CN108515085A - The preparation method of Copper-Aluminum compound strip - Google Patents
The preparation method of Copper-Aluminum compound strip Download PDFInfo
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- CN108515085A CN108515085A CN201810295821.0A CN201810295821A CN108515085A CN 108515085 A CN108515085 A CN 108515085A CN 201810295821 A CN201810295821 A CN 201810295821A CN 108515085 A CN108515085 A CN 108515085A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- Crystallography & Structural Chemistry (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Metal Rolling (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses the preparation methods of Copper-Aluminum compound strip comprising following steps：It is required to choose the copper coin and aluminium strip being of the required size according to finished product, wherein the copper coin is as baseplate material, and the aluminium strip is as built-in materials；Homogenizing annealing processing is carried out to copper coin：Annealing temperature is 320 ~ 400 DEG C, soaking time is 0.5 ~ 3h, and homogenizing annealing processing is carried out to aluminium strip：Annealing temperature is 180 ~ 220 DEG C, soaking time is 1 ~ 3h, and water quenching is carried out after annealing；Surface preparation is carried out to copper coin and aluminium strip, is degreased, surface scale and other impurities, and copper coin and aluminium strip are subjected to surface roughness polishing；Aluminium strip is embedded in the intrusion slot of copper coin, then carries out several passage cold rolling combined processings；Copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, obtains required finished product；By heat treatment early period, surface preparation, multi-pass cold rolling and heat-treatment of annealing technique, to obtain the copper-aluminum composite board with the interfaces transition structure sheaf haveing excellent performance.
Description
Technical field
The present invention relates to copper-aluminum composite board technical fields, and in particular to a kind of preparation method of Copper-Aluminum compound strip.
Background technology
Copper-aluminum composite board is copper coin and aluminium sheet plate, and by cold rolling, hot rolling, explosion composite method, the modes such as explosion rolling are welded
It is connected together, the new material that cannot be separated.
It is divided according to the process attribute of general bimetallic recombination process, has founding composite algorithm, explosion composite method, welding compound
Method, roll-bonding method etc..But when preparing copper-aluminum composite board, copper and aluminium are oxidized easily, lead to boundary in founding recombination process
Face bond strength is low, and Explosion composite has poor version type, complex process and of high cost, and welding compound is because copper and aluminium exist
Greatest differences in terms of physics and chemical property and be not suitable for, the method hot rolling bond strength in Rolling compund is good but dimensional accuracy
The positioning accuracy of especially local compound tense is relatively low；However cold rolling is compound with easy to operate, easy automation, accurate size and effect
Rate height becomes a kind of processing method of the local copper-aluminum composite board of most potential large-scale production.
But combination of the copper aluminium on interface is only physical bond in cold rolling journey, does not reach metallurgical binding
Degree can generate more serious residual stress in matrix simultaneously as the inhomogeneous deformation of two kinds of materials, to the property after compound
It can influence very big.Therefore, for comprehensive performances such as the boundary strengths that improves copper-aluminum composite board, it is necessary to copper aluminium cold rolling composite plate band
It is heat-treated.It by heat treatment, on the one hand can make copper aluminium element phase counterdiffusion, metallurgical binding is realized in interface, to
Improve bond strength；On the other hand make intrinsic silicon residual stress relaxation, restore plasticity.But copper-aluminum composite board is in heat treatment process
In, interface easily forms CuAl, CuAl2、Cu4Al9Equal brittlement phases, these brittlement phases can lead to the bond strength of complex plate strip
It reduces, to influence the performance of material.
Therefore, now need to provide that a kind of realization metallurgical binding, keeping interface diffusion layer thickness, interface cohesion is good, property to obtain
The preparation method of the Copper-Aluminum compound strip of the excellent Copper-Aluminum compound plate material of energy.
