CN114157264A - an oven controlled crystal oscillator - Google Patents
an oven controlled crystal oscillator Download PDFInfo
- Publication number
- CN114157264A CN114157264A CN202111661762.2A CN202111661762A CN114157264A CN 114157264 A CN114157264 A CN 114157264A CN 202111661762 A CN202111661762 A CN 202111661762A CN 114157264 A CN114157264 A CN 114157264A
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- quartz crystal
- integrated chip
- crystal
- crystal oscillator
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- 239000013078 crystal Substances 0.000 title claims abstract description 163
- 239000010453 quartz Substances 0.000 claims abstract description 102
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 102
- 230000010355 oscillation Effects 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention belongs to the technical field of electronic components and discloses a constant temperature crystal oscillator. The constant temperature crystal oscillator comprises a base, a shell and a constant temperature oscillation module, wherein the shell is arranged on the base and is connected with the base to form a cavity; in the cavity was located to the constant temperature oscillation module, the constant temperature oscillation module included integrated chip and quartz crystal, and quartz crystal located on the base, and on integrated chip located quartz crystal, integrated chip and quartz crystal electric connection, integrated chip were configured to can heat the accuse temperature to quartz crystal to can control quartz crystal oscillation in order to produce frequency signal. According to the constant temperature crystal oscillator provided by the invention, the integrated chip is configured to heat and control the temperature of the quartz crystal and control the oscillation of the quartz crystal to generate the frequency signal, and the integrated chip is directly arranged on the quartz crystal, so that the overall size of the constant temperature crystal oscillator is reduced, the heating efficiency of the quartz crystal is improved, the temperature control effect is improved, and the overall power consumption of the constant temperature crystal oscillator is reduced.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a constant-temperature crystal oscillator.
Background
The crystal oscillator is a quartz crystal oscillator, and the application of the quartz crystal oscillator has been in the history of decades, so that the quartz crystal oscillator has the characteristic of high frequency stability, and therefore the quartz crystal oscillator always occupies an important position in the field of electronic technology. Especially, the rapid development of the information technology industry makes the crystal oscillator appear vigorous. The quartz crystal oscillator is used as a standard frequency source or a pulse signal source to provide a frequency reference in remote communication, satellite communication, mobile phone systems, global positioning systems, navigation, remote control, aerospace, high-speed computers, precision measurement instruments and consumer civil electronic products, and cannot be replaced by other types of oscillators at present.
Quartz crystal oscillators are classified into several types, such as non-temperature compensated crystal oscillators, voltage controlled crystal oscillators, oven controlled crystal oscillators (OCXO for short), and digital/up compensated crystal oscillators. The constant temperature crystal oscillator is the crystal oscillator with the highest frequency stability and accuracy at present, and has very good performance in the aspects of aging rate, temperature stability, long-term stability, short-term stability and the like, so that the constant temperature crystal oscillator is frequently used as a precise time-frequency signal source to be widely applied to electronic instruments such as a global positioning system, communication, metering, remote measuring and controlling, a frequency spectrum analyzer, a network analyzer and the like.
As components of system equipment, research subjects such as miniaturization and high stability of quartz crystal oscillators are almost invariable, and some special application scenes (such as test and measurement, instruments and meters, outdoor mobile equipment and the like) require very high temperature stability, very high stabilization speed and very strict power consumption on the crystal oscillators, so that most constant temperature crystal oscillators cannot meet the requirements.
Disclosure of Invention
The invention aims to provide an oven-controlled crystal oscillator, which aims to solve the problems of large overall size and high power consumption of the oven-controlled crystal oscillator in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
an oven-controlled crystal oscillator comprising:
a base;
the shell is arranged on the base and connected with the base to form a cavity;
the constant temperature oscillation module, the constant temperature oscillation module is located in the cavity, the constant temperature oscillation module includes integrated chip and quartz crystal, quartz crystal locates on the base, integrated chip locates on the quartz crystal, integrated chip with quartz crystal electric connection, integrated chip is configured as can be right quartz crystal heats the accuse temperature, and can control quartz crystal oscillation is in order to produce frequency signal.
