CN109595960B - Thermosiphon radiator - Google Patents
Thermosiphon radiator Download PDFInfo
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- CN109595960B CN109595960B CN201710940005.6A CN201710940005A CN109595960B CN 109595960 B CN109595960 B CN 109595960B CN 201710940005 A CN201710940005 A CN 201710940005A CN 109595960 B CN109595960 B CN 109595960B
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- 239000007788 liquid Substances 0.000 claims abstract description 47
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 238000005192 partition Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 238000013461 design Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract 3
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明提供了一种热虹吸散热装置，包括蒸发器，蒸发器的内腔在竖直方向自上而下依次被分隔成多个互不连通的子腔体，形成多个子蒸发器，每个子蒸发器的子腔体均通过汽管和液管连通至少一位置在其上部的冷凝器，相互连通的子蒸发器、冷凝器、汽管以及液管内抽真空后充注有工质工作时，每个子蒸发器吸收热源热量后将其内工质汽化，汽化后的工质经汽管到达与其连通的冷凝器而被放热冷凝后，再经液管回流到子蒸发器，形成多个子热虹吸散热回路。该热虹吸散热装置，大幅度减少冷凝器占用蒸发器之上高度空间，拓展了热虹吸散热系统的应用范围和优势。
The present invention provides a thermosiphon heat dissipation device, including an evaporator, wherein the inner cavity of the evaporator is divided into a plurality of mutually unconnected sub-cavities from top to bottom in the vertical direction, forming a plurality of sub-evaporators, wherein the sub-cavities of each sub-evaporator are connected to at least one condenser located above it through a steam pipe and a liquid pipe, and when the mutually connected sub-evaporators, condensers, steam pipes, and liquid pipes are evacuated and filled with working fluid, each sub-evaporator absorbs heat from a heat source and vaporizes the working fluid therein, and the vaporized working fluid reaches the condenser connected thereto through the steam pipe and is condensed by releasing heat, and then flows back to the sub-evaporator through the liquid pipe, forming a plurality of sub-thermosiphon heat dissipation circuits. The thermosiphon heat dissipation device greatly reduces the height space occupied by the condenser above the evaporator, and expands the application scope and advantages of the thermosiphon heat dissipation system.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a thermosiphon heat dissipation device.
Background
As shown in fig. 1, a conventional thermosiphon heat sink generally includes an evaporator 1a, a condenser 2a, and a vapor pipe 3a and a liquid pipe 4a that communicate the evaporator 1a and the condenser 2a, and a hollow circuit formed by these communicating components is filled with a working medium. After the evaporator 1a absorbs heat of a heat source, the internal working medium is boiled and vaporized, the internal working medium enters the condenser 2a through the steam pipe 3a, the condenser 2a releases heat to other mediums (such as air or secondary refrigerant) and then the internal vaporized working medium is condensed into liquid state, and the liquid working medium flows back to the evaporator 1a through the liquid pipe 4a, so that the circulation is continued, and the continuous transmission and emission of heat flow of the heat source are realized.
Because the condenser of the thermosiphon heat sink depends on gravity for reflux, the flow direction of the working medium must be unidirectional and flow from high to low, and the flow direction cannot be folded back against the gravity direction, and these characteristics determine that the condenser of the thermosiphon heat sink occupies a significant height space.
The thermosiphon heat sink, which works based on the thermosiphon principle, is structured to meet the condition that the condenser 2a must be higher than the evaporator 1a, i.e. the condenser 2a needs to be disposed above the evaporator 1 a. In the thermosiphon heat sink, therefore, the condenser 2a needs to occupy a space above the evaporator 1 a. This results in the problem that the entire thermosiphon heat sink is excessively high, and the space above the evaporator 1a is not fully utilized. This problem is more pronounced in the case of a larger heat source heat consumption of the evaporator 1a, because the larger the heat source heat consumption, the larger the condenser 2a size, which occupies a larger height requirement.
Disclosure of Invention
The invention aims to solve the problems that in the thermosiphon heat dissipation device in the prior art, a condenser occupies excessive height space above an evaporator, so that the whole height of the thermosiphon heat dissipation device is too large, and the space above the thermosiphon heat dissipation device cannot be fully utilized.
