CN108900174B - Quartz crystal oscillator and method for manufacturing same - Google Patents
Quartz crystal oscillator and method for manufacturing same Download PDFInfo
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- CN108900174B CN108900174B CN201810969159.2A CN201810969159A CN108900174B CN 108900174 B CN108900174 B CN 108900174B CN 201810969159 A CN201810969159 A CN 201810969159A CN 108900174 B CN108900174 B CN 108900174B
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- 239000013078 crystal Substances 0.000 title claims abstract description 112
- 239000010453 quartz Substances 0.000 title claims abstract description 79
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 230000035882 stress Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000005997 Calcium carbide Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- CLZWAWBPWVRRGI-UHFFFAOYSA-N tert-butyl 2-[2-[2-[2-[bis[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]amino]-5-bromophenoxy]ethoxy]-4-methyl-n-[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]anilino]acetate Chemical compound CC1=CC=C(N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)C(OCCOC=2C(=CC=C(Br)C=2)N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)=C1 CLZWAWBPWVRRGI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention provides a quartz crystal oscillator and a method for manufacturing the quartz crystal oscillator, wherein the quartz crystal oscillator comprises a connecting base, an oscillator special IC chip and a finished product of the quartz crystal oscillator, the connecting base is integrally formed, an IC assembly groove, a conducting circuit, a first oscillator electrode and a second oscillator electrode are arranged in the connecting base, the finished product of the quartz crystal oscillator comprises a resonator base, a resonator upper cover and a quartz crystal oscillator in a package, a first electrode circuit and a second electrode circuit are arranged below the resonator base, the quartz crystal oscillator is electrically connected with the first electrode circuit and the second electrode circuit which are realized by the inner circuit of the base, the resonator base is covered on the connecting base, the first electrode circuit is electrically connected with the first oscillator electrode, and the second electrode circuit is electrically connected with the second oscillator electrode. The technical scheme is used for solving the problem that the production efficiency is low due to complex working procedures in the prior art for manufacturing the quartz crystal oscillator.
Description
Technical Field
The invention belongs to the technical field of semiconductor electronic assembly, and particularly relates to a quartz crystal oscillator and a method for manufacturing the quartz crystal oscillator.
Background
In the prior art, as shown in fig. 1, in the design production process of a quartz crystal oscillator, a stacked package type design is adopted, and in the production and manufacturing process, after parts such as a ceramic base 1, a first support frame 2, a second support frame 3, an upper cover 4, a quartz crystal oscillator 5, an IC chip 6 and the like are produced and prepared, assembly processing is performed, namely: fixing an IC chip 6 on a ceramic base 1 through a bonding pad and soldering tin, sealing bonding adhesive 7 around the fixed IC chip 6, adhering and fixing a first supporting frame 2 on the ceramic base 1 through adhesive, enabling printed circuits on the first supporting frame 2 to be in butt joint conduction with corresponding printed circuits on the ceramic base 1, and bonding the IC chip 6 with the first supporting frame 2 through bonding wires 8; the quartz crystal oscillator 5 is connected and fixed on the second supporting frame 3 through the silver colloid 9, and the upper cover 4 is packaged by the high-cut ring 10; then, the second supporting frame 3 is fixed on the first supporting frame 2 by adhesive, and the printed circuit on the second supporting frame 3 is in butt joint conduction with the corresponding printed circuit on the first supporting frame 2. Therefore, in the prior art, in the design and production of the quartz crystal oscillator, the process is extremely complex, and the production efficiency is low.
Disclosure of Invention
The invention aims to solve the technical problems of low production efficiency caused by complex process for producing and manufacturing a quartz crystal oscillator in the prior art.