Invention content
For this purpose, the present invention provides a kind of preparation methods of Copper-Aluminum compound strip comprising following steps：
Step 1: being required to choose the copper coin and aluminium strip being of the required size according to finished product, wherein the copper coin is as substrate material
Material, the aluminium strip is as built-in materials；
Step 2: carrying out homogenizing annealing processing to copper coin：Annealing temperature is 320 ~ 400 DEG C, soaking time is 0.5 ~ 3h, to aluminium
Band carries out homogenizing annealing processing：Annealing temperature is 180 ~ 220 DEG C, soaking time is 1 ~ 3h, to copper coin and aluminium after annealing
Band carries out water quenching；
Step 3: carrying out surface preparation to copper coin and aluminium strip, degrease, surface scale and other impurities, and by copper coin
The roughness of embedded rooved face be polishing to 60 ~ 80 μm, the surface roughness of aluminium strip is polishing to 70 ~ 90 μm；
Step 4: aluminium strip is embedded in the intrusion slot of copper coin, and bends copper coin end and withhold fixed aluminium strip, if then carrying out arterial highway
Secondary cold rolling combined processing；
Step 5: the copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, required finished product is obtained.
In step 1, the thickness of selected copper coin is 15 ~ 20 mm, and the thickness of selected aluminium strip is 1.5 ~ 2mm.
In step 3, surface preparation includes：A concentration of 10% NaOH solution is used to clean copper coin and aluminium strip to remove
Greasy dirt, then use dilute sulfuric acid cleaning copper coin and aluminium strip to remove surface scale and other impurities.
In step 3, surface roughness polishing, the stainless steel of stainless steel wire brush are carried out to copper coin using stainless steel wire brush
The hardness of silk is HRC40 ~ 50, a diameter of 0.3 ~ 0.4mm；Surface roughness polishing, gold are carried out to aluminium strip using diamond dust abrasive band
The granularity in emery abrasive band is 120 ~ 140 mesh；Wherein, the copper coin intrusion slot after grinding process and formation interference fit between aluminium strip.
In step 4, the compound mill speed of cold rolling is 10 ~ 20m/min, and rolling pass is 4 ~ 5 times, rolls accumulative become
Shape amount is 80% ~ 95%；Wherein, it when deflection is more than 90%, needs to carry out intermediate annealing process in cold rolling recombination process：Processing
Temperature is 320 ~ 380 DEG C, soaking time is 0.5 ~ 1h.
In step 5, it is heat-treated and is：Under inert gas protection, annealing heat-treats, processing are carried out to copper-aluminum composite board
Temperature is 400 ~ 420 DEG C, and soaking time is 1 ~ 4h；Copper-aluminum composite board is quickly cooled down using water cooling after heat treatment, in turn
Finished product needed for obtaining.
In step 5, heat treatment includes the following steps：
A. annealing heat-treats are carried out to copper aluminium cold rolling composite plate under inert gas protection：320 DEG C ~ 360 DEG C are gradually warming up to, is protected
Temperature 1 ~ 3h postcoolings are to room temperature；
B. to carrying out cold rolling several times through step a treated copper-aluminum composite boards；
C. in the case where nitrogen and hydrogen gas mixture are protected to through step b, treated that copper-aluminum composite board is heat-treated again：Place
Reason temperature is 480 DEG C ~ 560 DEG C, processing time is 2 ~ 5min, and then obtains finished product.
In stepb, 5-8 passage cold rollings are carried out, mill speed is 10 ~ 20m/min.
In step c, when being heat-treated again to complex plate strip, the transmission speed of complex plate strip is 0.8 ~ 2.0m/
min。
It further include step 6：Finished product is detected；The thickness of the interface diffusion layer of finished product is 1.5 ~ 2.4 μm after testing.
