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CN109687184B - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN109687184B
CN109687184B CN201811513250.XA CN201811513250A CN109687184B CN 109687184 B CN109687184 B CN 109687184B CN 201811513250 A CN201811513250 A CN 201811513250A CN 109687184 B CN109687184 B CN 109687184B
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conductor
electrical connector
elastic arm
conductive
circuit board
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CN109687184A (zh
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何建志
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Abstract

本发明公开了一种电连接器，安装于一电路板上用以对接一芯片模块，包括：一绝缘本体，设有至少一收容孔；至少一导电端子，收容于所述收容孔，所述导电端子具有一导接部；至少一导电体，设于所述导接部的下方，用以接触所述导接部以及电性连接于所述电路板。所述导电体收容在所述绝缘本体的所述容纳槽中，所述导电体与所述导电端子的位置在水平方向上相对固定，且所述导电体更加耐磨，所述导电体不会由于与所述导电端子刮擦而影响导电性能。仅使用一个所述导电体电性连接所述导电端子和所述焊料或电路板，不会产生额外的电容效应，有助于调控导电通路的阻抗。

Description

电连接器
【技术领域】
本发明涉及一种电连接器，尤指一种安装于电路板上的电连接器。
【背景技术】
申请号为CN201020129222.0的中国专利公开了一种将芯片模块电性连接至印刷电路板的电连接模块，包括一电连接器和位于电连接器与电路板之间的基板。电连接器包括一绝缘本体和收容在绝缘本体中的多个导电端子；基板由软性材料制成，其上表面设有上导电单元接触导电端子，其下表面设有下导电单元通过锡块焊接在印刷电路板，上、下导电单元通过一导电通道连接。上导电单元凸出暴露在基板的上表面，且基板与电连接器并未相互固定，当基板对接安装于电连接器时，上导电单元容易被导电端子刮擦磨损，影响电性连接。上、下导电单元本身也具有容易从基板上脱落的风险。再者，所述上、下导电单元上下重叠，会形成额外的电容效应，从而影响整个导电通路的阻抗。
因此，有必要设计一种改良的电连接器，以克服上述问题。
【发明内容】
针对背景技术所面临的问题，本发明提供了一种导电端子与电路板之间通过一导电体相互电性连接的电连接器。
为实现上述目的，本发明采用以下技术手段：
一种电连接器，安装于一电路板上用以对接一芯片模块，包括：一绝缘本体，设有至少一收容孔；至少一导电端子，收容于所述收容孔，所述导电端子具有一导接部；至少一导电体，设于所述导接部的下方，用以接触所述导接部以及电性连接于所述电路板。
进一步地，所述绝缘本体的下表面向上凹设至少一容纳槽，所述容纳槽位于所述收容孔的下方并连通所述收容孔，所述导电体固定于所述容纳槽中。
进一步地，所述收容孔的底面向下凹陷有自上而下逐渐收缩的一凹部，所述凹部连通所述容纳槽，所述导接部进入所述凹部。
进一步地，所述导电体为金属材质。
进一步地，所述导电体通过一焊料连接所述电路板。
进一步地，所述导接部与所述导电体之间具有一间隙；当所述芯片模块下压所述接触部，所述导电端子向下移动，所述导接部向下抵接所述导电体。