In order to solve the above technical problems, the present invention is implemented by a quartz crystal oscillator, comprising: the connecting base is integrally formed and provided with an IC assembly groove, a conducting circuit is paved at the bottom of the IC assembly groove, and the connecting base is also provided with a first vibrator electrode and a second vibrator electrode; the IC chip is fixedly arranged on the bottom of the IC assembly groove, the conducting circuit is electrically connected to a connecting port of the IC chip, and the first vibrator electrode and the second vibrator electrode are respectively and correspondingly connected to corresponding electrode ports of the IC chip; the crystal resonator comprises a resonator base, a resonator upper cover and a quartz crystal oscillator, wherein the quartz crystal oscillator is assembled in the resonator base, a first electrode circuit and a second electrode circuit are arranged on the resonator base, the quartz crystal oscillator is electrically connected with one of the first electrode circuit or the second electrode circuit, the resonator base covers the connecting base, the first electrode circuit is electrically connected with a first oscillator electrode, the second electrode circuit is electrically connected with a second oscillator electrode, and a closed cavity is formed after the resonator base and the connecting base are covered.
Further, the conducting circuit comprises a printed circuit, a conducting hole and a connecting welding leg, wherein the printed circuit is arranged on the bottom surface of the IC assembly groove, the connecting welding leg is arranged on one side of the connecting base opposite to the IC assembly groove, the conducting hole penetrates through the bottom of the IC assembly groove, the first end of the conducting hole is electrically connected with the printed circuit, and the second end of the conducting hole is electrically connected with the connecting welding leg.
Further, the resonator base is of an integrally formed frame structure, annular steps are arranged on the inner side of the resonator base along the circumferential direction, the first electrode circuit and the second electrode circuit are oppositely arranged on the inner wall of the resonator base, the crystal resonator finished product further comprises a resonator upper cover, the resonator upper cover is sealed and covered on the resonator base in a sealing mode, the quartz crystal oscillator is arranged between the resonator upper cover and the annular steps, and the edge of the quartz crystal oscillator coincides with the vertical projection of the annular steps on a horizontal plane.
Further, the first oscillator electrode and the second oscillator electrode extend to the top of the groove wall of the IC assembly groove, the first electrode circuit and the second electrode circuit extend to the end face of the frame structure, which faces the connecting base, and when the resonator base and the connecting base are covered, the first electrode circuit and the second electrode circuit are respectively in contact conduction with the first oscillator electrode and the second oscillator electrode.
Further, the quartz crystal resonator finished product also comprises an IC protective isolation material, and the IC protective isolation material is attached to the IC chip.
Further, the connecting base is in sealing connection with the resonator base in an adhesive manner; or the connecting base and the resonator base are in sealing connection in a stress pressing mode through a stress pressing material; or the connecting base (10) and the resonator base (31) are connected by welding materials in a high-temperature heating mode.
Further, the conducting circuit is connected and conducted with the connecting port of the IC chip through a gold wire; or the conducting circuit is connected and conducted with the IC chip by flip-chip technology.
Further, the connection end of the conducting circuit is set to be a bearing pad, the connection port of the IC chip is extended to be a compression bonding pad, and the bearing pad and the compression bonding pad are fixed in a compression mode.
Further, the connecting base is made of ceramic materials or calcium carbide materials, and the resonator base is made of ceramic materials or calcium carbide materials.
According to another aspect of the present invention, a method of manufacturing a quartz crystal oscillator is provided. The method comprises the following steps:
Preparing a connecting base by integral molding, forming an IC assembly groove, paving a conducting circuit, a first oscillator electrode and a second oscillator electrode on the connecting base, and correspondingly connecting the IC chip with the conducting circuit, the first oscillator electrode and the second oscillator electrode in a matched mode so as to assemble the IC chip in the IC assembly groove, thereby forming a first module;
Preparing a resonator base through integral molding, paving a first electrode circuit and a second electrode circuit on the resonator base, assembling a quartz crystal oscillator in the resonator base, and sealing and welding an upper cover of the resonator to form a second module;
the resonator base of the second module is sealed to the connection base of the first module.
Compared with the prior art, the invention has the beneficial effects that: in the quartz crystal oscillator, the integrally formed connecting base is matched with the assembly of the IC chip, so that the integrity of the connecting base can be better improved compared with the prior art, and compared with the quartz crystal oscillator in the prior art, the quartz crystal oscillator does not need to be assembled in a layer-by-layer bonding mode, the integrally formed connecting base is adopted to simplify the assembly process, and the production efficiency is better improved.