In order to solve the technical problems, the invention provides a thermosiphon heat dissipation device, which comprises an evaporator, wherein the inner cavity of the evaporator is sequentially divided into a plurality of sub-cavities which are not communicated with each other from top to bottom in the vertical direction to form a plurality of sub-evaporators, the sub-cavities of each sub-evaporator are communicated with at least one condenser at the upper part of the sub-cavities through a steam pipe and a liquid pipe, and the sub-evaporators, the condensers, the steam pipe and the liquid pipe which are communicated with each other are vacuumized and then filled with working media;
When the heat source evaporator works, each sub-evaporator absorbs heat of a heat source and then evaporates the working medium therein, the evaporated working medium reaches a condenser communicated with the steam pipe through the steam pipe to be subjected to heat release and condensation, and then flows back to the sub-evaporator through the liquid pipe to form a plurality of sub-thermosiphon heat dissipation loops.
And the condensers on the evaporator are sequentially arranged into a plurality of layers in the height direction.
And the adjacent two condensers of the thermosiphon heat dissipation device are arranged in a V shape to form an included angle which is open towards the non-vertical direction.
And the condensers of all layers except the top layer of the thermosiphon heat dissipation device are positioned on the side face of the evaporator.
And the condensers on the evaporators are sequentially arranged along the horizontal direction, and all or part of other condensers except the condenser corresponding to the top sub-evaporator are positioned on the side surface of the evaporator.
And the thermosiphon heat dissipation device is characterized in that two adjacent condensers are spaced, and a baffle is arranged between the two adjacent condensers.
The heat siphon heat dissipation device is characterized in that the condenser is a parallel flow heat exchanger, and the parallel flow heat exchanger comprises an upper collecting pipe, a lower collecting pipe and a plurality of flat pipes which are arranged between the upper collecting pipe and the lower collecting pipe at intervals in parallel, wherein each flat pipe is communicated with the collecting pipe connected with the flat pipe, the liquid pipe is communicated with the lower collecting pipe, and the steam pipe is communicated with the upper collecting pipe.
The evaporator is provided with a heat absorbing surface which is in contact with a heat dissipating object, and the heat absorbing surface is vertical.
The liquid pipe and the steam pipe are welded at the open pore of the evaporator or the condenser of the heat siphon heat radiator through the adapter, the adapter is a metal part, through holes which are communicated with each other are formed in the first main surface and the second main surface which penetrate through the adapter, the shape of the first main surface is matched with the welding joint surface of the heat siphon heat radiator, the liquid pipe or the steam pipe is inserted into the through holes from the second main surface and welded, and the aperture of the through holes in the second main surface is larger than that of the first main surface.
The liquid pipe and the steam pipe are welded at the opening of the evaporator or the condenser of the heat-siphon heat-radiating device through the adapter, the adapter is a metal part, holes formed in the two mutually perpendicular first main surfaces and the second main surfaces of the adapter are crossed and communicated with each other, the shape of the first main surface is matched with the welding joint surface of the heat-siphon heat-radiating device, the liquid pipe or the steam pipe is inserted into the through hole from the second main surface and welded, the holes formed in the second main surface are designed in a variable diameter mode, and the aperture of the holes is reduced in the part.
According to the technical scheme, the beneficial effects of the invention are as follows:
the invention divides the single evaporator into a plurality of independent sub-evaporators, the heat source heat consumption distributed on the single sub-evaporator is only a part of the whole evaporator which is divided, and the size requirement of the corresponding condenser is greatly reduced, so that the height space occupied by the condenser is obviously reduced on the premise that the heat source distribution and the heat consumption are unchanged on the whole evaporator.
Because the invention only requires the sub-thermosiphon heat dissipation loop to satisfy the thermosiphon principle, i.e. the condenser is positioned above the sub-evaporator communicated with the sub-evaporator, the invention can break through the limitation condition that the condenser must be totally higher than the single evaporator, i.e. one condenser can be positioned at the side of the evaporator without being partially or totally higher than the evaporator, thereby the height space of the condenser occupying the upper part of the single evaporator is obviously reduced.
Drawings
Fig. 1 is a schematic structural view of a prior art thermosiphon heat sink.
Fig. 2 is a schematic structural diagram of an embodiment 1 of a thermosiphon heat dissipating device according to the present invention.
Fig. 3 is a perspective view of fig. 2.
Fig. 4 is a schematic structural view of one of the adaptor bases.
Fig. 5 is a schematic structural view of another adapter.
Fig. 6 is a schematic structural diagram of a third adapter.
Fig. 7 is a schematic structural diagram of an embodiment 2 of a thermosiphon heat dissipating device according to the present invention.
