CN109246923A - A kind of pcb board and a kind of electronic equipment - Google Patents
A kind of pcb board and a kind of electronic equipment Download PDFInfo
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- CN109246923A CN109246923A CN201811172997.3A CN201811172997A CN109246923A CN 109246923 A CN109246923 A CN 109246923A CN 201811172997 A CN201811172997 A CN 201811172997A CN 109246923 A CN109246923 A CN 109246923A
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- 239000003990 capacitor Substances 0.000 claims abstract description 131
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 230000004044 response Effects 0.000 abstract description 11
- 230000001052 transient effect Effects 0.000 abstract description 11
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
本发明公开了一种PCB板，包括基板；位于基板表面的电源，以及沿电流方向依次设置的内存条以及芯片；位于基板表面且与芯片相对设置的第一电容；其中，第一电容与芯片引脚电连接，第一电容的电容值的取值范围为423μF至517μF，包括端点值。由于芯片距离电源较远，流经芯片的电流容易发生波动，而第一电容的电容值较高，可以储存更多的电能，且第一电容与芯片会在基板的表面相对设置，从而使得第一电容与芯片的引脚距离非常近。当流经芯片的电流发生波动时，第一电容可以及时的向芯片供电，从而改善设置有内存条的PCB板中电源的瞬态响应。本发明还提供了一种电子设备，同样具有上述有益效果。
The invention discloses a PCB board, comprising a substrate; a power supply located on the surface of the substrate, a memory bank and a chip arranged in sequence along the current direction; a first capacitor located on the surface of the substrate and opposite to the chip; wherein, the first capacitor is connected to the chip The pins are electrically connected, and the capacitance value of the first capacitor ranges from 423 μF to 517 μF, including the endpoint value. Since the chip is far away from the power supply, the current flowing through the chip is prone to fluctuate, and the capacitance value of the first capacitor is higher, which can store more electric energy, and the first capacitor and the chip are arranged opposite to the surface of the substrate, so that the A capacitor is very close to the pins of the chip. When the current flowing through the chip fluctuates, the first capacitor can supply power to the chip in time, thereby improving the transient response of the power supply in the PCB board provided with the memory module. The present invention also provides an electronic device, which also has the above beneficial effects.
Description
Technical field
The present invention relates to technical field of integrated circuits, more particularly to a kind of pcb board and a kind of electronic equipment.
Background technique
As the continuous progress of science and technology, the structure and manufacture craft of PCB (printed circuit board) have been achieved in recent years
Greatly development.
At this stage, either server either home computer, memory bar is all essential component, and in existing rank
Section is provided in the pcb board of memory bar, is provided with the power supply for being responsible for powering to memory bar and for controlling to memory bar
The chip of system.
But in the prior art, for being provided with the pcb board of memory bar, wherein the transient response of power supply is usually poor,
When transition occurs for the electric current for the power supply output being provided in the pcb board of memory bar, the voltage of output generally can not be controlled in spy
Determine in range of tolerable variance, is unable to bear capable of holding at it for multiple, fast frequency so as to cause the electronic equipment for being provided with above-mentioned pcb board
It is switched between the maximum functional intensity received, is easy to hang extremely so as to cause the system of electronic equipment, influences the experience of user.
So the transient response for how improving power supply in the pcb board for be provided with memory bar is that those skilled in the art are badly in need of solution
Certainly the problem of.
Summary of the invention
The object of the present invention is to provide a kind of pcb board, it can effectively solve the problems, such as that pcb board transient response is not up to standard；This
The another object of invention is to provide a kind of electronic equipment, and the transient response which does the pcb board used is up to standard.
In order to solve the above technical problems, the present invention provides a kind of pcb board, comprising:
Substrate；
Positioned at the power supply of the substrate surface；
Positioned at the substrate surface, and the memory bar and chip set gradually along current direction；
Positioned at the substrate surface and the first capacitor that is oppositely arranged with the chip；Wherein, the first capacitor and institute
Chip pin electrical connection is stated, the value range of the capacitance of the first capacitor is 423 μ F to 517 μ F, including endpoint value.