Drawings
FIG. 1 is a schematic cross-sectional structural view of an embodiment of a prior art quartz crystal oscillator;
FIG. 2 is a schematic diagram of an assembled structure of a first embodiment of a quartz crystal oscillator of the present invention;
FIG. 3 is a schematic diagram of an exploded structure of a first embodiment of a quartz crystal oscillator of the present invention;
FIG. 4 is a top view of a connection base in a first embodiment of a quartz crystal oscillator of the invention;
FIG. 5 is a schematic view, partly in section, of A-A of FIG. 4;
FIG. 6 is a schematic cross-sectional structural view of a finished crystal resonator in a first embodiment of a quartz crystal oscillator of the invention;
FIG. 7 is a schematic cross-sectional structural view of a finished crystal resonator in a second embodiment of a quartz crystal oscillator of the invention;
fig. 8 is a schematic diagram showing an exploded structure of a third embodiment of the quartz crystal oscillator of the present invention.
In the drawings, each reference numeral denotes:
10. A connecting base; 11. an IC assembly slot; 12. a turn-on circuit; 121. a printed wiring; 122. a guide through hole; 123. connecting the welding legs; 13. a first vibrator electrode; 14. a second vibrator electrode; 20. an IC chip; 30. a finished crystal resonator; 31. a resonator base; 32. a quartz crystal oscillator; 33. a resonator upper cover; 34. a high-cut ring; 35. silver colloid; 40. the IC protects the isolation material.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or components referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Explanation: the abbreviation of IC, INTEGRATED CIRCUIT, also known as integrated circuit; the high-cut ring is to provide a platform to weld the metal upper cover to the resonator base, so that the resonator base and the metal upper cover can form a sealed cavity.
As shown in fig. 2 to 6, the quartz crystal oscillator of the first embodiment of the present invention comprises a connection base 10, an IC chip 20 and a finished quartz crystal resonator 30, wherein the finished quartz crystal resonator 30 comprises a resonator base 31 and a quartz crystal resonator 32, the connection base 10 is integrally formed, the connection base 10 is provided with an IC assembly groove 11, a conducting circuit 12 is laid at the bottom of the IC assembly groove 11, the connection base 10 is further provided with a first oscillator electrode 13 and a second oscillator electrode 14, the IC chip 20 is fixedly arranged at the bottom of the IC assembly groove 11, the conducting circuit 12 is electrically connected to a connection port of the IC chip 20, the first oscillator electrode 13 and the second oscillator electrode 14 are respectively connected to corresponding electrode ports of the IC chip 20, the quartz crystal resonator 32 is assembled in the resonator base 31, the resonator base 31 is provided with a first electrode line (not shown) and a second electrode line (not shown) and one of the first electrode line or the second electrode line, the resonator base 31 is covered on the connection base 10, the first electrode line is electrically connected with the first electrode 13 and the second electrode line 14, and the resonator base 31 is electrically connected with the resonator base 14, and the cavity is formed after the resonator base is electrically connected with the resonator base 10.
In the working process of the quartz crystal oscillator, the quartz crystal oscillator 32 in the finished product 30 of the crystal resonator generates resonance action of corresponding stress strain under the action of corresponding excitation voltage, and the resonance action caused by the stress strain can be converted into a pulse signal, and then the pulse signal is converted into an electric signal through the IC chip 20, so that the function of controlling output is realized. In the quartz crystal oscillator of the invention, the integrally formed connecting base 10 is matched with the assembly of the IC chip 20, so that the integrity of the connecting base 10 can be better improved compared with the prior art, and compared with the quartz crystal oscillator of the invention in the prior art, the quartz crystal oscillator of the invention does not need to be assembled in a layer-by-layer bonding way, the integrally formed connecting base 10 simplifies the assembly process, and the production efficiency is better improved.
