CN101750525B - Manufacturing method of test socket and elastic test probe used therein - Google Patents

Abstract

The invention provides a manufacturing method of a test socket and an elastic test probe used by the same, comprising the following steps: providing a substrate made of a non-metal material; covering at least one sacrificial layer on the substrate; covering at least one photoresist layer on the sacrificial layer; performing a photolithography process on the photoresist layer to remove a portion of the photoresist layer and form a plurality of columnar protrusions; coating a surface metal layer on the surfaces of the columnar bulges to form a plurality of elastic test probes; providing a socket body having a plurality of openings corresponding to the plurality of elastic test probes; removing the sacrificial layer to take off the test socket, and the test socket is sleeved with the plurality of elastic test probes; each elastic test probe has an elastic body formed of a photoresist material and a conductive surface.

Description

Manufacturing method of test socket and elastic test probe used therein

technical field

The present invention relates to a method for manufacturing a test socket for semiconductor components and the elastic test probe used therein, in particular to an elastic body made of photoresist material and then formed elastic test probes and Test sockets using this flexible test probe.

Background technique

In the testing of semiconductor high-frequency components, test probes or conductive connection devices with short paths are usually used to test semiconductor components, such as ball grid array (Ball GridArray/BGA) packaging of IC components After the BGA component is packaged, the BGA component must undergo an electrical test to ensure the quality of the BGA component. However, because the packaging structure of BGA components is distributed in a high-density matrix, in order to make the test probes or conductive connection devices accurately contact the metal bumps or tin-lead bumps on the BGA components, the known conductive connection devices can be surface Adhesive matrix (surface mount matrix/SMM) or integrated silicon contactor (integrated silicon contactor/ISC), etc. Please refer to FIG. 1A and FIG. 1B, which is a known ISC elastic conductor 10, including conductive particles A, plastic elastomer B and conductor C, wherein conductive particle A is embedded in plastic elastomer B, and plastic elastomer B has There are a plurality of conductors C, and the arrangement of the conductors C is relative to the number of tin-lead bumps 4 of the IC component 9 to be tested. When carrying out this IC component 9 test, apply an action force F to make the tin-lead bump 4 of IC component 9 contact the plastic elastomer B in the ISC elastic conductor 10, so the conductive particles A inside the plastic elastomer B are subjected to Compressed and then connected to each other to achieve the effect of current conduction, and the IC component 9 and the PCB board 8 can conduct each other for testing, but the above-mentioned current conduction path is far lower than the general traditional elastic test probe (pogo pin) The current conduction path is very easy to use in the high-frequency test area, and the needle cleaning procedure is simpler and more convenient than elastic test probes. But its biggest disadvantage is that the manufacturing technology is complex and expensive. As long as one of the conductive particles A is damaged or burnt due to a short circuit caused by the test, it is impossible to directly replace a single damaged conductive particle A, resulting in the elastic conductivity of the entire ISC. The body 10 will be unusable and scrapped, and the above-mentioned problems will greatly increase the testing cost.

Contents of the invention

In order to solve the unsatisfactory problems in the above-mentioned known technologies, the object of the present invention is to provide a method for manufacturing a test socket.

Yet another object of the present invention is to provide an elastic testing probe.

In order to achieve the above object, the manufacturing method of the test socket provided by the present invention comprises the following steps:

1) Provide a non-metal substrate;

2) coating at least one sacrificial layer on the substrate;

3) coating at least one photoresist layer on the sacrificial layer, wherein the material of the photoresist layer is an elastic polymer;

4) Exposing and developing the photoresist layer to remove part of the photoresist layer, and forming a plurality of columnar protrusions on the sacrificial layer;

5) Coating a layer of surface metal layer on the surface of the plurality of columnar protrusions in a coating manner to form a plurality of elastic test probes;

6) providing a socket body, the socket body has a plurality of openings corresponding to the aforementioned plurality of elastic test probes, so that the above-mentioned plurality of elastic test probes are inserted into the plurality of openings of the socket body;

7) removing the sacrificial layer to take off the socket body, and the socket body has been inserted into the above-mentioned plurality of elastic test probes; and

8) Coating a surface metal layer on the surface of the socket body by coating, and each elastic test probe of the socket body has an elastic body formed of photoresist material and a conductive surface.