The present invention compared with the existing technology, has the following advantages that place：
In the present invention, copper coin and aluminium strip being made annealing treatment before the rolling so that the two is in the soft state to match, to
So that roll-force is more used to enhance interface cohesion in the operation of rolling, copper-aluminum composite board deep drawability is effectively improved；Meanwhile it rolling
Surface preparation is carried out to copper coin and aluminium strip before system and carries out the polishing of roughness requirements so that the two is in cold rolling recombination process
There are more fresh contact interfaces, it is easier to generate firm physics occlusion by rolling the relative shear deformation at median surface；
Fixation is withheld using bending, realize Copper-Aluminum compound strip size and positioning it is accurate, high-end applications demand can be met, realize
The size of Copper-Aluminum compound strip and positioning it is accurate, can meet high-end applications demand；Therefore, the present invention passes through at early period heat
Reason, surface preparation, multi-pass cold rolling be compound and heat-treatment of annealing technique, to obtain the interface mistake for having and haveing excellent performance
The copper-aluminum composite board of structure sheaf is crossed, which effectively increases the interface bond strength of finished product.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is the interface cohesion SEM figures of finished product complex plate strip produced by the present invention；
Fig. 2 is the structural schematic diagram of the raw copper aluminium cold rolling composite plate band described in the present embodiment 3；
Fig. 3 is the structural schematic diagram of the raw copper aluminium cold rolling composite plate band described in the present embodiment 4.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
The every other embodiment that personnel are obtained without making creative work, shall fall within the protection scope of the present invention.
As long as in addition, technical characteristic involved in invention described below different embodiments non-structure each other
It can be combined with each other at conflict.
Embodiment 1
Present embodiments provide a kind of preparation method of Copper-Aluminum compound strip comprising following steps：
Step 1: being required to choose the copper coin and aluminium strip being of the required size according to finished product, wherein the copper coin is as substrate material
Material, the aluminium strip is as built-in materials；
Step 2: carrying out homogenizing annealing processing to copper coin：Annealing temperature is 320 ~ 400 DEG C, soaking time is 0.5 ~ 3h, to aluminium
Band carries out homogenizing annealing processing：Annealing temperature is 180 ~ 220 DEG C, soaking time is 1 ~ 3h, to copper coin and aluminium after annealing
Band carries out water quenching；
Step 3: carrying out surface preparation to copper coin and aluminium strip, degrease, surface scale and other impurities, and by copper coin
The roughness of embedded rooved face be polishing to 60 ~ 80 μm, the surface roughness of aluminium strip is polishing to 70 ~ 90 μm；
Step 4: aluminium strip is embedded in the intrusion slot of copper coin, and bends copper coin end and withhold fixed aluminium strip, if then carrying out arterial highway
Secondary cold rolling combined processing；
Step 5: the copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, required finished product is obtained.
In the present embodiment, copper coin and aluminium strip are made annealing treatment before the rolling so that the two is soft in matching
State effectively improves copper-aluminum composite board deep drawability so that roll-force is more used to enhance interface cohesion in the operation of rolling；
Meanwhile surface preparation is carried out to copper coin and aluminium strip before rolling and carries out the polishing of roughness requirements so that the two is multiple in cold rolling
There are more fresh contact interfaces during closing, it is easier to generate firm object by rolling the relative shear deformation at median surface
Reason occlusion；Fixation is withheld using bending, realize Copper-Aluminum compound strip size and positioning it is accurate, high-end applications need can be met
Ask, realize Copper-Aluminum compound strip size and positioning it is accurate, high-end applications demand can be met；Therefore, the present embodiment passes through
Heat treatment early period, surface preparation, multi-pass cold rolling be compound and heat-treatment of annealing technique, is had excellent performance to obtain to have
Interfaces transition structure sheaf copper-aluminum composite board, which effectively increases the interface bond strength of finished product.
Specifically, in step 1, the thickness of selected copper coin is 15 ~ 20 mm, the thickness of selected aluminium strip is 1.5 ~
2mm.In the present embodiment, one or more embedded aluminium strip can be set on copper coin, to improve effective welding job
Area promotes whole processing efficiency.