进一步地，所述导电端子具有一基部，所述基部的上方向上倾斜延伸一上弹臂，所述上弹臂具有向下弯折延伸一接触部，所述接触部用以接触所述芯片模块，所述接触部下方连接有一第一抵接部；所述基部的下方设有向下倾斜延伸一下弹臂，所述下弹臂与所述上弹臂相对于所述基部同向延伸，所述下弹臂向上弯折延伸所述导接部，所述导接部上方连接有一第二抵接部。
进一步地，所述上弹臂在所述接触部与所述第一抵接部之间设有一开槽；所述下弹臂在所述导接部与所述第二抵接部之间设有一开口。
进一步地，所述收容孔的一端壁凸设有一挡块，所述下弹臂具有连接于所述基部下方的一挡部，所述挡部向端壁凸出，并位于所述挡块的下方；所述收容孔在所述基部的一侧凹设有一限位槽，所述基部凸伸一限位部收容于所述限位槽中。
进一步地，仅当所述芯片模块向下压接所述导电端子时，所述第一抵接部接触所述第二抵接部。
与现有技术相比，本发明具有以下有益效果：所述导电体收容在所述绝缘本体的所述容纳槽中，所述导电体与所述导电端子的位置在水平方向上相对固定，且所述导电体更加耐磨，所述导电体不会由于与所述导电端子刮擦而影响导电性能。仅使用一个所述导电体电性连接所述导电端子和所述焊料或电路板，不会产生额外的电容效应，有助于调控导电通路的阻抗。
一种电连接器，安装于一电路板上，包括：一绝缘本体，设有至少一收容孔；至少一导电端子，收容于所述收容孔，所述导电端子具有一导接部；一柔性基板，位于所述绝缘本体的下方；至少一导电体，设于所述柔性基板并位于所述导接部的下方，且所述导电体显露于所述柔性基板的表面，以电性连接所述导接部和所述电路板。
进一步地，所述柔性基板由两层柔性子板相互贴合组成，所述导电体固定于所述二柔性子板之间，所述柔性基板的上表面和下表面向所述导电体凹陷形成二凹槽，使所述导电体显露。
进一步地，所述导电体的上表面接触所述导接部，下表面通过一焊料焊接于所述电路板。
进一步地，所述绝缘本体向下凸伸多个定位块抵接所述柔性基板的边缘，以限制所述柔性基板水平移动。
进一步地，所述导电端子具有一基部，所述基部的上方向上倾斜延伸一上弹臂，所述上弹臂具有向下弯折延伸一接触部，所述接触部用以接触一芯片模块，所述接触部下方连接有一第一抵接部；所述基部的下方设有向下倾斜延伸一下弹臂，所述下弹臂与所述上弹臂相对于所述基部同向延伸，所述下弹臂向上弯折延伸所述导接部，所述导接部上方连接有一第二抵接部。
与现有技术相比，本发明具有以下有益效果：所述导电体固定在所述柔性基板中，所述柔性基板被所述绝缘本体的下表面的定位柱和定位块限制了水平位移，故所述导电体与所述导电端子的位置在水平方向上相对固定，且所述导电体更加耐磨，所述导电体不会由于与所述导电端子刮擦而影响导电性能。仅使用一个所述导电体电性连接所述导电端子和所述焊料或电路板，不会产生额外的电容效应，有助于调控导电通路的阻抗。
【附图说明】
图1为本发明电连接器第一实施例的立体图；
图2为图1中的电连接器翻转180°后的立体图；
图3为图1中的电连接器在芯片模块下压前的主视图；
图4为图3中的电连接器在芯片模块下压后的示意图；
图5为电连接器第二实施例的示意图；
图6为图5中的电连接器在芯片模块下压后的示意图；
图7为电连接器第三实施例的立体图；
图8为图7中的电连接器翻转180°后的立体图；
图9为图7中的绝缘本体、柔性基板与电路板的立体分解图；
图10为图7中的电连接器在芯片模块下压前的主视图；
图11为图10中的电连接器在芯片模块下压后的示意图；
具体实施方式的附图标号说明：
电连接器100,200,300 绝缘本体1 收容孔11 挡块111
限位槽112 凹部113 容纳槽12 定位柱13
定位块14 导电端子2 基部21 上弹臂22
接触部221 第一抵接部222 开槽223 下弹臂23
导接部231 第二抵接部232 开口233 挡部234
限位部24 连料部25 导电体3 焊料4
柔性基板5 凹槽50 定位孔51 间隙G
芯片模块A 电路板B
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
如图1至图4所示，为本发明的电连接器100的第一实施例，用以将一芯片模块A电性连接至一电路板B。所述电连接器100包括一绝缘本体1，收容在所述绝缘本体1的多个导电端子2，以及固定于所述绝缘本体1的多个导电体3，多个所述导电体3与多个所述导电端子2逐一对应，并位于所述导电端子2的下方。所述电连接器100通过所述导电端子2接触所述芯片模块A，所述导电体3接触所述导电端子2的下端，所述导电体3通过焊料4连接于所述电路板B的方式实现将所述芯片模块A电性连接至所述电路板B。
