CN107044745A - Micro-channel condenser - Google Patents

Abstract

In the microchannel condenser provided by the present invention, the left and right ends of each microchannel condensing pipeline are respectively fixedly connected to the first header and the second header arranged in parallel, and each row of flat heat pipes is arranged between the microchannel condensing pipelines , one end of each row of flat heat pipes is fixedly connected to the first connecting plate, and the inlet pipe and the liquid outlet pipe are all connected with one of the first header and the second header; respectively connected with the first header and the second header connected to each other, the first filling pipe is fixedly arranged on the first connecting plate, the structure of the above-mentioned microchannel condenser can be completed by one-time welding, and the preparation process is simple; in addition, the traditional copper and aluminum fin structures are replaced by flat heat pipes, and at the same time , because the flat heat pipes are connected to each other through the first connecting plate and the second connecting plate, all the flat heat pipes can be filled with working medium at one time through the filling pipe. The gas-liquid working medium is automatically adjusted and balanced, thus effectively improving the heat dissipation efficiency.

Description

A Microchannel Condenser

technical field

The invention relates to the technical field of air cooling and heat dissipation, in particular to a microchannel condenser.

Background technique

At present, the condenser in the refrigeration system is generally a coil condenser. A number of aluminum sheets or copper sheets are placed on the outside of the coil to form fins, and the heat is taken away by forced air cooling. Another kind of condenser is made of many parallel-flow aluminum tubes, and corrugated fins are arranged between adjacent parallel-flow aluminum tubes to form a micro-channel condenser. During the heat transfer process, the gaseous working medium condenses and releases heat in the condensing pipe, and the heat is transferred to the external fins through the condensing pipe wall, and the heat is dissipated to the outside through the convective heat exchange between the fins and the air.

The condensation heat transfer coefficient in the condensing pipeline and the convective heat transfer coefficient between the fins and the air have an important influence on the overall heat transfer performance of the condenser. Usually the heat dissipation fins are very thin, limited by the efficiency of the ribs, the height of the fins should not be too large, there is a large temperature difference between the base and the end of the existing fins, if you want to improve the heat dissipation capacity, you can only increase the number of fins and the length of the condensing line , so that the area of the condenser is continuously increased in the plane direction to meet the heat dissipation requirements. In order to improve the cooling capacity of the condenser, it is necessary not only to increase the condensation heat transfer coefficient and heat transfer area, but also to increase the heat dissipation area of the fins and improve the efficiency of the ribs of the fins.

The heat pipe is a highly efficient phase change heat transfer device with excellent temperature uniformity and is called a superconductor of heat. Using the heat pipe to expand the heat dissipation of the condenser will greatly improve and enhance the heat dissipation performance of the condenser. In the invention patent with the application number 201710020541.4 and the name "Microchannel Condenser", the applicant provided a microchannel condenser device that uses flat heat pipes for extended heat dissipation. The microchannel structure is used as the condensation pipeline, and several flat panels The heat pipe is bonded or welded together with the outer surface of the microchannel condensing pipeline, and the fin structure is replaced by a flat heat pipe to increase the heat dissipation area of the condenser and improve the rib efficiency. Although the microchannel condenser can effectively improve heat dissipation efficiency, each flat heat pipe is an independent entity and needs to be filled separately, and then the flat heat pipe and the microchannel pipeline are assembled and fixed, and the entire production process is relatively complicated.

Contents of the invention

Based on this, it is necessary to provide a micro-channel condenser with high heat dissipation efficiency and simple assembly for the defects of the prior art.

To achieve the above object, the present invention adopts the following technical solutions:

A microchannel condenser, comprising: multi-row flat heat pipes, multiple microchannel condensing pipelines, a first header, a second header, a first connecting plate, an air inlet pipe, a liquid outlet pipe and a first filling pipe, in:

The first header and the second header are arranged in parallel, and the left and right ends of each microchannel condensation pipeline are respectively fixedly connected to the first header and the second header, and each row of the flat heat pipes It is arranged between the microchannel condensing pipelines, and one end of each row of the flat heat pipes is fixedly connected to the first connecting plate, and the inlet pipe and the liquid outlet pipe are connected with the first header and the second pipe. One of the two headers is connected; or, the inlet pipe and the liquid outlet pipe are respectively connected with the first header and the second header, and the first filling pipe is fixedly arranged in the first connection board.

As a preferred embodiment of the present invention, the flat heat pipe includes a metal flat plate and at least one capillary structure inside the metal flat plate.

As a preferred embodiment of the present invention, the capillary structure is a microgroove or a capillary wick, and the length of the capillary structure is the same as that of the flat heat pipe.

As a preferred embodiment of the present invention, the cross-sectional shape of the capillary structure is a square, a circle or a special-shaped structure with protrusions.

