CN107286861B - Pouring sealant anti-poisoning agent and heat-conducting pouring sealant - Google Patents
Pouring sealant anti-poisoning agent and heat-conducting pouring sealant Download PDFInfo
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- CN107286861B CN107286861B CN201710426586.1A CN201710426586A CN107286861B CN 107286861 B CN107286861 B CN 107286861B CN 201710426586 A CN201710426586 A CN 201710426586A CN 107286861 B CN107286861 B CN 107286861B
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- component
- denaturant
- weight
- thermally conductive
- casting glue
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- 239000003795 chemical substances by application Substances 0.000 title claims abstract 6
- 239000000565 sealant Substances 0.000 title abstract 4
- 229920002545 silicone oil Polymers 0.000 claims abstract description 26
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000001343 alkyl silanes Chemical class 0.000 claims abstract description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 239000011701 zinc Substances 0.000 claims abstract description 3
- 239000003398 denaturant Substances 0.000 claims description 47
- 239000003292 glue Substances 0.000 claims description 32
- 238000005266 casting Methods 0.000 claims description 30
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 11
- 229920002554 vinyl polymer Polymers 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 7
- 239000003921 oil Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- AIVAIUMRPBQMLT-UHFFFAOYSA-N 3-acetylpentane-2,4-dione;nickel Chemical compound [Ni].CC(=O)C(C(C)=O)C(C)=O AIVAIUMRPBQMLT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000000468 ketone group Chemical group 0.000 claims description 3
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 231100000167 toxic agent Toxicity 0.000 claims 1
- 239000003440 toxic substance Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 10
- 150000001875 compounds Chemical class 0.000 abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052718 tin Inorganic materials 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004382 potting Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 229910052703 rhodium Inorganic materials 0.000 abstract description 3
- 239000010948 rhodium Substances 0.000 abstract description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052717 sulfur Inorganic materials 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010941 cobalt Substances 0.000 abstract description 2
- 229910017052 cobalt Inorganic materials 0.000 abstract description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract description 2
- 231100000572 poisoning Toxicity 0.000 abstract description 2
- 230000000607 poisoning effect Effects 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000011593 sulfur Substances 0.000 abstract description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000001147 anti-toxic effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000006459 hydrosilylation reaction Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000006555 catalytic reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- -1 siloxanes Chemical class 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 231100000567 intoxicating Toxicity 0.000 description 2
- 230000002673 intoxicating effect Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000003863 metallic catalyst Substances 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 235000015927 pasta Nutrition 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003498 tellurium compounds Chemical class 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the field of organosilicon potting materials, and discloses an anti-poisoning agent for a potting adhesive, which consists of 3-4 parts by weight of an anti-poisoning agent matrix and 1 part by weight of methyl vinyl silicone oil containing 0.5-3% by weight of alkoxy long-chain alkyl silane, wherein the anti-poisoning agent matrix is a complex of one metal or a mixture of complexes of more than two metals of zinc, iron, cobalt, copper, nickel, aluminum and rhodium. The pouring sealant disclosed by the invention is not easy to absorb moisture, has a long shelf life, and can effectively inhibit poisoning phenomena caused by sulfur-containing compounds, nitrogen-containing compounds, lead, tin and other substances. The invention also discloses a heat-conducting pouring sealant which contains the anti-poisoning agent, has a good anti-poisoning effect and has a wide application prospect.
Description
Technical field
The present invention relates to organic silicon potting material field, specifically a kind of anti-denaturant and a kind of thermally conductive encapsulating
Glue.
Background technique
Organic silicon potting material has high-low temperature resistant, mechanical performance, weather-proof, electric due to its special silicon oxygen bond backbone structure
The serial excellent performance such as insulation has significant research potential and great application prospect in high-tech area.Organosilicon encapsulating
Material can be divided into one-component and two-component according to the difference of contained component, and bi-component organic silicon casting glue is divided into condensed type again and adds
Two kinds of molding.The preparation principle of additional organosilicon Embedding Material is by the siloxanes containing vinyl and the silicon oxygen containing Si -- H bond
Alkane carries out hydrosilylation reaction under the catalysis of the 8th group transition metal compound (such as Pt), forms new Si-C key, make line style
It is silicone cross-linked to become network structure.The process industrial art performance of additional organosilicon encapsulating product is fine, and product viscosity is low, flows
Property it is good, mechanical casting can be used；Electric pump pumping can also be used and realize static mixing, had using simple process, quick, efficiently
The advantage of energy conservation, is acknowledged as the novel encapsulated material of used in electronic industry most development prospect.
