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CN108515085B - The preparation method of Copper-Aluminum compound strip - Google Patents

The preparation method of Copper-Aluminum compound strip Download PDF

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Publication number
CN108515085B
CN108515085B CN201810295821.0A CN201810295821A CN108515085B CN 108515085 B CN108515085 B CN 108515085B CN 201810295821 A CN201810295821 A CN 201810295821A CN 108515085 B CN108515085 B CN 108515085B
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copper
copper sheet
aluminium strip
strip
annealing
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CN108515085A (en
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王日初
董翠鸽
罗森晖
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Hunan Korod New Material Co Ltd
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Hunan Korod New Material Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/02Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Rolling (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

The invention discloses the preparation methods of Copper-Aluminum compound strip comprising following steps: being required to choose the copper sheet and aluminium strip being of the required size according to finished product, wherein the copper sheet is as baseplate material, and the aluminium strip is as built-in materials;Carry out homogenizing annealing processing to copper sheet: annealing temperature is 320 ~ 400 DEG C, soaking time is 0.5 ~ 3h, and carry out homogenizing annealing processing to aluminium strip: annealing temperature is 180 ~ 220 DEG C, soaking time is 1 ~ 3h, carries out water quenching after annealing;Surface preparation is carried out to copper sheet and aluminium strip, is degreased, surface scale and other impurities, and copper sheet and aluminium strip are subjected to surface roughness polishing;By in the intrusion slot of aluminium strip insertion copper sheet, several passage cold rolling combined processings are then carried out;Copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, finished product needed for obtaining;By heat treatment early period, surface preparation, multi-pass cold rolling and heat-treatment of annealing technique, to obtain the copper-aluminum composite board with the interfaces transition structure sheaf haveing excellent performance.

Description

The preparation method of Copper-Aluminum compound strip
Technical field
The present invention relates to copper-aluminum composite board technical fields, and in particular to a kind of preparation method of Copper-Aluminum compound strip.
Background technique
Copper-aluminum composite board is copper sheet and aluminium sheet plate, and by cold rolling, hot rolling, explosion composite method, the modes such as explosion rolling are welded It is connected together, the new material that cannot be separated.
It is divided according to the process attribute of general bimetallic recombination process, has founding composite algorithm, explosion composite method, welding compound Method, roll-bonding method etc..But when preparing copper-aluminum composite board, copper and aluminium are oxidized easily, lead to boundary in founding recombination process Face bond strength is low, and Explosion composite has poor version type, complex process and at high cost, and welding compound is because copper and aluminium exist Greatest differences in terms of physics and chemical property and be not suitable for, the method hot rolling bond strength in Rolling compund is good but dimensional accuracy The positioning accuracy of especially local compound tense is lower;However cold rolling is compound with easy to operate, easy automation, accurate size and effect The processing method that rate height becomes a kind of local copper-aluminum composite board of most potential large-scale production.
But be only physical bond in combination of the cold rolling Cheng Zhongtong aluminium on interface, do not reach metallurgical bonding Degree can generate more serious residual stress in matrix simultaneously as the inhomogeneous deformation of two kinds of materials, to the property after compound It can influence very big.Therefore, for comprehensive performances such as the boundary strengths that improves copper-aluminum composite board, it is necessary to copper aluminium cold rolling composite plate band It is heat-treated.It by heat treatment, on the one hand can make copper aluminium element phase counterdiffusion, realize metallurgical bonding in interface, thus Improve bond strength;On the other hand make intrinsic silicon residual stress relaxation, restore plasticity.But copper-aluminum composite board is in heat treatment process In, interface easily forms CuAl, CuAl2、Cu4Al9Equal brittlement phases, these brittlement phases will lead to the bond strength of complex plate strip It reduces, to influence the service performance of material.
Therefore, now need to provide that a kind of realization metallurgical bonding, keeping interface diffusion layer thickness, interface cohesion is good, property to obtain The preparation method of the Copper-Aluminum compound strip of Copper-Aluminum compound plate material that can be excellent.
