CN107286861A - Pouring sealant anti-poisoning agent and heat-conducting pouring sealant - Google Patents
Pouring sealant anti-poisoning agent and heat-conducting pouring sealant Download PDFInfo
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- CN107286861A CN107286861A CN201710426586.1A CN201710426586A CN107286861A CN 107286861 A CN107286861 A CN 107286861A CN 201710426586 A CN201710426586 A CN 201710426586A CN 107286861 A CN107286861 A CN 107286861A
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- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 56
- 239000000565 sealant Substances 0.000 title 2
- 238000004382 potting Methods 0.000 claims abstract description 46
- 229920002545 silicone oil Polymers 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 5
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical group C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 4
- 239000010948 rhodium Substances 0.000 claims abstract description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 3
- 239000010941 cobalt Substances 0.000 claims abstract description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 3
- 150000004696 coordination complex Chemical group 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims abstract description 3
- 229910052742 iron Inorganic materials 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 239000011701 zinc Substances 0.000 claims abstract description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 150000001343 alkyl silanes Chemical class 0.000 claims description 3
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 claims description 3
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 2
- 125000005595 acetylacetonate group Chemical group 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 19
- 229920001296 polysiloxane Polymers 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 7
- 229910052718 tin Inorganic materials 0.000 abstract description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000607 poisoning effect Effects 0.000 abstract description 5
- 229910052717 sulfur Inorganic materials 0.000 abstract description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 4
- 231100000572 poisoning Toxicity 0.000 abstract description 4
- 229910000077 silane Inorganic materials 0.000 abstract description 4
- 239000011593 sulfur Substances 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000003197 catalytic effect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000006459 hydrosilylation reaction Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 150000008040 ionic compounds Chemical class 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002355 alkine group Chemical group 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical group 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003498 tellurium compounds Chemical class 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
本发明涉及有机硅灌封材料领域，公开了一种灌封胶抗中毒剂，由3‑4重量份的抗中毒剂基质与1重量份的含有重量百分比为0.5～3％的烷氧基长链烷基硅烷的甲基乙烯基硅油组成，所述抗中毒剂基质为锌、铁、钴、铜、镍、铝、铑中的一种金属的络合物或两种以上金属的络合物的混合物。本发明灌封胶抗中毒剂不容易吸潮，具有较长的保质期，并且可有效抑制含硫、含氮等化合物、铅、锡等物质引起的中毒现象。本发明还公开了一种导热灌封胶，所述导热灌封包含所述抗中毒剂，抗中毒效果良好，具有广阔的应用前景。The invention relates to the field of silicone potting materials, and discloses an anti-poisoning agent for potting glue, which consists of 3-4 parts by weight of an anti-poisoning agent matrix and 1 part by weight of an alkoxy group containing 0.5-3% by weight. Composition of methyl vinyl silicone oil of alkanyl silane, the anti-poisoning agent matrix is a metal complex or a complex of two or more metals in zinc, iron, cobalt, copper, nickel, aluminum, rhodium mixture. The potting glue anti-poisoning agent of the present invention is not easy to absorb moisture, has a long shelf life, and can effectively inhibit poisoning caused by compounds containing sulfur and nitrogen, substances such as lead and tin. The invention also discloses a heat-conducting potting glue, the heat-conducting potting contains the anti-poisoning agent, has a good anti-poisoning effect and has broad application prospects.
Description
技术领域technical field
本发明涉及有机硅灌封材料领域，具体地说是一种抗中毒剂以及一种导热灌封胶。The invention relates to the field of silicone potting materials, in particular to an anti-poisoning agent and a heat-conducting potting glue.
