[go: up one dir, main page]

CN106497508A - A kind of high anti-poisoning add-on type casting glue and preparation method thereof - Google Patents

A kind of high anti-poisoning add-on type casting glue and preparation method thereof Download PDF

Info

Publication number
CN106497508A
CN106497508A CN201610953358.5A CN201610953358A CN106497508A CN 106497508 A CN106497508 A CN 106497508A CN 201610953358 A CN201610953358 A CN 201610953358A CN 106497508 A CN106497508 A CN 106497508A
Authority
CN
China
Prior art keywords
poisoning
add
casting glue
type casting
methylvinyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610953358.5A
Other languages
Chinese (zh)
Inventor
胡国新
刘廷铸
黄献文
陈军
黄永军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Million Shun's Organosilicon Science And Technology Co Ltd
Original Assignee
Dongguan Million Shun's Organosilicon Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Million Shun's Organosilicon Science And Technology Co Ltd filed Critical Dongguan Million Shun's Organosilicon Science And Technology Co Ltd
Priority to CN201610953358.5A priority Critical patent/CN106497508A/en
Publication of CN106497508A publication Critical patent/CN106497508A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/206Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a kind of high anti-poisoning add-on type casting glue and preparation method thereof, wherein high anti-poisoning add-on type casting glue includes that two components of A and B, A groups are made up of the raw material of following mass percent:Methylvinyl-polysiloxane 20% ~ 40%, anti-denaturant 10% ~ 30%, methylhydrogenpolysi,oxane 5% ~ 30%, inorganic filler 20% ~ 60%, inorganic agent 0.01% ~ 1%, inhibitor 0.01% ~ 0.1%;B component is made up of the raw material of following mass percent:Methylvinyl-polysiloxane 20% ~ 40%, anti-denaturant 10% ~ 30%, inorganic filler 20% ~ 60%, inorganic agent 0.05% ~ 2%, catalyst 0.1% ~ 0.6%.High anti-poisoning add-on type embedding adhesiveness of the invention is little, good fluidity, without obvious not dry intoxicating phenomenon when in use, and completion of cure.

