JP5101093B2 - Piezoelectric oscillator and manufacturing method thereof - Google Patents

Description

  The present invention relates to a piezoelectric oscillator that is one of electronic components used in an electronic device such as a portable communication device.

  A conventional piezoelectric oscillator will be described below with reference to FIG. In the drawings, description will be made on the assumption that the upper side of the described paper is “up” in the piezoelectric oscillator. Such a conventional piezoelectric oscillator includes a container body 100 in which the piezoelectric vibration element 101 is housed and the piezoelectric vibration element 101 is hermetically sealed by a lid, a concave space having an opening in the center region of the upper surface, and a lower surface. Is attached on the top surface of the side wall surrounding the recessed space of the base body 102 on which external connection electrode terminals are formed, and in a space region surrounded by the lower surface of the container body 100 and the recessed space of the base body 102. In order to control the oscillation output based on the excitation of the piezoelectric vibration element 101, a piezoelectric oscillator having a structure in which at least an oscillation integrated circuit element 103 electrically connected to the piezoelectric vibration element 101 is accommodated is known. (For example, see Patent Document 1 below.)

  The container body 100 and the base body 102 are usually made of a ceramic material such as alumina ceramics, and a predetermined wiring pattern is formed on the inside and the surface thereof. By adopting a conventionally known green sheet laminating method or the like, It has been produced. In addition, a base body connecting electrode terminal is provided on the lower surface of the container body 101 facing the base body 102, and a container body connection pad is provided on the opening side top surface of the side wall of the base body 102 at locations facing each other. The container body 100 was fixed to the upper surface of the base body 102 by conductively fixing the electrode terminal for base body connection and the container body connection pad through a conductive bonding material such as a conductive adhesive or solder.

The following prior art is disclosed about the piezoelectric oscillator of the above forms.
JP-A-10-98151 JP 2004-228894 A JP 2004-88533 A JP 2000-349555 A

  In addition, the applicant has not found other than the prior art documents related to the present invention other than the prior art documents specified by the above prior art document information by the time of filing of the present application.

  In the conventional piezoelectric oscillator described above, the piezoelectric oscillator is configured by connecting the container body containing the piezoelectric vibration element to the upper surface of the base on which the integrated circuit element is mounted. The overall structure becomes tall due to the influence. Therefore, the conventional piezoelectric oscillator structure has a problem that it is difficult to further reduce the height (thinner).

  Further, in the conventional method for manufacturing a piezoelectric oscillator described above, in the manufacturing method of a container body or a base body, a so-called "" The piezoelectric oscillator is manufactured by mounting a plurality of crystal oscillators and integrated circuit elements on individual containers and bases obtained after the division. In that case, it is necessary to mount and hold the integrated circuit element and the piezoelectric vibration element after mounting and holding the individual container body and the base body on the carrier jig. The process also has a problem of complicating.

  Further, in the above-described conventional method for manufacturing a piezoelectric oscillator, when a container body on which a piezoelectric vibration element is mounted and a substrate on which an integrated circuit element is mounted are electrically and mechanically connected, a spherical conductor is used as a container. Although it is necessary to mount on the substrate connection electrode terminal on the main mounting surface of the body, there is a problem that the production efficiency decreases because it is necessary to perform the work of mounting the conductors one by one. It was.

  The present invention has been devised in view of the above problems, and an object of the present invention is to provide a piezoelectric oscillator that is easy to handle, has excellent productivity, and can cope with a low profile, and a method for manufacturing the piezoelectric oscillator. It is in.

The piezoelectric device of the present invention is made in order to solve the above-mentioned problems, and in one form, the piezoelectric vibration element is hermetically sealed inside the container body in which the electrode terminal for lead connection is formed on one main surface. A piezoelectric vibrator unit mounted on the integrated circuit element , an integrated circuit element including at least an oscillation circuit electrically connected to the piezoelectric vibration element described above, and a connection pad formed on one main surface of the integrated circuit element. A plurality of plate-like lead portions each electrically and mechanically connected, and of the lead portions, the lead portion used for electrical and mechanical connection between the piezoelectric vibration element and the integrated circuit element. A protrusion is formed only on the protrusion, and a part of the lead is opposed to the integrated circuit element of the lead so that the protrusion has a height higher than the thickness of the integrated circuit element. Lead from the side opposite to the surface to be The integrated circuit being formed by recessing it towards the element surface facing the side, and the protrusion, and said electrode terminal leads connecting the piezoelectric vibrator unit, by joining conductive by a conductive bonding agent The piezoelectric oscillator is characterized by an integral structure.

