CN108129802A - A kind of composition epoxy resin preparation method of semiconductor-sealing-purpose - Google Patents
A kind of composition epoxy resin preparation method of semiconductor-sealing-purpose Download PDFInfo
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- CN108129802A CN108129802A CN201711423707.3A CN201711423707A CN108129802A CN 108129802 A CN108129802 A CN 108129802A CN 201711423707 A CN201711423707 A CN 201711423707A CN 108129802 A CN108129802 A CN 108129802A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Composition epoxy resin the present invention relates to semiconductor-sealing-purpose and preparation method thereof.The present invention is that epoxy resin, curing agent phenolic resin, colorant, releasing agent, inorganic filler, silane coupling agent, fire retardant and low stress modified dose are put into reaction kettle, heat, which is carried out, when temperature is 120 ~ 180 DEG C melts mixing, room temperature is cooled to after stirring evenly, heat is melted into mixture crushing that is rear and being cooled to room temperature, ball milling, crosses sieve；Then obtained powder is stirred evenly with curing accelerator in homogenizer；By the mixture stirred evenly, mixing extrusion, cooling crush in double screw extruder, obtain the composition epoxy resin of semiconductor-sealing-purpose.Semiconductor devices and integrated antenna package are carried out using the composition epoxy resin of the semiconductor-sealing-purpose of the present invention, the yield rate in encapsulation process can be improved, demolding performace is good and Encapsulation Moulds time are significantly increased, and reduces the incidence of package interior stomata.
Description
Technical field
The present invention relates to the composition epoxy resins of semiconductor-sealing-purpose, are related specifically to that epoxy composite can be improved
Composition epoxy resin of semiconductor-sealing-purpose of object encapsulated moulding and preparation method thereof.
Background technology
In recent years, semicon industry develops rapidly, and higher is also proposed to the composition epoxy resin of semiconductor-sealing-purpose
Requirement：Improve the mouldability of encapsulation process, good release property, longer clear mould period, the higher filling of package interior
Property；Traditional processing method since component is excessive, can not ensure the equal of mixing in homogenizer and twin screw extrusion
Evenness, final product are also susceptible to that release property is poor, and the clear mould period is short, and package interior has the problems such as stomata, study the ring
The new processing method of epoxy resin composition is come to improve these problems be one of currently the most important ones direction.
Bibliography：CN 1700973A, CN 1654538A, CN 201310272431.9.
Invention content
An object of the present invention was to provide with excellent encapsulated moulding, good release property, longer clear mould week
Phase, package interior have the composition epoxy resin of the semiconductor-sealing-purpose of higher fillibility.
The second object of the present invention is to by way of improving processing technology, to solve the epoxy of current semiconductor-sealing-purpose
Resin combination product stripping is poor, and the clear mould period is short, and package interior has the problems such as stomata, and a kind of purpose is prepared so as to provide
The method of the composition epoxy resin of one semiconductor-sealing-purpose.
Applicants have unexpectedly found that it is mixed by heating, by each component fills in addition to accelerating agent in composition epoxy resin
Dispersion, second step reuse expressing technique, add curing accelerator, are conducive to a small amount of component dispersions and disperse again, more
Uniformly, increase the interface cohesion between each component, reduce follow-up final package defect probability, product can be solved and release property occur
Difference, the clear mould period is short, and package interior has the problems such as stomata.
Technical scheme is as follows：
The present invention semiconductor-sealing-purpose composition epoxy resin preparation method through the following steps that realize：
By the epoxy resin weighed, phenolic resin, inorganic filler, releasing agent, low stress modified dose, it is colorant, fire-retardant
Agent and silane coupling agent are put into reaction kettle, and carrying out heat when temperature is 120~180 DEG C melts mixing, cools down after stirring evenly
To room temperature, heat is melted into mixture crushing that is rear and being cooled to room temperature, ball milling, crosses sieve；Then it by obtained powder and weighs
Curing accelerator stirs evenly in blender；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder,
Cooling crushes, and obtains the composition epoxy resin of semiconductor-sealing-purpose.
The key component and weight percentage of the composition epoxy resin of the semiconductor-sealing-purpose of the present invention are as follows：
The epoxy resin is the monomer, oligomer or polymer for having in 1 epoxy molecule 2 or more epoxy groups,
Its molecular weight and molecular structure are not particularly limited.The epoxy resin can be selected from o-cresol formaldehyde epoxy resin, bisphenol-A type ring
Oxygen resin, bisphenol f type epoxy resin, linear phenolic epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin,
One or more of open chain aliphatic epoxy resin, cycloaliphatic epoxy resin and heterocyclic-type epoxy resin etc..
