CN108020695B

CN108020695B - Method for manufacturing probe

Info

Publication number: CN108020695B
Application number: CN201711178742.3A
Authority: CN
Inventors: 刘红军; 杨文仁
Original assignee: Wuhan Memscard Micro Electronics Co ltd
Current assignee: Zhejiang micro needle Semiconductor Co.,Ltd.
Priority date: 2017-11-23
Filing date: 2017-11-23
Publication date: 2020-11-10
Anticipated expiration: 2037-11-23
Also published as: CN108020695A

Abstract

The invention discloses a method for manufacturing a probe, which comprises a needle post and a needle cone, wherein a metal layer is formed on a substrate, the metal layer comprises a basic layer and a conductive circuit layer formed on the basis of a plurality of patterns on the basic layer, the needle post and a needle cone model hole are formed on the patterns, and the patterns are integrally formed by electroplating; the manufacturing method of the probe is not limited by the traditional machining capacity, is convenient for manufacturing the probe bodies in batches in a fixed area in an equal proportion, ensures the parallelism among the probes and reduces the height error; and each probe is integrated into one piece, and the needle type is unanimous, the needle footpath is littleer, needle body length is shorter, the precision is higher for the volume production.

Description

Method for manufacturing probe

Technical Field

The invention relates to the technical field related to the detection of integrated circuit probe cards and display panels, in particular to a manufacturing method of a probe.

Background

A Probe (Probe) is a device for measuring electrical characteristics of a minute electronic device (for example, a semiconductor device or a tft array in a liquid crystal display panel), and as is well known in the art, a tft array (tft array) has a plurality of gate lines and signal lines connected to a plurality of test pads (TestPad) for exchanging signals with an external electronic system; the thin film transistor array processes the electrical signals inputted through the test pads, and transmits the processed results to an external system through the test pads to detect whether the electrical characteristics of the display panel are good or bad or defective.

At present, with the increasing pixel of the liquid crystal display panel, the requirements for the probe such as the fine and minute pin body and the pin shape of the pin body are increased, and the traditional machining method can not meet the requirements.

An effective solution to the problems in the related art has not been proposed yet.

Disclosure of Invention

The invention provides a method for manufacturing a probe, which can effectively solve the problems in the background technology.

The method comprises the following steps:

s1: forming a metal layer on the substrate, wherein the metal layer comprises a base layer and a conductive circuit layer formed on the basis of a plurality of patterns 21 on the base layer;

s2: forming a needle cone plastic layer on the metal layer, forming a needle cone photoresist layer on the needle cone plastic layer, patterning the needle cone photoresist layer by using a needle cone photomask to form a patterned needle cone pattern photoresist layer, and removing the patterned needle cone pattern photoresist layer and the needle cone plastic layer to form a needle cone die hole corresponding to the patterned needle cone pattern photoresist layer;

s3: forming a metal pad in the needle cone die hole, forming a needle cylinder plastic layer on the needle cone plastic layer, forming a needle cylinder photoresist layer on the needle cylinder plastic layer, patterning the needle cylinder photoresist layer by using a needle cylinder photomask to form a patterned needle cylinder pattern photoresist layer and a needle cylinder pattern photoresist layer to be tested and removed, removing the patterned needle cylinder pattern photoresist layer to be removed, so that the needle cylinder plastic layer forms a needle cylinder die hole corresponding to the patterned needle cylinder pattern photoresist layer, and removing the needle cylinder plastic layer, wherein the needle cylinder die hole and the needle cone die hole are a through die hole conducting circuit layer;

s4; and electroplating in the pin column die holes and the pin cone die holes to form the probes.

Further, in step S2, the shape and size of the metal pad are matched with the needle cone die holes in equal proportion.

Further, in step S2, the needle taper holes may be made with taper angles according to the setting.

Further, in step S3, the pin mold hole and the taper mold hole are coaxial.

Further, in step S3, the cross section of the pin mold hole is polygonal or circular.

Further, in steps S2 and S3, the needle cone plastic layer and the needle cylinder plastic layer are formed by surface pasting or coating.

The invention has the beneficial effects that: the manufacturing method of the probe is not limited by the traditional machining capacity, is convenient for manufacturing the probe bodies in batches in a fixed area in an equal proportion, ensures the parallelism among the probes and reduces the height error; and each probe is integrated into one piece, and the needle type is unanimous, the needle footpath is littleer, needle body length is shorter, the precision is higher for the volume production.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic top view of a metal layer in the present invention;

FIG. 2 is a front view of a metal layer formed on a substrate in the present invention;

FIG. 3 is a front view of the present invention showing the formation of a needle-cone plastic layer and a needle-cone photoresist layer;

FIG. 4 is a front view of a patterned tapered photoresist layer of the tapered reticle of the present invention;

FIG. 5 is a front view of the present invention with the tapered pin die holes removed;

FIG. 6 is a front view of the formation of a pin column plastic layer and a pin column photoresist layer in accordance with the present invention;

FIG. 7 is a front view of the present invention with the pin mold holes formed removed;

FIG. 8 is a front view of a plating molded probe body according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.

The probe of the present invention is not limited to be used in testing of liquid crystal display panels, and other probe cards such as integrated circuit testing or probe structures requiring fabrication of micro-scale can be implemented. The following examples are given by way of illustration only and the scope of the present invention is not limited thereto.