Fig. 8 is a schematic structural diagram of an embodiment 3 of a thermosiphon heat dissipating device of the present invention.
The reference numerals are as follows, 1a, evaporator, 2a, condenser, 3a, steam pipe, 4a, liquid pipe, 1, thermosiphon heat dissipation device, 11, evaporator, 12, sub thermosiphon heat dissipation loop, 111, sub evaporator, 121, condenser, 1211, collecting pipe, 1212, flat pipe, 122, liquid pipe, 123, steam pipe, 13, liquid filling pipe, 15, adapter, 14, mounting hole, 16 and baffle.
Detailed Description
Exemplary embodiments that embody features and advantages of the present invention will be described in detail in the following description. It will be understood that the invention is capable of various modifications in various embodiments, all without departing from the scope of the invention, and that the description and illustrations herein are intended to be by way of illustration only and not to be construed as limiting the invention.
For the purpose of further illustrating the principles and structure of the present invention, preferred embodiments of the invention will now be described in detail with reference to the accompanying drawings.
Example 1.
Referring to fig. 2 and 3, the present embodiment provides a thermosiphon heat dissipation device 1, which can be used to achieve heat transfer and heat dissipation. The thermosiphon heat dissipation device 1 comprises an evaporator 11, wherein a horizontal partition plate is arranged in an inner cavity of the evaporator 11, a dashed line in fig. 2 indicates the position of the partition plate, the partition plate divides the inner cavity of the evaporator into two sub-cavities which are not communicated with each other and are distributed up and down to form a plurality of sub-evaporators 111, the cavity of each sub-evaporator 111 is communicated with at least one condenser 121 through a steam pipe 123 and a liquid pipe 122, one end of the condenser 121 is communicated with a liquid inlet of the sub-evaporator 111 matched with the condenser through the liquid pipe 122, and the other end of the condenser 121 is communicated with an air outlet of the sub-evaporator through the steam pipe 123. The sub-evaporator 111, the condenser 121, the steam pipe 123 and the liquid pipe 122 which are communicated with each other are filled with working medium after being vacuumized.
In operation, the working medium in each sub-evaporator 111 is vaporized after absorbing heat of a heat source, the vaporized working medium reaches a condenser 121 communicated with the sub-evaporator 111 through a steam pipe 123 for heat release and condensation, and the condensed working medium flows back to the sub-evaporator 111 of the evaporator 11 through a liquid pipe 122 to form a plurality of independent sub-thermosiphon heat dissipation loops 12.
On the premise of keeping the heat absorption surface area or the heat dissipation capacity of the evaporator 11 unchanged, the heat source heat consumption born by each sub-evaporator 111 is only a part of the whole evaporator 11, and the size requirement, particularly the length size, of the corresponding condenser 121 is greatly reduced, so that the height space occupied by the condenser 121 is greatly reduced on the premise of keeping the heat source distribution and the heat consumption unchanged on the whole evaporator 11. In this embodiment, the condensers 121 of the other layers except the top layer are all located on the side of the evaporator 11, so that the lower layer condenser 121 does not occupy the height space above the evaporator 11 except the uppermost condenser 121, and at the same time, since the size of each condenser 121 is reduced, the height of the uppermost condenser 121 above the evaporator 11 is also reduced, so that the height space above the evaporator 11 is not excessively occupied, and the overall height of the thermosiphon heat dissipation device 1 is prevented from being excessively large.
Based on the working principle of thermosiphon heat dissipation, in the present embodiment, the condenser 121 is higher than the sub-evaporator 111 that is connected to the condenser, and the air outlet on the same sub-evaporator 111 is higher than the liquid inlet. Meanwhile, in order to ensure the pressure balance in the thermosiphon circuit, gravity is needed to counteract the resistance of the working medium flowing in the condenser 121, so that the communication position between the same condenser 121 and the liquid pipe 122 is lower than the communication position between the same condenser 121 and the vapor pipe 123.
The height difference between the two communication positions of the condenser 121 and the liquid pipe 122 and the vapor pipe 123 is related to the heat source heat consumption of the corresponding sub-evaporator 111, and when the heat source heat consumption of the sub-evaporator 111 is small to a certain extent, the communication position of the condenser 121 and the liquid pipe 122 matched with the sub-evaporator 111 can be equal to be higher than the communication position of the condenser 121 and the vapor pipe 123. Preferably, when the heat source heat consumption of the uppermost sub-evaporator 111 in the evaporator 11 is small to a certain extent, the position of the condenser 121 communicated with the sub-evaporator 111, which is communicated with the liquid pipe 122, may be equal to the position of the condenser 121 communicated with the vapor pipe 123, and the condenser 121 communicated with the uppermost sub-evaporator 111 occupies substantially no or little height space above the evaporator 11.
