CN107917554A - Flat heat pipe expansion type condensing device - Google Patents

Abstract

The present invention relates to heat dissipation, and provides a flat heat pipe expansion type condensing device, which includes multiple rows of flat heat pipes, a condenser cavity, an air inlet pipe and a liquid outlet pipe, wherein: the condenser cavity is provided with an air inlet and a liquid outlet, The condenser cavity is also provided with a number of assembly holes corresponding to each flat heat pipe one by one. Each flat heat pipe is installed at the corresponding assembly hole and at least partly located in the condenser cavity. The air port and the liquid outlet are connected. In the condensing device of the present invention, since the flat heat pipe and the condenser cavity are both planar structures, and the wall thickness is very thin, the contact area is large, and they are integrated by welding or bonding, and because the evaporation section is arranged in the condenser cavity The interior is in direct contact with the gas refrigerant, which can effectively reduce the heat transfer resistance, and through the structure of the combination of the flat heat pipe and the condenser cavity, the heat dissipation capacity of the condensing device can be enhanced, and the reliability of the condensing device can be improved at the same time.

Description

Flat-plate heat pipe expansion condensing device

technical field

The invention relates to heat dissipation, in particular to a flat heat pipe expansion type condensing device.

Background technique

As the heat dissipation of electronic devices and high-power equipment increases sharply, the heat flux density rises sharply, which affects the stability and safety of components and system operation. It is necessary to dissipate the heat in time to be able to work normally. Or the refrigeration system puts forward higher requirements.

At present, the condenser in the refrigeration system is generally a coil condenser, and a number of aluminum or copper fins are placed on the outside of the coil, and the heat is taken away by forced air cooling. Another kind of condenser is made of many parallel flow aluminum tubes, and corrugated fins are arranged between adjacent parallel flow aluminum tubes to form a condenser. During the heat transfer process, the gaseous working medium condenses and releases heat in the condensing pipe, and the heat is transferred to the external fins through the condensing pipe wall, and the heat is dissipated to the outside through the convective heat exchange between the fins and the air.

The condensation heat transfer coefficient in the condensing pipeline and the convective heat transfer coefficient between the fins and the air have an important influence on the overall heat transfer performance of the condenser. Usually the heat dissipation fins are very thin, limited by the efficiency of the ribs, the height of the fins should not be too large, there is a large temperature difference between the base and the end of the existing fins, if you want to improve the heat dissipation capacity, you can only increase the number of fins and the length of the condensing line , so that the area of the condenser is continuously increased in the plane direction to meet the heat dissipation requirements, resulting in an increase in the volume and weight of the condenser. In order to improve the cooling capacity of the condenser, it is necessary not only to increase the condensation heat transfer coefficient and heat transfer area, but also to increase the heat dissipation area of the fins and improve the efficiency of the ribs of the fins.

Contents of the invention

The object of the present invention is to provide a flat heat pipe expansion type condensing device, which aims to solve the problem of low heat dissipation effect of the heat dissipation fins of the existing condenser.

The present invention is achieved like this:

An embodiment of the present invention provides a flat-plate heat pipe expansion type condensing device, which includes multiple rows of flat heat pipes, a condenser cavity, an air inlet pipe and a liquid outlet pipe, wherein: the condenser cavity is provided with an air inlet and a liquid outlet , the condenser cavity is also provided with a number of mounting holes corresponding to each of the flat heat pipes, each of the flat heat pipes is installed at the corresponding mounting hole and at least partly located in the condenser cavity In the body, the flat heat pipe and the condenser cavity are not connected to each other, and the air inlet pipe and the liquid outlet pipe are connected to the air inlet and the liquid outlet respectively.

As a preferred embodiment of the present invention, it also includes a first communication plate, and the ends of each of the flat heat pipes away from the condenser cavity extend into the inner cavity of the first communication plate, and communicate with the first communication plate. The inner cavities of the plates are connected.

As a preferred embodiment of the present invention, a first filling pipe is provided on the first communication plate, and the first filling pipe communicates with the inner cavity of the first communication plate.

As a preferred embodiment of the present invention, a second communication plate is further included, and the other end of each row of flat heat pipes passes through the condenser cavity and is fixedly connected to the second communication plate.

As a preferred embodiment of the present invention, the second connecting plate is further connected with a second filling pipe.

As a preferred embodiment of the present invention, the flat heat pipe includes a metal flat plate and at least one capillary structure inside the metal flat plate.

As a preferred embodiment of the present invention, the capillary structure is a microgroove or a capillary wick, and the length of the capillary structure is the same as that of the flat heat pipe.

As a preferred embodiment of the present invention, the microgroove capillary structure has a cross-sectional shape of rectangle, triangle, polygon, circle or a special-shaped structure with protrusions.