The curing agent phenolic resin has the monomer, oligomer or polymerization of 2 or more hydroxyls for 1 phenolic aldehyde intramolecular
Object, molecular weight and molecular structure are not particularly limited.The phenolic resin can be selected from phenol linear phenolic resin and its spread out
Biology, phenyl methylcarbamate linear phenolic resin and its derivative, monohydroxy or dihydroxy naphthlene phenolic resin and its derivative, paraxylene
One or more of with the copolymer of the condensation product and dicyclopentadiene of phenol or naphthols and phenol etc..
The inorganic filler is not particularly limited.It is micro- that the inorganic filler can be selected from fine silica powder, aluminium oxide
One or more of powder, titanium oxide fine powder, silicon nitride powder and aluminium nitride micro mist etc..Fine silica powder can be crystal type
Fine silica powder or fusion fine silica powder；The fusion fine silica powder can be angular micro mist or ball-type
Micro mist.Wherein, it is preferable to use the fusion fine silica powder of ball-type.Above-mentioned powdered quartz micro mist and fusion dioxy
SiClx micro mist may be used alone or in combination.In addition, the surface of the fine silica powder can use it is silane coupled
Agent is surface-treated (high-speed stirred mixing).
The curing accelerator as long as can promote the curing reaction of epoxy group and phenolic hydroxyl group, is not particularly limited.Institute
The content of the curing accelerator stated generally in the composition is 0.16~0.8wt%；Imidazolium compounds, tertiary amine chemical combination can be selected from
One or more of object and organic phosphine compound etc..
The imidazolium compounds is selected from 2-methylimidazole, 2,4- methylimidazoles, 2-ethyl-4-methylimidazole, 2- benzene
One or more of base imidazoles, 2- phenyl -4-methylimidazole and 2- (heptadecyl) imidazoles etc..
The tertiary amine compound is selected from triethylamine benzyl group dimethylamine, Alpha-Methyl benzyl group dimethylamine, 2- (dimethylamino first
Base) one kind in -7 grade of phenol, (dimethylamino methyl) phenol of 2,4,6- tri- and 1,8- diazabicyclos (5,4,0) endecatylene
It is or several.
The organic phosphine compound is selected from triphenylphosphine, trimethyl-phosphine, triethyl phosphine, tributylphosphine, three (to methylbenzene
One or more of base) phosphine and three (nonyl phenyl) phosphines etc..
The content of the releasing agent generally in the composition is 0.3~0.5wt%；It is preferred that 0.4wt%；Can be selected from bar
One or more of western palm wax, synthetic wax and mineral matter wax.
The general content in the composition of described low stress modified dose is 0.7~0.9wt%；It is preferred that 0.8wt%；Such as liquid
Body silicone oil, silicone rubber powder or their mixture etc..
The content of the colorant generally in the composition is 0.4~0.6wt%；It is preferred that 0.5wt%；Such as carbon black.
The content of the fire retardant generally in the composition is 0.5~3wt%, is aoxidized including brominated epoxy resin and three
The mass ratio of the mixture of two antimony, wherein brominated epoxy resin and antimony oxide is 5:1.
The content of the silane coupling agent generally in the composition is 0.4~0.6wt%；It is preferred that 0.5wt%；It can select
From γ-glycidyl propyl ether trimethoxy silane, γ aminopropyltriethoxy silane, γ-mercaptopropyi trimethoxy silicon
One or more of alkane and γ-aminopropyltrimethoxysilane.
Various raw materials involved by the composition epoxy resin of the semiconductor-sealing-purpose of the present invention are commercially
It obtains.
The composition epoxy resin of the semiconductor-sealing-purpose of the present invention, can improve composition epoxy resin using this and be packaged into
The composition epoxy resin of the semiconductor-sealing-purpose of type carries out semiconductor devices and integrated antenna package, can improve encapsulation process
In yield rate, demolding performace is good and Encapsulation Moulds time are significantly increased, and reduces the incidence of package interior stomata.
The preparation method of the composition epoxy resin of semiconductor-sealing-purpose provided by the present invention can be obtained with excellent
Encapsulated moulding, good release property, in the longer clear mould period, package interior has the semiconductor-sealing-purpose of higher fillibility
Composition epoxy resin, the performance of composition more stablizes.