Optionally, the pcb board further include:
Positioned at the substrate surface, and the second capacitor being electrically connected with the pin of the memory bar；Wherein, second electricity
Hold the distance between described memory bar and is not more than 20mil；The value range of the capacitance of second capacitor be 19.8 μ F extremely
24.2 μ F, including endpoint value.
Optionally, the pcb board includes multiple memory bars；Multiple memory bars are parallel to each other, second electricity
Hold between the adjacent memory bar.
Optionally, the pcb board further include:
Positioned at the substrate surface, and the third capacitor being electrically connected with the pin of the power supply；Wherein, the third capacitor
The distance between described power supply is not more than 20mil；The value range of the capacitance of the third capacitor is 9 μ F to 11 μ F, packet
Include endpoint value.
Optionally, the pcb board further include:
Positioned at the substrate surface, and the 4th capacitor being electrically connected with the pin of the power supply；Wherein, the 4th capacitor
The distance between described power supply is not more than 20mil；The value range of the capacitance of 4th capacitor is 42.3 μ F to 51.7 μ
F, including endpoint value.
Optionally, the power supply, the memory bar and the chip are located at the same surface of the substrate.
The present invention also provides a kind of electronic equipment, including pcb board as described in any one of the above embodiments.
A kind of pcb board provided by the present invention, including substrate；Positioned at the power supply of the substrate surface；Positioned at the substrate
Surface, and the memory bar and chip set gradually along current direction；Positioned at the substrate surface and opposite with the chip set
The first capacitor set；Wherein, the first capacitor is electrically connected with the chip pin, the value of the capacitance of the first capacitor
Range is 423 μ F to 517 μ F, including endpoint value.Due to said chip apart from power supply farther out, the electric current for flowing through chip is easy to happen
Fluctuation, and the capacitance of above-mentioned first capacitor is higher, can store more electric energy, and the first capacitor and chip can be in substrates
Surface be oppositely arranged so that the pin of first capacitor and chip distance it is very close.When wave occurs for the electric current for flowing through chip
When dynamic, first capacitor can timely power to chip, to ensure that the stabilization for flowing through chip current, and then improve and be provided with
The transient response of power supply in the pcb board of memory bar.
The present invention also provides a kind of electronic equipment, since the electronic equipment is provided with PCB provided by aforementioned present invention
Plate is no longer repeated herein so that the electronic equipment equally has above-mentioned beneficial effect.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of pcb board in the prior art；
Fig. 2 is a kind of overlooking structure diagram of pcb board provided by the embodiment of the present invention；
Fig. 3 is a kind of positive structure diagram of pcb board provided by the embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of specific pcb board provided by the embodiment of the present invention.
In figure: 1. substrates, 2. power supplys, 3. memory bars, 4. chips, 5. first capacitors, 6. second capacitors, 7. third capacitors,
8. the 4th capacitor.
Specific embodiment
Core of the invention is to provide a kind of pcb board.Referring to Fig. 1, in the prior art, for being provided with memory bar
Pcb board, in order to simplify design procedure, the electricity that usually will need to be electrically connected to each other with the pin of the pin of memory bar and chip
It is installed with and sets in the void spaces distant apart from chip, example a-quadrant as shown in figure 1, wherein it is generally necessary to be electrically connected with chip pin
, bulky capacitor of the capacitance in 470 μ F or so can be also arranged in the a-quadrant so that the bulky capacitor at a distance from chip farther out.
Since the electric current flowed out from power supply needs just flow through chip by longer distance, when the voltage transient frequent switching of power supply
When, will lead to flow through chip electric current be easy to happen larger fluctuation either voltage power down the case where；Simultaneously because above-mentioned big electricity
Hold apart from chip farther out, usually can not timely power to chip, to influence the transient response of power supply in pcb board.