As another form, a piezoelectric vibrator portion in which a piezoelectric vibration element is hermetically mounted inside a container body in which an integrated circuit element connection electrode terminal including a lead connection electrode terminal is formed on one main surface. A connection formed on one main surface of the integrated circuit element, and an integrated circuit element including an oscillation circuit that is electrically connected to at least the piezoelectric vibration element, and a plurality of plate-like leads. The piezoelectric vibrator portion and the integrated circuit element are integrally formed by electrically and mechanically connecting the pad and the electrode terminal for connecting the integrated circuit element, and the lead portion is provided with a protrusion. The protruding portion has a portion of the lead portion on the side opposite to the surface facing the integrated circuit element so that the height dimension of the protruding portion is higher than the thickness dimension of the integrated circuit element. To the side of the lead facing the integrated circuit element It is formed by recessing tinge, wherein the lead connecting the electrode terminals, the lead portion is a piezoelectric oscillator, characterized by being fixed conductive bonding to the conductive bonding agent protrusions.

  Further, the main surface of the lead portion connected to the integrated circuit element on the side not facing the integrated circuit element, and the tip of the protrusion formed on the lead portion are exposed outside the insulating resin surface, The piezoelectric oscillator according to paragraph (0010), wherein the periphery of the integrated circuit element is covered with an insulating resin.

The method for manufacturing a piezoelectric oscillator according to the present invention has been made to solve the above-described problems, and as one form thereof, one end of a plurality of lead parts is arranged in a form connected to a frame part. In this lead part, only the lead part used for electrical and mechanical connection between the piezoelectric vibration element and the integrated circuit element, a part of the lead part is a surface facing the integrated circuit element of the lead part. Recesses are recessed from the opposite surface side toward the surface facing the integrated circuit element of the lead portion to form a protrusion having a height that is higher than the thickness of the integrated circuit element, with a predetermined spacing. In the form of preparing a lead frame arranged with the other end of the lead part facing each other, and with each lead part of the lead frame facing the connection pad corresponding to the function determined for each lead part Integrated circuit element Each lead part and connection pad are electrically and mechanically connected, and the piezoelectric vibration element is hermetically mounted inside a container body in which a lead connection electrode terminal is formed on one main surface. Mounting a piezoelectric vibrator unit on an integrated circuit element by bonding a lead connection electrode terminal and a protrusion formed on the lead unit with a conductive bonding agent; and a frame unit of each lead frame; A method of manufacturing a piezoelectric oscillator comprising: a step of disconnecting each lead portion from a frame portion by cutting a connection portion with the lead portion, and simultaneously obtaining a plurality of piezoelectric oscillators.

As another form, one end of a plurality of lead parts is arranged in a form connected to the frame part, and a part of the lead part is opposed to the integrated circuit element of the lead part in all of the lead parts. Recessed from the surface opposite to the surface toward the surface facing the integrated circuit element of the lead portion to form a protrusion having a height that is higher than the thickness of the integrated circuit element. A container body in which an electrode terminal for connecting an integrated circuit element including a lead connecting electrode terminal is formed on one main surface, and a step of preparing a lead frame arranged with the other end of the lead portion facing each other with a space therebetween The electrode pad for connecting the integrated circuit element of the piezoelectric vibrator portion in which the piezoelectric resonator element is hermetically mounted inside is connected to the connection pad corresponding to the function determined for each electrode terminal for connecting the integrated circuit element. Integrated circuit elements in different forms Mounting, electrically and mechanically connecting, and mounting by connecting the electrode terminal for lead connection of the piezoelectric vibrator portion and the protrusion formed on each lead portion of the lead frame with a conductive bonding agent And a step of disconnecting each lead portion from the frame portion by cutting a connecting portion between the frame portion and the lead portion of each lead frame to simultaneously obtain a plurality of piezoelectric oscillators. This is a method of manufacturing a piezoelectric oscillator.

  Furthermore, after the integrated circuit element is mounted on each lead portion of the lead frame, the lead portion connected to the integrated circuit element is formed on the main surface on the side not facing the integrated circuit element and the lead portion. In the method of manufacturing a piezoelectric oscillator according to paragraph (0013), further comprising a step of covering the periphery of the integrated circuit element with an insulating resin so that the tip of the protrusion is exposed outside the surface of the insulating resin. is there.