如图1和图2所示，所述绝缘本体1由绝缘材料制成，大致呈一长方体，具有自其上表面向下凹陷的收容所述导电端子2的多个收容孔11，以及自其下表面向上凹陷的收容所述导电体3的多个容纳槽12，多个所述收容孔11和多个所述容纳槽12逐一上下对应，且所述容纳槽12连通于所述收容孔11的下方。
如图1和图3所示，所述收容孔11大致呈长方体形，在所述收容孔11的水平纵长方向的一端壁上具有凸出的挡块111，用以限制所述导电端子2过度向上移动；与所述端壁相邻连接的两侧壁具有凹陷的二限位槽112，用以限制所述导电端子2过度向下移动。所述二限位槽112对称设置。所述收容孔11的底面向下凹陷有自上而下宽度逐渐收缩的呈漏斗形状的一凹部113，所述凹部113向下连通所述容纳槽12。如图2所示，在本实施例中所述容纳槽12大致呈一正方体，收容所述导电体3和所述焊料4。所述容纳槽12的顶壁被所述凹部113所贯通。
如图1和图3所示，所述导电端子2大致呈C字形，由金属材料制成。所述导电端子2具有平板状的一基部21，所述基部21的上方连接有向上倾斜延伸的一上弹臂22，所述上弹臂22的顶端具有向下弯折延伸的一接触部221，所述接触部221用以接触所述芯片模块A的导电垫片(未标号)，所述接触部221下方连接有一第一抵接部222，所述上弹臂22自所述接触部221到所述第一抵接部222设有一开槽223，所述开槽223将所述接触部221分为两部分，使得所述接触部221与所述芯片模块A之间具有两个不同的接触点，所述接触部221与所述第一抵接部222之间的所述上弹臂22向远离所述基部21的方向弯折并抵接于所述绝缘本体1；所述基部21的下方连接有向下倾斜延伸的一下弹臂23，所述下弹臂23与所述上弹臂22相对于所述基部21同向延伸，所述下弹臂23具有连接于所述基部21下方的一挡部234，所述挡部234向端壁凸出并位于所述挡块111的下方以限制所述导电端子2过度向上移动，所述下弹臂23的底端具有向上弯折延伸的一导接部231，用以通过所述凹部113接触所述导电体3，所述导接部231上方连接有一第二抵接部232，在本实施例中，所述芯片模块A下压对接之前，所述第二抵接部232不接触所述第一抵接部222(在其它实施例中，所述芯片模块A下压对接前，所述第二抵接部232与所述第一抵接部222预先相互接触)，所述下弹臂23自所述导接部231到所述第二抵接部232设有一开口233，所述开口233将所述导接部231分为两部分，使得所述导接部231与所述导电体3之间具有两个不同的接触点，所述导接部231与所述第二抵接部232之间的所述下弹臂23向远离所述基部21的方向弯折并抵接于所述绝缘本体1。在本实施例中，所述上弹臂22和所述下弹臂23上下对称。所述基部21的两侧凸设二限位部24，所述限位槽112收容所述二限位部24限制所述导电端子2过度向下移动，所述限位部24向上延伸有用以连接料带(未图示)的连料部25。
如图1和图2所示，在本实施例中，所述导电体3呈扁平的板状长方体，由金属板材制成，优选地所述导电体3的材质为铜合金，且所述导电体3相对于所述导电端子2更耐摩擦；当然在其他实施例中所述导电体3的材质可以为其它能够满足其导电性能的合金或导电材料，并不以此为限。所述导电体3组装在所述容纳槽12中，所述导电体3可通过粘胶固定于所述容纳槽12，也可通过干涉所述绝缘本体1固定于所述容纳槽12内。在其他实施例中，所述导电体3可与所述绝缘本体1注塑成型。所述导电体3的尺寸大于所述凹部113在所述容纳槽12的顶壁的开孔的尺寸，故所述导电体3被所述容纳槽12的顶壁所限位而无法进入所述收容孔11。所述导电体3的上表面抵接所述导接部231，所述导电体3的下表面焊接所述焊料4，所述焊料4焊接于所述电路板B的导电垫片(未标号)。
在本实施例中，所述焊料4为锡球。在其他实施例中所述焊料4亦可为锡膏。所述焊料4可预先固定于所述电路板B上，也可以预先固定于所述导电体3，或者以其它方式加设其它形式的焊料4。