And a kind of pcb board provided by the present invention, including substrate；Positioned at the power supply of the substrate surface；Positioned at the base
Plate surface, and the memory bar and chip set gradually along current direction；Positioned at the substrate surface and opposite with the chip
The first capacitor of setting；Wherein, the first capacitor is electrically connected with the chip pin, and the capacitance of the first capacitor takes
It is worth range for 423 μ F to 517 μ F, including endpoint value.Due to said chip apart from power supply farther out, flow through chip electric current be easy hair
Raw fluctuation, and the capacitance of above-mentioned first capacitor is higher, can store more electric energy, and the first capacitor and chip can be in bases
The surface of plate is oppositely arranged, so that the pin of first capacitor and chip distance is very close.When the electric current for flowing through chip occurs
When fluctuation, can timely it power to chip, to ensure that the stabilization for flowing through chip current, so as to improve memory bar is provided with
Pcb board in power supply transient response.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 2 and Fig. 3 is please referred to, Fig. 2 is a kind of overlooking structure diagram of pcb board provided by the embodiment of the present invention；
Fig. 3 is a kind of positive structure diagram of pcb board provided by the embodiment of the present invention.
Referring to fig. 2 and Fig. 3, in embodiments of the present invention, the pcb board includes substrate 1；Positioned at 1 surface of substrate
Power supply 2；Positioned at 1 surface of substrate, and the memory bar 3 and chip 4 set gradually along current direction；Positioned at the substrate
1 surface and the first capacitor 5 being oppositely arranged with the chip 4；Wherein, the first capacitor 5 is electrically connected with 4 pin of chip
It connects, the value range of the capacitance of the first capacitor 5 is 423 μ F to 517 μ F, including endpoint value.
Aforesaid substrate 1 is the substrate of pcb board, specific material and the design parameter of the substrate 1 in relation to the substrate 1 etc.
In embodiments of the present invention and it is not specifically limited, it is depending on the circumstances.It should be noted that in embodiments of the present invention,
For the usually tool of substrate 1 there are two the surface that electronic component can be set, above-mentioned two surfaces that electronic component can be set are logical
It is often two opposite surfaces in substrate 1.
Above-mentioned power supply 2 is arranged on 1 surface of substrate, can provide to other devices for being located at 1 surface of substrate from the power supply 2
Electric current.Since in embodiments of the present invention, above-mentioned power supply 2 needs to power to memory bar 3 and chip 4, corresponding above-mentioned power supply 2
Provided voltage is usually in 1.2V or so, and the model of the power supply 2 is usually PVDDQ.Specific structure in relation to the power supply 2 can
To refer to the prior art, do not repeated in embodiments of the present invention.
The surface of aforesaid substrate 1 is additionally provided with memory bar 3 and chip 4.Wherein, above-mentioned memory bar 3 is at this stage
DIMM, and said chip 4 is usually the CPU of entire server or household host.In embodiments of the present invention, above-mentioned memory bar 3
And chip 4 is the current direction setting along 1 surface of substrate, i.e., can first pass through memory bar by the electric current that above-mentioned power supply 2 is issued
3, using CPU.Under normal conditions, above-mentioned memory bar 3 and the distance between power supply 2 are smaller, and said chip 4 and power supply 2 it
Between distance it is larger.
Preferably, in order to simplify the production of pcb board provided by the embodiment of the present invention, above-mentioned power supply 2, above-mentioned memory
Item 3 and said chip 4 can be located at the same surface of aforesaid substrate 1, consequently facilitating in pcb board signal wire setting.It needs
What is illustrated is, it is generally the case that the closer device of distance in pcb board, between signal line length it is shorter.
By being filtered for the electric current issued to power supply 2, while avoiding can be to device when electric current fluctuates
It damages, is electrically connected capacitor with the pin of the electronic component on 1 surface of substrate usually requiring to be arranged at this stage.Usual situation
Under, capacitor needs and corresponding pins in parallel in corresponding electronic component.In embodiments of the present invention, it is set on 1 surface of substrate
It is equipped with first capacitor 5, the value range of the capacitance of the first capacitor 5 is 423 μ F electric to 517 μ F, including endpoint value, i.e., first
423 μ F or 517 μ F can be exactly by holding 5 capacitance.Under normal conditions, the first capacitor 5 in embodiments of the present invention
Capacitance is 470 μ F.