  According to the piezoelectric device of the present invention, the lead connection electrode terminal is formed on the first main surface facing the integrated circuit element of the container body on which the piezoelectric vibration element is mounted. Of the lead portions connected to the pads, the lead portions that need to be electrically and mechanically connected to the electrode terminals for lead connection are formed with protrusions having a height dimension higher than the thickness dimension of the integrated circuit element. The protrusion and the electrode terminal for lead connection are joined and conductive with a conductive adhesive, thereby eliminating the use of a substrate on which an integrated circuit element is mounted, and lowering the height compared to a conventional piezoelectric oscillator ( It is possible to reduce the thickness.

Also, by filling the periphery of the integrated circuit element including the surface of the lead part on the integrated circuit element side with an insulating resin, when the lead part is cut and separated from the frame part of the lead frame, the insulating resin leads when cutting. Therefore, it is possible to further reduce problems such as disconnection between the lead portion and the connection pad of the integrated circuit element due to stress at the time of cutting.
In addition, because the tip of the protrusion provided on the lead is exposed from the filled insulating resin, conductive bonding is possible when connecting the protrusion to the lead connection electrode terminal of the piezoelectric vibrator. It is possible to prevent the agent from coming into contact with a metal part such as another lead part and causing a short circuit.

  Furthermore, according to the method for manufacturing a piezoelectric device of the present invention, the lead frame is a step of dividing the frame portion and the lead portion after mounting the integrated circuit element. During the manufacturing process, the lead frame itself is divided. Therefore, the carrier for mounting an integrated circuit element as described in the conventional example is unnecessary, and each sub-board obtained by dividing the board is not necessary. No complicated work such as mounting on a carrier is required. This also improves the productivity of the piezoelectric oscillator.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view illustrating a piezoelectric oscillator according to an embodiment of the present invention using an oscillator using a crystal as a piezoelectric material (hereinafter referred to as a crystal oscillator) as an example. FIG. 2 is a sectional view after the crystal oscillator shown in FIG. 1 is assembled. FIG. 3 is a plan view of the lead frame prepared at the time of manufacturing the crystal oscillator of the present invention disclosed in FIGS. 1 and 2 as seen from the main surface of the integrated circuit element mounting side. In FIG. 1 and FIG. 2, the upper side of the paper on which the drawings are described for explanation is described as the upper side of the crystal oscillator. Moreover, in each figure, the same code | symbol shows the same components, and in order to clarify description, a part of structure unnecessary for description is not shown in figure. Further, the illustrated dimensions are partially exaggerated.
The crystal oscillator shown in each drawing contains a crystal resonator element 20 inside a container body 10 whose main surface outer shape is rectangular. The container body 10 is connected to an external connection electrode terminal 41a and a write control terminal 41b. Lead portion 41 is connected. Each lead portion 41 has a structure in which an integrated circuit element 50 in which an electronic circuit network such as an oscillation circuit or a temperature compensation circuit is formed is mounted in the vicinity of one end portion.

  The container body 10 is made of, for example, a ceramic material such as alumina ceramics, glass-ceramics, and the upper main surface of the container body 10 is formed with a recessed space 14 that opens in a rectangular shape in the central region. An annular sealing conductor pattern 11 is formed on the opening side top surface of the side wall surrounding the opening of the recessed space 14, and an electronic circuit network mounted in the integrated circuit element 50 is mounted on the mounting side main surface. The lead connection electrode terminal 12 is provided for connecting to the lead portion 41 serving as the monitor electrode terminal 41c having a function of monitoring the characteristics of the crystal resonator element 20 and making electrical connection with the crystal resonator element 20. Further, when the container body 10 is attached and fixed to the lead portion 41, the protruding portions 44 provided on the four lead portions 41 (including the monitor electrode terminal 41 c) arranged on the outermost side of the lead portions 41. The protrusion connection portion and the lead connection electrode terminal 12 formed on the mounting surface of the container body 10 are mechanically and electrically joined to each other by a conductive adhesive 60 such as solder or a conductive adhesive. Further, the container body 10 is for accommodating the crystal resonator element 20 in the recess space 14 opened on the upper surface thereof, and is formed on both the front and back main surfaces of the crystal resonator element 20 on the bottom surface in the recess space 14. A piezoelectric vibration element mounting pad 13 that is electrically connected to each of the excitation electrodes 21 thus formed is deposited.