As a preferred embodiment of the present invention, the shape of each of the micro-channel condensation lines is flat and long, and each of the micro-channel condensation lines is provided with a plurality of condensation micro-channels.

As a preferred embodiment of the present invention, a plurality of microchannel condensing pipes are arranged side by side at equal intervals, and the interval is equal to the thickness of each row of flat heat pipes.

As a preferred embodiment of the present invention, each row of flat heat pipes arranged between two adjacent microchannel condensation lines includes at least two flat heat pipes.

As a preferred embodiment of the present invention, fins are provided between each of the flat heat pipes.

As a preferred embodiment of the present invention, both ends of the first header and the second header are provided with end caps.

As a preferred embodiment of the present invention, the microchannel condenser further includes a second connecting plate, the other end of each row of flat heat pipes is fixedly connected to the second connecting plate, and the first connecting plate and the second connecting plate Mounting holes for flat heat pipes are provided on the two connecting plates.

As a preferred embodiment of the present invention, the second connecting plate is further connected with a second filling pipe.

The present invention adopts the beneficial effect of above-mentioned technical scheme to be:

In the microchannel condenser provided by the present invention, the first header and the second header are arranged in parallel, and the left and right ends of each microchannel condensation pipeline are respectively fixedly connected to the first header and the second header. header, each row of the flat heat pipes is arranged between the microchannel condensation pipelines, and one end of each row of the flat heat pipes is fixedly connected to the first connecting plate, the inlet pipe and the liquid outlet pipe are both It communicates with one of the first header and the second header; or, the inlet pipe communicates with the liquid outlet pipe respectively the first header and the second header, and the first filling pipe Fixedly arranged on the first connecting plate, the structure of the microchannel condenser can be completed by one-time welding, and the preparation process is simple; in addition, the microchannel condenser provided by the present invention replaces traditional copper and aluminum fins with flat heat pipes At the same time, since the flat heat pipes are connected to each other through the first connecting plate and the second connecting plate, all the flat heat pipes can be filled with working medium at one time through the filling pipe. During the heat dissipation process, the flat heat pipes can The gas-liquid working medium is automatically adjusted and balanced according to the size of the volume, thus effectively improving the heat dissipation efficiency.

In addition, the micro-channel condenser provided by the present invention, because the flat heat pipe and the micro-channel condensing pipeline are both planar structures, and the wall thickness is very thin, the contact area is large, and they are integrated by welding, which can effectively reduce the thermal resistance of heat transfer , and through the combination of the flat heat pipe and the microchannel pipeline, the heat dissipation capacity of the microchannel condenser can be enhanced, and the reliability of the microchannel condenser can be improved at the same time; at the same time, the present invention uses the microchannel structure as the condensation pipeline, which can improve the internal temperature of the pipeline. The heat transfer area and condensation heat transfer coefficient make the structure of the condensation pipeline more compact.

Description of drawings

Figure 1 is a schematic diagram of the structure of a flat heat pipe extended microchannel condenser.

Figure 2 is the right side view of the flat heat pipe extended microchannel condenser.

Fig. 3 is a schematic diagram of a cross-sectional structure of a microchannel condensation pipeline.

Fig. 4 is a schematic diagram of a cross-sectional structure of a microchannel condenser.

Fig. 5 is a schematic structural diagram of the second connecting plate.

Fig. 6 is a schematic diagram of the structure of the flat heat pipe.

Among them: 1. Flat heat pipe, 2. Microchannel condensation pipeline, 3. First header, 4. Second header, 5. First connecting plate, 6. Second connecting plate, 7. Intake pipe, 8. Outlet pipe, 9, end cap, 10, first filling pipe, 11, fins, 12, condensing microchannel, 13, first communicating chamber, 14, second communicating chamber, 15, inner cavity of heat pipe, 16, Heat pipe mounting holes.

detailed description

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

As shown in Fig. 1-Fig. 2, the microchannel condenser of one embodiment of the present invention comprises: multi-column flat heat pipe 1, multiple microchannel condensing pipelines 2, first header 3, second header 4, the first A connecting plate 5 , an air inlet pipe 7 , a liquid outlet pipe 8 and a first filling pipe 10 . in:

The first header 3 and the second header 4 are arranged in parallel, and the left and right ends of each of the microchannel condensation pipelines 2 are respectively fixedly connected to the first header 3 and the second header 4, each The flat heat pipes 1 in the rows are arranged between the microchannel condensation pipelines 2, and one end of the flat heat pipes 1 in each row is fixedly connected to the first connecting plate 5, and the air inlet pipe 7 and the liquid outlet pipe All 8 communicate with one of the first header 3 and the second header 4; or, the inlet pipe 7 communicates with the first header 3 and the second header 4 of the liquid outlet pipe 8 respectively , the first filling pipe 10 is fixedly arranged on the first communicating plate 5 .