Summary of the invention
For this purpose, the present invention provides a kind of preparation methods of Copper-Aluminum compound strip comprising following steps:
Step 1: being required to choose the copper sheet and aluminium strip being of the required size according to finished product, wherein the copper sheet is as substrate Material, the aluminium strip is as built-in materials;
Step 2: carrying out homogenizing annealing processing to copper sheet: annealing temperature is 320 ~ 400 DEG C, soaking time is 0.5 ~ 3h, Carry out homogenizing annealing processing to aluminium strip: annealing temperature is 180 ~ 220 DEG C, soaking time is 1 ~ 3h, to copper sheet after annealing Water quenching is carried out with aluminium strip;
Step 3: carrying out surface preparation to copper sheet and aluminium strip, degrease, surface scale and other impurities, and will The roughness of the embedded rooved face of copper sheet is polishing to 60 ~ 80 μm, and the surface roughness of aluminium strip is polishing to 70 ~ 90 μm;
Step 4: by the intrusion slot of aluminium strip insertion copper sheet, and bend copper sheet end and withhold fixed aluminium strip, if then carrying out Arterial highway time cold rolling combined processing;
Step 5: copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, needed for obtaining at Product.
In step 1, selected copper sheet with a thickness of 15 ~ 20 mm, selected aluminium strip with a thickness of 1.5 ~ 2mm.
In step 3, surface preparation includes: that the NaOH solution for using concentration to be 10% cleans copper sheet and aluminium strip to remove Greasy dirt, then use dilute sulfuric acid cleaning copper sheet and aluminium strip to remove surface scale and other impurities.
In step 3, surface roughness polishing, the stainless steel of stainless steel wire brush are carried out to copper sheet using stainless steel wire brush The hardness of silk is HRC40 ~ 50, diameter is 0.3 ~ 0.4mm;Surface roughness polishing, gold are carried out to aluminium strip using diamond dust abrasive band The granularity in emery abrasive band is 120 ~ 140 mesh;Wherein, the copper sheet intrusion slot after grinding process and formation interference fit between aluminium strip.
In step 4, the compound mill speed of cold rolling is 10 ~ 20m/min, and rolling pass is 4 ~ 5 times, rolls accumulative become Shape amount is 80% ~ 95%;Wherein, when deflection is more than 90%, need to carry out intermediate annealing process in cold rolling recombination process: processing Temperature is 320 ~ 380 DEG C, soaking time is 0.5 ~ 1h.
In step 5, heat treatment are as follows: under inert gas protection, annealing heat-treatment, processing are carried out to copper-aluminum composite board Temperature is 400 ~ 420 DEG C, and soaking time is 1 ~ 4h;Copper-aluminum composite board is rapidly cooled using water cooling after heat treatment, in turn Finished product needed for obtaining.
In step 5, heat treatment the following steps are included:
A. annealing heat-treatment is carried out to copper aluminium cold rolling composite plate under inert gas protection: is gradually warming up to 320 DEG C ~ 360 DEG C, it is cooled to room temperature after keeping the temperature 1 ~ 3h;
B. cold rolling several times is carried out to through step a treated copper-aluminum composite board;
C. it is carried out at heat again under nitrogen and hydrogen gas mixture protection to through step b treated copper-aluminum composite board Reason: treatment temperature is 480 DEG C ~ 560 DEG C, the processing time is 2 ~ 5min, and then obtains finished product.
In stepb, 5-8 passage cold rolling is carried out, mill speed is 10 ~ 20m/min.
In step c, when being heat-treated again to complex plate strip, the transmission speed of complex plate strip is 0.8 ~ 2.0m/ min。
Further include step 6: finished product is detected;Through detect finished product interface diffusion layer with a thickness of 1.5 ~ 2.4 μm.