Further, in step 3, surface preparation includes：Using a concentration of 10% NaOH solution cleaning copper coin and
Aluminium strip is to degrease, then uses dilute sulfuric acid cleaning copper coin and aluminium strip to remove surface scale and other impurities.Meanwhile in step
In rapid three, surface roughness polishing is carried out to copper coin using stainless steel wire brush, the hardness of the stainless steel wire of stainless steel wire brush is
HRC40 ~ 50, a diameter of 0.3 ~ 0.4mm；Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band, diamond dust abrasive band
Granularity is 120 ~ 140 mesh；Wherein, the copper coin intrusion slot after grinding process and formation interference fit between aluminium strip.In the present embodiment
In, surface preparation is carried out to copper coin and aluminium strip before the rolling and carries out the polishing of roughness requirements so that the two is multiple in cold rolling
There are more fresh contact interfaces during closing, it is easier to generate firm object by rolling the relative shear deformation at median surface
Reason occlusion, to effectively increase the interface bond strength of finished product.
As preferred embodiment, four the step of the present embodiment in, the compound mill speed of cold rolling is 10 ~ 20m/min,
Rolling pass is 4 ~ 5 times, and it is 80% ~ 95% to roll accumulative deflection；Wherein, when deflection is more than 90%, in cold rolling recombination process
It needs to carry out intermediate annealing process：Treatment temperature is 320 ~ 380 DEG C, soaking time is 0.5 ~ 1h.
Further, it in step 5, is heat-treated and is：Under inert gas protection, annealing heat is carried out to copper-aluminum composite board
Processing, treatment temperature are 400 ~ 420 DEG C, and soaking time is 1 ~ 4h；Copper-aluminum composite board is carried out quickly using water cooling after heat treatment
It is cooling, and then obtain required finished product.In the present embodiment, according to bimetallic composite principle, using multi-pass cold rolling it is compound with it is high
Warm diffusion annealing is prepared, so that the bond strength of the combination interface of copper-aluminum composite board is high, while the copper-aluminum composite board
With excellent surface quality.
On the basis of the above, the present embodiment further includes step 6：Finished product is detected；The interface diffusion of finished product after testing
The thickness of layer is 1.5 ~ 2.4 μm.In the present embodiment, Fig. 1 is using finished product complex plate strip made from the present embodiment the method
Interface cohesion SEM figure, as shown in Figure 1, the thickness of the interface diffusion layer of copper-aluminum composite board is greatly enhanced.
Embodiment 2
On the basis of embodiment 1, the present embodiment further provides for a kind of disposable embodiment, not with embodiment 1
It is with place：
In step 5, heat treatment includes the following steps：
A. annealing heat-treats are carried out to copper aluminium cold rolling composite plate under inert gas protection：320 DEG C ~ 360 DEG C are gradually warming up to, is protected
Temperature 1 ~ 3h postcoolings are to room temperature；
B. to carrying out cold rolling several times through step a treated copper-aluminum composite boards；
C. in the case where nitrogen and hydrogen gas mixture are protected to through step b, treated that copper-aluminum composite board is heat-treated again：Place
Reason temperature is 480 DEG C ~ 560 DEG C, processing time is 2 ~ 5min, and then obtains finished product.
In stepb, 5-8 passage cold rollings are carried out, mill speed is 10 ~ 20m/min.
In step c, when being heat-treated again to complex plate strip, the transmission speed of complex plate strip is 0.8 ~ 2.0m/
min。
In the present embodiment, which continues low temperature prolonged anneal, more in copper-aluminum composite board after cold rolling is compound
Passage cold rolling and high temperature, short time diffusion heat treatments are prepared, excellent surface quality and copper aluminium interface bond strength height；
That is the method can obtain the copper aluminium interface transition layer haveing excellent performance through this embodiment, copper aluminium can be effectively improved
The interface bond strength of complex plate strip finished product, meets punching press during follow-up use, bending is not cracked, do not detached, and this method
It is easy to operate, at low cost.