背景技术Background technique
有机硅灌封材料因其特殊的硅氧键主链结构而具有耐高低温、机械性能、耐候、电绝缘等系列优良性能，在高科技领域具有显著的研究潜力和极大的应用前景。有机硅灌封材料根据所含组份的不同可分为单组份和双组份，双组份有机硅灌封胶又分为缩合型和加成型两种。加成型有机硅灌封材料的制备原理是由含乙烯基的硅氧烷与含Si-H键的硅氧烷，在第八族过渡金属化合物(如Pt)催化下进行氢硅化加成反应，形成新的Si-C键，使线型硅氧烷交联成为网络结构。加成型有机硅灌封产品的加工工艺性能很好，产品粘度低、流动性好，能使用机械浇注；也可以用电泵泵送和实现静态混合，具有使用工艺简单、快捷，高效节能的优点，被公认为电子工业用最具发展前途的新型封装材料。Silicone potting materials have a series of excellent properties such as high and low temperature resistance, mechanical properties, weather resistance, and electrical insulation due to their special silicon-oxygen bond backbone structure. They have significant research potential and great application prospects in high-tech fields. Silicone potting materials can be divided into one-component and two-component according to the different components contained, and the two-component silicone potting adhesive is divided into two types: condensation type and addition type. The preparation principle of the addition-type silicone potting material is a hydrosilation addition reaction of vinyl-containing siloxane and Si-H bond-containing siloxane under the catalysis of a group VIII transition metal compound (such as Pt). A new Si-C bond is formed, and the linear siloxane is cross-linked into a network structure. The processing performance of the addition-type silicone potting products is very good, the product has low viscosity and good fluidity, and can be poured mechanically; it can also be pumped by an electric pump and achieve static mixing, which has the advantages of simple, fast, high-efficiency and energy-saving processes , is recognized as the most promising new packaging material for the electronics industry.
但有机硅灌封产品有一个很大的弱点，与含N、P、S等元素的有机物或Sn、Pb、Hg、Bi、As等重金属的离子性化合物及含炔基的不饱和有机物接触时,所含的铂催化剂易中毒，使得有机硅灌封产品不能硫化，因此在用到有机硅灌封产品时，切忌工作环境和工件沾有氮、硫、磷的化合物及金属有机酸。However, silicone potting products have a big weakness, when in contact with organic compounds containing N, P, S and other elements or ionic compounds of heavy metals such as Sn, Pb, Hg, Bi, As, and unsaturated organic compounds containing alkyne groups , The contained platinum catalyst is easily poisoned, so that the silicone potting product cannot be vulcanized. Therefore, when using the silicone potting product, the working environment and the workpiece must not be stained with nitrogen, sulfur, phosphorus compounds and metal organic acids.
现在市面上的一些抗中毒剂受其结构影响容易吸潮，吸湿后粘度变大，给后续操作带来不便，并且容易产生气泡，这样配制出的灌封胶在使用过程中往往得不到平整的表面，影响使用效果。目前，一些抗中毒剂与乙酰丙酮搭配使用，但这样并不能阻止抗中毒剂吸潮。Some anti-poisoning agents on the market are easy to absorb moisture due to their structure, and the viscosity becomes larger after moisture absorption, which brings inconvenience to subsequent operations and is prone to generate air bubbles, so that the prepared potting compound is often not smooth during use. The surface will affect the use effect. At present, some antipoisoning agents are used in combination with acetylacetone, but this does not prevent the antipoisoning agent from absorbing moisture.
发明内容Contents of the invention
本发明旨在提供一种防潮性能优异的抗中毒剂。The present invention aims to provide an anti-poisoning agent with excellent moisture-proof performance.
本发明为实现上述目的，采取以下技术方案予以实现：In order to achieve the above object, the present invention takes the following technical solutions to achieve:
一种灌封胶抗中毒剂，由以下重量百分比的组份组成：3～4份的抗中毒剂基质与1份的含有重量百分比为0.5～3％的烷氧基长链烷基硅烷的甲基乙烯基硅油，所述抗中毒剂基质为锌、铁、钴、铜、镍、铝、铑中的一种金属的络合物或两种以上金属的络合物的混合物。An anti-poisoning agent for potting glue, which is composed of the following components by weight percentage: 3-4 parts of anti-poisoning agent base and 1 part of formaldehyde containing 0.5-3% by weight of alkoxy long-chain alkylsilane Vinyl silicone oil, the anti-poisoning agent matrix is a metal complex in zinc, iron, cobalt, copper, nickel, aluminum, rhodium or a mixture of two or more metal complexes.
