CN107353546A - A kind of epoxy resin composition for semiconductor encapsulation - Google Patents
A kind of epoxy resin composition for semiconductor encapsulation Download PDFInfo
- Publication number
- CN107353546A CN107353546A CN201710782706.1A CN201710782706A CN107353546A CN 107353546 A CN107353546 A CN 107353546A CN 201710782706 A CN201710782706 A CN 201710782706A CN 107353546 A CN107353546 A CN 107353546A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor encapsulation
- present
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 13
- 238000005538 encapsulation Methods 0.000 title claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 4
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 4
- -1 Polytetrafluoroethylene Polymers 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 8
- 229960004643 cupric oxide Drugs 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A kind of epoxy resin composition for semiconductor encapsulation of the present invention, its raw material and raw material weight percentage composition are as follows：Resin 40 50%；EMA 0.1 1%；Glass fibre 0.1 3%；Polyvinyl alcohol 0.1 3%；Butyl titanate 0.1 3%；Polytetrafluoroethylene (PTFE) 40 60%.Release property, continuously shaped property when the epoxy resin composition for semiconductor encapsulation of the present invention is to the cohesive of cupric oxide and shaping is excellent, if be packaged with the epoxy resin composition for semiconductor encapsulation to electronic units such as IC, LSI, semiconductor device excellent in reliability can be obtained.
Description
Technical field
The present invention relates to epoxy resin composition for semiconductor encapsulation.
Background technology
In package semiconductor assembling procedure, by being thermally compressed gold between the aluminium electrode of semiconductor chip and inner lead
Category line turns into main flow now come the method being electrically connected.In addition, in recent years along with the miniaturization of electronic device, lightweight,
The market trends of high performance, highly integrated, more pinizations of electronic unit develop year by year.It is it is therefore desirable to more more complicated than in the past
Wire bonding process, during using copper lead frame, due in 200~250 DEG C of condition of high temperature exposure for a long time, thus copper surface
Oxidation is more carried out.
Under this situation, even if the semiconductor sealing material that the conventional cohesive for unoxidized copper surface is excellent,
In the case of the different cupric oxide of surface state is also often adhesive poor, when mold is removed after resin-encapsulated so as to appear in,
The problem of causing stripping during reflow.
Insert for suppressing to peel off with the cohesive of encapsulating material resin is opposite with the release property for mould
Index, accordingly, there exist such issues that release property is poor, mouldability reduces if cohesive is improved.Using electronic unit
It is highly integrated and copper frame to be oxidized into the former of problem, in order to take into account cohesive and release property, it is proposed that addition aoxidizes poly- second
Method of the half ester compound of the copolymer of alkene wax and alhpa olefin and maleic acid as releasing agent.(referring for example to patent document 1,
2.) according to this method, although excellent to the cohesive and release property of unoxidized copper, due to and used OPE,
The problem of potting resin reduces to the cohesive of oxidized copper frame thus be present.Moreover, it is as short as carbon atom for alhpa olefin part
For the copolymer releasing agent (referring for example to patent document 3) of less than 25, (the demoulding of blow vent blocking etc. of continuously shaped property be present
Property) it is poor the problem of.
The content of the invention
The present invention be in view of the situation and complete, and release property good to the cohesive of cupric oxide, even to be provided
Continuous mouldability also excellent epoxy resin composition for semiconductor encapsulation.
The present inventor furthers investigate, as a result found, by semiconductor-sealing-purpose ring to solve above-mentioned problem repeatedly
It can reach above-mentioned purpose using specific releasing agent in epoxy resin composition, so far complete the present invention.
That is, the present invention is as follows：
A kind of epoxy resin composition for semiconductor encapsulation, its raw material and raw material weight percentage composition are as follows：
Resin 40-50%；
EMA 0.1-1%；
Glass fibre 0.1-3%；
Polyvinyl alcohol 0.1-3%；
Butyl titanate 0.1-3%；
Polytetrafluoroethylene (PTFE) 40-60%.
The demoulding when epoxy resin composition for semiconductor encapsulation of the present invention is to the cohesive of cupric oxide and shaping
Property, continuously shaped property are excellent, if sealed with the epoxy resin composition for semiconductor encapsulation to electronic units such as IC, LSI
Dress, then can obtain semiconductor device excellent in reliability.
Embodiment
The present invention is described in detail below in conjunction with specific embodiment, herein illustrative examples and explanation of the invention
For explaining the present invention, but it is not as a limitation of the invention.
Embodiment
A kind of epoxy resin composition for semiconductor encapsulation of the present invention, its raw material and raw material weight percentage composition are such as
Under：Resin 45%, EMA 0.5%, glass fibre 0.5%, polyvinyl alcohol 1%, butyl titanate 2%, poly- four
PVF 51%.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, it is included within the scope of the present invention.
Claims (1)
1. a kind of epoxy resin composition for semiconductor encapsulation, it is characterised in that its raw material and raw material weight percentage composition are as follows：
Resin 40-50%；
EMA 0.1-1%；
Glass fibre 0.1-3%；
Polyvinyl alcohol 0.1-3%；
Butyl titanate 0.1-3%；
Polytetrafluoroethylene (PTFE) 40-60%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710782706.1A CN107353546A (en) | 2017-09-02 | 2017-09-02 | A kind of epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710782706.1A CN107353546A (en) | 2017-09-02 | 2017-09-02 | A kind of epoxy resin composition for semiconductor encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107353546A true CN107353546A (en) | 2017-11-17 |
Family
ID=60289918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710782706.1A Withdrawn CN107353546A (en) | 2017-09-02 | 2017-09-02 | A kind of epoxy resin composition for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107353546A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181127A (en) * | 2011-03-30 | 2011-09-14 | 同济大学 | Preparation method of glass fiber reinforced epoxy resin composite material modified by reclaimed circuit board powder |
| CN103897344A (en) * | 2012-12-26 | 2014-07-02 | 第一毛织株式会社 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
| CN105199276A (en) * | 2015-07-28 | 2015-12-30 | 苏州新区特氟龙塑料制品厂 | Formula of high-viscosity modified polytetrafluoroethylene |
| CN105647092A (en) * | 2016-04-13 | 2016-06-08 | 苏州锦腾电子科技有限公司 | Glass fiber reinforced plastic and preparation method thereof |
| CN105778411A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Secondary mixing method of epoxy resin composition for semiconductor encapsulation |
-
2017
- 2017-09-02 CN CN201710782706.1A patent/CN107353546A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181127A (en) * | 2011-03-30 | 2011-09-14 | 同济大学 | Preparation method of glass fiber reinforced epoxy resin composite material modified by reclaimed circuit board powder |
| CN103897344A (en) * | 2012-12-26 | 2014-07-02 | 第一毛织株式会社 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
| CN105778411A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Secondary mixing method of epoxy resin composition for semiconductor encapsulation |
| CN105199276A (en) * | 2015-07-28 | 2015-12-30 | 苏州新区特氟龙塑料制品厂 | Formula of high-viscosity modified polytetrafluoroethylene |
| CN105647092A (en) * | 2016-04-13 | 2016-06-08 | 苏州锦腾电子科技有限公司 | Glass fiber reinforced plastic and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171117 |
|
| WW01 | Invention patent application withdrawn after publication |