It can be understood that, in the present invention, when one end of each row of flat heat pipes 1 is fixedly connected to the first communication plate 5 , the other end of each flat heat pipe 1 is independently sealed.

In an embodiment provided by the present invention, the microchannel condenser further includes a second communication plate 6 , and the other end of each row of the flat heat pipes 1 is fixedly connected to the second communication plate 6 . It can be understood that in the microchannel condenser provided by the present invention, since the flat heat pipe 1, the first connecting plate 5 and the second connecting plate 6 form an integral closed space, the inside of the flat heat pipe 1 is evacuated and Filled with working fluid, simple structure, stable and reliable.

Further, a second filling pipe (not shown) may also communicate with the second communicating plate 6

Please refer to FIG. 3 , which is a schematic structural diagram of a flat heat pipe provided by a preferred embodiment of the present invention.

Preferably, the outer surface of the flat heat pipe 1 is a planar structure, and the flat heat pipe 1 includes a metal flat plate and at least one capillary structure opened inside the metal flat plate, the capillary structure is a microgroove or a capillary wick, and the length of the capillary structure is the same as that of the flat heat pipe. 1 have the same length, the heat transfer medium circulates in the cavity of the capillary structure to transfer heat.

Further, the cross-sectional shape of the capillary structure is a square, a circle or a special-shaped structure with protrusions.

Further, fins 11 are arranged between the flat heat pipes 1 , and the fins 11 are welded to the flat heat pipes 1 .

Specifically, one end of the flat heat pipe 1 extends between two adjacent microchannel condensing pipelines 2, the extended part of the flat heat pipe 1 is assembled and welded with the second connecting plate 6, and the other end of the flat heat pipe 1 communicates with the first connecting plate 6. Plate 5 is assembled and soldered.

It can be understood that the structure of the above-mentioned microchannel condenser can be completed by one-time welding, the preparation process is simple, and the traditional copper and aluminum fin structures are replaced by flat heat pipes. The connecting plates are connected to each other, and all the flat heat pipes can be filled with working fluid at one time through the filling pipe. During the heat dissipation process, the flat heat pipes can automatically adjust and balance the gas-liquid working fluid according to the local heat dissipation, thus effectively improving the heat dissipation. efficiency.

Please refer to FIG. 4 , which is a schematic structural diagram of a microchannel condensation pipeline provided by a preferred embodiment of the present invention.

Preferably, each of the micro-channel condensing lines 2 is shaped as a flat strip, and each of the micro-channel condensing lines is provided with a plurality of condensing micro-channels.

Further, a plurality of microchannel condensation pipelines 2 are arranged side by side at equal intervals, and the interval thereof is equal to the thickness of the flat heat pipe 1 . It can be understood that the two ends of the microchannel condensation pipeline 2 go deep into the first header 3 and the second header 4 , and are assembled and welded with the first header 3 and the second header 4 .

Further, the inside of the microchannel condensation pipeline 2 is provided with a plurality of condensation microchannels 12, thereby realizing that the first manifold 3 and the second manifold 4 communicate with the plurality of microchannel condensation pipelines 2, so that the multiple microchannels Condensation pipeline 2 and first header 3, second header 4, inlet pipe 7, and liquid outlet pipe 8 form refrigerant flow and condensation passages. It can be understood that the present invention uses a microchannel structure as a condensation pipe, which can improve the efficiency of the pipe. The heat transfer area and condensation heat transfer coefficient inside the circuit make the structure of the condensation circuit more compact.

Preferably, each row of flat heat pipes arranged between two adjacent microchannel condensation lines 2 includes at least two flat heat pipes 1 . It can be understood that several flat heat pipes 1 form a two-dimensional array and are assembled with the microchannel condensation pipeline 2. The area where the flat heat pipe 1 contacts the microchannel condensation pipeline 2 is the evaporation area, and the other areas are condensation areas. The condensation area of the flat heat pipe 1 is cooled.

It can be understood that since the flat heat pipe and the microchannel condensing pipeline are both planar structures, and the wall thickness is very thin, the contact area is large, and they are integrated by welding, which can effectively reduce the heat transfer resistance, and through the flat heat pipe and the microchannel The combined structure of pipelines can enhance the heat dissipation capacity of the micro-channel condenser, and meanwhile improve the reliability of the micro-channel condenser.

Please refer to FIG. 5 , which is a schematic diagram of the vertical cross-sectional structure of the microchannel condenser provided by the present invention.

It can be seen from Fig. 5 that the first communicating plate 5 and the second communicating plate 6 are respectively provided with a first communicating chamber 13 and a second communicating chamber 14, which communicate with the heat pipe inner chamber 15, so that the flat heat pipe 1, the second communicating chamber The first connecting plate 5 and the second connecting plate 6 form an integral closed space, and the inside of the flat heat pipe 1 is evacuated and filled with working fluid through the first filling pipe 10 .