在所述芯片模块A下压对接于所述电连接器100前，所述基部21可在所述收容孔11中沿上下方向适度移动，但所述导接部231保持与所述导电体3的接触，如此设置以保证所述导接部231与所述导电体3实现稳定接触。
如图4所示，所述芯片模块A下压对接于安装在所述电路板B上的所述电连接器100。所述焊料4经过焊接熔融后完全收容在所述容纳槽12内，所述绝缘本体1向下抵靠于所述电路板B，所述导电体3的下表面通过所述焊料4焊接于所述电路板B；当所述芯片模块A完全下压时，所述芯片模块A向下抵靠于所述绝缘本体1，所述芯片模块A抵接所述接触部221，所述第一抵接部222向下抵接所述第二抵接部232，从而在所述芯片模块A与所述电路板B之间形成依次经由所述芯片模块A、所述接触部221、所述上弹臂22、所述基部21、所述下弹臂23、所述导接部231、所述导电体3、所述电路板B的第一导电通路，以及依次经由所述芯片模块A、所述接触部221、所述第一抵接部222、所述第二抵接部232、所述导接部231、所述导电体3、所述电路板B的第二导电通路，该第一导电通路与第二导电通路为并联设置，具有较小的自感应效应，减小了所述芯片模块A与所述电路板B间电讯传输时的电阻抗，进而确保了所述芯片模块A与所述电路板B间良好的电性导接及电讯传输性能。
如图5和图6所示，为本发明的电连接器200的第二实施例，其与第一实施例的区别主要在于：所述芯片模块A下压前，所述导接部231与所述导电体3之间具有间隙G，即所述导接部231与所述导电体3不接触。所述导电端子2可在所述收容孔11中上下适度移动，且上下移动的距离大于所述间隙G，仅当所述芯片模块A向下压接所述导电端子2时，所述导接部231接触所述导电体3。
如图7至图11所示，为本发明的电连接器300的第三实施例，其与第一实施例的区别主要在于，所述绝缘本体1不具有用以收容固定所述导电体3的容纳槽12，所述收容孔11自所述绝缘本体1的上表面贯穿所述绝缘本体1的下表面，所述导接部231凸出所述绝缘本体1的下表面；所述绝缘本体1与所述电路板B之间设置有一柔性基板5，所述导电体3固定于所述柔性基板5中。在本实施例中，所述导电体3呈圆形片状。
如图9和图10所示，所述柔性基板5由绝缘材料制成，在本实施例中优选采用麦拉(mylar)，所述柔性基板5由两层柔性子板(未标号)上下相互贴合组成，所述导电体3被所述二柔性子板夹持在所述收容孔11的下方，所述导电体3显露于所述柔性基板5的外表面，即所述柔性基板5的上表面和下表面同时向所述导电体3凹陷形成二凹槽50，因此所述导接部231得以通过所述导电体3上方的所述凹槽50抵接所述导电体3的上表面，所述焊料4填充所述导电体3下方的所述凹槽50接触所述导电体3的下表面并使所述导电体3电性连接所述电路板B，以此实现所述导电端子2与所述电路板B的电性连接。在其它实施例中，所述导电体3可直接抵接于所述电路板B的导电垫片以实现电性连接，无需焊接所述焊料4。
如图9所示，所述柔性基板5的形状与所述绝缘本体1的下表面的形状相似。所述绝缘本体1的下表面的向下凸伸有大小不同的两个定位柱13，所述绝缘本体1的下表面的四周向下凸设条状的多个定位块14，所述二定位柱13位于所述绝缘本体1的下表面的两个对角，所述柔性基板5具有对应所述二定位柱13所开设的大小不同的两个定位孔51，所述二定位孔51大小分别与所述二定位柱13的大小匹配。如图10所示，所述柔性基板5组装贴覆在所述绝缘本体1的下表面，大小不同的所述二定位柱13对应穿过与之匹配的所述二定位孔51，起防呆作用，且多个所述定位块14的内侧抵接所述柔性基板5的多个边缘，在水平方向上固持所述柔性基板5，避免所述柔性基板5水平位移，使得所述导电体3在上下方向上对准所述导接部231。在本实施例中，所述定位柱13还贯穿了所述电路板B(辅助参阅图8)。
本发明的电连接器具有以下有益效果：
在第一实施例和第二实施例中，所述导电体3收容在所述绝缘本体1的所述容纳槽12中，所述导电体3与所述导电端子2的位置在水平方向上相对固定，且所述导电体3更加耐磨；在第三实施例中，所述导电体3固定在所述柔性基板5中，所述柔性基板5被所述绝缘本体1的下表面的定位柱13和定位块14限制了水平位移，故所述导电体3与所述导电端子2的位置在水平方向上相对固定，且所述导电体3更加耐磨，因此在各实施例中，所述导电体3不会由于与所述导电端子2刮擦而影响导电性能。