As a preferred embodiment of the present invention, fins are provided between the flat heat pipes.

As a preferred embodiment of the present invention, the flat heat pipe is glued or welded to the cavity of the condenser.

As a preferred embodiment of the present invention, the condenser cavity is flat, cylindrical, semi-cylindrical, V-shaped or arc-shaped, and each of the flat heat pipes is installed vertically or obliquely on the condenser cavity.

As a preferred embodiment of the present invention, there are at least two flat heat pipes, which are distributed in an array.

The present invention has the following beneficial effects:

In the condensing device of the present invention, a plurality of flat heat pipes are arranged on the condenser cavity, a part of each flat heat pipe is located in the condenser cavity, and the other part is exposed to the condenser cavity, and the condenser device can be welded as a whole The structure and the development process are simple. Since the wall thickness of the flat heat pipe is very thin, and the evaporation section is set inside the condenser cavity, it is directly in contact with the gas refrigerant, which can effectively reduce the heat transfer resistance; at the same time, the flat heat pipe replaces the traditional copper and aluminum fin structure, It can effectively improve the rib efficiency, and further increase the heat dissipation area by setting fins between the flat heat pipes; several flat heat pipes are connected to each other through the first connecting plate, and can be completed for all the flat heat pipes at one time through the first filling pipe. Working medium filling; in the heat dissipation process, the gas-liquid working medium can be automatically adjusted and balanced according to the local heat dissipation between the flat heat pipes, so that the condensing device can dissipate heat more efficiently.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic structural view of a flat heat pipe expansion type condensing device provided by an embodiment of the present invention;

Fig. 2 is a structural schematic diagram of another embodiment of the flat heat pipe expansion type condensing device provided by the embodiment of the present invention;

Fig. 3 is a structural schematic diagram of the condenser cavity of the flat heat pipe expansion type condensing device shown in Fig. 1;

4 is a schematic cross-sectional structural view of the first viewing angle of the flat heat pipe expansion type condensing device of FIG. 1;

Fig. 5 is a schematic cross-sectional structure diagram of a second viewing angle of the flat heat pipe expansion type condensing device of Fig. 1;

FIG. 6 is a schematic structural view of the first communication plate of the flat heat pipe expansion type condensing device shown in FIG. 1 .

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Referring to Fig. 1 and Fig. 3, an embodiment of the present invention provides a flat-plate heat pipe expansion type condensing device, which includes a condenser cavity 1, multiple rows of flat-plate heat pipes 2, an inlet pipe 12 and a liquid outlet pipe 13, wherein:

The condenser cavity 1 is provided with an air inlet and a liquid outlet. The gaseous refrigerant enters the condenser cavity 1 through the air inlet, and releases heat in the condenser cavity 1 to change into a liquid state. The refrigerating medium is led out from the liquid outlet, which can be an integral structure of one-time welding. The condensing device also includes a number of flat heat pipes 2, each of which can be filled with heat transfer medium, and the condenser cavity 1 is also provided with A plurality of assembly holes 111 corresponding to each flat heat pipe 2 one by one, each flat heat pipe 2 is installed in the corresponding assembly hole 111 and at least partly located in the condenser cavity 1, and the connection between the flat heat pipe 2 and the condenser cavity 1 The space is fixed by gluing or welding, the flat heat pipe 2 and the condenser cavity 1 are not connected to each other, the inlet pipe 12 and the liquid outlet pipe 13 are connected to the condenser cavity 1, specifically the inlet pipe 12 is connected to the air inlet , the liquid outlet pipe 13 communicates with the liquid outlet, that is, the gaseous refrigerant is introduced into the condenser cavity 1 through the inlet pipe 12, and is discharged from the liquid outlet pipe 13 after the heat exchange phase in the condenser cavity 1 changes into a liquid state. The condenser cavity 1 is provided with an inlet pipe 12 and a liquid outlet pipe 13, which can facilitate the connection and installation of the condensing device and the peripheral device.