Please refer to FIG. 6 , which is a schematic structural diagram of the first connecting plate or the second connecting plate. It can be seen from FIG. 6 that heat pipe assembly holes 16 are provided on the first communication plate 5 and the second communication plate 6 for assembling with the ends of the flat heat pipe 1 .

When the above-mentioned microchannel condenser is working, the gaseous refrigerant flows into the first header 3 from the condenser inlet 7, and then disperses and flows into each microchannel condensation pipeline 2. During the process of flowing through the microchannel condensation pipeline 2, The gaseous working medium condenses into liquid and releases heat to the tube wall; the condensed liquid continues to flow forward and flows out of the microchannel condensation pipeline 2, collects in the second header 4, and finally flows out of the condenser through the liquid outlet pipe 8.

It can be understood that the heat released by the refrigerant during the condensation process is transferred to the tube wall of the flat heat pipe 1 in contact with it through the tube wall of the microchannel condensation pipeline 2 in a heat conduction manner, and then transferred to the inside of the flat heat pipe 1 . The liquid heat transfer medium in the flat heat pipe 1 undergoes a phase change and absorbs heat after being heated, and evaporates into a gaseous state. The gaseous heat transfer medium flows along the gas channel in the cavity to the condensation area of the flat heat pipe 1 . The gaseous heat transfer medium condenses into a liquid state in the condensation area of the flat heat pipe 1 and releases heat at the same time. The liquid heat transfer medium flows back to the evaporation area along the capillary structure, and the released heat is taken away by the cold air and dissipated into the surrounding environment. Since the two ends of the flat heat pipe 1 are communicated through the first connecting plate 5 and the second connecting plate 6, when the heat dissipation of the local microchannel condensation pipeline 2 is not uniform with the heat dissipation of the microchannel condensation pipeline 2 at other positions, the gap between the flat heat pipe 1 It can automatically adjust the internal gas-liquid balance according to the size of the local heat dissipation. The heat transfer medium continuously undergoes phase change and circulation in the flat heat pipe 1, so that the whole flat heat pipe 1 is in a uniform temperature state, so that the heat of the condenser can be efficiently dissipated to the external environment.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (11)

1. a kind of micro-channel condenser, it is characterised in that including：Multiple row flat-plate heat pipe, many microchannel condenser pipes, the first collection Pipe, the second collector, the first through plate, air inlet pipe, drain pipe and the first filling tube, wherein：

First collector and the second collector are be arranged in parallel, and the left and right ends of the every microchannel condenser pipe are fixed respectively First collector and the second collector are connected to, flat-plate heat pipe described in each column is arranged between the microchannel condenser pipe, and One end of flat-plate heat pipe described in each column is fixedly connected on first through plate, and the air inlet pipe and drain pipe are with described One in one collector and the second collector is connected；Or, the air inlet pipe and the drain pipe respectively with the first collector and the Two collectors are connected, and first filling tube is fixedly installed on first through plate.

2. micro-channel condenser according to claim 1, it is characterised in that the flat-plate heat pipe include metallic flat board and It is opened at least one capillary structure inside the metallic flat board.

3. micro-channel condenser according to claim 2, it is characterised in that the capillary structure is microflute or capillary wick, The length of the capillary structure is identical with the length of the flat-plate heat pipe.

4. micro-channel condenser according to claim 3, it is characterised in that the cross sectional shape of the capillary structure is side Shape, circle or the polymorphic structure with projection.

5. micro-channel condenser according to claim 1, it is characterised in that the shape of the every microchannel condenser pipe Inside for flat strip, and the every microchannel condenser pipe is provided with multiple condensation microchannels.

6. micro-channel condenser according to claim 1, it is characterised in that multiple microchannel condenser pipes are equidistant Arranged in parallel, its spacing is equal to the thickness of each column flat-plate heat pipe.

7. micro-channel condenser according to claim 6, it is characterised in that set between adjacent two microchannel condenser pipes The each column flat-plate heat pipe put includes at least two panels flat-plate heat pipe.

8. micro-channel condenser according to claim 7, it is characterised in that wing is provided between the every flat-plate heat pipe Piece.

9. micro-channel condenser according to claim 1, it is characterised in that the two ends of first collector and the second collector It is equipped with end cap.

10. micro-channel condenser according to claim 1, it is characterised in that the micro-channel condenser also includes second Through plate, the other end of flat-plate heat pipe described in each column is fixedly connected on second through plate, and first through plate and Flat-plate heat pipe pilot hole is offered on second through plate.

11. micro-channel condenser according to claim 10, it is characterised in that is also communicated with second through plate Two filling tubes.