  In addition, the sealing conductor pattern 11 formed on the top surface of the opening side of the recess space 14 on the side wall of the container body 10 is made of nickel (on the surface of a base layer made of tungsten (W), molybdenum (Mo), etc., for example. A Ni) layer and a gold (Au) layer are sequentially deposited in a form surrounding the opening of the recess space 14 in an annular shape, and are formed to a thickness of 10 μm to 25 μm. The peripheral edge is exposed on the inner wall surface of the recessed space 14, and the outer peripheral edge is exposed on the outer surface of the container body 10. The conductive pattern 11 for sealing improves the airtight reliability and productivity of the piezoelectric vibration element mounting space by improving the wettability of the sealing member 31 formed on the lid 30 for the lid 30 described later. Can do.

  The piezoelectric vibration element mounting pad 13 provided on the bottom surface in the recessed space 14 of the side wall of the container body 10 constitutes the container body 10 with the lead connection electrode terminals 12 provided on the mounting side main surface of the container body 10. Are electrically connected via a wiring pattern on the surface of each layer and via conductors that penetrate each layer. Further, the piezoelectric vibration element mounting pad 13 is electrically and mechanically connected to an excitation electrode 21 of a crystal vibration element 20 described later via a conductive adhesive 70 on the upper surface side.

  On the other hand, the crystal resonator element 20 accommodated in the recessed space 14 of the container body 10 is mainly a crystal element plate having a substantially flat plate shape with a rectangular main surface shape that is cut from the artificial crystal lens at a predetermined cut angle and is subjected to external processing. As a structure, a pair of excitation electrodes 21 are attached and formed on both the front and back main surfaces of the crystal element plate, and when an alternating voltage from the outside is applied to the crystal element plate via the excitation electrode 21. The excitation is generated in a predetermined vibration mode and frequency. Such a crystal resonator element 20 has a lead electrode drawn out from the excitation electrode 21 applied to both main surfaces thereof to one short side of the crystal base plate and a corresponding piezoelectric vibration in the bottom surface of the recessed space 14. The element mounting pad 13 is mounted on the bottom surface in the recessed space 14 of the container body 10 by electrically and mechanically connecting the element mounting pad 13 via the conductive adhesive 70.

  The conductive adhesive 70 is obtained by adding and mixing a predetermined amount of conductive particles made of Ag or the like into a resin material made of silicon resin or polyimide resin.

  Further, the lid 30 disposed on the container body 10 is manufactured by adopting a conventionally known metal processing method and shaping a metal such as 42 alloy into a predetermined shape. A nickel (Ni) layer is formed on the upper surface of the lid body 30, and further, gold tin (Au—Sn) which is a sealing member 31 at least at a location facing the sealing conductor pattern 11 on the upper surface of the nickel (Ni) layer. ) Layer is formed. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Moreover, such a sealing member 31 can relieve unevenness on the surface of the sealing conductor pattern 11 and prevent a decrease in hermeticity. Such a lid 30 is disposed on the sealing conductor pattern 11 formed on the top of the side wall portion surrounding the recessed space 14 in which the crystal resonator element 20 is mounted so as to cover the opening of the recessed space 14. The sealing member 31 and the sealing conductor pattern 11 are melt-bonded to hermetically seal the inside of the recessed space 14 to constitute a piezoelectric vibrator portion.

  The lead portion 41 is a metal material having a relatively high conductivity such as copper, and a plurality of such as shown in FIG. 3, in which such a metal plate is formed by a conventionally known punching method or etching method. The lead portion 41 is formed by separating the lead portion 41 from the lead frame 43 in a form in which one end of the lead portion 41 is arranged and connected to the frame portion 42. Further, the lead portion 41 of the lead portion 41 connected to the lead connection electrode terminal 12 formed in the container body 10 is provided with a protruding portion 44 by a punching method or the like. The protrusion 44 provided on the predetermined lead 41 and the lead frame connecting electrode terminal 12 on the mounting surface of the container body 10 are melt-bonded by the conductive adhesive 60.

