CN102360242A - Method for realizing modularized power supply of mainboard - Google Patents

Abstract

The invention discloses a method for realizing modularized power supply of a mainboard, relating to the technical field of power supply of a server mainboard. In the method, a power supply part on the mainboard on the mainboard are independently divided into a plurality of power supply modules, each power supply module is inserted in each module power supply interface of the mainboard in a subcard manner, the power supply modules comprise a CPU power supply module, a memory DIMM (dual in-line memory module) power supply module and a memory VTT and a mainboard peripheral chip power supply module. Compared with the prior art, the method for realizing modularized power supply of the mainboard can save area of the mainboard, can enhance easy maintenance of the mainboard, and has a better popularization and application value.

Description

A Method for Realizing Mainboard Modular Power Supply

the

technical field

The invention relates to the technical field of server motherboard power supply, in particular to a method for realizing modularized power supply of the motherboard.

Background technique

With the continuous development and improvement of office informatization, various traditional approval services, medical registration and payment and other services have been gradually replaced by network informatization. The amount of data processed by servers on the network is increasing. In the past, the main board could only support up to 8 memory sticks, and up to two Gigabit Ethernet ports. With the increase of business volume, the resources of the original motherboard can no longer meet the application requirements. Therefore, server users have put forward higher requirements for the scalability of the motherboard. In addition, the power supply part of the mainboard is a frequent point of mainboard problems. Once there is a problem with the power supply, the maintenance workload of the mainboard will be heavy and it is not easy to maintain.

On the other hand, due to the huge cost of mold opening for the chassis structure, general server manufacturers hope to fix the structure of the chassis for universal use to save development costs. Therefore, the structural size of the motherboard placed inside the case is also limited by the case. In the case of a limited motherboard area, expanding more memory and peripheral device interfaces will make the PCB of the motherboard a bottleneck.

Contents of the invention

The technical task of the present invention is to provide a method for realizing the modularized power supply of the main board, which can save the area of the main board and is easy to maintain.

The technical task of the present invention is achieved in the following manner: a method for realizing the modular power supply of the main board, which is characterized in that: the power supply part on the main board is independently divided into several power supply modules, and each power supply module is inserted into the main board in the form of a sub-card on the power supply interface of each module.

Because the relevant functional modules of the server motherboard in the prior art include a CPU computing subsystem, a memory subsystem, a chipset, a network subsystem, and a peripheral chip subsystem. Among them, the power supply part of the CPU has three power supply lines: the core voltage Vcore, the peripheral power supply voltage VSA of the CPU, and the initialization voltage Vtt of the CPU. These three power supply lines all have high current output, and the implementation method is generally adopted: main control chip + driver chip + external upper and lower MOS tubes + LC filter. The memory power supply includes DIMM power supply voltage VDDQ and initial voltage Vtt. The DIMM power supply current of the memory is generally a large current, and the realization method of power supply by Ness CPU is adopted: main control chip + driver chip + external upper and lower MOS tubes + LC filter; the general current of the Vtt power supply part of the memory is in the range of 2-10A, generally The chip integrates the upper and lower MOS tubes + LC filter circuit. The power supply of the network control chip and other peripheral chips are generally low-voltage and low-current power supply. Generally, the chip integrates the upper and lower MOS tubes + LC filter circuit or LDO (a low-power linear power supply line) to supply power to each module. The power supply module can independently be a CPU power supply module, a memory DIMM power supply module, a memory VTT and a motherboard peripheral chip power supply module.

The sub-card adopted by the CPU power supply module is a high-current output DC/DC switch conversion sub-card,

The daughter card includes a control module, a drive module, a switch conversion module and a filter circuit link. The control module realizes the processing and generation of circuit control signals, the protection monitoring of the output circuit and the generation of Power Good signals; the drive module realizes the control pulse for opening the upper and lower MOS tubes; The switching conversion module is mainly composed of two upper and lower MOS tubes to realize the switching and conversion function of the circuit; the filter circuit is filtered by LC to obtain a DC output with less pulsation.