The present invention is further illustrated with reference to embodiments, but they do not form limitation of the invention, right
In those skilled in the art, some the nonessential variations and adjustment done according to the present invention are accordingly to be regarded as falling the present invention's
In protection domain.
Specific embodiment
Ingredient in embodiment is as follows：
O-cresol formaldehyde epoxy resin A1 (Japanese DIC Corporation systems " N-665 ")
Phenol linear phenolic resin B1 (Japanese DIC Corporation systems " TD-2131 ")
2-methylimidazole C1
1,8- diazabicyclos (5,4,0) endecatylene -7C2
Fine silica powder D (d50 is 25 μm)
Brazil wax E
γ-glycidyl propyl ether trimethoxy silane F
Carbon black G
Liquid silicone oil H1
Silicone rubber powder H2
The mixture of brominated epoxy resin and antimony oxide (mass ratio 5:1)I
Biphenyl type epoxy resin A2 (Japan Epoxy Resins Co., Ltd. systems " YX-4000H ")
Dicyclopentadiene type epoxy Resin A 3 (Japanese DIC Corporation systems " HP-7200 ")
Phenol alkyl phenolic resin (phenol linear phenolic resin derivative) B2 (Mitsui Chemicals, Inc. systems
“XLC-4L”)
Triphenylphosphine C3
Embodiment 1
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A1, B1, D, E, F, G, H1 and H2,
I raw materials are put into reaction kettle, and carrying out heat when temperature is 120 DEG C melts mixing, stirs evenly rear cooling down to room temperature, will be hot
Melt mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C2 and C3
Raw material stirs evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, cold
But it, crushes, obtains the composition epoxy resin of semiconductor-sealing-purpose.The composition epoxy resin of gained semiconductor-sealing-purpose is into one
Step is molded, and molding composition epoxy resin is encapsulated and carries out performance evaluation after TO-22O and the results are shown in Table 1.
Embodiment 2
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A2, B2, D, E, F, G, H1 and H2,
I raw materials are put into reaction kettle, and carrying out heat when temperature is 130 DEG C melts mixing, stirs evenly rear cooling down to room temperature, will be hot
Melt mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C3 raw materials
It is stirred evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, cooling, powder
It is broken, obtain the composition epoxy resin of semiconductor-sealing-purpose.The composition epoxy resin of gained semiconductor-sealing-purpose further into
Row molding encapsulates molding composition epoxy resin and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 3
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A3, B1, D, E, F, G, H1 and H2,
I raw materials are put into reaction kettle, and carrying out heat when temperature is 150 DEG C melts mixing, stirs evenly rear cooling down to room temperature, will be hot
Melt mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C1 and C3
Raw material stirs evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, cold
But it, crushes, obtains the composition epoxy resin of semiconductor-sealing-purpose.The composition epoxy resin of gained semiconductor-sealing-purpose is into one
Step is molded, and molding composition epoxy resin is encapsulated and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 4
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A1, B2, D, E, F, G, H1 and H2,
I raw materials are put into reaction kettle, and carrying out heat when temperature is 160 DEG C melts mixing, stirs evenly rear cooling down to room temperature, will be hot
Melt mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C3 raw materials
It is stirred evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, cooling, powder
It is broken, obtain the composition epoxy resin of semiconductor-sealing-purpose.The composition epoxy resin of gained semiconductor-sealing-purpose further into
Row molding encapsulates molding composition epoxy resin and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 5
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A3, B2, D, E, F, G, H1 and H2,
I raw materials are put into reaction kettle, and carrying out heat when temperature is 170 DEG C melts mixing, stirs evenly rear cooling down to room temperature, will be hot
Melt mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C3 raw materials
It is stirred evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, cooling, powder
It is broken, obtain the composition epoxy resin of semiconductor-sealing-purpose.The composition epoxy resin of gained semiconductor-sealing-purpose further into
Row molding encapsulates molding composition epoxy resin and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 6
Above-mentioned various raw materials are weighed according to the content proportioning in table 1, and by load weighted A1, B1 and B2, D, E, F, G, H1
It is put into reaction kettle with H2, I raw material, carrying out heat when temperature is 150 DEG C melts mixing, stirs evenly rear cooling down to room
Heat is melted mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh by temperature；By obtained powder and weigh
C3 raw materials stirred evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes in double screw extruder
Go out, cool down, crush, obtain the composition epoxy resin of semiconductor-sealing-purpose.The epoxy composite of gained semiconductor-sealing-purpose
Object is further molded, and molding composition epoxy resin is encapsulated and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 7