  Each lead portion 41 is used as an external connection electrode terminal 41a (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal), write control terminal 41b, or the aforementioned monitor electrode terminal 41c. When the piezoelectric oscillator is mounted on an external electric circuit such as a mother board, the external connection electrode terminal 41a is electrically connected to the circuit wiring of the external electric circuit by soldering or the like. Further, the write control terminal 41b applies the probe needle of the temperature compensation data writing device, and writes temperature compensation data according to the temperature characteristics of the crystal resonator element 20, whereby the temperature compensation data is stored in the memory of the integrated circuit element 50. Stored. In addition, the lead part 41 used as each electrode terminal is provided with a difference in outer shape depending on the use of the electrode terminal.

  Here, if the ground terminal and the oscillation output terminal are arranged close to each other among the four external connection electrode terminals 41a, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. can do. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

  As the integrated circuit element 50, for example, a rectangular flip chip type integrated circuit element having a plurality of connection pads corresponding to each lead portion 41 on the lower surface is used. An oscillation circuit or the like that is connected to the element 20 and generates a predetermined oscillation output is provided. The oscillation output generated by the oscillation circuit is output to the outside and then used as a reference signal such as a clock signal, for example. It will be.

  Further, the integrated circuit element 50 is attached to the lead 41 by connecting the connection pads provided on the lower surface thereof individually to the lead 41 via the conductive adhesive 60, solder or metal bumps. As a result, the electronic circuit in the integrated circuit element 50 is electrically connected to the crystal vibrating element 20, the lead frame 41 serving as the external connection electrode terminal 41a, and the like.

FIG. 6 shows the main surface of the lead 41 connected to the integrated circuit element 50 of the piezoelectric oscillator shown in FIGS. 1 and 2 on the side not facing the integrated circuit element 50 and the lead 41 Disclosed is a piezoelectric oscillator in which the tip of the projection 44 formed on the monitor electrode terminal 41c is exposed outside the surface of the insulating resin 80 and the periphery of the integrated circuit element 50 is covered with the insulating resin 80. is doing.
The insulating resin 80 is often made of epoxy, polyimide, or the like, and is made of a thermoplastic resin that has the property of flowing when softened or melted by heating.
Thus, since the periphery of the integrated circuit element 50 is covered and protected by the insulating resin 80 in the form, it is possible to prevent the frequency from fluctuating due to the influence of foreign matter or the like. In addition, by filling and covering the periphery of the integrated circuit element 50 including the surface of the lead part 41 on the side of the integrated circuit element 50 with an insulating resin, the lead part 41 is removed from the frame part 42 of the lead frame 43 in the manufacturing method described later. When cutting and separating, the insulating resin 80 serves as a buffer material for stress generated in the lead portion 41 during cutting, so that problems such as disconnection between the lead portion 41 and the integrated circuit element 50 due to stress during cutting are further reduced. It becomes possible.

Next, a manufacturing method of the above-described piezoelectric oscillator will be described with reference to FIGS.
Here, FIGS. 7A to 7C are cross-sectional views for explaining the manufacturing method of the present invention, and FIG. 8 shows the lead frame used in the manufacturing method of the present invention as seen from the main surface on which the integrated circuit element is mounted. It is a top view. First, as shown in FIGS. 7A and 8, one end of a plurality of lead portions 41 is arranged in a form connected to the frame portion 42, and the piezoelectric vibration element and the integrated circuit element in the lead portion 41 are arranged. Only the lead portion 41 (monitor electrode end 41c) used for electrical and mechanical connection between the protrusion portions 44 having a height dimension higher than the thickness dimension of the integrated circuit element 50 protruding in the same direction. A lead frame 43 formed and arranged in a form in which the other end of the lead portion 41 is opposed to each other with a predetermined interval is prepared. Such a lead frame 43 is formed by processing a metal such as copper, a known pattern such as photoetching and punching into a predetermined pattern. Further, in this embodiment, the lead frame 43 cuts the lead portion 41 and the frame portion 42 in a process described later.

  Next, as shown in FIG. 7B, functions (for GND, power supply voltage input, signal output, etc.) determined for each lead portion 41 are located near the other end of each lead portion 41 of this lead frame 43. The integrated circuit element 50 is mounted in a form in which connection pads corresponding to each other) are faced to each other, and each lead portion 41 and the connection pad are electrically and mechanically connected by a conductive adhesive 60.