The present invention compared with the existing technology, has the following advantages that place:
In the present invention, copper sheet and aluminium strip are made annealing treatment before the rolling, so that the two is in the soft state to match, So that roll-force is more used to enhance interface cohesion in the operation of rolling, copper-aluminum composite board deep drawability is effectively improved;Together When, surface preparation is carried out to copper sheet and aluminium strip before rolling and carries out the polishing of roughness requirements, so that the two is compound in cold rolling There are more fresh contact interfaces in the process, it is easier to which firm physics is generated by the relative shear deformation at rolling median surface Occlusion;Fixation is withheld using bending, realize Copper-Aluminum compound strip size and positioning it is accurate, be able to satisfy high-end applications need Ask, realize Copper-Aluminum compound strip size and positioning it is accurate, be able to satisfy high-end applications demand;Therefore, before the present invention passes through Phase heat treatment, surface preparation, multi-pass cold rolling be compound and heat-treatment of annealing technique, to obtain with haveing excellent performance The copper-aluminum composite board of interfaces transition structure sheaf, the preparation method effectively increase the interface bond strength of finished product.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is that the interface cohesion SEM of finished product complex plate strip produced by the present invention schemes;
Fig. 2 is the structural schematic diagram of raw copper aluminium cold rolling composite plate band described in the present embodiment 3;
Fig. 3 is the structural schematic diagram of raw copper aluminium cold rolling composite plate band described in the present embodiment 4.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments It can be combined with each other at conflict.
Embodiment 1
Present embodiments provide a kind of preparation method of Copper-Aluminum compound strip comprising following steps:
Step 1: being required to choose the copper sheet and aluminium strip being of the required size according to finished product, wherein the copper sheet is as substrate Material, the aluminium strip is as built-in materials;
Step 2: carrying out homogenizing annealing processing to copper sheet: annealing temperature is 320 ~ 400 DEG C, soaking time is 0.5 ~ 3h, Carry out homogenizing annealing processing to aluminium strip: annealing temperature is 180 ~ 220 DEG C, soaking time is 1 ~ 3h, to copper sheet after annealing Water quenching is carried out with aluminium strip;
Step 3: carrying out surface preparation to copper sheet and aluminium strip, degrease, surface scale and other impurities, and will The roughness of the embedded rooved face of copper sheet is polishing to 60 ~ 80 μm, and the surface roughness of aluminium strip is polishing to 70 ~ 90 μm;
Step 4: by the intrusion slot of aluminium strip insertion copper sheet, and bend copper sheet end and withhold fixed aluminium strip, if then carrying out Arterial highway time cold rolling combined processing;
Step 5: copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, needed for obtaining at Product.
In the present embodiment, copper sheet and aluminium strip are made annealing treatment before the rolling, so that the two is soft in matching State effectively improves copper-aluminum composite board deep drawability so that roll-force is more used to enhance interface cohesion in the operation of rolling; Meanwhile surface preparation is carried out to copper sheet and aluminium strip before rolling and carries out the polishing of roughness requirements, so that the two is multiple in cold rolling There are more fresh contact interfaces during closing, it is easier to which firm object is generated by the relative shear deformation at rolling median surface Reason occlusion;Fixation is withheld using bending, realize Copper-Aluminum compound strip size and positioning it is accurate, be able to satisfy high-end applications need Ask, realize Copper-Aluminum compound strip size and positioning it is accurate, be able to satisfy high-end applications demand;Therefore, the present embodiment passes through Heat treatment early period, surface preparation, multi-pass cold rolling be compound and heat-treatment of annealing technique, has excellent performance to obtain and have Interfaces transition structure sheaf copper-aluminum composite board, which effectively increases the interface bond strength of finished product.
Specifically, in step 1, selected copper sheet with a thickness of 15 ~ 20 mm, selected aluminium strip with a thickness of 1.5 ~ 2mm.In the present embodiment, one or more embedded aluminium strip can be set on copper sheet, to improve effective welding Area promotes whole processing efficiency.
Further, in step 3, surface preparation include: use concentration for 10% NaOH solution clean copper sheet and Aluminium strip is to degrease, then uses dilute sulfuric acid cleaning copper sheet and aluminium strip to remove surface scale and other impurities.Meanwhile in step In rapid three, surface roughness polishing is carried out to copper sheet using stainless steel wire brush, the hardness of the stainless steel wire of stainless steel wire brush is HRC40 ~ 50, diameter are 0.3 ~ 0.4mm;Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band, diamond dust abrasive band Granularity is 120 ~ 140 mesh;Wherein, the copper sheet intrusion slot after grinding process and formation interference fit between aluminium strip.In the present embodiment In, surface preparation is carried out to copper sheet and aluminium strip before the rolling and carries out the polishing of roughness requirements, so that the two is multiple in cold rolling There are more fresh contact interfaces during closing, it is easier to which firm object is generated by the relative shear deformation at rolling median surface Reason occlusion, to effectively increase the interface bond strength of finished product.