In the present invention, the gaseous refrigerant in the condenser cavity 1 and the liquid heat transfer medium in the flat heat pipe 2 may be the same or different. The evaporating section is located in the condenser cavity 1, while the condensing section is located outside the condenser cavity 1. The gaseous refrigerant is introduced into the condenser cavity 1 from the inlet pipe 12, and the gaseous refrigerant is outside the evaporation section of the flat heat pipe 2. The gap between the surfaces flows and gradually cools down, and the gaseous refrigerant exchanges heat with the liquid heat transfer medium in the flat heat pipe 2, then the gaseous refrigerant releases heat and changes into a liquid state, which is discharged from the liquid outlet pipe 13, and at the same time, each plate The liquid heat transfer medium in the heat pipe 2 absorbs heat and changes into a gaseous state, while the gaseous heat transfer medium flows along the flat heat pipe 2. The gaseous heat transfer medium condenses into a liquid state during the flow process and releases heat to the surrounding environment. And the liquid heat transfer working medium reflows, and the liquid heat transfer working medium absorbs heat again and turns into a gaseous state. In this way, the circulating heat transfer working medium continuously undergoes phase change and circulation flow in the flat heat pipe 2, so that the whole flat heat pipe 2 is at a uniform temperature. state, so that the heat of the condensing device can be efficiently dissipated to the external environment. Since the wall thickness of the flat heat pipe 2 is very thin, and the evaporation section is set inside the condenser cavity 1, it is in direct contact with the gas refrigerant, which can effectively reduce the heat transfer resistance, and is combined with the condenser cavity 1 through the flat heat pipe 2 The structure can enhance the heat dissipation capacity of the condensing device, and at the same time improve the reliability of the condensing device. In addition, the flat heat pipe 2 is used to replace the traditional copper and aluminum fin structure, which can effectively improve the rib efficiency.

Referring to Figures 4-6, in a preferred embodiment of the present invention, the condensing device further includes a first communication plate 3, and the end of each flat heat pipe 2 away from the condenser cavity 1 extends into the inner cavity of the first communication plate 3, The two can be connected and fixed by welding or gluing, and each flat heat pipe 2 communicates with the inner cavity of the first communication plate 3 . In this embodiment, the flat heat pipes 2 are connected to each other through the first connecting plate 3, and the internal heat transfer medium can flow and adjust according to the pressure change, and the pressures in the inner cavities of all the flat heat pipes 2 are equal, that is, the flat heat pipes 2 The gas-liquid working medium can be automatically adjusted and balanced according to the local heat dissipation, so that the condensing device can dissipate heat more efficiently, and the heat transfer medium can be filled to each flat heat pipe 2 at one time through the connecting plate 3, which is more convenient.

Referring to Fig. 5 and Fig. 6, to optimize the above-mentioned embodiment, a first filling pipe 31 should be provided on the first connecting plate 3, and the first filling pipe 31 communicates with the inner cavity of the first communicating plate 3, and the first The filling pipe 31 fills the heat transfer medium into each flat heat pipe 2 . The structure of the first connecting plate 3 is refined. The first connecting plate 3 has a connecting cover plate 32 arranged towards the condenser cavity 1. The connecting cover plate 32 and the first connecting plate 3 enclose the above-mentioned inner cavity. The plate 32 is provided with a number of installation holes 321 corresponding to the flat heat pipes 2 one by one, and the end of the condensation section of each flat heat pipe 2 extends into the corresponding installation holes 321 of the cover plate 32 . Of course, in fact, the condenser cavity 1 is also provided with a condensation cover plate 11 structure, the condensation cover plate 11 is arranged opposite to the communication cover plate 32, and the condensation cover plate 11 and the condenser cavity 1 are enclosed to form a sealed inner space of the condensation cavity Each assembly hole 111 of the condenser cavity 1 is opened on the condensation cover plate 11 . Through the structure of the condensation cover plate 11 and the communication cover plate 32, it is mainly to facilitate the processing of the inner space of the condenser cavity 1 and the communication plate 3, and after the processing of the inner space of the two is completed, the condensation cover plate 11 and the communication cover plate 32 are installed and fixed on the condenser cavity 1 and the first communicating plate 3 respectively.

In another embodiment provided by the present invention, the condensing device also includes a second connecting plate (not shown in the figure), and the other end of each row of flat heat pipes 2 passes through the condenser cavity 1 and is fixedly connected to the second connecting plate. connected board. In this embodiment, the flat heat pipe 2, the first connecting plate 3 and the second connecting plate form an integral closed space, and this closed space passes through the condenser cavity 1, and the flat heat pipe is filled by the first filling pipe 31. 2. Internal vacuum pumping and filling working medium, simple structure, stable and reliable. Certainly, the structure of the second communication plate is similar to that of the first communication plate 3 , and it may also communicate with the second filling pipe.

Referring to Fig. 2, of course, in another embodiment, the condensing device is not provided with a connecting plate structure, and both ends of each flat heat pipe 2 are sealed, one end is located in the condenser cavity 1, and the other end is located in the condenser cavity Body 1 outside.

Referring to Fig. 4 and Fig. 5 again, in the preferred embodiment provided by the present invention, the outer surface of the flat heat pipe 2 is a planar structure, and the flat heat pipe 2 includes a metal flat plate and at least one capillary structure ( Not shown in the figure), the capillary structure is a microgroove or capillary core, the length of the capillary structure is the same as the length of the flat heat pipe 2, and the heat transfer working fluid circulates and transfers heat in the cavity of the capillary structure, and the capillary force of the capillary structure In combination with the adhesive force, the return velocity in each flat heat pipe 2 can be accelerated, thereby improving the heat conduction efficiency. For the capillary structure, it can be a microgroove or a capillary core, and the cross-sectional shape of the capillary structure is rectangular, triangular, polygonal, trapezoidal, circular or a special-shaped structure with protrusions, etc.