As shown in fig. 5, in the first embodiment, the conductive circuit 12 on the connection base 10 includes a printed wiring 121, a conductive via 122 and a connection pad 123, the printed wiring 121 is disposed on the bottom surface of the IC assembly groove 11, and the printed wiring 121 is used to ensure the conductive quality, so that the wiring is not only fixed on the bottom of the IC assembly groove 11, but also the problem that the whole operation of the resonator is affected due to the disturbance of the wiring is avoided. The connection pad 123 is provided on the side of the connection base 10 opposite to the IC mounting groove 11, and the via 122 passes through the groove bottom of the IC mounting groove 11, and the first end of the via 122 is electrically connected to the printed wiring 121, and the second end of the via 122 is electrically connected to the connection pad 123. The conductive connection between the printed circuit 121 and the connection pad 123 is realized through the conductive via 122, and in the process of integrally assembling the quartz crystal oscillator to the electronic device, the rapid soldering can be realized through the connection pad 123, and the compactness of the conductive via 122 can realize normal circuit conduction while avoiding oxidation of the IC chip 20, the printed circuit 121, the quartz crystal oscillator 32, the first oscillator electrode 13, the second oscillator electrode 14, the first electrode circuit and the second electrode circuit in the closed cavity due to the conduction via 122. In the process of manufacturing the via hole 122, firstly, the corresponding position of the bottom of the IC assembly groove 11 of the connection base 10 is drilled, then, conductive material slurry is poured into the drilled hole, and the via hole 122 is formed after the conductive material slurry is cooled and solidified. Then, the printed wiring 121 and the connection pads 123 can be formed on the connection base 10, respectively.
Specifically, the crystal resonator finished product 30 in the first embodiment is assembled using the crystal resonator finished product in the related art to manufacture the quartz crystal oscillator of the present invention. As shown in fig. 6, after the resonator base 31 in the crystal resonator finished product 30 is manufactured and molded, the periphery of the resonator base 31 is adhered by using the high-cut ring 34, and the inner side of the high-cut ring 34 and the inner side edge of the resonator base 31 form a step shape, so that the quartz crystal vibrator 32 is assembled on the step edge of the resonator base 31 through the silver paste 35, and finally, the resonator upper cover 33 is covered on the top of the high-cut ring 34, thus completing the assembly work of the crystal resonator finished product. The crystal resonator finished product 30 adopted in the first embodiment may be purchased in a purchase manner, and after the manufacturing formation of the connection base 10 is completed and the connection base 10 is connected and assembled with the IC chip 20, the purchased crystal resonator finished product 30 is assembled in a combined manner, thereby completing the production and assembly of the crystal oscillator of the present invention and outputting the crystal oscillator product. Of course, the finished crystal resonator 30 used in the first embodiment may be manufactured by itself.
As shown in fig. 3 to 5, in the first embodiment, the first vibrator electrode 13 and the second vibrator electrode 14 are both extended to the top of the groove wall of the IC mounting groove 11, and the first electrode line and the second electrode line are both extended to the end face of the frame structure facing the connection base 10 (when the first embodiment is assembled with the crystal resonator finished product of the outsourcing prior art, the supplier must be required to modify the first electrode line and the second electrode line of the crystal resonator finished product of the prior art to adapt to the layout of the connection base 10 of the present invention, i.e. "the first electrode line and the second electrode line are both extended to the end face of the frame structure facing the connection base 10", and when the crystal resonator finished product of the prior art structure adopted in the first embodiment is adopted, the first electrode line and the second electrode line of the crystal resonator finished product are modified to adapt to the layout of the connection base 10 of the present invention by themselves). When the resonator base 31 is covered with the connection base 10, the first electrode line and the second electrode line are brought into contact with the first vibrator electrode 13 and the second vibrator electrode 14, respectively. In this way, when the resonator base 31 is capped on the connection base 10, the first oscillator electrode 13 and the first electrode line, and the second oscillator electrode 14 and the second electrode line can be directly electrically connected.