In this embodiment, the evaporator 11 is divided into two sub-evaporators 111 arranged vertically by a horizontal partition plate. In practical application, the orientation and shape of the partition plate are not limited to this, and the partition plate may be inclined, even, the partition plate may be a non-flat plate, a non-regular plate, or any shape of partition plate, and the number of the partition plates is not limited to one, and may be plural, so long as the partition plate can divide the evaporator 11 into plural mutually independent sub-evaporators 111. For other types of evaporators, such as tube fin evaporators that absorb heat from air, tube spacers or the like are used to separate the evaporator chambers.
In this embodiment, the condenser 121 is a parallel flow heat exchanger, and the condenser 121 includes a pair of headers 1211 arranged in parallel and a plurality of flat tubes 1212 connected between the two headers 1211, where the plurality of flat tubes 1212 are arranged in parallel and spaced apart from each other. Each flat tube 1212 communicates with the header 1211 to which it is connected, the liquid tube 122 communicates with one of the headers 1211, and the vapor tube 123 communicates with the other header 1211. The two adjacent flat tubes 1212 of the parallel flow heat exchanger of the present invention may or may not have a secondary heat radiation fin for increasing the heat exchange area between the condenser 121 and the air.
The heat absorbing surface of the evaporator 11 in this embodiment is provided with mounting holes 14 for mounting heat components. The division of the evaporator 11 into a plurality of sub-evaporators 111 from the inside does not affect the layout convenience of the heat generating components mounted on the heat absorbing surface, and even the same heat generating component can be simultaneously mounted on the upper and lower sub-evaporators 111, the heat consumption of which is absorbed by both sub-evaporators 111 at the same time. When the thermal element is installed on the evaporator 11, the thermal element is fastened through the installation holes 14, so that a thermal interface material arranged between the heat absorption surface of the evaporator 11 and the bottom surface of the thermal element can be pressed tightly.
As shown in fig. 2 and 3, in the present embodiment, the condensers 121 on the evaporator 11 are sequentially arranged in multiple layers in the height direction, and this arrangement is advantageous in saving space in the height direction, making the condenser 121 arrangement more compact. The adjacent two condensers 121 are arranged in a V shape to form an included angle which is open towards the non-vertical direction, an air driving device can be arranged at the opening, and the two adjacent condensers 121 can be subjected to forced air cooling at the same time.
In this embodiment, each sub-thermosiphon circuit 12 is filled with working medium through a filling pipe 13. The liquid filling pipe 13 is communicated with the corresponding sub-thermosiphon loop, and the corresponding sub-thermosiphon loop is vacuumized through the liquid filling pipe 13 before the working medium is filled. The liquid filling pipe 13 of the present embodiment is disposed on the header 1211 of the condenser 121 of each sub-thermosiphon circuit 12, and the end of the liquid filling pipe 13 is sealed to the outside after the completion of the filling of the working medium. In practical applications, the charging pipe 13 may be disposed at any position of the sub-thermosiphon heat dissipation circuit.
The liquid pipe 122 and the vapor pipe 123 in this embodiment are connected to the sub-evaporator 111 and the condenser 121 through the adapter 15.
Referring to fig. 2, 3, 4 and 5, the adaptor 15 is a metal part, through which through holes are formed on the first main surface 152 and the second main surface 151, the shape of the first main surface 152 is adapted to the welding joint surface of the thermosiphon heat dissipation device, the liquid pipe 122 or the vapor pipe 123 is inserted into the through hole 1511 from the second main surface 151 and welded, the aperture of the through hole 1511 on the second main surface 151 is larger than that on the first main surface 152, so that the through hole 1511 forms a step at the position of reducing, and the step is capable of automatically limiting the insertion of the pipe. When the adapter 15 is fixed on the heat absorbing surface of the evaporator 11 of the thermosiphon heat sink, the first main surface 152 of the adapter 15 adapted to the adapter is a plane, and when the adapter 15 is fixed on the upper and lower collecting pipes 1211 of the condenser 121 of the thermosiphon heat sink, the first main surface 152 of the adapter 15 adapted to the adapter is an arc surface matched with the collecting pipes.
