Pending CN110776330A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
| CN201922231700.2U Active CN211522037U (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
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| CN201911266054.1A Pending CN110776329A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
| CN201911268867.4A Pending CN110776330A (en) | 2018-12-31 | 2019-12-11 | Brazing method of ceramic and metal |
| CN201922231700.2U Active CN211522037U (en) | 2018-12-31 | 2019-12-11 | Brazing structure of ceramic and metal |
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| CN112975032A (en) * | 2021-02-23 | 2021-06-18 | 浙江浙能兰溪发电有限责任公司 | Brazing method of silicon carbide ceramic |
| CN112975032B (en) * | 2021-02-23 | 2022-09-27 | 浙江浙能兰溪发电有限责任公司 | Brazing method of silicon carbide ceramic |
| CN112851389A (en) * | 2021-04-14 | 2021-05-28 | 哈尔滨工业大学 | Method for connecting SiC ceramic material by using calcium oxide/aluminum oxide/silicon dioxide/lithium oxide glass solder |
| CN112851389B (en) * | 2021-04-14 | 2022-03-15 | 哈尔滨工业大学 | A method for connecting SiC ceramic materials using calcium oxide/alumina/silicon dioxide/lithium oxide glass solder |
| CN114105669A (en) * | 2021-11-11 | 2022-03-01 | 南京理工大学 | Composite manufacturing and stress releasing method of engine ceramic-clad cylinder liner |
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| CN115302033A (en) * | 2022-08-22 | 2022-11-08 | 哈尔滨工业大学（威海） | Low-temperature indirect brazing method for zirconia ceramic and titanium alloy |
| CN115302033B (en) * | 2022-08-22 | 2023-11-21 | 哈尔滨工业大学（威海） | Low-temperature indirect brazing method for zirconia ceramic and titanium alloy |
| CN115625394A (en) * | 2022-12-21 | 2023-01-20 | 中国机械总院集团北京机电研究所有限公司 | Active brazing method for large-size graphite/copper dissimilar material joint |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110734298A (en) | 2020-01-31 |
| CN110776329A (en) | 2020-02-11 |
| CN110776330A (en) | 2020-02-11 |
| CN211522037U (en) | 2020-09-18 |
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