Above-mentioned various raw materials are weighed according to the content proportioning in table 1, and by load weighted A2 and A3, B1, D, E, F, G, H1
It is put into reaction kettle with H2, I raw material, carrying out heat when temperature is 150 DEG C melts mixing, stirs evenly rear cooling down to room
Heat is melted mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh by temperature；By obtained powder and weigh
C3 raw materials stirred evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes in double screw extruder
Go out, cool down, crush, obtain the composition epoxy resin of semiconductor-sealing-purpose.The epoxy composite of gained semiconductor-sealing-purpose
Object is further molded, and molding composition epoxy resin is encapsulated and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 8
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A1, B2, D, E, F, G, H1 and H2,
I raw materials are put into reaction kettle, and carrying out heat when temperature is 180 DEG C melts mixing, stirs evenly rear cooling down to room temperature, will be hot
Melt mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C3 raw materials
It is stirred evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, cooling, powder
It is broken, obtain the composition epoxy resin of semiconductor-sealing-purpose.The composition epoxy resin of gained semiconductor-sealing-purpose further into
Row molding encapsulates molding composition epoxy resin and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 9
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A1, B1, D, E, F, G, H1 and H2,
I raw materials are put into reaction kettle, and carrying out heat when temperature is 160 DEG C melts mixing, stirs evenly rear cooling down to room temperature, will be hot
Melt mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C3 raw materials
It is stirred evenly in homogenizer；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, cooling, powder
It is broken, obtain the composition epoxy resin of semiconductor-sealing-purpose.The composition epoxy resin of gained semiconductor-sealing-purpose further into
Row molding encapsulates molding composition epoxy resin and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Embodiment 10
Weigh above-mentioned various raw materials according to the content proportioning in table 1, and by load weighted A1 and A3, B1, D, F, G, H1 and
H2, I raw material are put into reaction kettle, and carrying out heat when temperature is 120 DEG C melts mixing, stirs evenly rear cooling down to room temperature,
Heat is melted into mixture crushing that is rear and being cooled to room temperature, ball milling, and cross the sieve of 70 mesh；By obtained powder and load weighted C1
It is stirred evenly in homogenizer with C2 and raw material；By the mixture stirred evenly, melting mixing squeezes in double screw extruder
Go out, cool down, crush, obtain the composition epoxy resin of semiconductor-sealing-purpose.The epoxy composite of gained semiconductor-sealing-purpose
Object is further molded, and molding composition epoxy resin is encapsulated and carries out performance evaluation after TO-220 and the results are shown in Table 1.
Comparative example 1~10
The same Examples 1 to 10 of composition of composition, melting extrusion after preparation method is directly mixed using traditional each component
Method, the same above-described embodiment of method of evaluating performance, Evaluation results are shown in Table 2.
Table 1：The composition and content and Evaluation results of the composition epoxy resin of Examples 1 to 10 are (with weight percent
Than meter)
Table 2：The Evaluation results of comparative example
It can be seen that by the Evaluation results of above-described embodiment and comparative example, half obtained using the preparation method of the present invention
The composition epoxy resin of conductor encapsulation compared with the composition epoxy resin for using conventional extrusion techniques preparation, uses
The clear mould period of composition epoxy resin that the method for the present invention obtains is improved, and reduce the incidence of stomata.
Claims (10)
- A kind of 1. preparation method of the composition epoxy resin of semiconductor-sealing-purpose, which is characterized in that the epoxy resin group Close object preparation method be：By the epoxy resin weighed, curing agent phenolic resin, inorganic filler, releasing agent, low stress modified dose, colorant, resistance Combustion agent and silane coupling agent are put into reaction kettle, and carrying out heat for 120~180 DEG C in temperature melts mixing, cools down after stirring evenly To room temperature, heat is melted into mixture crushing that is rear and being cooled to room temperature, ball milling, crosses sieve；Then it by obtained powder and weighs Curing accelerator stirs evenly in blender；By the mixture stirred evenly, melting mixing squeezes out in double screw extruder, Cooling crushes, and obtains the composition epoxy resin of semiconductor-sealing-purpose.
- 2. preparation method according to claim 1, it is characterised in that：The composition epoxy resin key component and again It is as follows to measure percentage composition：The epoxy resin is selected from o-cresol formaldehyde epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, linear phenol Formaldehyde epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, open chain aliphatic epoxy resin, alicyclic epoxy One or more of resin and heterocyclic-type epoxy resin.