But organosilicon encapsulating product has a very big weakness, with containing elements such as N, P, S organic matter or Sn, Pb, Hg,
The ionic compound of the heavy metals such as Bi, As and containing alkynyl unsaturated compounds contact when, contained platinum catalyst is easily poisoned,
Prevent organosilicon encapsulating product is from vulcanizing, therefore when using organosilicon encapsulating product, never working environment and workpiece are speckled with
Nitrogen, sulphur, phosphorus compound and metal organic acid.
Some anti-denaturants on the market are influenced to be easy the moisture absorption by its structure now, and viscosity becomes larger after moisture absorption, give subsequent behaviour
It makes troubles, and is easy to produce bubble, the casting glue made in this way often cannot get smooth table in use
Face influences using effect.Currently, some anti-denaturants and acetylacetone,2,4-pentanedione collocation use, but anti-denaturant can not be prevented in this way
The moisture absorption.
Summary of the invention
The present invention is intended to provide the anti-denaturant that a kind of humidity resistance is excellent.
The present invention to achieve the above object, takes following technical scheme to be achieved:
A kind of anti-denaturant of casting glue, consists of the following components in percentage by weight: 3~4 parts of anti-denaturant matrix and 1
The methyl vinyl silicon oil of the alkoxy long chain alkyl silane for being 0.5~3% containing weight percent of part, the anti-denaturant
Matrix is the mixture of the complex compound of one of zinc, iron, cobalt, copper, nickel, aluminium, rhodium metal or the complex compound of two or more metals.
Preferably, the anti-denaturant matrix be three (levulinic ketone groups) be coordinated aluminium, one of diacetyl acetone nickel or
Two kinds of mixture.
Another object of the present invention is intended to provide a kind of anti-thermally conductive casting glue of poisoning.
The present invention to achieve the above object, takes following technical scheme to be achieved:
A kind of thermally conductive casting glue is made of, the weight ratio of the component A and B component component A, B component and anti-denaturant
For 1:1, the weight of the anti-denaturant is the 1%~8% of the weight summation of component A and B component；The component A is by following heavy
Amount percentage at being grouped as: vinyl silicone oil 10%~80%, filler 5%~50%, catalyst 0.01%~1%；The B
Component is by following weight percent at being grouped as: vinyl silicone oil 10%~80%, filler 5%~50%, surplus are hydrogeneous
Silicone oil.
Preferably, the filler is one or more mixtures of thermally conductive aluminium oxide, zinc oxide, iron oxide black.
Preferably, the catalyst is chloroplatinic acid.
Preferably, the weight of the anti-denaturant is the 1%~5% of the weight summation of component A and B component.
Preferably, the viscosity of the vinyl silicone oil is 100~10000cps.
Platinum catalysis hydrosilylation is used widely in silicone industry.Related hydrosilylation catalytic mechanism
Research also makes some progress.Different catalytic mechanisms is proposed to different catalyst systems, is broadly divided into free radical and is added
At mechanism, ion addition mechanism, coordination addition mechanism three categories.It is generally believed that by transition metal, such as platinum, rhodium, palladium, nickel shape
At catalyst system to the catalysis of hydrosilylation belong to coordination addition mechanism.
The poisonous substance for causing platinum catalyst to fail mainly has a three classes, the first kind be have the nonmetallic of unshared electron pair and its
Compound, such as nitrogen, phosphorus, arsenic, antimonial and oxygen, sulphur, selenium, tellurium compound, the second class be it is certain have occupied d track, and d
There are the metal ion with the unoccupied orbital of metallic catalyst effect and electronics, such as the ion of tin, lead, mercury, bismuth heavy metal on track
Property compound, third class is unsaturated compound, and the unsaturated bond in molecule can provide the d track of electronics and metallic catalyst
Bonding, to destroy the structure of catalyst and make its failure.
The anti-denaturant of casting glue of the invention is made of anti-denaturant matrix with long chain silane, in the table of anti-denaturant matrix
Face is coated with long chain silane, and long chain silane has stronger hydrophobic performance, therefore reduces anti-denaturant matrix and moisture
Contact, extends the shelf-life of anti-denaturant.Sulfur-bearing in filler, nitrogenous etc. can be effectively suppressed in the anti-denaturant of casting glue of the invention
Intoxicating phenomenon caused by the impurity such as compound, lead, tin, the complex compound of various metals, which is used in mixed way, has preferably anti-middle toxic effect
Fruit can be cooked primary coat and also directly be made into casting glue use.