优选地，所述抗中毒剂基质为三(乙酰丙酮基)配位铝、二乙酰丙酮镍中的一种或两种的混合物。Preferably, the anti-poisoning agent matrix is one or a mixture of tri(acetylacetonate) coordinated aluminum and nickel diacetylacetonate.
本发明的另一个目的旨在提供一种抗中毒导热灌封胶。Another object of the present invention is to provide an anti-poisoning heat-conducting potting compound.
本发明为实现上述目的，采取以下技术方案予以实现：In order to achieve the above object, the present invention takes the following technical solutions to achieve:
一种导热灌封胶，由A组份、B组份以及抗中毒剂组成，所述A组份与B组份的重量比为1:1，所述抗中毒剂的重量为A组份与B组份的重量总和的1％～8％；所述A组份由以下重量百分比的成分组成：乙烯基硅油10％～80％、填料5％～50％、催化剂0.01％～1％；所述B组份由以下重量百分比的成分组成：乙烯基硅油10％～80％、填料5％～50％、余量为含氢硅油。A heat-conducting potting compound, consisting of component A, component B and an anti-poisoning agent, the weight ratio of the component A to the component B is 1:1, and the weight of the anti-poisoning agent is the weight of the component A and the anti-poisoning agent 1% to 8% of the total weight of component B; the component A is composed of the following components by weight percentage: vinyl silicone oil 10% to 80%, filler 5% to 50%, and catalyst 0.01% to 1%. The B component is composed of the following ingredients in weight percentage: 10%-80% of vinyl silicone oil, 5%-50% of filler, and the balance of hydrogen-containing silicone oil.
优选地，所述填料为导热氧化铝、氧化锌、氧化铁黑中的一种或两种以上混合物。Preferably, the filler is one or a mixture of two or more of thermally conductive aluminum oxide, zinc oxide, and iron oxide black.
优选地，所述催化剂为氯铂酸。Preferably, the catalyst is chloroplatinic acid.
优选地，所述抗中毒剂的重量为A组份与B组份的重量总和的1％～5％。Preferably, the weight of the anti-poisoning agent is 1%-5% of the sum of the weights of components A and B.
优选地，所述乙烯基硅油的粘度为100～10000cps。Preferably, the vinyl silicone oil has a viscosity of 100-10000 cps.
铂催化硅氢加成反应在有机硅工业得到广泛应用。有关硅氢加成反应催化机理的研究也取得了一定的进展。对不同的催化体系提出了不同的催化机理，主要分为自由基加成机理、离子加成机理、配位加成机理三大类。一般认为，由过渡金属，如铂、铑、钯、镍等形成的催化体系对硅氢加成反应的催化属于配位加成机理。Platinum-catalyzed hydrosilylation reactions are widely used in the silicone industry. Some progress has also been made in the research on the catalytic mechanism of the hydrosilylation reaction. Different catalytic mechanisms have been proposed for different catalytic systems, which are mainly divided into three categories: free radical addition mechanism, ion addition mechanism and coordination addition mechanism. It is generally believed that the catalytic system formed by transition metals, such as platinum, rhodium, palladium, nickel, etc., belongs to the coordination addition mechanism for the catalysis of the hydrosilylation reaction.
造成铂催化剂失效的毒物主要有三类，第一类是具有未共享电子对的非金属及其化合物，如氮、磷、砷、锑化合物及氧、硫、硒、碲化合物，第二类是某些具有已占用d轨道，且d轨道上有与金属催化剂作用的空轨道和电子的金属离子，如锡、铅、汞、铋等重金属的离子性化合物，第三类是不饱和化合物，其分子中的不饱和键能提供电子与金属催化剂的d轨道成键，从而破坏催化剂的结构并使其失效。There are three main types of poisons that cause the failure of platinum catalysts. The first type is non-metals and their compounds with unshared electron pairs, such as nitrogen, phosphorus, arsenic, antimony compounds, and oxygen, sulfur, selenium, and tellurium compounds. The second type is certain Some have occupied d orbitals, and there are empty orbitals and electrons that interact with metal catalysts on the d orbitals, such as ionic compounds of heavy metals such as tin, lead, mercury, bismuth, etc. The third category is unsaturated compounds, whose molecules The unsaturated bonds in can provide electrons to bond with the d-orbitals of metal catalysts, thereby destroying the structure of the catalyst and making it ineffective.