As preferred embodiment, four the step of the present embodiment in, the compound mill speed of cold rolling is 10 ~ 20m/min, Rolling pass is 4 ~ 5 times, and rolling accumulative deflection is 80% ~ 95%;Wherein, when deflection is more than 90%, in cold rolling recombination process Need to carry out intermediate annealing process: treatment temperature is 320 ~ 380 DEG C, soaking time is 0.5 ~ 1h.
Further, in step 5, heat treatment are as follows: under inert gas protection, annealing heat is carried out to copper-aluminum composite board Processing, treatment temperature are 400 ~ 420 DEG C, and soaking time is 1 ~ 4h;Copper-aluminum composite board is carried out quickly using water cooling after heat treatment It is cooling, and then obtain required finished product.In the present embodiment, according to bimetallic composite principle, using multi-pass cold rolling it is compound with it is high Warm diffusion annealing is prepared, so that the bond strength of the combination interface of copper-aluminum composite board is high, while the copper-aluminum composite board With excellent surface quality.
On the basis of the above, the present embodiment further includes step 6: being detected to finished product;Detected the interface diffusion of finished product Layer with a thickness of 1.5 ~ 2.4 μm.In the present embodiment, Fig. 1 is using finished product complex plate strip made from the present embodiment the method Interface cohesion SEM figure, as shown in Figure 1, the thickness of the interface diffusion layer of copper-aluminum composite board is greatly enhanced.
Embodiment 2
On the basis of embodiment 1, the present embodiment further provides for a kind of disposable embodiment, with embodiment 1 The difference is that:
In step 5, heat treatment the following steps are included:
A. annealing heat-treatment is carried out to copper aluminium cold rolling composite plate under inert gas protection: is gradually warming up to 320 DEG C ~ 360 DEG C, it is cooled to room temperature after keeping the temperature 1 ~ 3h;
B. cold rolling several times is carried out to through step a treated copper-aluminum composite board;
C. it is carried out at heat again under nitrogen and hydrogen gas mixture protection to through step b treated copper-aluminum composite board Reason: treatment temperature is 480 DEG C ~ 560 DEG C, the processing time is 2 ~ 5min, and then obtains finished product.
In stepb, 5-8 passage cold rolling is carried out, mill speed is 10 ~ 20m/min.
In step c, when being heat-treated again to complex plate strip, the transmission speed of complex plate strip is 0.8 ~ 2.0m/ min。
In the present embodiment, which continues low temperature prolonged anneal, more in copper-aluminum composite board after cold rolling is compound Passage cold rolling and high temperature, short time diffusion heat treatments are prepared, excellent surface quality and copper aluminium interface bond strength height;? That is the method can obtain the copper aluminium interface transition layer haveing excellent performance through this embodiment, copper aluminium can be effectively improved The interface bond strength of complex plate strip finished product, meets punching press in subsequent use process, bending is not cracked, do not separated, and this method It is easy to operate, at low cost.
