CN108603800B - 压力传感器 - Google Patents

压力传感器 Download PDF

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Publication number: CN108603800B
Authority: CN; China
Prior art keywords: convex portion; case; pressure sensor; piezoelectric element; electrode
Prior art date: 2016-02-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN201680080713.0A

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English (en)

Chinese (zh)

Other versions

CN108603800A (zh

Inventor

浅仓康弘

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kyocera Corp

Original Assignee

Kyocera Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-02-15

Filing date

2016-06-23

Publication date

2020-08-11

2016-06-23 Application filed by Kyocera Corp filed Critical Kyocera Corp

2018-09-28 Publication of CN108603800A publication Critical patent/CN108603800A/zh

2020-08-11 Application granted granted Critical

2020-08-11 Publication of CN108603800B publication Critical patent/CN108603800B/zh

Status Active legal-status Critical Current

2036-06-23 Anticipated expiration legal-status Critical

Images

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/008—Transmitting or indicating the displacement of flexible diaphragms using piezoelectric devices
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means

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Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Measuring Fluid Pressure (AREA)

CN201680080713.0A 2016-02-15 2016-06-23 压力传感器 Active CN108603800B (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2016026068		2016-02-15
JP2016-026068		2016-02-15
PCT/JP2016/068670 WO2017141460A1 (fr)	2016-02-15	2016-06-23	Capteur de pression

Publications (2)

Publication Number	Publication Date
CN108603800A CN108603800A (zh)	2018-09-28
CN108603800B true CN108603800B (zh)	2020-08-11

Family

ID=59624881

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201680080713.0A Active CN108603800B (zh)	2016-02-15	2016-06-23	压力传感器

Country Status (5)

Country	Link
US (1)	US10859458B2 (fr)
EP (1)	EP3418706B1 (fr)
JP (1)	JP6557367B2 (fr)
CN (1)	CN108603800B (fr)
WO (1)	WO2017141460A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9970831B2 (en) *	2014-02-10	2018-05-15	Texas Instruments Incorporated	Piezoelectric thin-film sensor
US12056994B2 (en) *	2020-07-15	2024-08-06	Xerox Corporation	Systems and methods for improved object placement sensing for point-of-purchase sales
US12216011B2 (en)	2020-07-30	2025-02-04	Xerox Corporation	Systems and methods for improved sensing performance of pressure-sensitive conductive sheets
CN112082674B (zh) *	2020-09-25	2022-03-25	长安大学	一种基于正挠曲电效应的土压力测量盒
US12009159B2 (en)	2021-04-13	2024-06-11	Xerox Corporation	Membrane switches configured to sense pressure applied from compliant and rigid objects
EP4243222B1 (fr) *	2022-03-09	2024-05-15	WEZAG GmbH & Co. KG	Capteur de puissance de pince à sertir et pince à sertir

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04105374A (ja) *	1990-08-24	1992-04-07	Nec Corp	圧電アクチュエータ
JPH07253364A (ja) *	1994-03-14	1995-10-03	Nippondenso Co Ltd	応力検出装置
JP2001136151A (ja) *	1999-09-17	2001-05-18	Lucent Technol Inc	未使用のサブキャリヤを使用する直交周波数分割多重（ｏｆｄｍ）地上レピータを識別するための方法および装置
JP2012112824A (ja) *	2010-11-25	2012-06-14	Kyocera Corp	圧力センサ素子およびこれを備えた圧力センサ
CN102511088A (zh) *	2009-10-28	2012-06-20	京瓷株式会社	层叠型压电元件、使用该层叠型压电元件的喷射装置及燃料喷射系统
JP2013160669A (ja) *	2012-02-07	2013-08-19	Seiko Epson Corp	センサーデバイス、センサーモジュール、力検出装置及びロボット