本发明的灌封胶抗中毒剂由抗中毒剂基质与长链硅烷组成，在抗中毒剂基质的表面被覆一层长链硅烷，长链硅烷具有较强的疏水性能，因此减少了抗中毒剂基质与水分的接触，延长了抗中毒剂的保质期。本发明的灌封胶抗中毒剂可有效抑制填料中含硫、含氮等化合物、铅、锡等杂质引起的中毒现象，将多种金属的络合物混合使用具有更好的抗中毒效果，可做底涂也可直接配成灌封胶使用。The potting glue anti-poisoning agent of the present invention is composed of an anti-poisoning agent matrix and a long-chain silane, and a layer of long-chain silane is coated on the surface of the anti-poisoning agent matrix. The long-chain silane has strong hydrophobic properties, thus reducing the amount of anti-poisoning agent The contact of the matrix with moisture prolongs the shelf life of the antipoisoning agent. The potting glue anti-poisoning agent of the present invention can effectively suppress the poisoning phenomenon caused by impurities such as sulfur-containing and nitrogen-containing compounds, lead, tin and the like in the filler, and the mixed use of various metal complexes has better anti-poisoning effect, It can be used as a primer or directly as a potting glue.
含有本发明的抗中毒剂的导热灌封胶在表干30min后未固化液体呈凝胶状态，有固化趋势，显示出良好的抗中毒效果。说明本发明的抗中毒剂可起到很好的防中毒效果。本发明的导热灌封胶具有良好的应用前景。The heat-conducting encapsulant containing the anti-poisoning agent of the present invention is in a gel state after surface drying for 30 minutes, and the uncured liquid has a tendency to solidify, showing a good anti-poisoning effect. It shows that the anti-poisoning agent of the present invention can play a very good anti-poisoning effect. The heat-conducting potting glue of the invention has good application prospects.
具体实施方式detailed description
以下结合具体实施例来对本发明作进一步的说明。The present invention will be further described below in conjunction with specific examples.
灌封胶A组分制备实施例Example of preparation of component A of potting glue
将氯铂酸、氧化铝与粘度为100cps的乙烯基硅油按下表混合均匀制得。Prepared by uniformly mixing chloroplatinic acid, aluminum oxide and vinyl silicone oil with a viscosity of 100cps as shown in the table below.
灌封胶B组分制备实施例Example of preparation of component B of potting glue
将氧化锌、含氢硅油、与粘度为10000cps的乙烯基硅油按下表混合均匀制得。Prepared by uniformly mixing zinc oxide, hydrogen-containing silicone oil, and vinyl silicone oil with a viscosity of 10,000 cps as shown in the table below.
抗中毒剂1制备实施例Antipoisoning agent 1 preparation embodiment
将100g的三(乙酰丙酮基)配位铝与300g粘度为300cps、含有0.5～3wt.％烷氧基长链烷基硅烷的甲基乙烯基硅油混合均匀，制得抗中毒剂1。100g of tris(acetylacetonate)coordinated aluminum and 300g of methyl vinyl silicone oil with a viscosity of 300cps and containing 0.5-3wt.% alkoxy long-chain alkylsilane were evenly mixed to prepare antipoisoning agent 1.
抗中毒剂2制备实施例Antipoisoning agent 2 preparation embodiment
将100g的二乙酰丙酮镍与400g粘度为300cps、含有0.5～3wt.％烷氧基长链烷基硅烷的甲基乙烯基硅油混合均匀，制得抗中毒剂2。100 g of nickel diacetylacetonate and 400 g of methyl vinyl silicone oil with a viscosity of 300 cps and containing 0.5 to 3 wt. % of alkoxy long-chain alkyl silane are evenly mixed to prepare antipoisoning agent 2.