The subcard used by the memory DIMM power supply module is a small current output DC/DC switch conversion subcard,

The daughter card includes the control module, switch conversion and filter circuit links. The control module realizes the processing and generation of circuit control signals, the protection monitoring of the output circuit and the generation of Power Good signals. At the same time, the upper and lower MOS tubes for switching conversion are integrated in the control chip; the switch The conversion is mainly composed of upper and lower MOS tubes to realize the switching and conversion of the circuit; the filter circuit is filtered by LC to obtain a DC output with less pulsation.

The subcard used by the memory VTT and the mainboard peripheral chip power supply module is a small current output DC/DC conversion LDO subcard,

The daughter card includes an LDO integrated chip and a feedback output link. The LDO integrated chip includes a current limiting link, an adjustment link, and a reference voltage link. Realize the function of stabilizing and transforming the output voltage; the feedback output link mainly realizes the transformation of voltage, and transforms the input voltage into the output voltage required by the application.

The bottom of the above-mentioned sub-cards can be used as the input or output ports of current and signals by way of gold fingers.

Since each part has different requirements on power supply, on the premise of taking into account the cost, it can be considered to cover the connection port with higher power output with the port with lower power output.

Compared with the prior art, the method for realizing the modularized power supply of the motherboard of the present invention has the following outstanding beneficial effects:

(1) The modular power supply mode saves more space for expanding other functional parts while ensuring the power supply of the motherboard system.

(2) When the power supply of the motherboard fails, you can easily locate the problem by plugging and unplugging, find the point of the problem, and replace it with a good power supply card to improve the timeliness and ease of maintenance of the motherboard fault location.

Description of drawings

Accompanying drawing 1 is the schematic diagram of main board structure in the method for modular power supply of the present invention;

Accompanying drawing 2 is the structural block diagram of the logic relationship structure of the large current output DC/DC switch conversion sub-card in the method for modularized power supply of the present invention;

Accompanying drawing 3 is a small current output DC/DC switch conversion sub-card logic structural block diagram in the method for modularized power supply of the present invention;

Accompanying drawing 4 is the structural block diagram of the logic relationship of the small current output DC/DC conversion LDO sub-card in the modularized power supply method of the present invention.

Detailed ways

Referring to the accompanying drawings in the description, the method for realizing the modularized power supply of the mainboard of the present invention will be described in detail below with specific embodiments.

Example:

As shown in Figure 1, the functional modules of the motherboard include a CPU module, a memory DIMM part, a memory Vtt part and several peripheral chips.

The main board is provided with a CPU power supply connection port, a memory DIMM power supply connection port, a memory Vtt power supply connection port and a peripheral core power supply connection port respectively at positions close to each functional module.

The high-current output DC/DC switch conversion daughter card is plugged into the CPU power supply connection port to supply power to the CPU module.

As shown in Figure 2, the high-current output DC/DC switch conversion sub-card includes a control module, a drive module, a switch conversion module and a filter circuit. Signal generation; the drive module realizes the control pulse of opening the upper and lower MOS tubes; the switch conversion module is mainly composed of upper and lower MOS tubes to realize the switch conversion function of the circuit; the filter circuit is filtered by LC to obtain a DC output with less pulsation .

Below the daughter card is the input or output port of the current and signal through the golden finger. The part of the golden finger pointed by the a arrow shown in Figure 2 is the positive voltage input and the ground return terminal of the input DC; the part of the golden finger pointed by the b arrow is the enable signal end and the Power Good signal end of the control module; the c arrow The part of the gold finger referred to is the positive voltage input and ground return terminal of the output DC.

The small current output DC/DC switching conversion daughter card is plugged into the memory DIMM power supply connection port to supply power to the memory DIMM.

As shown in Figure 3, the small current output DC/DC switch conversion daughter card includes a control module, switch conversion and filter circuit links. The control module realizes the processing and generation of circuit control signals, the protection and monitoring of output circuits and the generation of Power Good signals. At the same time, the upper and lower MOS tubes that realize the switching transformation are integrated in the control chip; the switching transformation is mainly composed of the upper and lower MOS tubes to realize the switching effect on the circuit; the filter circuit is filtered by LC to obtain a DC output with less pulsation.

Below the daughter card is the input or output port of the current and signal through the golden finger. The part of the gold finger pointed by the a arrow shown in Figure 3 is the positive voltage input and the ground return terminal of the input DC; the part of the gold finger pointed by the b arrow is the enable signal end and the Power Good signal end of the control module; the c arrow The part of the gold finger referred to is the positive voltage input and ground return terminal of the output DC.