Thermally conductive casting glue containing anti-denaturant of the invention uncured liquid after surface drying 30min is in gel state, is had
Curing tendency shows good anti-toxic effects.Illustrate that anti-denaturant of the invention can play good anti-poisoning effect.This
The thermally conductive casting glue of invention has a good application prospect.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is further illustrated.
Casting glue component A prepares embodiment
Chloroplatinic acid, aluminium oxide are uniformly mixed with the vinyl silicone oil according to the form below that viscosity is 100cps and are made.
| Vinyl silicone oil (g) | Aluminium oxide (g) | Chloroplatinic acid (g) | |
| Embodiment 1 | 80 | 19 | 1 |
| Embodiment 2 | 10 | 50 | 1 |
| Embodiment 3 | 80 | 5 | 0.01 |
| Embodiment 4 | 40 | 50 | 1 |
| Embodiment 5 | 60 | 25 | 0.5 |
Casting glue B component prepares embodiment
It is uniformly mixed by zinc oxide, containing hydrogen silicone oil, with the vinyl silicone oil according to the form below that viscosity is 10000cps obtained.
| Vinyl silicone oil (g) | Zinc oxide (g) | Containing hydrogen silicone oil (g) | |
| Embodiment 6 | 80 | 18 | 2 |
| Embodiment 7 | 10 | 50 | 40 |
| Embodiment 8 | 80 | 5 | 15 |
| Embodiment 9 | 40 | 25 | 35 |
Anti- denaturant 1 prepares embodiment
Three (levulinic ketone groups) the coordination aluminium and 300g viscosity of 100g are 300cps, contain 0.5~3wt.% alkoxy
The methyl vinyl silicon oil of long chain alkyl silane is uniformly mixed, and anti-denaturant 1 is made.
Anti- denaturant 2 prepares embodiment
It is 300cps by the diacetyl acetone nickel of 100g and 400g viscosity, contains 0.5~3wt.% alkoxy chain alkyl
The methyl vinyl silicon oil of silane is uniformly mixed, and anti-denaturant 2 is made.
Thermally conductive casting glue prepares embodiment 10~15
Component A, B component, 1 according to the form below of anti-denaturant are uniformly mixed and are made.Embodiment 10 is the blank of thermally conductive casting glue
Embodiment is free of anti-denaturant.Thermally conductive casting glue obtained by embodiment 10~15 is coated on circuit board, above-mentioned sizing material is 60
The surface drying time vulcanized at DEG C is 5min, and after twenty minutes, the blob of viscose feel raised is softer, high-visible uncured silicon for solidification
Oil, with the increase of anti-1 dosage of denaturant, the amount of silicone oil is smaller, has uncured silicone oil to only near beginning scolding tin tin grain
With the presence of there is silicone oil at scolding tin, effect is more apparent, illustrates that anti-denaturant 1 has anti-toxic effects.After solidification 3 minutes, it is seen that not solid
SiClx pasta product obviously tails off, and as the dosage of anti-denaturant 1 increases, silicone oil is gradually presented gel, there is curing tendency, and
Control group or apparent silicone oil, no gel, not wire drawing illustrate anti-denaturant 1 effectively.To thermally conductive Embedding Material, anti-denaturant 1
To a certain extent as the anti-toxic effects of the increase of dosage also gradually increase, and shadow is not generated to thermally conductive casting glue performance
It rings, the solidification effect of especially embodiment 13~15 is obvious, and anti-intoxication is preferable.
Thermally conductive casting glue prepares embodiment 16~20
Component A, B component, 2 according to the form below of anti-denaturant are uniformly mixed and are made.It will be thermally conductive obtained by embodiment 16~20
Casting glue is coated on circuit board, and the surface drying time that above-mentioned sizing material vulcanizes at 60 DEG C is 5min, is solidified after twenty minutes, the glue raised
Block feel is softer, high-visible uncured silicone oil, and with the increase of anti-2 dosage of denaturant, the amount of silicone oil is smaller, from starting to weld
Tin tin grain nearby has silicone oil at only scolding tin with the presence of uncured silicone oil, and effect is more apparent, and anti-denaturant 2 has toxic effect in anti-
Fruit.But compared to for anti-denaturant 1, the antitoxic effect of anti-denaturant 2 is slightly worse.After solidification 30 minutes, it is seen that uncured silicone oil face
Product obviously tails off, and with the increase of the dosage of anti-denaturant 2, silicone oil is gradually presented gel, and control group or apparent silicon
Oil, no gel, not wire drawing illustrate anti-denaturant 2 effectively.Anti- denaturant 2 is to a certain extent with the anti-poisoning of the increase of dosage
Effect also gradually increases, and the effect of especially embodiment 19,20 is obvious, and anti-poisoning is preferable.It is not apparent to thermally conductive casting glue
Side effect, but it is somewhat poorer compared to anti-1 effect of denaturant.