Optionally, the oven controlled crystal oscillator further includes a supporting member, the supporting member is disposed on the base, the supporting member is configured to support the quartz crystal, and the supporting member is electrically connected to the integrated chip and the base.
Optionally, the oven controlled crystal oscillator further includes a conductive pin, the conductive pin is disposed through the base, one end of the conductive pin is connected to the support, and the other end of the conductive pin is used for electrically connecting to an external component.
Optionally, the quartz crystal is a cylindrical structure, and the support abuts against the outer circumferential surface of the quartz crystal.
Optionally, the support member includes a support portion and a support portion, one end of the support portion is connected to the conductive pin, the support portion is disposed at the other end of the support portion, and the support portion can support the edge of the end face of the quartz crystal and abut against the outer circumferential surface of the quartz crystal.
Optionally, the plurality of the supporting members are uniformly arranged along the peripheral side of the quartz crystal.
Optionally, the quartz crystal includes a crystal electrode, the crystal electrode is disposed on an end surface of the quartz crystal, and the integrated chip is connected to the crystal electrode.
Optionally, the integrated chip is bonded on the quartz crystal;
or the integrated chip is connected with the quartz crystal through welding.
Optionally, the integrated chip and the quartz crystal are connected through a wire.
Optionally, the side wall of the outer shell is provided with a convex ring, and the convex ring is lapped on the base.
The invention has the beneficial effects that: the constant temperature crystal oscillator provided by the invention is provided with the constant temperature oscillation module, the constant temperature oscillation module is arranged in the cavity and comprises the integrated chip and the quartz crystal, the quartz crystal is arranged on the base, the integrated chip is arranged on the quartz crystal and electrically connected with the quartz crystal, the integrated chip is configured to heat and control the temperature of the quartz crystal and control the oscillation of the quartz crystal to generate a frequency signal, and the integrated chip is directly arranged on the quartz crystal, so that the overall size of the constant temperature crystal oscillator is reduced, the heating efficiency of the quartz crystal is improved, the temperature control effect is improved, excellent temperature stability is achieved, and the overall power consumption of the constant temperature crystal oscillator is reduced due to the small heat conduction distance between the integrated chip and the quartz crystal.
Drawings
FIG. 1 is a cross-sectional view of an oven-controlled crystal oscillator provided by the present invention;
fig. 2 is a top view of an oven-controlled crystal oscillator provided by the present invention.
In the figure:
1. a base; 2. a housing; 21. a convex ring; 3. a constant temperature oscillation module; 31. an integrated chip; 32. a quartz crystal; 321. a crystal electrode; 4. a support member; 41. a support portion; 42. a bearing part; 5. and a conductive pin.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The present embodiment provides an oven controlled crystal oscillator, as shown in fig. 1 and fig. 2, the oven controlled crystal oscillator includes a base 1, a housing 2, and an oven controlled oscillation module 3, the housing 2 is disposed on the base 1, and the housing 2 is connected with the base 1 to form a cavity; the constant temperature oscillation module 3 is arranged in the cavity, the constant temperature oscillation module 3 comprises an integrated chip 31 and a quartz crystal 32, the quartz crystal 32 is arranged on the base 1, the integrated chip 31 is arranged on the quartz crystal 32, the integrated chip 31 is electrically connected with the quartz crystal 32, and the integrated chip 31 is configured to heat and control the temperature of the quartz crystal 32 and control the oscillation of the quartz crystal 32 to generate a frequency signal.