A number of small current output DC/DC conversion LDO sub-cards are respectively plugged into the memory Vtt power supply connection port and the peripheral core power supply connection port to supply power to the memory Vtt part and peripheral chips.

As shown in Figure 4, the small current output DC/DC conversion LDO daughter card includes an LDO integrated chip and a feedback output link. The LDO integrated chip includes a current limiting link, a regulator tube and a reference voltage link, which mainly realizes the linear conversion of the input DC, and the adjustment tube inside the LDO integrated chip feedbacks the change of the output of the adjustment circuit, thereby realizing the voltage regulation and transformation of the output voltage; The feedback output link mainly realizes the transformation of voltage, and transforms the input voltage into the output voltage required by the application.

Below the daughter card is the input or output port of the current and signal through the golden finger. The part of the gold finger pointed by the arrow a shown in attached drawing 4 is the positive voltage input and the ground loop terminal of the input DC; the part of the gold finger pointed by the arrow b is the enable signal end and the Power Good signal end of the control module; the arrow c The part of the gold finger referred to is the positive voltage input and ground return terminal of the output DC.

The implementation process of the above-mentioned embodiment is as follows:

1) When designing the motherboard, calculate the power consumption of each functional part of the motherboard;

2) List the power supply topology diagram of the motherboard according to the power consumption of each part;

3) Optimize the selection of the power supply connection port according to the topology diagram, and finally determine the model and specification of the power supply port used by each functional part;

4) Determine the DC/DC sub-card scheme for powering each functional module according to the topology diagram and the specifications of the power supply connection port;

5) Formulate the implementation plan of the DC/DC sub-card powered by each functional module, and make the PCB sub-card;

After the mainboard PCB is finished, the DC/DC sub-cards designed for each functional part are installed on the corresponding power supply connection ports of the mainboard to realize the power supply for the entire mainboard system.

Claims (4)

1. method that realizes the mainboard module power supply, it is characterized in that: the power pack on the mainboard is independently become some supply modules, and each supply module is plugged on each module for power supply interface of mainboard with the form of subcard,

Said supply module comprises CPU supply module, internal memory DIMM supply module and internal memory VTT and mainboard peripheral chip supply module.

2. the method for realization mainboard module according to claim 1 power supply is characterized in that, the subcard that said CPU supply module adopts is big electric current output DC/DC switch change-over subcard,

Subcard comprises control module, driver module, switch change-over module and filtering circuit link, and control module realizes the processing generation of circuit control signal, the protection monitoring of output circuit and the generation of Power Good signal; Driver module realizes opening the gating pulse of metal-oxide-semiconductor up and down; The switch change-over module mainly is made up of two metal-oxide-semiconductors up and down, and realization is to the switch change-over effect of circuit; The filtering circuit link is by LC filtering, obtains the direct current output of pulsing less.

3. the method for realization mainboard module according to claim 1 power supply is characterized in that, the subcard that said internal memory DIMM supply module adopts is little electric current output DC/DC switch change-over subcard,

Subcard comprises control module, switch change-over and filtering circuit link; Control module realizes the processing generation of circuit control signal, the protection monitoring of output circuit and the generation of Power Good signal, realizes that simultaneously the metal-oxide-semiconductor up and down of switch change-over is integrated in control chip inside; Switch change-over mainly is made up of two metal-oxide-semiconductors up and down, and realization is to the switch change-over effect of circuit; The filtering circuit link is by LC filtering, obtains the direct current output of pulsing less.

4. the method for realization mainboard module according to claim 1 power supply is characterized in that, the subcard that said internal memory VTT and mainboard peripheral chip supply module adopt is little electric current output DC/DC conversion LDO subcard,

Subcard comprises LDO integrated chip and feedback output element; The LDO integrated chip comprises current limliting link, adjustment link and reference voltage link; The main linear transformation that realizes input DC; The variation of the adjustment pipe feedback regulating circuit output through the LDO chip internal, thus realize voltage stabilizing change action to output voltage; The feedback output element mainly realizes the conversion of voltage, input voltage is transformed into uses required output voltage.

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