As shown in fig. 3, in order to avoid damage to the IC chip 20 caused by collision with the IC chip 20 due to an operation error during the process of capping the resonator base 31 on the connection base 10, the quartz crystal oscillator further includes an IC protective insulating material 40, and the IC protective insulating material 40 is attached to the IC chip 20.
When the connection base 10 and the resonator base 31 are sealed by gluing, a closed cavity is formed between the connection base 10 and the resonator base 31. Or when the connecting base 10 and the resonator base 31 are sealed and connected by a stress pressing material in a stress pressing manner, so that a closed cavity is formed between the connecting base 10 and the resonator base 31. Or the connection base 10 and the resonator base 31 are connected by a welding material in a high-temperature heating mode, the welding material is melted first by the high-temperature heating, at the moment, all relevant parts still can be guaranteed to have normal performance under the high-temperature condition, and then the welding material is cooled down and cooled down to be solidified, so that the connection procedure between the connection base 10 and the resonator base 31 can be completed.
As shown in fig. 3, in the first embodiment, the connection port between the conductive circuit 12 and the IC chip 20 is connected and conducted by a gold wire.
Preferably, the connection base 10 in the first embodiment is made of a ceramic material or a carbide material, and the resonator base 31 is made of a ceramic material or a carbide material.
As shown in fig. 7, which shows a schematic cross-sectional structure of a crystal oscillator in a second embodiment of the quartz crystal oscillator of the present invention. In the second embodiment, the crystal resonator finished product employed by the quartz crystal oscillator is different from the crystal resonator finished product in the prior art employed by the quartz crystal oscillator in the first embodiment in that: the resonator base 31 is an integrally formed frame structure, and an annular step is formed on the inner side of the resonator base 31 along the circumferential direction, so that the step form formed in the first embodiment is formed by bonding the high-cut ring 34 and the resonator base 31, and the step form in the second embodiment is directly integrally formed on the resonator base 31, namely the annular step; the first electrode circuit and the second electrode circuit are oppositely arranged on the inner wall of the resonator base 31, and the distribution form of the first electrode circuit and the second electrode circuit is designed, so that the crystal oscillator of the second embodiment can be correspondingly matched with the first oscillator electrode 13 and the second oscillator electrode 14 on the integrally formed connecting base 10; the finished crystal resonator also comprises a resonator upper cover 33, wherein the resonator upper cover 33 is sealed and covered on the resonator base 31 (the resonator upper cover 33 can be directly covered on the resonator base 31, or the resonator upper cover 33 and the resonator base 31 are still indirectly sealed and covered by a layer of high-cut ring 34); the quartz crystal vibrator 32 is disposed between the resonator upper cover 33 and the annular step, and the edge of the quartz crystal vibrator 32 coincides with the vertical projection of the annular step on the horizontal plane.
The second embodiment is the same as the first embodiment except for the above differences, and will not be described here.
As shown in fig. 8, there is shown a schematic diagram of an exploded structure of a third embodiment of the quartz crystal oscillator of the present invention. In the third embodiment, the quartz crystal oscillator is compared with the quartz crystal oscillators of the first and second embodiments, respectively, and each has the following differences: the connection terminal of the conductive circuit 12 is provided as a load pad, and the connection port of the IC chip 20 is provided as a compression pad in an extending manner, and the load pad is compression-fixed with the compression pad. This enables the IC chip 20 to be more quickly assembled to the connection pad 10, further improving production efficiency.
The third embodiment is similar to the first embodiment and the second embodiment except for the above differences, and will not be described herein.