导热灌封胶制备实施例10～15Examples 10-15 of Preparation of Heat-conducting Potting Compound
将A组分、B组分、抗中毒剂1按下表混合均匀制得。实施例10为导热灌封胶的空白实施例，不含抗中毒剂。将实施例10～15所制得的导热灌封胶涂上电路板上，上述胶料在60℃下硫化的表干时间为5min，固化20分钟后，掀开的胶块手感较软，清晰可见未固化的硅油，随着抗中毒剂1用量的增大，硅油的量越小，从开始焊锡锡粒附近都有未固化硅油到只有焊锡处有硅油存在，效果较明显，说明抗中毒剂1有抗中毒效果。固化3分钟后，可见未固化硅油面积明显变少，且随着抗中毒剂1的用量增加，硅油逐渐呈现凝胶状，有固化趋势，而对照组还是明显的硅油，无凝胶，不拉丝，说明抗中毒剂1有效。对导热灌封材料，抗中毒剂1在一定程度上随着用量的增加抗中毒效果也逐渐增加，并且没有对导热灌封胶性能产生影响，尤其是实施例13～15的固化效果明显，抗中毒作用较好。Prepare by mixing components A, B and anti-poisoning agent 1 according to the table below. Example 10 is a blank example of the heat-conducting potting compound, which does not contain anti-poisoning agent. Apply the heat-conducting potting compound prepared in Examples 10 to 15 on the circuit board. The surface-drying time of the above-mentioned compound vulcanized at 60°C is 5 minutes. After curing for 20 minutes, the opened glue block feels soft and clear. It can be seen that uncured silicone oil, as the amount of anti-poisoning agent 1 increases, the amount of silicone oil becomes smaller. From the beginning, there is uncured silicone oil near the solder tin particles to the presence of silicone oil only at the soldering tin. The effect is more obvious, indicating that the anti-poisoning agent 1 has an anti-poisoning effect. After curing for 3 minutes, it can be seen that the area of uncured silicone oil is significantly reduced, and with the increase of the amount of anti-poisoning agent 1, the silicone oil gradually becomes gel-like and has a tendency to solidify, while the control group is still obvious silicone oil, no gel, no wire drawing , indicating that anti-poisoning agent 1 is effective. For heat-conducting potting materials, the anti-poisoning effect of anti-poisoning agent 1 gradually increases with the increase of dosage to a certain extent, and has no effect on the performance of heat-conducting potting materials, especially the curing effect of Examples 13-15 is obvious, and the anti-poisoning The poisoning effect is better.
导热灌封胶制备实施例16～20Examples 16-20 of Preparation of Heat-conducting Potting Compound
将A组分、B组分、抗中毒剂2按下表混合均匀制得。将实施例16～20所制得的导热灌封胶涂上电路板上，上述胶料在60℃下硫化的表干时间为5min，固化20分钟后，掀开的胶块手感较软，清晰可见未固化的硅油，随着抗中毒剂2用量的增大，硅油的量越小，从开始焊锡锡粒附近都有未固化硅油到只有焊锡处有硅油存在，效果较明显，抗中毒剂2有抗中毒效果。但相比抗中毒剂1来说，抗中毒剂2的抗毒效果稍差。固化30分钟后，可见未固化硅油面积明显变少，且随着抗中毒剂2的用量增加，硅油逐渐呈现凝胶状，而对照组还是明显的硅油，无凝胶，不拉丝，说明抗中毒剂2有效。抗中毒剂2在一定程度上随着用量的增加抗中毒效果也逐渐增加，尤其是实施例19、20的效果明显，抗中毒较好。对导热灌封胶没有明显的副作用，但相比抗中毒剂1效果稍微差些。Prepare by mixing component A, component B and anti-poisoning agent 2 according to the table below. Apply the heat-conducting potting compound prepared in Examples 16 to 20 on the circuit board. The surface-drying time of the above-mentioned compound vulcanized at 60°C is 5 minutes. After curing for 20 minutes, the opened glue block feels soft and clear. It can be seen that the uncured silicone oil, with the increase of the amount of anti-poisoning agent 2, the smaller the amount of silicone oil, from the beginning there is uncured silicone oil near the solder tin particles to the presence of silicone oil only in the solder, the effect is more obvious, anti-poisoning agent 2 Has an anti-poisoning effect. However, compared with anti-poisoning agent 1, the anti-poisoning effect of anti-poisoning agent 2 is