仅使用一个所述导电体3电性连接所述导电端子2和所述焊料4或电路板B，不会产生额外的电容效应，有助于调控导电通路的阻抗。
所述焊料4焊接于平板状的所述导电体3，相比于直接焊接于向上弯折的所述导接部231，所述焊料4不容易断裂，所述导接部231再压接于所述导电体3，能够保证所述导电端子2稳定地电性连接所述电路板B。
可通过改变所述导电体3的阻抗来调节整个导电通路的阻抗，相比于通过改变所述导电端子2来调节整个导电通路的阻抗，更容易实施。
以上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明的专利范围，所以，凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本发明的专利范围内。

Claims (13)

1.一种电连接器，安装于一电路板上用以对接一芯片模块，其特征在于，包括：
一绝缘本体，设有至少一收容孔；
至少一导电端子，收容于所述收容孔，所述导电端子具有一基部，所述基部的上方设有向上倾斜延伸一上弹臂，所述上弹臂具有一接触部用以接触所述芯片模块，所述基部的下方设有向下倾斜延伸一下弹臂，所述下弹臂具有一导接部；
至少一导电体，设于所述导接部的下方，用以接触所述导接部以及电性连接于所述电路板；
所述导接部与所述导电体之间具有一间隙；当所述芯片模块下压所述接触部，所述导电端子向下移动，所述导接部向下抵接所述导电体。
2.如权利要求1所述的电连接器，其特征在于：所述绝缘本体的下表面向上凹设至少一容纳槽，所述容纳槽位于所述收容孔的下方并连通所述收容孔，所述导电体固定于所述容纳槽中。
3.如权利要求2所述的电连接器，其特征在于：所述收容孔的底面向下凹陷有自上而下逐渐收缩的一凹部，所述凹部连通所述容纳槽，所述导接部进入所述凹部。
4.如权利要求1所述的电连接器，其特征在于：所述导电体为金属材质。
5.如权利要求1所述的电连接器，其特征在于：所述导电体通过一焊料连接所述电路板。
6.如权利要求1所述的电连接器，其特征在于：所述接触部向下弯折延伸，所述接触部下方连接有一第一抵接部；所述下弹臂与所述上弹臂相对于所述基部同向延伸，所述导接部向上弯折延伸，所述导接部上方连接有一第二抵接部。
7.如权利要求6所述的电连接器，其特征在于：所述上弹臂在所述接触部与所述第一抵接部之间设有一开槽；所述下弹臂在所述导接部与所述第二抵接部之间设有一开口。
8.如权利要求6所述的电连接器，其特征在于：所述收容孔的一端壁凸设有一挡块，所述下弹臂具有连接于所述基部下方的一挡部，所述挡部向端壁凸出，并位于所述挡块的下方；所述收容孔在所述基部的一侧凹设有一限位槽，所述基部凸伸一限位部收容于所述限位槽中。
9.如权利要求6所述的电连接器，其特征在于：仅当所述芯片模块向下压接所述导电端子时，所述第一抵接部接触所述第二抵接部。
10.一种电连接器，安装于一电路板上，其特征在于，包括：
一绝缘本体，设有至少一收容孔；
至少一导电端子，收容于所述收容孔，所述导电端子具有一基部，所述基部的上方设有向上倾斜延伸一上弹臂，所述上弹臂具有一接触部用以接触一芯片模块，所述基部的下方设有向下倾斜延伸一下弹臂，所述下弹臂具有一导接部；
一柔性基板，位于所述绝缘本体的下方，所述柔性基板由两层柔性子板相互贴合组成；
至少一导电体，固定于两层所述柔性子板之间并位于所述导接部的下方，且所述柔性基板的上表面和下表面向所述导电体凹陷形成二凹槽使所述导电体显露于所述柔性基板的表面，以电性连接所述导接部和所述电路板。
11.如权利要求10所述的电连接器，其特征在于：所述导电体的上表面接触所述导接部，下表面通过一焊料焊接于所述电路板。
12.如权利要求10所述的电连接器，其特征在于：所述绝缘本体向下凸伸多个定位块抵接所述柔性基板的边缘，以限制所述柔性基板水平移动。
13.如权利要求10所述的电连接器，其特征在于：所述接触部向下弯折延伸，所述接触部下方连接有一第一抵接部；所述下弹臂与所述上弹臂相对于所述基部同向延伸，所述导接部向上弯折延伸，所述导接部上方连接有一第二抵接部。
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