Referring to Fig. 1, optimize above-mentioned embodiment, be provided with fin (not shown among the figure) between flat heat pipe 2, fin and flat heat pipe 2 are welded, can increase the surface area of each flat heat pipe 2 by arranging fin, thereby can improve The heat dissipation area of each flat heat pipe 2 can dissipate heat to the surrounding environment through each fin, thereby improving the heat dissipation efficiency of each flat heat pipe 2, and can also strengthen the condensation effect of the condensation section of the flat heat pipe 2 through forced air cooling. The flat heat pipe 2 and the condenser cavity 1 may also be connected and fixed by welding, or by gluing.

Referring to Fig. 1-Fig. 3, the structure of the condenser cavity 1 is refined, which is flat as a whole, and each assembly hole 111 is opened on the upper surface of the condenser cavity 1, and each flat heat pipe 2 is installed vertically on the condenser. on the chamber body 1. The upper surface area of the condenser cavity 1 is relatively large. Specifically, the condenser cavity 1 is a flat cuboid structure, and more assembly holes 111 can be opened on the upper surface, that is, the condenser cavity 1 can be matched with A plurality of flat heat pipes 2 make the distribution of the flat heat pipes 2 similar to the fins of a traditional condenser, ensuring the cooling and heat exchange efficiency of the condenser cavity 1 . Usually, each flat heat pipe 2 can be distributed according to a certain rule, for example, it can be distributed in an array on the upper surface of the condenser cavity 1, and there is no contact between adjacent flat heat pipes 2, and there is a gap between them. According to this arrangement, not only The flat heat pipes 2 corresponding to the condenser cavity 1 can be evenly distributed, and the installation of the flat heat pipes 2 can be facilitated.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of the present invention. within the scope of protection.

Claims (12)

1. A flat heat pipe expansion type condensing device, characterized in that: it includes multiple columns of flat heat pipes, a condenser cavity, an air inlet pipe and a liquid outlet pipe, wherein: the condenser cavity is provided with an air inlet and a liquid outlet The condenser cavity is also provided with a number of assembly holes corresponding to each of the flat heat pipes, and each of the flat heat pipes is installed at the corresponding assembly hole and at least partly located in the condenser. In the cavity, the flat heat pipe is not connected to the condenser cavity, and the air inlet pipe and the liquid outlet pipe are connected to the air inlet and the liquid outlet respectively. 2. The flat heat pipe expansion type condensing device according to claim 1, characterized in that: it also includes a first connecting plate, and each end of each of the flat heat pipes away from the condenser cavity extends into the first connecting plate The inner cavity of the first connecting plate communicates with the inner cavity of the first communication plate. 3. The flat heat pipe expansion type condensing device as claimed in claim 2, characterized in that: the first connecting plate is provided with a first filling pipe, and the first filling pipe is connected to the first connecting plate. The lumen is connected. 4. The flat heat pipe expansion type condensing device according to claim 1, further comprising a second connecting plate, the other end of each row of the flat heat pipes passes through the condenser cavity and is fixedly connected to the condenser cavity. on the second connected board. 5 . The flat heat pipe expansion type condensing device according to claim 4 , wherein a second filling pipe is communicated with the second connecting plate. 5 . 6 . The flat heat pipe expansion type condensing device according to claim 1 , wherein the flat heat pipe comprises a metal flat plate and at least one capillary structure inside the metal flat plate. 7 . 7 . The flat heat pipe expansion type condensing device according to claim 6 , wherein the capillary structure is a microgroove or a capillary wick, and the length of the capillary structure is the same as that of the flat heat pipe. 8 . The flat heat pipe expansion type condensing device according to claim 7 , wherein the cross-sectional shape of the capillary structure of the microgroove is rectangular, triangular, polygonal, trapezoidal, circular or a special-shaped structure with protrusions. 9 . The flat heat pipe expansion type condensing device according to claim 1 , wherein fins are arranged between the flat heat pipes. 10. The flat heat pipe expansion type condensing device according to claim 1, characterized in that: said flat heat pipe is glued or welded to said condenser cavity. 11. The flat-plate heat pipe expansion type condensing device according to claim 1, characterized in that: the condenser cavity is flat, cylindrical, semi-cylindrical, V-shaped or arc-shaped, and each of the flat heat pipes They are installed vertically or obliquely on the condenser cavity. 12. The flat-plate heat pipe expansion type condensing device according to claim 1, wherein there are at least two flat-plate heat pipes arranged in an array.