In the adapter shown in fig. 4 and 5, the first main surface 152 and the second main surface 151 are opposite to each other, in other embodiments, the first main surface 152 and the second main surface 151 may be perpendicular to each other, as shown in fig. 6, the adapter is provided with a hole 1521 and a hole 1511 on the first main surface 152 and the second main surface 151 perpendicular to each other, the two holes 1521 and 1511 are crossed and communicated inside the adapter, the shape of the first main surface 152 is adapted to the welding joint surface of the thermosiphon heat dissipation device, the liquid pipe 122 or the vapor pipe 123 is inserted into the through hole from the second main surface 151 and welded, the hole formed on the second main surface 151 adopts a reducing design, and the aperture is reduced inside the part.
The access mode is easy to position the vapor pipe 123 and the liquid pipe 122, and the situation of solder blockage can not occur in sealing welding after positioning. The adapter 15 is welded in advance at the liquid inlet and the gas outlet of the evaporator 11 and at the opening of the header 1211 of the condenser 121, respectively.
In the present embodiment, the evaporator 11, the condenser 121, the vapor pipe 123, the liquid pipe 122, and the adapter 15 are all made of aluminum alloy.
Example 2.
Referring to fig. 7, the thermosiphon heat dissipating device 1 in this embodiment is substantially the same as that of embodiment 1, except that the condensers 121 of this embodiment are arranged in sequence in the horizontal direction. The condensers 121 are arranged in order in the horizontal direction in a manner suitable for the flow of the external air through the condensers 121 in the vertical direction and for the natural heat dissipation of the air flow from bottom to top.
On the premise of keeping the heat absorbing surface area or the heat dissipating capacity of the evaporator 11 unchanged, the heat source heat consumption born by each sub-evaporator 111 is only a part of the whole evaporator 11, so that the size of the condenser 121 communicated with each sub-evaporator 111 is greatly reduced, and meanwhile, the left condenser 121 is mostly not higher than the evaporator but is positioned on the side surface of the evaporator, so that the height space above the evaporator 11 is not excessively occupied, and the whole height of the thermosiphon heat dissipating device 1 is prevented from being excessively large.
Example 3.
Referring to fig. 8, in another preferred embodiment, unlike fig. 7, adjacent condensers 121 are spaced apart from each other, and baffles 16 are provided between adjacent condensers 121. The baffle 16 can prevent the hot air exhausted from the condenser 121 from affecting each other, and further ensure the heat dissipation effect of the thermosiphon heat dissipation device 1.
While the invention has been described with reference to several exemplary embodiments, it is to be understood that the terminology used is intended to be in the nature of words of description and of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.
Claims (10)
1. The thermosiphon heat dissipation device is characterized by comprising an evaporator, wherein a partition plate is arranged in an inner cavity of the evaporator, the inner cavity of the evaporator is sequentially divided into a plurality of sub-cavities which are not communicated with each other from top to bottom in the vertical direction, a plurality of sub-evaporators are formed, the sub-cavities of each sub-evaporator are communicated with at least one condenser at the upper part of the sub-cavities through a steam pipe and a liquid pipe, and working media are filled in the sub-evaporators, the condenser, the steam pipe and the liquid pipe which are communicated with each other after vacuumizing;
when the evaporator works, each sub-evaporator absorbs heat of a heat source and then evaporates the working medium in the sub-evaporator, the evaporated working medium reaches a condenser communicated with the steam pipe through the steam pipe to be subjected to heat release and condensation, and then flows back to the sub-evaporator through the liquid pipe to form a plurality of sub-thermosiphon heat dissipation loops;
The plurality of sub-evaporators at least comprise a lower-layer sub-evaporator positioned at the bottom and an upper-layer sub-evaporator positioned above the lower-layer sub-evaporator, wherein the side surface of the upper-layer sub-evaporator is correspondingly provided with an upper-layer condenser, and the side surface of the lower-layer sub-evaporator is correspondingly provided with a lower-layer condenser;
Wherein, at least part of the lower layer condenser is arranged in the space below the air outlet of the side face of the upper layer sub-evaporator and is arranged in the space above the air outlet of the side face of the corresponding sub-evaporator, so that part or all of the lower layer condenser can be arranged below the top face of the evaporator.
2. The thermosiphon heat sink of claim 1 wherein the condensers on the evaporator are arranged in a plurality of layers in sequence in the height direction.
3. The thermosiphon heat sink of claim 2 wherein adjacent condensers are arranged in a V-shape forming an angle that is open toward a non-up-down direction.