slightly worse. After curing for 30 minutes, it can be seen that the area of uncured silicone oil is significantly reduced, and as the amount of anti-poisoning agent 2 increases, the silicone oil gradually becomes gel-like, while the control group is still obvious silicone oil, no gel, no wire drawing, indicating that the anti-poisoning agent 2 Poison 2 works. To a certain extent, the anti-poisoning effect of the anti-poisoning agent 2 gradually increases with the increase of the dosage, especially the effects of Examples 19 and 20 are obvious, and the anti-poisoning is better. There is no obvious side effect on thermal conductive potting compound, but the effect is slightly worse than that of anti-poisoning agent 1.
导热灌封胶制备实施例21～26Examples 21-26 of Preparation of Heat-conducting Potting Compound
将A组分、B组分、抗中毒剂按下表混合均匀制得。将实施例21～26所制得的导热灌封胶涂上电路板上，上述胶料在60℃下硫化的表干时间为5min，固化30分钟后，实施例22、23在20min后有少量未固化残液，在30min后固化程度相对较好，效果较好，有改善灌封胶中毒现象，利于灌封胶固化。总体而言，实施例23的结果较好，能达到抗中毒的预期结果。实施例25、26在20min后仅在锡焊处有未固化残液，在30min后固化程度相对较好，具有改善灌封胶中毒现象，利于灌封胶固化。总体而言实施例26的结果更好，能达到抗中毒的预期结果。与实施例21～23对比，具有更好的抗中毒效果。Prepare by mixing components A, B and antipoisoning agent according to the table below. Apply the heat-conducting potting compound prepared in Examples 21 to 26 on the circuit board. The surface-drying time of the above-mentioned compound vulcanized at 60°C is 5 minutes. After curing for 30 minutes, Examples 22 and 23 have a small amount of The uncured residual liquid has a relatively good curing degree after 30 minutes, and the effect is good, which can improve the poisoning of the potting glue and facilitate the curing of the potting glue. Overall, the results of Example 23 are better, and can achieve the expected results of anti-poisoning. Examples 25 and 26 only have uncured residual liquid at the soldering part after 20 minutes, and the curing degree is relatively good after 30 minutes, which can improve the poisoning phenomenon of the potting glue and facilitate the curing of the potting glue. Generally speaking, the result of embodiment 26 is better, and the expected result of anti-poisoning can be achieved. Compared with Examples 21-23, it has better anti-poisoning effect.
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内限制本发明之权利范围。The above-mentioned embodiment is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above-mentioned embodiment, and any other changes, modifications, substitutions, combinations, Simplifications should be equivalent replacement methods, and all are included in the protection scope of the present invention to limit the scope of rights of the present invention.
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| US4156689A (en) * | 1978-02-13 | 1979-05-29 | General Electric Company | Purification of hydrosilanes and siloxanes |
| EP0184965A1 (en) * | 1984-10-15 | 1986-06-18 | Rhone-Poulenc Chimie | Silicone compositions for antiadherent coating and application process |
| CN101824224A (en) * | 2010-04-15 | 2010-09-08 | 同济大学 | Preparation method of anti-poisoning silicon rubber |
| CN106497508A (en) * | 2016-11-03 | 2017-03-15 | 东莞兆舜有机硅科技股份有限公司 | A kind of high anti-poisoning add-on type casting glue and preparation method thereof |
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