According to the constant temperature crystal oscillator provided by the invention, the constant temperature oscillation module 3 is arranged in the cavity, the constant temperature oscillation module 3 comprises the integrated chip 31 and the quartz crystal 32, the quartz crystal 32 is arranged on the base 1, the integrated chip 31 is arranged on the quartz crystal 32, the integrated chip 31 is electrically connected with the quartz crystal 32, the integrated chip 31 is configured to heat and control the temperature of the quartz crystal 32 and control the oscillation of the quartz crystal 32 to generate a frequency signal, the integrated chip 31 is directly arranged on the quartz crystal 32, the integral volume of the constant temperature crystal oscillator is reduced, the heating efficiency of the quartz crystal 32 is improved, the temperature control effect is improved, and excellent temperature stability can be achieved, and the overall power consumption of the constant temperature crystal oscillator is reduced due to the small heat conduction distance between the integrated chip 31 and the quartz crystal 32.
Optionally, the oven controlled crystal oscillator further includes a support 4, the support 4 is disposed on the base 1, the support 4 is used for supporting the quartz crystal 32, and the support 4 is electrically connected to both the integrated chip 31 and the base 1. Through setting up support 4, support 4 plays supporting role to quartz crystal 32, and support 4 and integrated chip 31 and base 1 all electric connection to realize the electric connection between support 4, integrated chip 31 and the base 1.
Furthermore, the oven controlled crystal oscillator further comprises a conductive pin 5, the conductive pin 5 penetrates through the base 1, one end of the conductive pin 5 is connected with the support piece 4, and the other end of the conductive pin 5 is used for being electrically connected with an external component. Through setting up electrically conductive pin 5 to realize this constant temperature crystal oscillator and external component's electric connection, be convenient for cooperate other subassemblies to use.
Alternatively, the quartz crystal 32 is a cylindrical structure, and the support 4 abuts against the outer circumferential surface of the quartz crystal 32. The quartz crystal 32 is arranged to be of a cylindrical structure, so that the quartz crystal 32 is convenient to process and manufacture, and the processing difficulty is reduced; the support member 4 abuts against the outer circumferential surface of the quartz crystal 32 to prevent the quartz crystal 32 from shaking in the radial direction, thereby improving the support stability.
Specifically, the support member 4 includes a support portion 41 and a support portion 42, one end of the support portion 41 is connected to the conductive pin 5, the support portion 42 is disposed at the other end of the support portion 41, and the support portion 42 can support an edge of an end face of the quartz crystal 32 and abut against an outer circumferential surface of the quartz crystal 32. With this arrangement, the supporting portion 42 can support the edge of the end face of the quartz crystal 32 to provide the quartz crystal 32 with a supporting force along the axial direction of the quartz crystal 32, and the supporting portion 42 abuts against the outer circumferential surface of the quartz crystal 32 to provide the quartz crystal 32 with a resistance along the radial direction of the quartz crystal 32, so as to prevent the quartz crystal 32 from shaking and improve the supporting stability.
Preferably, the plurality of support members 4 are uniformly arranged along the peripheral side of the quartz crystal 32. By the arrangement, the support stability of the support piece 4 to the quartz crystal 32 can be effectively improved. In this embodiment, the number of the support members 4 is four, and the four support members 4 are uniformly arranged along the peripheral side of the quartz crystal 32. In other embodiments, the number of the supporting members 4 can be set by those skilled in the art according to actual needs.
As shown in FIG. 2, the quartz crystal 32 includes a crystal electrode 321, the crystal electrode 321 is disposed on an end surface of the quartz crystal 32, and the integrated chip 31 is connected to the crystal electrode 321. By providing the crystal electrode 321, the connection reliability between the integrated chip 31 and the crystal electrode 321 can be effectively improved.
Optionally, the integrated chip 31 is bonded to the quartz crystal 32. The arrangement is convenient to install and simple and convenient to operate. Or, the integrated chip 31 and the quartz crystal 32 are connected by welding, so that the connection is reliable and the connection airtightness is good.
Alternatively, the integrated chip 31 and the quartz crystal 32 are connected by a wire, and the integrated chip 31 and the support 4 are connected by a wire. The arrangement is easy to install and disassemble.