As the integrated circuit element 50, a rectangular flip-chip type integrated circuit element having a plurality of connection pads on the bonding surface is used.
In the integrated circuit element 50, a plurality of connection pads provided on the joint surface are connected to electrode terminals corresponding to functions in the lead portions 41 of the lead frame 43, such as a conductive adhesive 60 or a conductive material such as solder. After that, the conductive adhesive 60 is melted by application of heat and then solidified by cooling, and the bonding pad and the lead portion 41 are connected to the conductive adhesive. The integrated circuit element 50 is attached to and mounted on the lead frame 43 by joining via the lead 60.

  Next, as shown in FIG. 7 (c), the container body 10 containing the crystal resonator element 20 constituting the piezoelectric vibrator portion is placed on the integrated circuit element 50 mounted on the lead frame 43 on the lead frame. The projecting portion 44 provided on the predetermined lead portion 41 of 43 and the electrode terminal 12 for lead connection provided on the mounting side main surface of the container body 10 are mounted by bonding with the conductive adhesive 60. Therefore, the electronic circuit in the integrated circuit element 50 is electrically connected to the crystal resonator element 20 and the lead portion 41 of the lead frame 43 through the wiring conductor of the container body 10 and the like. Thereafter, by cutting the connecting portion between the frame portion 42 and the lead portion 41 of each lead frame 43, each lead portion 41 is separated from the frame portion 42, and a plurality of piezoelectric oscillators are obtained simultaneously. The lead frame 43 is cut by dicing using a dicer or the like, and a plurality of piezoelectric elements in which the lead portion 41 performs various functions of the external connection electrode terminal 41a and the write control terminal 41b through the cutting process. An oscillator is obtained at the same time.

  Finally, the temperature compensation data is input to the integrated circuit element 50 via the write control terminal 41b of the lead part 41 cut and separated from the frame part 42, and the temperature compensation data is stored in the memory in the integrated circuit element 50. . Such temperature compensation data writing operation is performed by applying the probe needle of the temperature compensation data writing device to the write control terminal 41b and using the temperature compensation data created according to the temperature characteristics of the crystal resonator element 20 as an integrated circuit. This is performed by inputting to a memory provided in the temperature compensation circuit of the element 50 and storing it. Here, the temperature compensation data written in the integrated circuit element 50 is for correcting the temperature characteristic variation for each crystal oscillation element 20, and the temperature of the crystal oscillation element 20 used in the temperature compensation type crystal oscillator. It is obtained by measuring the characteristics in advance.

In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, after connecting the connection pads of the integrated circuit element 50 to the plurality of lead portions 41, a predetermined lead portion of the lead portions 41 (including a lead portion serving as the monitor electrode terminal 41c). Although the container body 10 constituting the piezoelectric vibrator portion is mounted and mounted by the protrusion 44 provided on the integrated circuit element connection as shown in FIG. 4, the lead connection electrode terminal 12 is provided on one main surface. An integrated circuit element in which a piezoelectric vibrator portion in which the crystal resonator element 20 is air-tightly mounted and an oscillation circuit that is electrically connected to the crystal resonator element 20 are incorporated in the container body 10 in which the electrode terminal for operation is formed. 50 are integrally formed by electrically and mechanically connecting a connection pad formed on one main surface of the integrated circuit element 50 and an electrode terminal for connecting the integrated circuit element, and lead connection. Electrode The lead part 41 in which the protrusion part 44 whose height dimension is higher than the thickness dimension of the integrated circuit element 50 is formed on the child 12 and the protrusion part 44 is conductively bonded by the conductive bonding agent 60 and fixed. The piezoelectric oscillator may be used.

As another method of manufacturing the piezoelectric oscillator shown in FIG. 4, a plurality of lead portions 41 are arranged in such a manner that one end of each lead portion 41 is connected to the frame portion, and all of the lead portions protrude in the same direction. The protrusion 44 having a height higher than the thickness of the integrated circuit element 50 is formed and arranged in a form in which the other ends of the lead portions face each other at a predetermined interval. Prepare a lead frame similar to the lead frame form,
Next, the piezoelectric vibrator portion in which the crystal resonator element 20 is airtightly mounted inside the container body 10 in which the integrated circuit element connection electrode terminal including the lead connection electrode terminal 12 is formed on one main surface. The integrated circuit element 50 is mounted on the electrode terminal for connecting the integrated circuit element so that the connection pads corresponding to the functions determined for each of the electrode terminals for connecting the integrated circuit element face each other, and are electrically and mechanically connected. ,
Next, after the lead connection electrode terminal 12 of the container body 10 constituting the piezoelectric vibrator portion and the projection 44 formed on each lead portion 41 of the lead frame are joined by the conductive bonding agent 60, By cutting the connecting portion between the frame portion of the lead frame and the lead portion 41, each step of separating the lead portions 41 from the frame portion and simultaneously obtaining a plurality of piezoelectric oscillators is provided.