According to another aspect of the present invention, a method of manufacturing a quartz crystal oscillator is also provided. The method comprises the following steps:
Step S10: preparing a connection base 10 by integral molding, forming an IC assembly groove 11 on the connection base 10, paving a conducting circuit 12, a first vibrator electrode 13 and a second vibrator electrode 14 on the groove surface of the IC assembly groove 11 of the connection base 10, enabling the first vibrator electrode 13 to extend to the top of one groove wall of the IC assembly groove 11, enabling the second vibrator electrode 14 to extend to the top of the other groove wall of the IC assembly groove 11, enabling the two groove walls to be two opposite groove walls, and then correspondingly matching and connecting the IC chip 20 with the conducting circuit 12, the first vibrator electrode 13 and the second vibrator electrode 14 (through gold wire fusion welding connection or through soldering connection through designing corresponding pad soldering pins), so as to assemble the IC chip 20 in the IC assembly groove 11, thereby forming a first module.
Step S20: the resonator base 31 is prepared by integral molding, the first electrode line and the second electrode line are laid on the resonator base 31, the quartz crystal vibrator 32 is prepared by cutting, the quartz crystal vibrator 32 is assembled in the resonator base 31, and then the resonator upper cover 33 is sealed and welded on the resonator base 31, thereby forming a second module, namely a finished crystal resonator 30. In step S20, the crystal resonator finished product 30 may be purchased without being manufactured by machining, but the corresponding crystal resonator finished product in the prior art may be purchased, and of course, the first electrode line and the second electrode line in the purchased crystal resonator finished product in the prior art need to be able to be connected to the first oscillator electrode 13 and the second oscillator electrode 14 designed in step S10, respectively.
The steps S10 and S20 may be performed simultaneously, or may be processed and prepared in the order of step s10→step S20 or step s20→step S10, and then step S30 may be performed.
Step S30: the resonator base 31 of the second module is sealed to the connection base 10 of the first module such that a closed cavity is formed between the resonator base 31 and the connection base 10.
In addition, in the process of completing the capping in step S30, the first module and the second module are always kept in a vacuum environment at this time, so that, after the capping of the resonator base 31 and the connection base 10 is completed, the sealed cavity formed between the resonator base 31 and the connection base 10 is a vacuum sealed cavity, thereby effectively preventing the problems of aging failure caused by oxidation of the IC chip 20, the printed circuit 121, the quartz crystal vibrator 32, the first vibrator electrode 13, the second vibrator electrode 14, the first electrode circuit and the second electrode circuit in the sealed cavity, and prolonging the service life of the quartz crystal resonator finished product.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (7)
1. A quartz crystal oscillator, comprising:
The connecting base (10) is manufactured by an integral forming process, the connecting base (10) is provided with an IC assembly groove (11), the bottom of the IC assembly groove (11) is provided with a conducting circuit (12), and the connecting base (10) is also provided with a first vibrator electrode (13) and a second vibrator electrode (14);
An oscillator-dedicated IC chip (20), the IC chip (20) being fixedly disposed on a bottom of the IC mounting groove (11), the conducting circuit (12) being electrically connected to a connection port of the IC chip (20), the first vibrator electrode (13) and the second vibrator electrode (14) being respectively and correspondingly connected to respective electrode ports of the IC chip (20);
The crystal resonator comprises a crystal resonator finished product (30), wherein the crystal resonator finished product (30) comprises a resonator base (31) and a quartz crystal oscillator (32), a resonator upper cover (33) of the quartz crystal oscillator (32) is assembled in the resonator base (31), a first electrode circuit and a second electrode circuit are arranged on the resonator base (31), the quartz crystal oscillator (32) is electrically connected with one of the first electrode circuit or the second electrode circuit, when the resonator base (31) is covered with the connecting base (10), the first electrode circuit and the second electrode circuit are respectively in contact conduction with the first oscillator electrode (13) and the second oscillator electrode (14), the resonator base (31) is covered on the connecting base (10), the first electrode circuit is electrically connected with the first electrode (13), the second electrode circuit is electrically connected with the second electrode (14), and a cavity is formed between the resonator base (31) and the connecting base (10) after the resonator base and the connecting base (10) are covered;
The conducting circuit (12) comprises a printed circuit (121), a conducting via hole (122) and a connecting welding pin (123), wherein the printed circuit (121) is arranged on the bottom surface of the IC assembly groove (11), the connecting welding pin (123) is arranged on one side of the connecting base (10) opposite to the IC assembly groove (11), the conducting via hole (122) penetrates through the bottom of the IC assembly groove (11), the first end of the conducting via hole (122) is electrically connected with the printed circuit (121), and the second end of the conducting via hole (122) is electrically connected with the connecting welding pin (123);
the crystal oscillator comprises a resonator base (31), and is characterized in that the resonator base (31) is of an integrally formed frame structure, an annular step is arranged on the inner side of the resonator base (31) along the circumferential direction, a first electrode circuit and a second electrode circuit are oppositely arranged on the inner wall of the resonator base (31), the crystal oscillator further comprises a resonator upper cover (33), the resonator upper cover (33) is sealed and covered on the resonator base (31), a quartz crystal oscillator (32) is arranged between the resonator upper cover (33) and the annular step, and the edge of the quartz crystal oscillator (32) is overlapped with the vertical projection of the annular step on a horizontal plane;
The conducting circuit (12) is connected and conducted with the connecting port of the IC chip (20) through a gold wire.