In order to improve the installation stability of the housing 2 and the base 1, the side wall of the housing 2 is provided with a convex ring 21, and the convex ring 21 is lapped on the base 1. The arrangement of the convex ring 21 increases the contact area between the housing 2 and the base 1, and improves the installation stability.
Alternatively, the base 1 and the housing 2 are connected by welding. With this arrangement, the reliability of connection between the base 1 and the housing 2 is improved.
In this embodiment, the housing 2 is preferably made of copper. The metal copper is easy to process and form, and the shell 2 is convenient to manufacture.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111661762.2A CN114157264A (en) | 2021-12-31 | 2021-12-31 | an oven controlled crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111661762.2A CN114157264A (en) | 2021-12-31 | 2021-12-31 | an oven controlled crystal oscillator |
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| Publication Number | Publication Date |
|---|---|
| CN114157264A true CN114157264A (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111661762.2A Pending CN114157264A (en) | 2021-12-31 | 2021-12-31 | an oven controlled crystal oscillator |
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| CN (1) | CN114157264A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116398581A (en) * | 2023-03-29 | 2023-07-07 | 中国科学院国家空间科学中心 | A crystal vibration damping device for sounding rocket digital transmission transmitter |
| CN117318625A (en) * | 2023-09-22 | 2023-12-29 | 深圳市兴威帆电子技术有限公司 | Temperature constant device and method of crystal oscillator and chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202818244U (en) * | 2012-09-29 | 2013-03-20 | 西安深亚电子有限公司 | High-precision temperature compensation type crystal oscillator packaging structure |
| CN203761346U (en) * | 2014-03-21 | 2014-08-06 | 株洲职业技术学院 | Simple crystal resonator |
| CN104579226A (en) * | 2014-12-30 | 2015-04-29 | 广东大普通信技术有限公司 | Method for improving temperature accuracy of crystal oscillator, oscillator and packaging method of crystal oscillator |
| CN105024668A (en) * | 2015-07-27 | 2015-11-04 | 广东大普通信技术有限公司 | Direct temperature measuring constant-temperature crystal oscillator |
| WO2020037859A1 (en) * | 2018-08-23 | 2020-02-27 | 应达利电子股份有限公司 | Quartz crystal oscillator and method for manufacturing quartz crystal oscillator |
| CN216929987U (en) * | 2021-12-31 | 2022-07-08 | 广东大普通信技术股份有限公司 | Constant temperature crystal oscillator |
-
2021
- 2021-12-31 CN CN202111661762.2A patent/CN114157264A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202818244U (en) * | 2012-09-29 | 2013-03-20 | 西安深亚电子有限公司 | High-precision temperature compensation type crystal oscillator packaging structure |
| CN203761346U (en) * | 2014-03-21 | 2014-08-06 | 株洲职业技术学院 | Simple crystal resonator |
| CN104579226A (en) * | 2014-12-30 | 2015-04-29 | 广东大普通信技术有限公司 | Method for improving temperature accuracy of crystal oscillator, oscillator and packaging method of crystal oscillator |
| CN105024668A (en) * | 2015-07-27 | 2015-11-04 | 广东大普通信技术有限公司 | Direct temperature measuring constant-temperature crystal oscillator |
| WO2020037859A1 (en) * | 2018-08-23 | 2020-02-27 | 应达利电子股份有限公司 | Quartz crystal oscillator and method for manufacturing quartz crystal oscillator |
| CN216929987U (en) * | 2021-12-31 | 2022-07-08 | 广东大普通信技术股份有限公司 | Constant temperature crystal oscillator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116398581A (en) * | 2023-03-29 | 2023-07-07 | 中国科学院国家空间科学中心 | A crystal vibration damping device for sounding rocket digital transmission transmitter |
| CN117318625A (en) * | 2023-09-22 | 2023-12-29 | 深圳市兴威帆电子技术有限公司 | Temperature constant device and method of crystal oscillator and chip |
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