  Further, in FIG. 1 and FIG. 2, two of the four lead portions 41 formed with the protrusions 44 connect the integrated circuit element 50 and the crystal resonator element 20 and simultaneously measure the characteristics of the crystal resonator element 20. Functioning as a monitoring electrode pad 40c. Since the thickness of the lead part 41 serving as the monitor electrode terminal 41c and the write control terminal 41b is made thinner than the thickness of the lead part 41 serving as the external connection electrode terminal 41a, an external electric circuit network such as a motherboard is provided. Even if it is mounted on, the monitor electrode terminal 41c does not come into contact with the wiring pattern formed on the mother board, so that a stable oscillation frequency can be output.

FIG. 1 is an exploded perspective view showing an embodiment of a crystal oscillator which is an example of a piezoelectric oscillator according to the present invention. FIG. 2 is a schematic cross-sectional view showing the piezoelectric oscillator shown in FIG. 1 assembled and then cut at the position of the virtual cutting line AA ′ shown in FIG. FIG. 3 is a plan view of a lead frame constituting a crystal oscillator which is an example of a piezoelectric oscillator according to the present invention as viewed from the container mounting direction. FIG. 4 is an exploded perspective view showing another embodiment of a crystal oscillator which is an example of a piezoelectric oscillator according to the present invention. (Note that the integrated circuit element is already connected to the lower surface of the piezoelectric vibrator portion.) FIG. 5 is a schematic cross-sectional view showing the piezoelectric oscillator shown in FIG. 4 assembled and then cut along the virtual cutting line B-B ′ shown in FIG. 4. FIG. 6 is an exploded perspective view showing another embodiment of a crystal oscillator which is an example of a piezoelectric oscillator according to the present invention. FIG. 7 is a process explanatory view showing a method (a) to a form (c) in the process of the method for manufacturing a piezoelectric oscillator according to the present invention using sectional views. FIG. 8 is a plan view of a metal plate used in the method for manufacturing a piezoelectric oscillator according to the present invention as seen from the container body mounting direction. FIG. 9 is an exploded perspective view showing a crystal oscillator as an example of a conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 11 ... Conducting pattern for sealing 12 ... Electrode terminal for lead connection 13 ... Piezoelectric vibration element mounting pad 14 ... Recessed space 20 ... Piezoelectric vibration element (crystal vibration element) )
DESCRIPTION OF SYMBOLS 21 ... Electrode for excitation 30 ... Cover body 31 ... Sealing member 41 ... Lead part 41a ... Lead part (external connection electrode terminal)
41b ... Lead part (write control terminal)
41c ... Lead part (monitor electrode terminal)
42 ... Frame part 43 ... Lead frame 44 ... Protrusion part 50 ... Integrated circuit element 60, 70 ... Conductive adhesive (conductive adhesive)
80 ... Insulating resin

Claims (6)