Embodiment 3
As shown in Fig. 2, on the basis of embodiment 1, the present embodiment further provides for a kind of specific embodiment, the purpose is to
Prepare the Copper-Aluminum compound strip for double clad aluminum bands that integral thickness is 2.00mm, al zone thickness is 0.15mm；Specific preparation method
It is as follows：
Step 1: the copper coin that selection thickness is 20.00mm is as baseplate material, the aluminium strip that selection thickness is 1.5mm, which is used as, to be embedded
Material；
Step 2: carrying out homogenizing annealing processing to copper coin：Annealing temperature is 370 DEG C, soaking time 2h, is carried out to aluminium strip equal
Homogenize annealing：Annealing temperature is 190 DEG C, soaking time 1.5h, and water quenching is carried out to copper coin and aluminium strip after annealing；
Step 3: use a concentration of 10% NaOH solution to clean copper coin and aluminium strip cleans copper to degrease, then using dilute sulfuric acid
Plate and aluminium strip are to remove surface scale and other impurities；Surface roughness polishing is carried out to copper coin using stainless steel wire brush, is made
The surface roughness of copper coin is 60 ~ 80 μm, the hardness of the stainless steel wire of stainless steel wire brush be HRC40 ~ 50, it is a diameter of 0.3 ~
0.4mm；Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band so that the surface roughness of aluminium strip is 70 ~ 90 μm, gold
The granularity in emery abrasive band is 120 ~ 140 mesh；
Step 4: aluminium strip is embedded in the intrusion slot of copper coin, and bends copper coin end and withhold fixed aluminium strip；The embedded copper aluminium of aluminium is multiple
Plywood band is through big rolling reduction composite rolling at target composite material, wherein the mill speed of the cold rolling is 10m/min, former
It is 90% that the rolling of material, which adds up deflection,；
It is finished Step 5: cold rolling is compound, carries out carrying out annealing heat-treats process under inert atmosphere protection, the temperature of the heat treatment is
400 DEG C, soaking time 1h, and be quickly cooled down using water cooling, to obtain required finished product.
In the present embodiment, finished product Copper-Aluminum compound strip is obtained by above-mentioned concrete operation step, it after testing it is found that should
Two kinds of metal materials of Copper-Aluminum compound strip are combined into indivisible entirety, obtain higher combined strength bination, can picture
Single metal carries out the deep processings such as bending, drilling, punching press like that, fully meets the process requirements of different finished products.
Embodiment 4
As shown in figure 3, on the basis of embodiment 1, the present embodiment further provides for a kind of specific embodiment, the purpose is to
Prepare the Copper-Aluminum compound strip for single clad aluminum band that integral thickness is 0.80mm, al zone thickness is 0.10mm；Specific preparation method
It is as follows：
Step 1: the copper coin that selection thickness is 16.00mm, which as baseplate material, chooses the aluminium strip that thickness is 2mm, is used as embedded material
Material；
Step 2: carrying out homogenizing annealing processing to copper coin：Annealing temperature is 370 DEG C, soaking time 2h, is carried out to aluminium strip equal
Homogenize annealing：Annealing temperature is 190 DEG C, soaking time 1.5h, and water quenching is carried out to copper coin and aluminium strip after annealing；
Step 3: use a concentration of 10% NaOH solution to clean copper coin and aluminium strip cleans copper to degrease, then using dilute sulfuric acid
Plate and aluminium strip are to remove surface scale and other impurities；Surface roughness polishing is carried out to copper coin using stainless steel wire brush, is made
The surface roughness of copper coin is 60 ~ 80 μm, the hardness of the stainless steel wire of stainless steel wire brush be HRC40 ~ 50, it is a diameter of 0.3 ~
0.4mm；Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band so that the surface roughness of aluminium strip is 70 ~ 90 μm, gold
The granularity in emery abrasive band is 120 ~ 140 mesh；