- 3. preparation method according to claim 1, it is characterised in that：The phenolic resin is selected from phenol novolac tree Fat and its derivative, phenyl methylcarbamate linear phenolic resin and its derivative, monohydroxy or dihydroxy naphthlene phenolic resin and its derivative, One or more of paraxylene and the copolymer of condensation product and dicyclopentadiene and phenol of phenol or naphthols.
- 4. preparation method according to claim 1, it is characterised in that：The inorganic filler be selected from fine silica powder, One or more of alumina powder, titanium oxide fine powder, silicon nitride powder and aluminium nitride micro mist.
- 5. preparation method according to claim 3, it is characterised in that：The fine silica powder is selected from crystal type dioxy SiClx micro mist, fusion fine silica powder or their mixture；The fusion fine silica powder is angular micro mist Or ball-type micro mist.
- 6. preparation method according to claim 1, it is characterised in that：The curing accelerator be selected from imidazolium compounds, One or more of tertiary amine compound and organic phosphine compound.
- 7. preparation method according to claim 5, it is characterised in that：The imidazolium compounds is selected from 2-methylimidazole, 2,4- methylimidazoles, 2-ethyl-4-methylimidazole, 2- phenyl miaows One or more of azoles and 2- phenyl -4-methylimidazole and 2- (heptadecyl) imidazoles；The tertiary amine compound is selected from triethylamine benzyl group dimethylamine, Alpha-Methyl benzyl group dimethylamine, 2- (dimethylamino methyl) benzene One or more of phenol, (dimethylamino methyl) phenol of 2,4,6- tri- and 1,8- diazabicyclos (5,4,0) endecatylene -7；The organic phosphine compound is selected from triphenylphosphine, trimethyl-phosphine, triethyl phosphine, tributylphosphine, three (p-methylphenyls) One or more of phosphine and three (nonyl phenyl) phosphines.
- 8. preparation method according to claim 1, it is characterised in that：The releasing agent is selected from Brazil wax, synthesis One or more of wax and mineral matter wax；Releasing agent weight percentage in composition epoxy resin is 0.4%.
- 9. preparation method according to claim 1, it is characterised in that：Described low stress modified dose is liquid silicone oil, silicon Rubber powder or their mixture；The weight percentage in composition epoxy resin of described low stress modified dose is 0.8%.
- 10. preparation method according to claim 1, it is characterised in that：The colorant is carbon black；The colorant Weight percentage is 0.5% in composition epoxy resin；The fire retardant is the oxidation of the mixture of brominated epoxy resin and antimony oxide, wherein brominated epoxy resin and three two The mass ratio of antimony is 5:1；The silane coupling agent is selected from γ-glycidyl propyl ether trimethoxy silane, gamma-amino propyl-triethoxysilicane One or more of alkane, γ mercaptopropyitrimethoxy silane and γ-aminopropyltrimethoxysilane；The silane is even It is 0.5% to join agent weight percentage in composition epoxy resin.
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Cited By (8)
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| CN109486100A (en) * | 2018-11-27 | 2019-03-19 | 江苏中鹏新材料股份有限公司 | Epoxy resin for electronic packaging composition and preparation method thereof |
| CN109535612A (en) * | 2018-12-06 | 2019-03-29 | 南阳医学高等专科学校 | A kind of computer chip encapsulation material and preparation method thereof |
| CN109904125A (en) * | 2019-03-06 | 2019-06-18 | 西安航思半导体有限公司 | The preparation method of high temperature resistant QFN encapsulating structure |
| CN109904124A (en) * | 2019-03-06 | 2019-06-18 | 西安航思半导体有限公司 | QFN encapsulating structure with anti-short-circuit function |
| CN109957210A (en) * | 2019-02-18 | 2019-07-02 | 英鸿纳米科技股份有限公司 | A kind of nanoscale electric chip encapsulation material |
| CN112384572A (en) * | 2018-07-27 | 2021-02-19 | 松下知识产权经营株式会社 | Resin composition for semiconductor encapsulation, semiconductor device, and method for manufacturing semiconductor device |
| CN112873603A (en) * | 2020-12-29 | 2021-06-01 | 江苏科化新材料科技有限公司 | Preparation method of high-cost-performance epoxy composition |
| CN114940805A (en) * | 2022-05-09 | 2022-08-26 | 衡所华威电子有限公司 | Low-stress low-water-absorption epoxy plastic packaging material for semiconductor packaging and preparation method thereof |
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