The above-mentioned needs of first capacitor 5 are oppositely arranged with said chip 4 about substrate 1, and even said chip 4 is located at substrate 1
First surface, then the first capacitor 5 needs to be located at the second surface opposite with first surface in substrate 1, and first capacitor 5 needs
To be located at region corresponding with chip 4 in second surface.The above-mentioned needs of first capacitor 5 are electrically connected with the pin of chip 4, usually
In the case of, which can be electrically connected by the via hole being arranged in substrate 1 with the pin of chip 4.
It should be noted that the capacitance of first capacitor 5 is larger in embodiments of the present invention, there is stronger storage energy
Power, while the first capacitor 5 is very close at a distance from chip 4, can timely power to chip 4 when current fluctuation.Usually
In the case of, it is only necessary to be electrically connected to each other with a first capacitor 5 for chip 4；But since chip 4 has multiple pins, usually
In the case of chip 4 need with it is multiple with different capacitances capacitors electrical connections, wherein the most of capacitor being electrically connected with chip 4
Capacitance be respectively less than 100 μ F, said chip 4 mostly just needs to be electrically connected with a first capacitor 5.
Preferably, the capacitor that above-mentioned needs are electrically connected with chip 4 can be set in 1 surface of substrate with above-mentioned core
The opposite region of piece 4.
A kind of pcb board provided by the embodiment of the present invention, including substrate 1；Power supply 2 positioned at 1 surface of substrate；It is located at
1 surface of substrate, and the memory bar 3 and chip 4 set gradually along current direction；Positioned at 1 surface of substrate and with institute
State the first capacitor 5 that chip 4 is oppositely arranged；Wherein, the first capacitor 5 is electrically connected with 4 pin of chip, first electricity
Hold the value range of 5 capacitance for 423 μ F to 517 μ F, including endpoint value.Due to said chip 4 apart from power supply 2 farther out, stream
Electric current through chip 4 is easy to happen fluctuation, and the capacitance of above-mentioned first capacitor 5 is higher, can store more electric energy, and should
First capacitor 5 and chip 4 can be oppositely arranged on the surface of substrate 1, so that the pin of first capacitor 5 and chip 4 is apart from non-
Chang Jin.It when the electric current for flowing through chip 4 fluctuates, can timely power to chip 4, flow through 4 electricity of chip to ensure that
The stabilization of stream, so as to improve the transient response of power supply 2 in the pcb board for being provided with memory bar 3.
Specific structure in relation to pcb board provided by the present invention will be described in detail in following inventive embodiments.
Referring to FIG. 4, Fig. 4 is a kind of structural schematic diagram of specific pcb board provided by the embodiment of the present invention.
It is different from foregoing invention embodiment, the embodiment of the present invention is on the basis of foregoing invention embodiment, further
The structure of pcb board is specifically limited.Remaining content is described in detail in foregoing invention embodiment, herein no longer
It is repeated.
Referring to Fig. 3, in embodiments of the present invention, the pcb board can also include be located at 1 surface of substrate, and with institute
State the second capacitor 6 of the pin electrical connection of memory bar 3；Wherein, the distance between second capacitor 6 and the memory bar 3 be not no
Greater than 20mil；The value range of the capacitance of second capacitor 6 is 19.8 μ F to 24.2 μ F, including endpoint value.
Other than the pin of said chip 4 needs to be electrically connected capacitor, the pin of above-mentioned memory bar 3 also needs to be electrically connected
Capacitor.Then in embodiments of the present invention, the capacitor being electrically connected with 3 pin of memory bar is the second capacitor 6.Due to memory bar 3 and electricity
Source 2 apart from relative close, the capacitance for the second capacitor 6 being electrically connected in embodiments of the present invention with 3 pin of memory bar takes
Being worth range is 19.8 μ F to 24.2 μ F, including endpoint value, i.e. the capacitance of the second capacitor 6 can be exactly 19.8 μ F or 24.2 μ
F.Under normal conditions, the capacitance of second capacitor 6 is 22 μ F in embodiments of the present invention.Selecting capacitance is the of 22 μ F
Two capacitors 6 it is internal can to reduce current fluctuation while the effect being filtered to the electric current issued by power supply 2 is effectively ensured
Deposit the influence of item 3.