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52134481A (en)	1976-05-04	1977-11-10	Nippon Gakki Seizo Kk	Piezo-electric conversion device
JPH0439552Y2 (fr) *	1986-01-20	1992-09-16
JPH0750789B2 (ja) *	1986-07-18	1995-05-31	日産自動車株式会社	半導体圧力変換装置の製造方法
JPS63124636U (fr)	1987-02-06	1988-08-15
US5062302A (en) *	1988-04-29	1991-11-05	Schlumberger Industries, Inc.	Laminated semiconductor sensor with overpressure protection
JP3365028B2 (ja) *	1994-03-14	2003-01-08	株式会社デンソー	圧力検出装置
JP3640337B2 (ja) *	1999-10-04	2005-04-20	信越化学工業株式会社	圧力センサー装置
DE10042185B4 (de) *	2000-07-10	2006-02-16	Murata Mfg. Co., Ltd., Nagaokakyo	Piezoelektrischer elektroakustischer Wandler
JP2004031696A (ja) *	2002-06-26	2004-01-29	Kyocera Corp	熱電モジュール及びその製造方法
CN1601735B (zh) *	2003-09-26	2010-06-23	松下电器产业株式会社	半导体器件及其制造方法
JP2006226756A (ja) *	2005-02-16	2006-08-31	Denso Corp	圧力センサ
WO2007049697A1 (fr) *	2005-10-28	2007-05-03	Kyocera Corporation	Element piezoelectrique stratifie et dispositif d’injection l’utilisant
JP2008053315A (ja)	2006-08-22	2008-03-06	Ngk Spark Plug Co Ltd	積層型圧電アクチュエータ
JP5693047B2 (ja) *	2009-06-01	2015-04-01	株式会社デンソー	力学量センサ素子、およびその製造方法
US20110291526A1 (en) *	2010-05-27	2011-12-01	Innowattech Ltd.	Piezoelectric stack compression generator
JP5772039B2 (ja) *	2011-02-15	2015-09-02	株式会社リコー	電気機械変換膜の製造方法および電気機械変換素子の製造方法
CH705261A1 (de)	2011-07-07	2013-01-15	Kistler Holding Ag	Verfahren zum Verbinden einer Membran an ein Sensorgehäuse.
JP2013101020A (ja) *	2011-11-08	2013-05-23	Seiko Epson Corp	センサー素子、力検出装置およびロボット
US8736080B2 (en) *	2012-04-30	2014-05-27	Apple Inc.	Sensor array package
KR101320136B1 (ko) *	2012-07-27	2013-10-23	삼성전기주식회사	진동 액추에이터
TW201435946A (zh) *	2012-11-08	2014-09-16	Ajinomoto Kk	薄膜開關及使用其所成之物品
JP2014196923A (ja) *	2013-03-29	2014-10-16	セイコーエプソン株式会社	力検出装置、ロボット、電子部品搬送装置、電子部品検査装置、部品加工装置および移動体
JP2016536393A (ja) *	2013-10-25	2016-11-24	アクロンポリマーシステムズ，インク．	樹脂組成物、基板、電子装置を製造する方法および電子装置
US9705069B2 (en) *	2013-10-31	2017-07-11	Seiko Epson Corporation	Sensor device, force detecting device, robot, electronic component conveying apparatus, electronic component inspecting apparatus, and component machining apparatus
JP6004123B2 (ja) *	2013-12-24	2016-10-05	株式会社村田製作所	圧電センサの製造方法
US9340412B2 (en) *	2014-07-28	2016-05-17	Ams International Ag	Suspended membrane for capacitive pressure sensor
US10373995B2 (en) *	2014-09-19	2019-08-06	Microsoft Technology Licensing, Llc	Image sensor bending using tension
KR101576444B1 (ko) *	2015-07-30	2015-12-10	(주)와이솔	압전 소자를 이용한 버튼 장치
KR20180098555A (ko) *	2015-12-25	2018-09-04	니폰 제온 가부시키가이샤	복합 적층체, 및 수지층의 보관 방법
US20170199217A1 (en) *	2016-01-13	2017-07-13	Seiko Epson Corporation	Electronic device, method for manufacturing electronic device, and physical-quantity sensor

2016
- 2016-06-23 US US16/073,818 patent/US10859458B2/en active Active
- 2016-06-23 WO PCT/JP2016/068670 patent/WO2017141460A1/fr active Application Filing
- 2016-06-23 JP JP2017567939A patent/JP6557367B2/ja active Active
- 2016-06-23 CN CN201680080713.0A patent/CN108603800B/zh active Active
- 2016-06-23 EP EP16890598.2A patent/EP3418706B1/fr active Active

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04105374A (ja) *	1990-08-24	1992-04-07	Nec Corp	圧電アクチュエータ
JPH07253364A (ja) *	1994-03-14	1995-10-03	Nippondenso Co Ltd	応力検出装置
JP2001136151A (ja) *	1999-09-17	2001-05-18	Lucent Technol Inc	未使用のサブキャリヤを使用する直交周波数分割多重（ｏｆｄｍ）地上レピータを識別するための方法および装置
CN102511088A (zh) *	2009-10-28	2012-06-20	京瓷株式会社	层叠型压电元件、使用该层叠型压电元件的喷射装置及燃料喷射系统
JP2012112824A (ja) *	2010-11-25	2012-06-14	Kyocera Corp	圧力センサ素子およびこれを備えた圧力センサ
JP2013160669A (ja) *	2012-02-07	2013-08-19	Seiko Epson Corp	センサーデバイス、センサーモジュール、力検出装置及びロボット

Also Published As

Publication number	Publication date
WO2017141460A1 (fr)	2017-08-24
EP3418706A1 (fr)	2018-12-26
CN108603800A (zh)	2018-09-28
US20190033153A1 (en)	2019-01-31
JP6557367B2 (ja)	2019-08-07
EP3418706B1 (fr)	2024-06-19
US10859458B2 (en)	2020-12-08
EP3418706A4 (fr)	2019-12-04
JPWO2017141460A1 (ja)	2018-11-01

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WO2020153289A1 (fr)	2020-07-30	Élément piézoélectrique
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US11746000B2 (en)	2023-09-05	MEMS device
JP7514755B2 (ja)	2024-07-11	超音波トランスデューサ
JP7394870B2 (ja)	2023-12-08	圧電アクチュエータ
WO2010122883A1 (fr)	2010-10-28	Boîtier pour capteur de pression et capteur de pression utilisant le boîtier
WO2020137966A1 (fr)	2020-07-02	Dispositif à ultrasons
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Legal Events

Date	Code	Title
2018-09-28	PB01	Publication
2018-09-28	PB01	Publication
2018-10-26	SE01	Entry into force of request for substantive examination
2018-10-26	SE01	Entry into force of request for substantive examination
2020-08-11	GR01	Patent grant
2020-08-11	GR01	Patent grant