As shown in fig. 1 to 8, the method for manufacturing a probe according to the present invention includes the following steps:

s1: forming a metal layer 200 on the substrate 100, wherein the metal layer 200 includes a base layer 201 and a conductive circuit layer 202 formed on the base layer 201 based on a plurality of patterns 21;

s2: forming a needle-tapered plastic layer 300 on the metal layer 200, forming a needle-tapered photoresist layer 400 on the needle-tapered plastic layer 300, patterning the needle-tapered photoresist layer 400 using a needle-tapered mask to form a patterned needle-tapered patterned photoresist layer 401, removing the patterned needle-tapered patterned photoresist layer 401 and the needle-tapered plastic layer 300, so that the needle-tapered plastic layer 300 forms a needle-tapered die hole 301 corresponding to the patterned needle-tapered patterned photoresist layer 401;

s3: forming a metal pad 10 in the pin mold hole 301, forming a pin plastic layer 500 on the pin plastic layer 300, forming a pin photoresist layer 600 on the pin plastic layer 500, patterning the pin photoresist layer 600 using a pin mask to form a patterned pin pattern photoresist layer 601 and a to-be-tested and removed patterned pin pattern photoresist layer 602, removing the to-be-removed patterned pin pattern photoresist layer 602, so that the pin plastic layer 500 forms a pin mold hole 501 corresponding to the patterned pin pattern photoresist layer 601, and removing the pin plastic layer 500, wherein the pin mold hole 501 and the pin mold hole 301 are a through mold hole conductive circuit layer;

s4; the probes 20 are formed in the pin column holes 501 and the pin cone holes 301 by electroplating.

In this embodiment, in step S2, the shape and size of the metal pad 10 are proportionally matched with the needle cone holes 301.

In this embodiment, in step S2, the needle taper hole 301 may be made with a taper angle according to a setting.

In this embodiment, in step S3, the pin mold hole 501 is coaxial with the tapered pin mold hole 301.

In this embodiment, in step S3, the cross section of the pin mold 501 is polygonal or circular.

In this embodiment, in steps S2 and S3, the needle cone plastic layer 300 and the needle cylinder plastic layer 500 are formed by surface pasting or coating.

Specifically, the metal layer 200 may be formed by a photomask and the like, which is similar to the technical scheme for forming the pin column die hole 501 and the pin cone die hole 301, and is not described again; the taper of the needle cone die hole 301 can be adjusted by controlling the thickness of the needle cone photoresist layer 400 and the length of the exposure time; the diameter of the probe cone manufactured by the method is more than or equal to 2um, the diameter of the probe pin column is more than or equal to 10 um, and the length of the probe pin is more than or equal to 40 um.

In summary, by means of the above technical scheme of the present invention, the method for manufacturing the probe is not limited by the conventional machining capability, and is convenient for manufacturing the probe bodies in an equal proportion batch in a fixed area, and simultaneously, the parallelism among the probes is ensured, and the height error is reduced; and each probe is integrated into one piece, and the needle type is unanimous, the needle footpath is littleer, needle body length is shorter, the precision is higher for the volume production.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. A method for manufacturing a probe is characterized by comprising the following steps:

s1: forming a metal layer (200) on the substrate (100), wherein the metal layer (200) comprises a base layer (201) and a conductive circuit layer (202) composed of a plurality of patterns (21) on the base layer (201);

s2: forming a needle-cone plastic layer (300) on the metal layer (200), forming a needle-cone photoresist layer (400) on the needle-cone plastic layer (300), patterning the needle-cone photoresist layer (400) by using a needle-cone photomask to form a patterned needle-cone pattern photoresist layer (401), and removing the patterned needle-cone pattern photoresist layer (401) and the needle-cone plastic layer (300), so that the needle-cone plastic layer (300) forms a needle-cone die hole (301) corresponding to the patterned needle-cone pattern photoresist layer (401);

s3: forming a metal pad (10) in a pin mold hole (301), forming a pin mold plastic layer (500) on the pin mold plastic layer (300), forming a pin mold photoresist layer (600) on the pin mold plastic layer (500), patterning the pin mold photoresist layer (600) by using a pin mold photomask to form a patterned pin mold photoresist layer (601) and a patterned pin mold photoresist layer (602) to be removed, removing the patterned pin mold photoresist layer (602) to be removed, so that the pin mold plastic layer (500) forms a pin mold hole (501) corresponding to the patterned pin mold photoresist layer (601), and removing the pin mold plastic layer (500), wherein the pin mold hole (501) and the pin mold hole (301) are a through mold hole conductive circuit layer;

s4; and (3) electroplating the pin column die holes (501) and the pin cone die holes (301) to form the probes (20), wherein in the step (S2), the shape and the size of the metal pad (10) are matched with the pin cone die holes (301) in an equal proportion, and the pin cone die holes (301) can be manufactured into cone-shaped angles according to set values.

2. The method of claim 1, wherein in step S3, the pin holes (501) are coaxial with the taper holes (301).

3. The method for manufacturing a probe according to claim 2, wherein in step S3, the cross section of the pin mold hole (501) is polygonal or circular.

4. The method of claim 3, wherein the needle cone plastic layer (300) and the needle pillar plastic layer (500) are formed by surface pasting or coating in steps S2 and S3.