The manufacturing method of the test socket of the present invention is to make the elastic test probe on the test socket by photolithography process, because the elastic test probe is composed of a single photoresist structure, and the damaged one can be replaced by a single Flexible test probes, thus reducing test costs.

The manufacturing method of the test socket of the present invention can produce a large number of test sockets containing elastic test probes by photolithography technology, thereby reducing the manufacturing cost of the test socket.

The elastic test probe provided by the present invention, wherein the elastic test probe has a columnar elastic body formed of a photoresist material, and the outside of the columnar elastic body is covered with a conductive surface metal, and the cross section of the columnar elastic body can have a specific pattern .

The elasticity test probe of the present invention can be produced in large quantities by photolithography technology, thereby reducing the production cost.

In the elastic test probe of the present invention, the outer surface of the columnar elastic body is coated with a conductive surface metal, thereby generating a high-frequency skin effect (Skin Effect) to achieve the purpose of high-frequency testing.

The elastic test probe of the present invention is composed of a single photoresist structure. When the elastic test probe is damaged, it is easy to replace a single one, thereby further reducing the test cost.

Description of drawings

FIG. 1A is a schematic diagram of an ISC elastic conductor in the known technology.

FIG. 1B is a cross-sectional view, which is a cross-sectional structure of an ISC elastic conductor in the known technology.

FIG. 2A is a flow chart, which is a manufacturing method of a test socket according to the first preferred embodiment of the present invention.

FIG. 2B is a schematic diagram of a socket body according to the first or second preferred embodiment of the present invention.

FIG. 2C is a schematic diagram of a calibration jig according to the first or second preferred embodiment of the present invention.

FIG. 3 is a flow chart, which is another manufacturing method of the test socket according to the second preferred embodiment of the present invention.

Explanation of main component symbols in the drawings

ISC elastic conductor (known technology) 10

Conductive particles (known technology) A

Plastic elastomer (known technology) B

Conductor (known technology) C

Force (known technology) F

PCB board (known technology) 8

IC components (known technology) 9

Tin-lead bumps (known technology) 4

Elastic test probe 200, 300

Substrates 21

Metal Substrate 31

sacrificial layer 22

Photoresist layer 23, 33

Part of the photoresist layer 13a, 23a

Columnar bump 25, 35

Surface metal layer 26, 36

Socket body 27, 37

Opening 271, 371

Calibration fixture 28, 38

Cover standard sheet 281, 381

Lower cover standard sheet 282, 382

Steps 201, 202, 203, 204, 205, 206,

207, 208

Step 301, 302, 303, 304, 305, 306,

307

Force direction L1, L2

Detailed ways

Because the present invention discloses a manufacturing method of a test socket and the elastic testing probe used therefor, which are used for testing semiconductor components, the probe testing principle and its basic functions used therein, as well as the photomask and optical micrometer used in the manufacturing method The principle of shadowing has been understood by those skilled in the art, so it will not be fully described in the following description. At the same time, the drawings compared below are schematic structural representations related to the features of the present invention, and are not and need not be completely drawn based on actual dimensions, and are described in advance.

First please refer to FIG. 2A, which is a first preferred embodiment of the present invention, a flow chart of a test socket manufacturing method, including the following steps:

Step 201: Provide a non-metal substrate 21, the material is not limited, and glass or plastic is preferred;

Step 202: coating at least one sacrificial layer 22 on the above-mentioned substrate 21, the material of this sacrificial layer 22 can be any of chromium (Cr), titanium (Ti), gold (Au), copper (Cu) or silicon substrate, etc. A sort of;

Step 203: coating at least one photoresist layer 23 on the sacrificial layer 22, and the material of the photoresist layer 23 is preferably an elastic polymer, such as commercially available photoresist structures such as SU8, AZ4620, and JSR 151N;