Description

A kind of high anti-poisoning add-on type casting glue and preparation method thereof
Technical field
The present invention relates to chemical material preparation technique field, more particularly to a kind of high anti-poisoning add-on type casting glue and its Preparation method.
Background technology
Existing casting glue has that viscosity is big, mobility is poor in use, the line of casting glue and welding assisted agent residuals Road boards solder point, baton round cell-shell contact position are susceptible to the phenomenon for not doing poisoning, cause embedding adhesive curing not exclusively, Jin Erying Ring bonding, the sealing property of electronic devices and components.
Content of the invention
For this purpose, the technical problem to be solved in the present invention is to overcome existing casting glue above shortcomings, and then provide one Plant high anti-poisoning add-on type casting glue and preparation method thereof.
For achieving the above object, the present invention is employed the following technical solutions:
A kind of high anti-poisoning add-on type casting glue, it is characterised in that:Including two components of A and B,
Wherein A groups are made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 20% ~ 40%
Anti- denaturant 10% ~ 30%
Methylhydrogenpolysi,oxane 5% ~ 30%
Inorganic filler 20% ~ 60%
Inorganic agent 0.01% ~ 1%
Inhibitor 0.01% ~ 0.1%
B component is made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 20% ~ 40%
Anti- denaturant 10% ~ 30%
Inorganic filler 20% ~ 60%
Inorganic agent 0.05% ~ 2%
Catalyst 0.1% ~ 0.6%.
Preferably, in the methylhydrogenpolysi,oxane, hydrogen content is 0.01% ~ 1%;The weight of the methylhydrogenpolysi,oxane is equal Molecular weight is 200 ~ 200000;The structural formula of the methylhydrogenpolysi,oxane is (R1)3SiO[R1R2SiO1/2]p[(R1)2SiO1/2]qSi(R1)3, wherein R1It is selected from-CH3、-CH2CH3Or-C6H5In any a kind, R2It is selected from-H ,-CH3, or-C6H5In any a kind, P and q are the integer more than 0.
Preferably, the contents of ethylene in the methylvinyl-polysiloxane in component A and B component is 0.1% ~ 3%; The weight average molecular weight of methylvinyl-polysiloxane is 500 ~ 200000;The structural formula of the methylvinyl-polysiloxane is: CH2=CHSi(R4)2O[(R5)2SiO1/2]a(R4)2SiCH=CH2
Wherein R4And R5It is respectively selected from-CH3、-CH2CH3Or-C6H5In any a kind or at least two, a be integer more than 0.
Preferably, the structural formula of the anti-denaturant is R6(R7)2SiO[(R6)2SiO1/2]bSi(R7)2R6, wherein R6Choosing From-CH3、-CH2CH3Or-C6H5In any a kind or at least two, R7It is selected from-CH=CH2、-CH2CH=CH2Or-CH2CH2CH=CH2 In any a kind or at least two, b be integer more than 0.
Preferably, 0.1 μm ~ 30 μm of the size scope of the inorganic filler.
Preferably, the inorganic filler is Titanium Dioxide, aluminium hydroxide, silicon dioxide, Calcium Carbonate, the one kind in aluminium oxide Or at least two.
Preferably, the inhibitor is selected from divinyl tetramethyl disiloxane, acetylene Hexalin, diallyl formyl Any a kind in amine, t etram-ethyltetravinylcyclotetrasiloxane, diallyl fumarate or at least 2 kinds of combination.
Preferably, the catalyst is platinum catalyst, and the platinum catalyst is the coordination thing or the chelate of platinum of platinum Mixture with organopolysiloxane.
Preferably, the inorganic agent be hexamethyldisiloxane, MTMS, ethyl trimethoxy silane, One kind in MTES, ethyl triethoxysilane or at least two.
A kind of preparation method of the high anti-poisoning add-on type casting glue described in any of the above-described, it is characterised in that:Will be high anti- The component A and B component in mass ratio 1 of poisoning add-on type casting glue:1 mixing and stirring, is made after drained bubble under vacuo.
Beneficial effects of the present invention:
Add-on type embedding adhesiveness is little, good fluidity for the high anti-poisoning of the present invention, the wiring board bumps of glue and welding assisted agent residuals, Baton round cell-shell is contacted, and without obvious not dry intoxicating phenomenon, completion of cure substantially increases dual composition addition type organic silicon potting adhesive The suitability in assist side and ball cell-shell.
Specific embodiment
Embodiment one
A kind of high anti-poisoning add-on type casting glue, it is characterised in that:Including two components of A and B,
Wherein A groups are made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 25.5
Anti- denaturant 10
Methylhydrogenpolysi,oxane 15
Inorganic filler 49
Inorganic agent 0.45
Inhibitor 0.05
B component:
Methylvinyl-polysiloxane 39.3
Anti- denaturant 10
Inorganic filler 50
Inorganic agent 0.5
Catalyst 0.2
By two components of above-mentioned A, B in mass ratio 1:1 mix homogeneously, under vacuo after drained bubble, product viscosity is little, mobility Good, the wiring board with welding assisted agent residuals is poured into, after glue room temperature is fully cured and 24h is placed, glue is contacted with wiring board Place is taken apart, invariably dry intoxicating phenomenon.
Wherein, in the methylhydrogenpolysi,oxane, hydrogen content is 0.01% ~ 1%;The methylhydrogenpolysi,oxane is divided equally again Son amount is 200 ~ 200000;The structural formula of the methylhydrogenpolysi,oxane is (R1)3SiO[R1R2SiO1/2]p[(R1)2SiO1/2]qSi (R1)3, wherein R1It is selected from-CH3、-CH2CH3Or-C6H5In any a kind, R2It is selected from-H ,-CH3, or-C6H5In any a kind, p and Q is the integer more than 0.
