CN107353546A - 一种半导体封装用环氧树脂组合物 - Google Patents
一种半导体封装用环氧树脂组合物 Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 13
- 238000005538 encapsulation Methods 0.000 title claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 4
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 4
- -1 Polytetrafluoroethylene Polymers 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 8
- 229960004643 cupric oxide Drugs 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
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- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
本发明所述一种半导体封装用环氧树脂组合物，其原料及原料重量百分含量如下：树脂40‑50％；甲基丙烯酸乙酯0.1‑1％；玻璃纤维0.1‑3％；聚乙烯醇0.1‑3％；钛酸四丁酯0.1‑3％；聚四氟乙烯40‑60％。本发明的半导体封装用环氧树脂组合物对氧化铜的粘合性、以及成型时的脱模性、连续成型性优异，如果用该半导体封装用环氧树脂组合物对IC、LSI等电子部件进行封装，则能够获得可靠性优异的半导体装置。
Description
技术领域
本发明涉及半导体封装用环氧树脂组合物。
背景技术
在半导体包装组装工序中，通过在半导体芯片的铝电极和内部引线之间热压接金属线来进行电连接的方法现在成为主流。另外，近年来伴随着电子器件的小型化、轻量化、高性能化的市场动向，电子部件的高集成化、多引脚化逐年发展。因此，要求比以前更复杂的焊线工序，使用铜制引线框时，由于在200～250℃的高温状态长时间暴露，因而铜表面的氧化更加进行。
这种状况下，即使以往的对于未氧化的铜表面的粘合性优异的半导体封装材料，对于表面状态不同的氧化铜也常有粘合性差的情况，从而出现在树脂封装后除去铸模时、回焊时引起剥离的问题。
用于抑制剥离的插入物与封装材料树脂的粘合性是与对于模具的脱模性相反的指标，因此，存在如果使粘合性提高则脱模性较差、成型性降低这类问题。采用电子部件的高集成化而铜框的氧化成为问题的以前，为了兼顾粘合性和脱模性，提出了添加氧化聚乙烯蜡以及α烯烃与马来酸的共聚物的半酯化物作为脱模剂的方法。(例如参照专利文献1、2。)根据该方法，虽然对未氧化的铜的粘合性和脱模性优异，但由于并用了氧化聚乙烯蜡，因而存在封装树脂对被氧化的铜框的粘合性降低的问题。而且，对于α烯烃部分短至碳原子为25个以下的共聚物脱模剂(例如参照专利文献3)，存在连续成型性(通气口堵塞等的脱模性)较差的问题。
发明内容
本发明是鉴于所述情况而完成的，要提供对氧化铜的粘合性良好并且脱模性、连续成型性也优异的半导体封装用环氧树脂组合物。
本发明人为了解决上述的课题，反复深入研究，结果发现，通过在半导体封装用环氧树脂组合物中使用特定的脱模剂能够达到上述的目的，至此完成了本发明。
即，本发明如下：
一种半导体封装用环氧树脂组合物，其原料及原料重量百分含量如下：
树脂40-50％；
甲基丙烯酸乙酯0.1-1％；
玻璃纤维0.1-3％；
聚乙烯醇0.1-3％；
钛酸四丁酯0.1-3％；
聚四氟乙烯40-60％。
本发明的半导体封装用环氧树脂组合物对氧化铜的粘合性、以及成型时的脱模性、连续成型性优异，如果用该半导体封装用环氧树脂组合物对IC、LSI等电子部件进行封装，则能够获得可靠性优异的半导体装置。
具体实施方式
下面将结合具体实施例来详细说明本发明，在此本发明的示意性实施例以及说明用来解释本发明，但并不作为对本发明的限定。
实施例
本发明所述一种半导体封装用环氧树脂组合物，其原料及原料重量百分含量如下：树脂45％、甲基丙烯酸乙酯0.5％、玻璃纤维0.5％、聚乙烯醇1％、钛酸四丁酯2％、聚四氟乙烯51％。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。
Claims (1)
1.一种半导体封装用环氧树脂组合物，其特征在于，其原料及原料重量百分含量如下：
树脂40-50％；
甲基丙烯酸乙酯0.1-1％；
玻璃纤维0.1-3％；
聚乙烯醇0.1-3％；
钛酸四丁酯0.1-3％；
聚四氟乙烯40-60％。
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181127A (zh) * | 2011-03-30 | 2011-09-14 | 同济大学 | 电路板回收粉料改性玻璃纤维增强环氧树脂复合材料的制备方法 |
| CN103897344A (zh) * | 2012-12-26 | 2014-07-02 | 第一毛织株式会社 | 用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件 |
| CN105199276A (zh) * | 2015-07-28 | 2015-12-30 | 苏州新区特氟龙塑料制品厂 | 一种高粘度改性聚四氟乙烯配方 |
| CN105647092A (zh) * | 2016-04-13 | 2016-06-08 | 苏州锦腾电子科技有限公司 | 一种玻璃纤维强化塑料及其制备方法 |
| CN105778411A (zh) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | 一种半导体封装用的环氧树脂组合物的二次混炼方法 |
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- 2017-09-02 CN CN201710782706.1A patent/CN107353546A/zh not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181127A (zh) * | 2011-03-30 | 2011-09-14 | 同济大学 | 电路板回收粉料改性玻璃纤维增强环氧树脂复合材料的制备方法 |
| CN103897344A (zh) * | 2012-12-26 | 2014-07-02 | 第一毛织株式会社 | 用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件 |
| CN105778411A (zh) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | 一种半导体封装用的环氧树脂组合物的二次混炼方法 |
| CN105199276A (zh) * | 2015-07-28 | 2015-12-30 | 苏州新区特氟龙塑料制品厂 | 一种高粘度改性聚四氟乙烯配方 |
| CN105647092A (zh) * | 2016-04-13 | 2016-06-08 | 苏州锦腾电子科技有限公司 | 一种玻璃纤维强化塑料及其制备方法 |
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