2. The quartz crystal oscillator of claim 1, characterized in that the first oscillator electrode (13) and the second oscillator electrode (14) each extend to the top of the groove wall of the IC assembly groove (11), and the first electrode line and the second electrode line each extend to the end face of the frame structure facing the connection base (10).
3. The quartz crystal oscillator of claim 2, further comprising an IC protective isolation material (40), the IC protective isolation material (40) being attached to the IC chip (20).
4. The quartz crystal oscillator according to claim 2, characterized in that the connection base (10) and the resonator base (31) are sealingly connected by means of gluing; or the connecting base (10) and the resonator base (31) are in sealing connection in a stress pressing manner through a stress pressing material; or the connecting base (10) and the resonator base (31) are connected by welding materials in a high-temperature heating mode.
5. The quartz crystal oscillator of claim 1, wherein the connection terminal of the pass-through circuit (12) is provided as a load pad, and the connection port of the IC chip (20) is provided as a compression pad in an extending manner, and the load pad is compression-fixed with the compression pad.
6. The quartz crystal oscillator according to claim 1, wherein the connection base (10) is made of a ceramic material or a carbide material, and the resonator base (31) is made of a ceramic material or a carbide material.
7. A method of manufacturing a quartz crystal oscillator for use in preparing a quartz crystal oscillator as claimed in any of claims 1-6, comprising the steps of:
Preparing a connection base (10) by integral molding, forming an IC assembly groove (11), paving a conducting circuit (12), a first vibrator electrode (13) and a second vibrator electrode (14) on the connection base (10), and correspondingly connecting an IC chip (20) with the conducting circuit (12), the first vibrator electrode (13) and the second vibrator electrode (14) in a matching way so as to assemble the IC chip (20) in the IC assembly groove (11) to form a first module;
a first electrode circuit and a second electrode circuit are paved on a resonator base (31), a quartz crystal oscillator (32) is assembled in the resonator base (31), and then a resonator upper cover (33) is sealed and welded, so that a second module is formed;
And sealing the resonator base (31) of the second module on the connecting base (10) of the first module, wherein the first electrode line and the second electrode line are respectively in contact conduction with the first oscillator electrode (13) and the second oscillator electrode (14).
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| CN201810969159.2A CN108900174B (en) | 2018-08-23 | 2018-08-23 | Quartz crystal oscillator and method for manufacturing same |
| PCT/CN2018/117241 WO2020037859A1 (en) | 2018-08-23 | 2018-11-23 | Quartz crystal oscillator and method for manufacturing quartz crystal oscillator |
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| CN201810969159.2A CN108900174B (en) | 2018-08-23 | 2018-08-23 | Quartz crystal oscillator and method for manufacturing same |
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| CN114157264A (en) * | 2021-12-31 | 2022-03-08 | 广东大普通信技术股份有限公司 | an oven controlled crystal oscillator |
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| WO2020037859A1 (en) | 2020-02-27 |
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