The contents of ethylene in the methylvinyl-polysiloxane in component A and B component is 0.1% ~ 3%;Methyl second The weight average molecular weight of thiazolinyl polysiloxanes is 500 ~ 200000;The structural formula of the methylvinyl-polysiloxane is:CH2= CHSi(R4)2O[(R5)2SiO1/2]a(R4)2SiCH=CH2
Wherein R4And R5It is respectively selected from-CH3、-CH2CH3Or-C6H5In any a kind or at least two, a be integer more than 0.
The structural formula of the anti-denaturant is R6(R7)2SiO[(R6)2SiO1/2]bSi(R7)2R6, wherein R6It is selected from-CH3、- CH2CH3Or-C6H5In any a kind or at least two, R7It is selected from-CH=CH2、-CH2CH=CH2Or-CH2CH2CH=CH2In any a kind Or at least two, b are the integer more than 0.
0.1 μm ~ 30 μm of the size scope of the inorganic filler.The inorganic filler be Titanium Dioxide, aluminium hydroxide, One kind in silicon dioxide, Calcium Carbonate, aluminium oxide or at least two.
The inhibitor is selected from divinyl tetramethyl disiloxane, acetylene Hexalin, diallyl formamide, tetramethyl Any a kind in tetravinyl cyclotetrasiloxane, diallyl fumarate or at least 2 kinds of combination.
The catalyst is platinum catalyst, and the platinum catalyst is that the chelate of the coordination thing or platinum of platinum is poly- with organic The mixture of siloxanes.
The inorganic agent is hexamethyldisiloxane, MTMS, ethyl trimethoxy silane, three second of methyl One kind in TMOS, ethyl triethoxysilane or at least two.
Embodiment two
Two components of A and B in the high anti-poisoning add-on type casting glue of the present embodiment can also adopt following charge ratio:
Wherein A groups are made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 40
Anti- denaturant 30
Methylhydrogenpolysi,oxane 30
Inorganic filler 60
Inorganic agent 1
Inhibitor 0.1
B component:
Methylvinyl-polysiloxane 40
Anti- denaturant 30
Inorganic filler 60
Inorganic agent 2
Catalyst 0.6
By two components of above-mentioned A, B in mass ratio 1:1 mix homogeneously, under vacuo after drained bubble, product viscosity is little, mobility Good, the wiring board with welding assisted agent residuals is poured into, after glue room temperature is fully cured and 24h is placed, glue is contacted with wiring board Place is taken apart, invariably dry intoxicating phenomenon.
Embodiment three
Two components of A and B in the high anti-poisoning add-on type casting glue of the present embodiment can also adopt following charge ratio:
Wherein A groups are made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 20
Anti- denaturant 10
Methylhydrogenpolysi,oxane 5
Inorganic filler 20
Inorganic agent 0.01
Inhibitor 0.01
B component:
Methylvinyl-polysiloxane 20
Anti- denaturant 10
Inorganic filler 20
Inorganic agent 0.05
Catalyst 0.1
By two components of above-mentioned A, B in mass ratio 1:1 mix homogeneously, under vacuo after drained bubble, product viscosity is little, mobility Good, the wiring board with welding assisted agent residuals is poured into, after glue room temperature is fully cured and 24h is placed, glue is contacted with wiring board Place is taken apart, invariably dry intoxicating phenomenon.
Example IV
Two components of A and B in the high anti-poisoning add-on type casting glue of the present embodiment can also adopt following charge ratio:
Wherein A groups are made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 30
Anti- denaturant 20
Methylhydrogenpolysi,oxane 25
Inorganic filler 40
Inorganic agent 0.6
Inhibitor 0.06
B component:
Methylvinyl-polysiloxane 30
Anti- denaturant 20
Inorganic filler 40
Inorganic agent 1
Catalyst 0.4
By two components of above-mentioned A, B in mass ratio 1:1 mix homogeneously, under vacuo after drained bubble, product viscosity is little, mobility Good, the wiring board with welding assisted agent residuals is poured into, after glue room temperature is fully cured and 24h is placed, glue is contacted with wiring board Place is taken apart, invariably dry intoxicating phenomenon.
Embodiment five
The present invention high anti-be poisoned add-on type casting glue preparation method be:By the component A of anti-for height poisoning add-on type casting glue and B Component in mass ratio 1:1 mixing and stirring, can be made into after drained bubble, its preparation method very simple under vacuo.Make Used time, only the high anti-add-on type casting glue of being poisoned for preparing need to be poured into wiring board with welding assisted agent residuals, treat that glue room temperature is complete After all solidstate and place 24h.After the high anti-poisoning add-on type casting glue of the present invention is fully cured, glue is contacted with wiring board Where take apart, it is possible to find dry intoxicating phenomenon invariably.And existing casting glue, under same testing conditions, contact scaling powder is residual There is the liquid of flowing where staying(It is poisoned).
Above-mentioned specific embodiment is simply explained in detail to technical scheme, the present invention not only only office Be limited to above-described embodiment, it will be understood by those skilled in the art that every according to above-mentioned principle and spirit on the basis of the present invention Improve, substitute, all should be within protection scope of the present invention.