4. The thermosiphon heat sink of claim 2 wherein the other layers of condenser except the top layer are located on the sides of the evaporator.
5. The thermosiphon heat sink of claim 1, wherein the condensers on the evaporators are arranged in order in a horizontal direction, and all or part of the other condensers except the condenser corresponding to the top sub-evaporator are located at the side of the evaporator.
6. The thermosiphon heat sink of claim 5 wherein adjacent ones of the condensers are spaced apart from each other and a baffle is disposed between adjacent ones of the condensers.
7. The heat sink according to any one of claims 2,3,4, 5, and 6, wherein the condenser is a parallel flow heat exchanger, the parallel flow heat exchanger comprises an upper collecting pipe, a lower collecting pipe, and a plurality of flat pipes arranged between the upper collecting pipe and the lower collecting pipe at intervals in parallel, each flat pipe is communicated with the collecting pipe connected with the flat pipe, the liquid pipe is communicated with the lower collecting pipe, and the vapor pipe is communicated with the upper collecting pipe.
8. The thermosiphon heat sink of any one of claims 2,3,4, 5, 6 wherein the evaporator has a heat absorbing surface in contact with the object to be heat-dissipated, the heat absorbing surface being vertical.
9. The heat sink according to claim 1, wherein the liquid pipe and the vapor pipe are welded at the opening of the evaporator or the condenser of the heat sink through a adaptor, the adaptor is a metal part, through holes which are mutually communicated are formed in two opposite first main surfaces and second main surfaces of the adaptor, the shape of the first main surface is adapted to the welding joint surface of the heat sink, the liquid pipe or the vapor pipe is inserted into the through holes from the second main surface and welded, and the hole diameter of the through holes in the second main surface is larger than that of the first main surface.
10. The heat sink according to claim 1, wherein the liquid pipe and the vapor pipe are welded to the opening of the evaporator or the condenser of the heat sink through a adaptor, the adaptor is a metal part, the holes formed on the first main surface and the second main surface perpendicular to each other are crossed and communicated with each other, the shape of the first main surface is adapted to the welding joint surface of the heat sink, the liquid pipe or the vapor pipe is inserted into the through hole from the second main surface and welded, the hole formed on the second main surface adopts a reducing design, and the hole diameter is reduced inside the part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710940005.6A CN109595960B (en) | 2017-09-30 | 2017-09-30 | Thermosiphon radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710940005.6A CN109595960B (en) | 2017-09-30 | 2017-09-30 | Thermosiphon radiator |
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| Publication Number | Publication Date |
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| CN109595960A CN109595960A (en) | 2019-04-09 |
| CN109595960B true CN109595960B (en) | 2024-12-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111752359A (en) * | 2020-06-30 | 2020-10-09 | 联想(北京)有限公司 | Electronic equipment |
| CN113316361B (en) * | 2021-05-21 | 2022-08-12 | 浙江酷灵信息技术有限公司 | Thermosiphon heat sinks, systems and applications |
| CN115265238A (en) * | 2022-09-05 | 2022-11-01 | 深圳市禾望电气股份有限公司 | Thermosyphon heat exchanger and heat exchange core thereof |
| WO2025107228A1 (en) * | 2023-11-23 | 2025-05-30 | Telefonaktiebolaget Lm Ericsson (Publ) | Loop thermosyphon heat radiator and electronic device comprising the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204421708U (en) * | 2015-02-04 | 2015-06-24 | 董陈 | Thermosyphon heat dissipation device |
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| CN201547898U (en) * | 2009-07-03 | 2010-08-11 | 北京工业大学 | A separate thermal siphon cooling device with an air pump for machine rooms or cabinets |
| CN107003072A (en) * | 2014-11-11 | 2017-08-01 | 丹麦丹腾制冷股份公司 | Thermal siphon block and thermosiphon system for heat transfer |
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| CN204421708U (en) * | 2015-02-04 | 2015-06-24 | 董陈 | Thermosyphon heat dissipation device |
| WO2016179169A1 (en) * | 2015-05-04 | 2016-11-10 | Google Inc. | Cooling electronic devices in a data center |
| CN106524602A (en) * | 2016-11-11 | 2017-03-22 | 深圳智焓热传科技有限公司 | Two-phase flow heat-removal system |
| CN207247967U (en) * | 2017-09-30 | 2018-04-17 | 深圳智焓热传科技有限公司 | Thermosyphon heat dissipation device |
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