Embodiment 3
As shown in Fig. 2, on the basis of embodiment 1, the present embodiment further provides for a kind of specific embodiment, mesh Be the Copper-Aluminum compound strip for preparing double clad aluminum bands that integral thickness is 2.00mm, al zone thickness is 0.15mm;Specific preparation Method is as follows:
Step 1: choosing the copper sheet with a thickness of 20.00mm as baseplate material, the aluminium strip conduct with a thickness of 1.5mm is chosen Built-in materials;
Step 2: carrying out homogenizing annealing processing to copper sheet: annealing temperature is 370 DEG C, soaking time 2h, to aluminium strip into The processing of row homogenizing annealing: annealing temperature is 190 DEG C, soaking time 1.5h, carries out water to copper sheet and aluminium strip after annealing It quenches;
Step 3: using the NaOH solution that concentration is 10% to clean copper sheet and aluminium strip to degrease, then clear using dilute sulfuric acid Copper sheet and aluminium strip are washed to remove surface scale and other impurities;Surface roughness is carried out to copper sheet using stainless steel wire brush to beat Mill, so that the surface roughness of copper sheet is 60 ~ 80 μm, the hardness of the stainless steel wire of stainless steel wire brush is HRC40 ~ 50, diameter is 0.3~0.4mm;Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band, so that the surface roughness of aluminium strip is 70 ~ 90 μ M, the granularity in diamond dust abrasive band are 120 ~ 140 mesh;
Step 4: by the intrusion slot of aluminium strip insertion copper sheet, and bend copper sheet end and withhold fixed aluminium strip;The embedded copper of aluminium Aluminum composite panel belt is through big rolling reduction composite rolling at target composite material, wherein the mill speed of the cold rolling is 10m/ Min, it is 90% that the rolling of raw material, which adds up deflection,;
It is finished Step 5: cold rolling is compound, carries out carrying out annealing heat-treatment process, the temperature of the heat treatment under inert atmosphere protection Degree is 400 DEG C, soaking time 1h, and is quickly cooled down using water cooling, thus finished product needed for obtaining.
In the present embodiment, finished product Copper-Aluminum compound strip is obtained by above-mentioned concrete operation step, it is found that it should through detection Two kinds of metal materials of Copper-Aluminum compound strip are combined into indivisible entirety, obtain higher combined strength bination, can picture Single metal carries out the deep processings such as bending, drilling, punching press like that, fully meets the process requirements of different finished products.
Embodiment 4
As shown in figure 3, on the basis of embodiment 1, the present embodiment further provides for a kind of specific embodiment, mesh Be the Copper-Aluminum compound strip for preparing single clad aluminum band that integral thickness is 0.80mm, al zone thickness is 0.10mm;Specific preparation Method is as follows:
Step 1: choosing the copper sheet with a thickness of 16.00mm as baseplate material, choose in the aluminium strip conduct with a thickness of 2mm Embedding material;
Step 2: carrying out homogenizing annealing processing to copper sheet: annealing temperature is 370 DEG C, soaking time 2h, to aluminium strip into The processing of row homogenizing annealing: annealing temperature is 190 DEG C, soaking time 1.5h, carries out water to copper sheet and aluminium strip after annealing It quenches;
Step 3: using the NaOH solution that concentration is 10% to clean copper sheet and aluminium strip to degrease, then clear using dilute sulfuric acid Copper sheet and aluminium strip are washed to remove surface scale and other impurities;Surface roughness is carried out to copper sheet using stainless steel wire brush to beat Mill, so that the surface roughness of copper sheet is 60 ~ 80 μm, the hardness of the stainless steel wire of stainless steel wire brush is HRC40 ~ 50, diameter is 0.3~0.4mm;Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band, so that the surface roughness of aluminium strip is 70 ~ 90 μ M, the granularity in diamond dust abrasive band are 120 ~ 140 mesh;
Step 4: by the intrusion slot of aluminium strip insertion copper sheet, and bend copper sheet end and withhold fixed aluminium strip;The embedded copper of aluminium Aluminum composite panel belt is through big rolling reduction composite rolling at target composite material, wherein the mill speed of the cold rolling is 10m/ Min, it is 90% that the rolling of raw material, which adds up deflection, and finish to gauge is with a thickness of 1.60mm;
Step 5: the copper-aluminum composite board band with a thickness of 1.60mm that step 5 is obtained carries out under inert atmosphere protection Between make annealing treatment, temperature be set as 350 DEG C, soaking time be set as 0.5h, then furnace cooling;
Step 6: it is multiple to carry out cold rolling again to the copper-aluminum composite board band with a thickness of 1.60mm by intermediate annealing process Close, rolled after 3 passages target size be 0.80mm copper-aluminum composite board;Wherein, mill speed is 20 m/min;
It is finished Step 7: cold rolling is compound, carries out carrying out annealing heat-treatment process, the temperature of the heat treatment under inert atmosphere protection Degree is 400 DEG C, soaking time 1h, and is quickly cooled down using water cooling, thus finished product needed for obtaining.