Above-mentioned second capacitor 6 needs to be arranged in the surrounding of memory bar 3, and between second capacitor 6 and the memory bar 3
Distance be not more than 20mil.By the way that the distance between the second capacitor 6 and memory bar 3 to be limited within 20mil and can effectively subtract
The length of signal wire between few second capacitor 6 and memory bar 3, to reduce the time that the second capacitor 6 powers to memory bar 3.
Under normal conditions, multiple memory bars 3 can be set in embodiments of the present invention, while can be arranged around memory bar 3
Multiple second capacitors 6.Under normal conditions, multiple memory bars 3 can be arranged in parallel, i.e., the axis of memory bar 3 can be parallel to each other.Existing
In the stage, when setting has the pcb board of memory bar 3, the distance between memory bar 3, which has, clearly to be limited.And in the embodiment of the present invention
In, preferably above-mentioned second capacitor 6 is arranged between adjacent memory bar 3, at this time between the second capacitor 6 and memory bar 3
Distance is usually in 20mil or so.It should be noted that when the space between memory bar 3 fails to lay down above-mentioned second capacitor 6,
Need for the second capacitor 6 to be arranged space of the distance between the memory bar 3 within 20mil, to guarantee the second capacitor 6 and memory
There is shorter signal wire between item 3.It should also be noted that, above-mentioned second capacitor 6 is usually in substrate 1 with memory bar 3
The same surface.
Further, in embodiments of the present invention, the pcb board can also include be located at 1 surface of substrate, and with institute
State the third capacitor 7 of the pin electrical connection of power supply 2；Wherein, the distance between the third capacitor 7 and the power supply 2 are not more than
20mil；The value range of the capacitance of the third capacitor 7 is 9 μ F to 11 μ F, including endpoint value.Above-mentioned pcb board equally may be used also
To include positioned at 1 surface of substrate, and the 4th capacitor 8 being electrically connected with the pin of the power supply 2；Wherein, the 4th electricity
Hold the distance between 8 and the power supply 2 and is not more than 20mil；The value range of the capacitance of 4th capacitor 8 be 42.3 μ F extremely
51.7 μ F, including endpoint value.
In embodiments of the present invention, the pin of above-mentioned power supply 2 also needs to be electrically connected with capacitor, and electric with 2 pin of power supply
The capacitor of connection is mainly used for being filtered the electric current that power supply 2 is issued.In embodiments of the present invention, the pin of power supply 2 is logical
It often needs to be electrically connected from two kinds of capacitors with different capacitances, wherein the lesser capacitor of capacitance is in embodiments of the present invention
For third capacitor 7, and the biggish capacitor of capacitance is the 4th capacitor 8 in embodiments of the present invention.
Above-mentioned third capacitor 7 and the 4th capacitor 8 need to be arranged in 2 surrounding of power supply, in order to reach preferable filter effect,
The distance between above-mentioned third capacitor 7 and power supply 2 are usually more than 20mil, corresponding above-mentioned 4th capacitor 8 and the power supply 2
The distance between usually equally also be not more than 20mil.The third capacitor 7 being electrically connected in embodiments of the present invention with 2 pin of power supply
Capacitance value range be 9 μ F to 11 μ F, including endpoint value, i.e. the capacitance of third capacitor 7 can be exactly 9 μ F or 11
μF.Under normal conditions, the capacitance of above-mentioned third capacitor 7 is 10 μ F；Above-mentioned the 4th capacitor 8 being electrically connected with 2 pin of power supply
The value range of capacitance is 42.3 μ F to 51.7 μ F, including endpoint value, i.e. the capacitance of the 4th capacitor 8 can be exactly 42.3
μ F or 51.7 μ F.Under normal conditions, the capacitance of above-mentioned 4th capacitor 8 is 47 μ F.
Good filtering can be carried out to the electric current issued by power supply 2 by above-mentioned third capacitor 7 and the 4th capacitor 8,
To improve the quality of the electric current issued by power supply 2.It should be noted that above-mentioned third capacitor 7 and the 4th capacitor 8 had been arranged
It is usually connected in parallel with each other in journey.