Step 4: aluminium strip is embedded in the intrusion slot of copper coin, and bends copper coin end and withhold fixed aluminium strip；The embedded copper aluminium of aluminium is multiple
Plywood band is through big rolling reduction composite rolling at target composite material, wherein the mill speed of the cold rolling is 10m/min, former
It is 90% that the rolling of material, which adds up deflection, and finish to gauge thickness is 1.60mm；
It is moved back Step 5: the copper-aluminum composite board band that the thickness that step 5 obtains is 1.60mm is carried out the centre under inert atmosphere protection
Fire processing, temperature be set as 350 DEG C, soaking time be set as 0.5h, then furnace cooling；
Step 6: to the thickness Jing Guo intermediate annealing process be 1.60mm copper-aluminum composite board band carry out again cold rolling it is compound, through 3
Rolled after passage target size be 0.80mm copper-aluminum composite board；Wherein, mill speed is 20 m/min；
It is finished Step 7: cold rolling is compound, carries out carrying out annealing heat-treats process under inert atmosphere protection, the temperature of the heat treatment is
400 DEG C, soaking time 1h, and be quickly cooled down using water cooling, to obtain required finished product.
In the present embodiment, finished product Copper-Aluminum compound strip is obtained by above-mentioned concrete operation step, it after testing it is found that should
Two kinds of metal materials of Copper-Aluminum compound strip are combined into indivisible entirety, obtain higher combined strength bination, can picture
Single metal carries out the deep processings such as bending, drilling, punching press like that, fully meets the process requirements of different finished products.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. the preparation method of Copper-Aluminum compound strip, it is characterised in that：It includes the following steps：
Step 1: being required to choose the copper coin and aluminium strip being of the required size according to finished product, wherein the copper coin is as substrate material
Material, the aluminium strip is as built-in materials；
Step 2: carrying out homogenizing annealing processing to copper coin：Annealing temperature is 320 ~ 400 DEG C, soaking time is 0.5 ~ 3h, to aluminium
Band carries out homogenizing annealing processing：Annealing temperature is 180 ~ 220 DEG C, soaking time is 1 ~ 3h, to copper coin and aluminium after annealing
Band carries out water quenching；
Step 3: carrying out surface preparation to copper coin and aluminium strip, degrease, surface scale and other impurities, and by copper coin
The roughness of embedded rooved face be polishing to 60 ~ 80 μm, the surface roughness of aluminium strip is polishing to 70 ~ 90 μm；
Step 4: aluminium strip is embedded in the intrusion slot of copper coin, and bends copper coin end and withhold fixed aluminium strip, if then carrying out arterial highway
Secondary cold rolling combined processing；
Step 5: the copper-aluminum composite board under atmosphere protection to cold rolling after compound carries out high-temperature heat treatment, required finished product is obtained.
2. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that：It is selected in step 1
The thickness of copper coin is 15 ~ 20 mm, and the thickness of selected aluminium strip is 1.5 ~ 2mm.
3. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that：In step 3, surface is pre-
Processing includes：It uses a concentration of 10% NaOH solution to clean copper coin and aluminium strip and cleans copper coin to degrease, then using dilute sulfuric acid
With aluminium strip to remove surface scale and other impurities.
4. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that：In step 3, using not
The wire brush that becomes rusty carries out surface roughness polishing to copper coin, and the hardness of the stainless steel wire of stainless steel wire brush is HRC40 ~ 50, a diameter of
0.3~0.4mm；Surface roughness polishing is carried out to aluminium strip using diamond dust abrasive band, the granularity in diamond dust abrasive band is 120 ~ 140 mesh；
Wherein, the copper coin intrusion slot after grinding process and formation interference fit between aluminium strip.
5. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that：In step 4, cold rolling is multiple
The mill speed of conjunction is 10 ~ 20m/min, and rolling pass is 4 ~ 5 times, and it is 80% ~ 95% to roll accumulative deflection；Wherein, work as deformation
When amount is more than 90%, need to carry out intermediate annealing process in cold rolling recombination process：Treatment temperature is 320 ~ 380 DEG C, soaking time is
0.5~1h。
6. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that：In step 5, heat treatment
For：Under inert gas protection, annealing heat-treats are carried out to copper-aluminum composite board, treatment temperature is 400 ~ 420 DEG C, and soaking time is
1~4h；Copper-aluminum composite board is quickly cooled down using water cooling after heat treatment, and then obtains required finished product.
7. the preparation method of Copper-Aluminum compound strip according to claim 1, it is characterised in that：In step 5, heat treatment
Include the following steps：
A. annealing heat-treats are carried out to copper aluminium cold rolling composite plate under inert gas protection：320 DEG C ~ 360 DEG C are gradually warming up to, is protected
Temperature 1 ~ 3h postcoolings are to room temperature；
B. to carrying out cold rolling several times through step a treated copper-aluminum composite boards；
C. in the case where nitrogen and hydrogen gas mixture are protected to through step b, treated that copper-aluminum composite board is heat-treated again：Place
Reason temperature is 480 DEG C ~ 560 DEG C, processing time is 2 ~ 5min, that is, obtains finished product.
8. the preparation method of Copper-Aluminum compound strip according to claim 7, it is characterised in that：In stepb, 5-8 is carried out
Passage cold rolling, mill speed are 10 ~ 20m/min.
9. the preparation method of Copper-Aluminum compound strip according to claim 7, it is characterised in that：In step c, to composite plate
When band is heat-treated again, the transmission speed of complex plate strip is 0.8 ~ 2.0m/min.
10. the preparation method of the Copper-Aluminum compound strip according to any one of claim 1-9, it is characterised in that：Further include
Step 6：Finished product is detected；The thickness of the interface diffusion layer of finished product is 1.5 ~ 2.4 μm after testing.
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109290371A (en) * | 2018-11-08 | 2019-02-01 | 瓯锟科技温州有限公司 | A kind of cold rolling manufacturing method of Copper-Aluminum compound strip |
| CN110721999A (en) * | 2019-10-17 | 2020-01-24 | 湖南科罗德新材料有限公司 | Copper-aluminum composite plate strip added with nickel grid layer and continuous production method thereof |
| CN110724850A (en) * | 2019-11-03 | 2020-01-24 | 霍山汇能汽车零部件制造有限公司 | Preparation method of radiator copper strip for automobile water tank |
| CN111424274A (en) * | 2020-04-03 | 2020-07-17 | 温州宏丰电工合金股份有限公司 | Copper-aluminum composite material and preparation method thereof |
| CN111850270A (en) * | 2020-07-20 | 2020-10-30 | 河南科技大学 | A processing method for improving peel strength of copper-aluminum composite plate |
| US10940672B2 (en) | 2018-11-22 | 2021-03-09 | Tsinghua University | Aluminum matrix composites and method thereof |
| CN112490820A (en) * | 2020-10-20 | 2021-03-12 | 常州市史美尔精密机械科技有限公司 | Machine tool machining process of connector metal piece |
| CN112547800A (en) * | 2020-11-19 | 2021-03-26 | 无锡市世达精密焊管制造有限公司 | Aluminum-copper composite board and preparation method thereof |