Thermally conductive casting glue prepares embodiment 21~26
Component A, B component, anti-denaturant according to the form below are uniformly mixed and are made.By thermally conductive filling obtained by embodiment 21~26
Sealing is coated on circuit board, and the surface drying time that above-mentioned sizing material vulcanizes at 60 DEG C is 5min, after solidification 30 minutes, embodiment 22,
23 have a small amount of uncured raffinate after 20 min, and curing degree is relatively preferable after 30min, and effect is preferable, and having improves in casting glue
Malicious phenomenon is conducive to encapsulating adhesive curing.In general, the result of embodiment 23 is preferable, can reach the expected results of anti-poisoning.Implement
Example 25,26 only has uncured raffinate at soldering after 20 min, and curing degree is relatively preferable after 30min, and having improves encapsulating
Glue intoxicating phenomenon is conducive to encapsulating adhesive curing.The result of embodiment 26 is more preferable in general, can reach the expected results of anti-poisoning.
It is compared with embodiment 21~23, there are better anti-toxic effects.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention the interest field of the limitation present invention.
Claims (6)
1. a kind of anti-denaturant of casting glue, it is characterised in that be made of the component of following parts by weight: 3-4 parts of anti-denaturant matrix
With the methyl vinyl silicon oil for the alkoxy long chain alkyl silane that 1 part is 0.5~3% containing weight percent, it is described it is anti-in
Toxic agent matrix is the mixture that three (levulinic ketone groups) are coordinated one or both of aluminium, diacetyl acetone nickel.
2. a kind of thermally conductive casting glue, it is characterised in that: by component A, B component and anti-denaturant group as described in claim 1
At the weight ratio of the component A and B component is 1:1, and the weight of the anti-denaturant is the weight summation of component A and B component
1%~8%；
The component A is by following weight percent at being grouped as: vinyl silicone oil 10%~80% filler 5%~50%, urges
Agent 0.01%~1%；
The B component is by following weight percent at being grouped as: vinyl silicone oil 10%~80%, filler 5%~50%, remaining
Amount is containing hydrogen silicone oil.
3. a kind of thermally conductive casting glue according to claim 2, it is characterised in that: the filler is thermally conductive aluminium oxide, oxidation
One or more mixtures of zinc, iron oxide black.
4. a kind of thermally conductive casting glue according to claim 2, it is characterised in that: the catalyst is chloroplatinic acid.
5. a kind of thermally conductive casting glue according to claim 2, it is characterised in that: the weight of the anti-denaturant is component A
With the 1%~5% of the weight summation of B component.
6. a kind of thermally conductive casting glue according to claim 2, it is characterised in that: the viscosity of the vinyl silicone oil is 100
~10000cps.
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| CN201710426586.1A CN107286861B (en) | 2017-06-08 | 2017-06-08 | Pouring sealant anti-poisoning agent and heat-conducting pouring sealant |
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| CN201710426586.1A CN107286861B (en) | 2017-06-08 | 2017-06-08 | Pouring sealant anti-poisoning agent and heat-conducting pouring sealant |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4156689A (en) * | 1978-02-13 | 1979-05-29 | General Electric Company | Purification of hydrosilanes and siloxanes |
| FR2571732B1 (en) * | 1984-10-15 | 1987-01-09 | Rhone Poulenc Spec Chim | ORGANOPOLYSILOXANIC COATING COMPOSITION FOR USE IN PARTICULAR FOR NON-STICK TREATMENT AND METHOD OF APPLICATION |
| CN101824224A (en) * | 2010-04-15 | 2010-09-08 | 同济大学 | Preparation method of anti-poisoning silicon rubber |
| CN106497508A (en) * | 2016-11-03 | 2017-03-15 | 东莞兆舜有机硅科技股份有限公司 | A kind of high anti-poisoning add-on type casting glue and preparation method thereof |
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Effective date of registration: 20240424 Address after: 523000 room 701, building 2, No. 636, Changdong Road, Changping Town, Dongguan City, Guangdong Province Patentee after: Dongguan zhongzhan silicone materials Co.,Ltd. Country or region after: China Address before: No.24 Dongsha street, textile Road, Haizhu District, Guangzhou City, Guangdong Province Patentee before: ZHONGKAI University OF AGRICULTURE AND ENGINEERING Country or region before: China |