A piezoelectric vibrator portion in which a piezoelectric vibration element is airtightly mounted inside a container body in which lead connection electrode terminals are formed on one main surface;
An integrated circuit element including at least an oscillation circuit electrically connected to the piezoelectric vibration element ;
A plurality of plate-like lead portions electrically and mechanically connected to connection pads formed on one main surface of the integrated circuit element,
Of the lead portion, a protrusion is formed only on the lead portion used for electrical and mechanical connection between the piezoelectric vibration element and the integrated circuit element,
The protruding portion has a surface on the side opposite to the surface facing the integrated circuit element of the lead portion so that the height dimension of the protruding portion is higher than the thickness dimension of the integrated circuit element. It is formed by denting from the side toward the surface facing the integrated circuit element of the lead part,
Said protrusion and said electrode terminal leads connecting the piezoelectric vibrator unit, by joining conductive by a conductive bonding agent, a piezoelectric oscillator, characterized in that has an integral structure. A piezoelectric vibrator portion in which a piezoelectric vibration element is hermetically mounted inside a container body in which an integrated circuit element connection electrode terminal including a lead connection electrode terminal is formed on one main surface;
An integrated circuit element including at least an oscillation circuit electrically connected to the piezoelectric vibration element ;
A plurality of plate-like lead portions,
The piezoelectric vibrator portion and the integrated circuit element are integrated by electrically and mechanically connecting a connection pad formed on one main surface of the integrated circuit element and the electrode terminal for connecting the integrated circuit element. Is formed,
The lead portion is provided with a protrusion,
The protruding portion has a surface on the side opposite to the surface facing the integrated circuit element of the lead portion so that the height dimension of the protruding portion is higher than the thickness dimension of the integrated circuit element. It is formed by denting from the side toward the surface facing the integrated circuit element of the lead part,
2. The piezoelectric oscillator according to claim 1 , wherein the lead portion is fixed to the lead connection electrode terminal by conductively bonding the protruding portion with a conductive bonding agent.   The main surface of the lead portion connected to the integrated circuit element on the side not facing the integrated circuit element and the tip of the protrusion formed on the lead portion are exposed outside the surface of the insulating resin. 2. The piezoelectric oscillator according to claim 1, wherein the periphery of the integrated circuit element is covered with the insulating resin. Arranged in a form in which one end of a plurality of lead parts is connected to a frame part, and only the lead part used for electrical and mechanical connection between the piezoelectric vibration element and the integrated circuit element among the lead parts, A part of the lead portion is recessed from the surface of the lead portion opposite to the surface facing the integrated circuit element toward the surface facing the integrated circuit element of the lead portion, and the integrated circuit Forming a projecting portion having a form with a height dimension higher than the thickness dimension of the element, and preparing a lead frame arranged in a form in which the other end of the lead part faces each other with a predetermined interval;
The integrated circuit element is mounted on each lead portion of the lead frame in such a manner that connection pads corresponding to functions determined in the lead portions face each other, and the lead portions and the connection pads are electrically connected. In addition, a piezoelectric vibrator portion in which a piezoelectric vibration element is hermetically mounted inside a container body that is mechanically connected and has a lead connection electrode terminal formed on one main surface is formed on the integrated circuit element. Mounting the lead connection electrode terminal and the protrusion formed on the lead portion by bonding with a conductive bonding agent;
By cutting the connecting portion between the said frame portion and the lead portion of each lead frame, obtaining a plurality of piezoelectric oscillators at the same time by to disconnect from the frame portion of the respective lead portions,
A method for manufacturing a piezoelectric oscillator, comprising: A plurality of lead portions are arranged in such a manner that one end thereof is connected to a frame portion, and a part of the lead portion is arranged on all of the lead portions on the side opposite to the surface of the lead portion facing the integrated circuit element. From the surface side, the lead portion is recessed toward the surface facing the integrated circuit element to form a protrusion having a height higher than the thickness dimension of the integrated circuit element, with a predetermined interval. Preparing a lead frame arranged in a form facing the other end of the lead portion; and
For connecting the integrated circuit element of the piezoelectric vibrator portion in which the piezoelectric vibration element is hermetically mounted in the container body in which the electrode terminal for connecting the integrated circuit element including the electrode terminal for lead connection is formed on one main surface. A step of mounting the integrated circuit element in a form in which the connection pads corresponding to the functions determined for the electrode terminals for connecting each integrated circuit element are faced to the electrode terminal, and electrically and mechanically connected;
A step of mounting by bonding with a conductive bonding agent and wherein the protrusion formed on the lead portion of the the lead frame and the lead connecting the electrode terminals of the piezoelectric vibrator unit,
By cutting the connecting portion between the frame portion and the lead portion of each lead frame, obtaining a plurality of piezoelectric oscillators at the same time by the respective lead portions to disconnect from said frame portion,
A method for manufacturing a piezoelectric oscillator, comprising: After the integrated circuit element is mounted on each lead part of the lead frame, the lead part connected to the integrated circuit element on the main surface on the side not facing the integrated circuit element, and the lead part 5. The method of manufacturing a piezoelectric oscillator according to claim 4, further comprising a step of covering the periphery of the integrated circuit element with an insulating resin so that a tip of the formed protrusion is exposed outside the surface of the insulating resin. Method.

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