In the present embodiment, finished product Copper-Aluminum compound strip is obtained by above-mentioned concrete operation step, it is found that it should through detection Two kinds of metal materials of Copper-Aluminum compound strip are combined into indivisible entirety, obtain higher combined strength bination, can picture Single metal carries out the deep processings such as bending, drilling, punching press like that, fully meets the process requirements of different finished products.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or It changes still within the protection scope of the invention.

Claims (9)

1. the preparation method of Copper-Aluminum compound strip, it is characterised in that: itself the following steps are included:
Step 1: being required to choose the copper sheet and aluminium strip being of the required size according to finished product, wherein the copper sheet is as substrate material Material, the aluminium strip is as built-in materials;
Step 2: carrying out homogenizing annealing processing to copper sheet: annealing temperature is 320~400 DEG C, soaking time is 0.5~3h, right Aluminium strip carries out homogenizing annealing processing: annealing temperature is 180~220 DEG C, soaking time is 1~3h, to copper sheet after annealing Water quenching is carried out with aluminium strip;
Step 3: carrying out surface preparation to copper sheet and aluminium strip, degrease, surface scale and other impurities, and by copper sheet The roughness of embedded rooved face be polishing to 60~80 μm, the surface roughness of aluminium strip is polishing to 70~90 μm;
Step 4: by the intrusion slot of aluminium strip insertion copper sheet, and bend copper sheet end and withhold fixed aluminium strip, if then carrying out arterial highway Secondary cold rolling combined processing;
Step 5: the copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, and finished product needed for obtaining, institute State high-temperature heat treatment the following steps are included:
A. annealing heat-treatment is carried out to copper aluminium cold rolling composite plate under inert gas protection: is gradually warming up to 320 DEG C~360 DEG C, It is cooled to room temperature after 1~3h of heat preservation;
B. cold rolling several times is carried out to through step a treated copper-aluminum composite board;
C. to through step b, treated that copper-aluminum composite board is heat-treated again under the protection of nitrogen and hydrogen gas mixture: locating Reason temperature is 480 DEG C~560 DEG C, the processing time is 2~5min, i.e. acquisition finished product.
2. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that: selected in step 1 Copper sheet with a thickness of 15~20mm, selected aluminium strip with a thickness of 1.5~2mm.
3. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that: in step 3, surface is pre- Processing includes: that the NaOH solution for using concentration to be 10% cleans copper sheet and aluminium strip to degrease, then dilute sulfuric acid is used to clean copper Plate and aluminium strip are to remove surface scale and other impurities.
4. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that: in step 3, using not The wire brush that becomes rusty carries out surface roughness polishing to copper sheet, and the hardness of the stainless steel wire of stainless steel wire brush is HRC40~50, diameter is 0.3~0.4mm;Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band, the granularity in diamond dust abrasive band is 120~140 Mesh;Wherein, the copper sheet intrusion slot after grinding process and formation interference fit between aluminium strip.
5. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that: in step 4, cold rolling is multiple The mill speed of conjunction is 10~20m/min, and rolling pass is 4~5 times, and rolling accumulative deflection is 80%~95%;Wherein, when When deflection is more than 90%, need to carry out intermediate annealing process in cold rolling recombination process: treatment temperature is 320~380 DEG C, keeps the temperature Time is 0.5~1h.
6. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that: in step 5, heat treatment Are as follows: under inert gas protection, annealing heat-treatment is carried out to copper-aluminum composite board, treatment temperature is 400~420 DEG C, soaking time For 1~4h;Copper-aluminum composite board is rapidly cooled using water cooling after heat treatment, and then obtains required finished product.
7. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that: in stepb, carry out 5-8 Passage cold rolling, mill speed are 10~20m/min.
8. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that: in step c, to composite plate When band is heat-treated again, the transmission speed of complex plate strip is 0.8~2.0m/min.
9. the preparation method of Copper-Aluminum compound strip according to claim 1 to 8, it is characterised in that: further include step Rapid six: finished product is detected;Through detect finished product interface diffusion layer with a thickness of 1.5~2.4 μm.
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