| CN112622365A (en) * | 2020-12-01 | 2021-04-09 | 无锡市世达精密焊管制造有限公司 | Aluminum-copper composite board adopting aluminum alloy and preparation method thereof |
| CN113145643A (en) * | 2021-03-11 | 2021-07-23 | 湖南科罗德新材料有限公司 | Laterally-pack-rolled copper-aluminum composite strip and production method and application thereof |
| CN113477712A (en) * | 2021-07-30 | 2021-10-08 | 安徽工业大学 | Preparation process of multilayer metal composite belt |
| CN114309121A (en) * | 2022-01-11 | 2022-04-12 | 上海六晶科技股份有限公司 | Ultrathin copper-aluminum composite sheet with side edges combined and preparation process thereof |
| CN114347586A (en) * | 2022-01-25 | 2022-04-15 | 宁波博威合金材料股份有限公司 | Copper-copper composite strip, preparation method and application |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109290371A (en) * | 2018-11-08 | 2019-02-01 | 瓯锟科技温州有限公司 | A kind of cold rolling manufacturing method of Copper-Aluminum compound strip |
| TWI754783B (en) * | 2018-11-22 | 2022-02-11 | 鴻海精密工業股份有限公司 | Aluminum matrix composite and mehtod thereof |
| US10940672B2 (en) | 2018-11-22 | 2021-03-09 | Tsinghua University | Aluminum matrix composites and method thereof |
| US11312105B2 (en) | 2018-11-22 | 2022-04-26 | Tsinghua University | Aluminum matrix composites and method thereof |
| CN110721999A (en) * | 2019-10-17 | 2020-01-24 | 湖南科罗德新材料有限公司 | Copper-aluminum composite plate strip added with nickel grid layer and continuous production method thereof |
| CN110724850A (en) * | 2019-11-03 | 2020-01-24 | 霍山汇能汽车零部件制造有限公司 | Preparation method of radiator copper strip for automobile water tank |
| CN111424274A (en) * | 2020-04-03 | 2020-07-17 | 温州宏丰电工合金股份有限公司 | Copper-aluminum composite material and preparation method thereof |
| CN111850270A (en) * | 2020-07-20 | 2020-10-30 | 河南科技大学 | A processing method for improving peel strength of copper-aluminum composite plate |
| CN112490820B (en) * | 2020-10-20 | 2022-05-06 | 常州市史美尔精密机械科技有限公司 | Machine tool machining process of connector metal piece |
| CN112490820A (en) * | 2020-10-20 | 2021-03-12 | 常州市史美尔精密机械科技有限公司 | Machine tool machining process of connector metal piece |
| CN112547800A (en) * | 2020-11-19 | 2021-03-26 | 无锡市世达精密焊管制造有限公司 | Aluminum-copper composite board and preparation method thereof |
| CN112622365A (en) * | 2020-12-01 | 2021-04-09 | 无锡市世达精密焊管制造有限公司 | Aluminum-copper composite board adopting aluminum alloy and preparation method thereof |
| CN112622365B (en) * | 2020-12-01 | 2022-08-30 | 无锡市世达精密焊管制造有限公司 | Aluminum-copper composite board adopting aluminum alloy and preparation method thereof |
| CN113145643A (en) * | 2021-03-11 | 2021-07-23 | 湖南科罗德新材料有限公司 | Laterally-pack-rolled copper-aluminum composite strip and production method and application thereof |
| CN113145643B (en) * | 2021-03-11 | 2022-09-27 | 湖南科罗德新材料有限公司 | Laterally-pack-rolled copper-aluminum composite strip and production method and application thereof |
| CN113477712A (en) * | 2021-07-30 | 2021-10-08 | 安徽工业大学 | Preparation process of multilayer metal composite belt |
| CN113477712B (en) * | 2021-07-30 | 2023-12-05 | 安徽工业大学 | Preparation process of multilayer metal composite belt |
| CN114309121A (en) * | 2022-01-11 | 2022-04-12 | 上海六晶科技股份有限公司 | Ultrathin copper-aluminum composite sheet with side edges combined and preparation process thereof |
| CN114347586A (en) * | 2022-01-25 | 2022-04-15 | 宁波博威合金材料股份有限公司 | Copper-copper composite strip, preparation method and application |
| CN114347586B (en) * | 2022-01-25 | 2024-05-03 | 宁波博威合金材料股份有限公司 | Copper-copper composite strip, preparation method and application |
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