Step 204 : Expose and develop the photoresist layer 23 by a photolithography process to remove part of the photoresist layer 23 a and form a plurality of columnar protrusions 25 on the sacrificial layer 22 . In this preferred embodiment, the specific pattern on the photoresist layer 23 is a circle. Of course, according to actual needs, the specific pattern on the photoresist layer 23 can be any one of ellipse, triangle, rectangle or polygon. In this preferred embodiment, the cross-sectional areas of the upper, middle and lower sections of the columnar protrusions 25 are substantially the same. In actual production, the characteristics of different commercially available photoresists can be used in combination with the exposure compensation method of the exposure machine, and the cross-sectional area of the upper section is larger than that of the lower section, or the cross-sectional area of the upper section is smaller than that of the lower section. The area of the columnar bump 25 is beneficial to the testing requirements of different semiconductor components;

Step 205: Cover a layer of surface metal layer 26 on the surface of the aforementioned columnar protrusion 25 in a coating manner to form a plurality of columnar elastic test probes 200, wherein each elastic test probe 200 has a photoresist material. The elastic body and the conductive surface, especially the material of the surface metal layer 26 is preferably a low-resistance metal material, such as gold (Au), silver (Ag), copper (Cu) or tungsten (W ) and other materials, and the coating method can be any coating method such as sputtering, evaporation, dipping, electroless plating or plastic plating;

Step 206: Provide a socket body 27 (as shown in FIG. 2B ), this socket body 27 has a plurality of openings 271 corresponding to the aforementioned plurality of elastic test probes 200, wherein the socket body 27 can be made by CNC machining , and preferably a flexible and non-conductive material, such as engineering plastics. Then, the plurality of openings 271 of the socket body 27 are inserted into the aforementioned plurality of elastic test probes 200. In addition, the method of inserting the socket body 27 into the elastic test probes 200 can be performed using a flip-chip alignment machine during actual operation. Of course, any kind of alignment method can be used, for example: it can be assisted by a CCD (CHARGE-COUPLED DEVIC/ charge-coupled device) image sensor, or an alignment key (AlignmentKey) can also be made on the substrate 21 or the socket body 27 ) (not shown), in order to achieve the effect of alignment;

Step 207: Remove the sacrificial layer 22 to remove the socket body 27. At this time, the socket body 27 has been inserted into the aforementioned plurality of elastic test probes 200, and the bottoms of the plurality of elastic test probes 200 have not been covered yet. surface metal layer 26; and

Step 208: Then coat a layer of surface metal layer 26 on the surface of the socket body 27 by any of the above coating methods, so the bottoms of the above-mentioned plurality of elastic test probes 200 are also coated on the surface metal layer 26, Therefore, each elastic test probe 200 on the socket body 27 has an elastic body formed of photoresist material and a conductive surface.

Special attention should be paid to the manufacturing method of this test socket. In addition to the above-mentioned step 206 so that the plurality of openings 271 of the socket body 27 are inserted into the aforementioned plurality of elastic test probes 200, of course, step 206 can also be skipped. After the sacrificial layer 22 is removed in step 207 , the plurality of elastic test probes 200 are removed, and then one by one elastic test probes 200 are inserted into the opening 271 of the socket body 27 .

In addition, the present invention further provides a calibration jig 28, please refer to FIG. 2C, the calibration jig 28 includes an upper cover standard sheet 281 and a lower cover standard sheet 282, and the use of the calibration jig 28 has the following two situations :

Situation 1: If one by one elastic test probes 200 are inserted into the opening 271 of the socket body 27, then use the upper cover standard sheet 281 and the lower cover standard sheet 282 of the calibration jig 28 to apply force along the The directions L1 and L2 pressurize the elastic test probe 200 on the socket body 27 to adjust its height, so that the elastic test probe 200 achieves a certain precise coplanarity.

Situation 2: When at least one elastic test probe 200 on the socket body 27 is damaged, the damaged elastic test probe 200 can be dissolved with chemicals such as acetone first, and then a good elastic test probe can be used The probe 200 is inserted into the previously dissolved hole with acetone for filling. After the stuffing is completed, the upper cover standard sheet 281 and the lower cover standard sheet 282 of the correction jig 28 can be used to pressurize the elastic test probe 200 on the socket body 27 respectively along the force direction L1 and L2 to adjust its The height makes the elastic testing probe 200 achieve a certain precise coplanarity.