Under normal conditions, can be provided in embodiments of the present invention the first capacitor 5 being connect with the electric pin of chip 4,
30 6, four third capacitors 7 being electrically connected with 2 pin of power supply of the second capacitor being electrically connected with 3 pin of memory bar and four
The 4th capacitor 8 being electrically connected with 2 pin of power supply.Related above-mentioned first capacitor 5, the second capacitor 6, third capacitor 7 and the 4th electricity
The specific location of appearance 8 is described in detail in foregoing invention embodiment, is no longer repeated herein.
A kind of pcb board provided by the embodiment of the present invention, by the way that the second capacitor 6 that capacitance is 22 μ F or so to be limited in
The same of the effect being filtered to the electric current issued by power supply 2 can be effectively ensured in the range of 3 surrounding 20mil of memory bar
When, influence of the current fluctuation to memory bar 3 is reduced, to further improve the wink for being provided with power supply 2 in the pcb board of memory bar 3
State response.
The present invention also provides a kind of electronic equipment, including the pcb board as provided by any of the above-described inventive embodiments.Due to
The transient response of power supply 2 is more preferable in the pcb board, so that can withstand multiple, fast frequency using the electronic equipment of the pcb board
Rate switches between the maximum functional intensity that it can bear, and then user experience can be improved.Related electronic equipment
The particular content and specific structure of middle remaining part are referred to the prior art, are no longer repeated herein.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of pcb board provided by the present invention and a kind of electronic equipment are described in detail above.It is used herein
A specific example illustrates the principle and implementation of the invention, and the above embodiments are only used to help understand
Method and its core concept of the invention.It should be pointed out that for those skilled in the art, not departing from this
, can be with several improvements and modifications are made to the present invention under the premise of inventive principle, these improvement and modification also fall into the present invention
In scope of protection of the claims.
Claims (7)
1. a kind of pcb board characterized by comprising
Substrate；
Positioned at the power supply of the substrate surface；
Positioned at the substrate surface, and the memory bar and chip set gradually along current direction；
Positioned at the substrate surface and the first capacitor that is oppositely arranged with the chip；Wherein, the first capacitor and the core
The electrical connection of piece pin, the value range of the capacitance of the first capacitor are 423 μ F to 517 μ F, including endpoint value.
2. pcb board according to claim 1, which is characterized in that the pcb board further include:
Positioned at the substrate surface, and the second capacitor being electrically connected with the pin of the memory bar；Wherein, second capacitor with
The distance between described memory bar is not more than 20mil；The value range of the capacitance of second capacitor is 19.8 μ F to 24.2 μ
F, including endpoint value.
3. pcb board according to claim 2, which is characterized in that the pcb board includes multiple memory bars；Multiple institutes
It states memory bar to be parallel to each other, second capacitor is between the adjacent memory bar.
4. pcb board according to claim 1, which is characterized in that the pcb board further include:
Positioned at the substrate surface, and the third capacitor being electrically connected with the pin of the power supply；Wherein, the third capacitor and institute
The distance between power supply is stated no more than 20mil；The value range of the capacitance of the third capacitor is 9 μ F to 11 μ F, including end
Point value.
5. pcb board according to claim 1, which is characterized in that the pcb board further include:
Positioned at the substrate surface, and the 4th capacitor being electrically connected with the pin of the power supply；Wherein, the 4th capacitor and institute
The distance between power supply is stated no more than 20mil；The value range of the capacitance of 4th capacitor is 42.3 μ F to 51.7 μ F, packet
Include endpoint value.
6. pcb board according to claim 1, which is characterized in that the power supply, the memory bar and the chip are located at
The same surface of the substrate.
7. a kind of electronic equipment, which is characterized in that including the pcb board as described in any one of claim 1 to 6 claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811172997.3A CN109246923A (en) | 2018-10-09 | 2018-10-09 | A kind of pcb board and a kind of electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811172997.3A CN109246923A (en) | 2018-10-09 | 2018-10-09 | A kind of pcb board and a kind of electronic equipment |
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| CN109246923A true CN109246923A (en) | 2019-01-18 |
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| CN201811172997.3A Pending CN109246923A (en) | 2018-10-09 | 2018-10-09 | A kind of pcb board and a kind of electronic equipment |
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