Please refer to Fig. 3, which is the second preferred embodiment proposed by the present invention, which is a flow chart of another test socket manufacturing method, including the following steps:

Step 301: providing a metal substrate 31;

Step 302: coating at least one photoresist layer 33 on the metal substrate 31, and the material of the photoresist layer 33 is preferably elastic polymer, such as commercially available photoresist structures such as SU8, AZ4620, JSR151N;

Step 303 : Expose and develop the photoresist layer 33 by a photolithography process to remove part of the photoresist layer 33 a and form a plurality of columnar protrusions 35 on the metal substrate 31 . In this preferred embodiment, the specific pattern on the photoresist layer 33 is a circle. Of course, according to actual needs, the specific pattern on the photoresist layer 33 can be any one of ellipse, triangle, rectangle or polygon. In this preferred embodiment, the cross-sectional areas of the upper section, middle section and lower section of the columnar protrusions 35 are approximately the same. In actual production, the characteristics of different commercially available photoresists can be used in combination with the exposure compensation method of the exposure machine, and the cross-sectional area of the upper section is larger than that of the lower section, or the cross-sectional area of the upper section is smaller than that of the lower section. The pillar-shaped protrusion 35 of the area is suitable for the testing requirements of different semiconductor components;

Step 304: Cover a layer of surface metal layer 36 on the surface of the aforementioned columnar protrusion 35 in a coating manner to form a plurality of columnar elastic test probes 300, wherein each elastic test probe 300 has a photoresist material Formed elastic body with conductive surface. The material of the surface metal layer 36 is preferably a low-resistance metal material, such as any material such as gold (Au), silver (Ag), copper (Cu) or tungsten (W), and the coating method It can be any coating method such as sputtering, evaporation, dipping, electroless plating or plastic plating;

Step 305: Provide a socket body 37 (as shown in FIG. 2B ), and this socket body 37 has a plurality of openings 371 corresponding to the aforementioned plurality of elastic test probes 300, wherein the socket body 37 can be processed by CNC. It is preferably made of flexible and non-conductive materials, such as engineering plastics. Then, the plurality of openings 371 of the socket body 37 are inserted into the aforementioned plurality of elastic test probes 300. In addition, the method of inserting the socket body 37 into the elastic test probes 300 can be performed using a flip-chip alignment machine during actual operation. Of course, any alignment method can be used, for example, it can be assisted by a CCD image sensor, or an alignment key (not shown) can be made on the substrate 31 or the socket body 37, so as to achieve alignment Effect;

Step 306: Remove part of the metal on the surface of the metal substrate 31 to remove the socket body 37. At this time, the socket body 37 has been inserted into the aforementioned plurality of elastic test probes 300, and at this time the plurality of elastic test probes 300 bottom uncovered surface metal layer 36; and

Step 307: Cover the surface of the socket body 37 with a layer of surface metal layer 36 by any of the aforementioned coating methods, so the bottoms of the aforementioned plurality of elastic test probes 300 are also covered with the surface metal layer 36, Therefore, each elastic test probe 300 on the socket body 37 has an elastic body formed of photoresist material and a conductive surface.

It should be noted that, in the manufacturing method of this test socket, in addition to making the plurality of openings 371 of the socket body 37 fit into the aforementioned plurality of elastic test probes 300 as in step 305, step 305 can also be skipped, and After removing part of the metal on the surface of the metal substrate 31 in step 306 , the plurality of elastic test probes 300 are removed, and then the elastic test probes 300 are put into the opening 371 of the socket body 37 one by one.

In addition, the present invention further provides a calibration jig 38. Please refer to FIG. 2C. The calibration jig 38 includes an upper cover standard sheet 381 and a lower cover standard sheet 382. The calibration jig 38 can be used in the following two ways: Condition:

Case 1, if the elastic test probes 300 are placed one by one into the opening 371 of the socket body 37, after the completion, the upper cover standard sheet 381 and the lower cover standard sheet 382 of the calibration jig 38 are used to apply force along the The directions L1 and L2 pressurize the elastic test probe 300 on the socket body 37 to adjust its height, so that the elastic test probe 300 achieves a certain precise coplanarity.

Case 2, when at least one elastic test probe 300 is damaged on the socket body 37, the damaged elastic test probe 300 can be dissolved with chemicals such as acetone first, and then a good elastic test probe can be used. The probe 300 is inserted into the previously dissolved hole with acetone for filling. After the filling is completed, the upper cover standard sheet 381 and the lower cover standard sheet 382 of the calibration jig 38 can be used to pressurize the elastic test probe 300 on the socket body 37 respectively along the force direction L1 and L2 to adjust Its height enables the elastic test probe 300 to achieve a certain degree of precise coplanarity.

The present invention further provides a third preferred embodiment, which is an elastic test probe for testing semiconductor components. The elastic test probe has a columnar elastic body formed of photoresist material, and the exterior of the columnar elastic body is coated with a conductive surface metal layer, and the cross section of the columnar elastic body has a specific pattern. As for other features of the elastic testing probe, it is as the elastic testing probe 200 produced in the first preferred embodiment and the elastic testing probe 300 produced in the second preferred embodiment.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent application rights of the present invention; meanwhile, the above descriptions should be clear and implementable for those skilled in the art, so others do not depart from the spirit disclosed by the present invention The equivalent changes or modifications completed below shall be included in the scope of the claims of the application.

Claims (10)

1. the method for making of a test jack is characterized in that comprising:

The substrate of one non-metallic material is provided;

At least one sacrifice layer of coating is on this substrate;

At least one photoresist layer of coating is on this sacrifice layer, and wherein the material of this photoresist layer is the rubber-like polymkeric substance;

Make public and develop at this photoresist layer, on this sacrifice layer, form a plurality of columnar projections to remove the photoresist layer of part;

With the surperficial coating layer of surface metal level of a coating mode, to form a plurality of elastic test probes in those columnar projections;

One jack body is provided, and this jack body has the plurality of openings corresponding to those elastic test probes, is inserted in those elastic test probes at those openings of this jack body;

Remove this sacrifice layer, to take off this jack body, this jack body has been inserted in those elastic test probes; And

With the surperficial coating layer of surface metal level of this coating mode at this jack body, wherein each elastic test probe of this jack body has elastic body and the conductive surface that forms with photoresist again.

2. the method for making of test jack as claimed in claim 1 is characterized in that, wherein this substrate is glass or plastics, and the material of this sacrifice layer is chromium, titanium, gold, copper and silicon substrate any.

3. the method for making of test jack as claimed in claim 1 is characterized in that, wherein the epimere of each columnar projections, stage casing are roughly identical with the sectional area of hypomere.

4. the method for making of test jack as claimed in claim 1 is characterized in that, wherein the epimere sectional area of each columnar projections is greater than the hypomere sectional area.

5. the method for making of test jack as claimed in claim 1 is characterized in that, wherein the epimere sectional area of each columnar projections is less than the hypomere sectional area.

6. the method for making of test jack as claimed in claim 1 is characterized in that, wherein this exposure and development step are to carry out with a lithography process.

7. the method for making of test jack as claimed in claim 1 is characterized in that, wherein the material of this surface metal-layer is the Low ESR metal.

8. the method for making of test jack as claimed in claim 1 is characterized in that, wherein this coating mode be sputter, vapor deposition, immersion plating, electroless plating and plastic electroplating any.

9. the method for making of test jack as claimed in claim 1 is characterized in that, comprising provides a correcting fixture, a plurality of elastic test probes of inserting this jack body is proofreaied and correct aimed at, and makes to have a reference plane.

10. the method for making of a test jack is characterized in that comprising:

One metal substrate is provided;

At least one photoresist layer of coating is on this metal substrate, and wherein the material of this photoresist layer is the rubber-like polymkeric substance;

Make public and develop at this photoresist layer, on this metal substrate, form a plurality of columnar projections to remove the photoresist layer of part;

With the surperficial coating layer of surface metal level of a coating mode, to form a plurality of elastic test probes in those columnar projections;

One jack body is provided, and this jack body has the plurality of openings corresponding to those elastic test probes, is inserted in those elastic test probes at those openings of this jack body;

Remove the part metal of this metallic substrate surfaces, to take off this jack body, this jack body has been inserted in those elastic test probes; And

With the surperficial coating layer of surface metal level of this coating mode at this jack body, wherein each elastic test probe on this jack body has elastic body and the conductive surface that forms with photoresist again.

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