Claims (10)

1. a kind of high anti-poisoning add-on type casting glue, it is characterised in that:Including two components of A and B,
Wherein A groups are made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 20% ~ 40%
Anti- denaturant 10% ~ 30%
Methylhydrogenpolysi,oxane 5% ~ 30%
Inorganic filler 20% ~ 60%
Inorganic agent 0.01% ~ 1%
Inhibitor 0.01% ~ 0.1%
B component is made up of the raw material of following mass percent:
Methylvinyl-polysiloxane 20% ~ 40%
Anti- denaturant 10% ~ 30%
Inorganic filler 20% ~ 60%
Inorganic agent 0.05% ~ 2%
Catalyst 0.1% ~ 0.6%.
2. height according to claim 1 anti-poisoning add-on type casting glue, it is characterised in that:The methylhydrogenpolysi,oxane In, hydrogen content is 0.01% ~ 1%;The weight average molecular weight of the methylhydrogenpolysi,oxane is 200 ~ 200000;The poly- silicon of the methyl hydrogen The structural formula of oxygen alkane is (R1)3SiO[R1R2SiO1/2]p[(R1)2SiO1/2]qSi(R1)3, wherein R1It is selected from-CH3、-CH2CH3Or- C6H5In any a kind, R2It is selected from-H ,-CH3, or-C6H5In any a kind, p and q is the integer more than 0.
3. height according to claim 1 anti-poisoning add-on type casting glue, it is characterised in that:Described in component A and B component Contents of ethylene in methylvinyl-polysiloxane is 0.1% ~ 3%;The weight average molecular weight of methylvinyl-polysiloxane is 500 ~200000;The structural formula of the methylvinyl-polysiloxane is: CH2=CHSi(R4)2O[(R5)2SiO1/2]a(R4)2SiCH= CH2
Wherein R4And R5It is respectively selected from-CH3、-CH2CH3Or-C6H5In any a kind or at least two, a be integer more than 0.
4. height according to claim 1 anti-poisoning add-on type casting glue, it is characterised in that:The structural formula of the anti-denaturant For R6(R7)2SiO[(R6)2SiO1/2]bSi(R7)2R6, wherein R6It is selected from-CH3、-CH2CH3Or-C6H5In any a kind or at least two Kind, R7It is selected from-CH=CH2、-CH2CH=CH2Or-CH2CH2CH=CH2In any a kind or at least two, b be integer more than 0.
5. height according to claim 1 anti-poisoning add-on type casting glue, it is characterised in that:The particle diameter of the inorganic filler is big 0.1 μm ~ 30 μm of small range.
6. height according to claim 5 anti-poisoning add-on type casting glue, it is characterised in that:The inorganic filler is titanium dioxide One kind in titanium, aluminium hydroxide, silicon dioxide, Calcium Carbonate, aluminium oxide or at least two.
7. height according to claim 1 anti-poisoning add-on type casting glue, it is characterised in that:The inhibitor is selected from divinyl Base tetramethyl disiloxane, acetylene Hexalin, diallyl formamide, t etram-ethyltetravinylcyclotetrasiloxane, fumaric acid two Any a kind in allyl ester or at least 2 kinds of combination.
8. height according to claim 1 anti-poisoning add-on type casting glue, it is characterised in that:The catalyst is catalyzed for platinum Agent, mixture of the platinum catalyst for the chelate and organopolysiloxane of the coordination thing or platinum of platinum.
9. height according to claim 1 anti-poisoning add-on type casting glue, it is characterised in that:The inorganic agent is hexamethyl two In silazane, MTMS, ethyl trimethoxy silane, MTES, ethyl triethoxysilane One kind or at least two.
10. described in a kind of any one of claim 1-8 high anti-poisoning add-on type casting glue preparation method, it is characterised in that: Component A and B component in mass ratio 1 by anti-for height poisoning add-on type casting glue:1 mixing and stirring, under vacuo after drained bubble Make.
CN201610953358.5A 2016-11-03 2016-11-03 A kind of high anti-poisoning add-on type casting glue and preparation method thereof Pending CN106497508A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610953358.5A CN106497508A (en) 2016-11-03 2016-11-03 A kind of high anti-poisoning add-on type casting glue and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610953358.5A CN106497508A (en) 2016-11-03 2016-11-03 A kind of high anti-poisoning add-on type casting glue and preparation method thereof

Publications (1)

Publication Number Publication Date
CN106497508A true CN106497508A (en) 2017-03-15

Family

ID=58321456

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610953358.5A Pending CN106497508A (en) 2016-11-03 2016-11-03 A kind of high anti-poisoning add-on type casting glue and preparation method thereof

Country Status (1)

Country Link
CN (1) CN106497508A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107286861A (en) * 2017-06-08 2017-10-24 仲恺农业工程学院 Pouring sealant anti-poisoning agent and heat-conducting pouring sealant
CN111234771A (en) * 2019-05-24 2020-06-05 深圳市鑫东邦科技有限公司 Single-component addition type silicone gel and preparation method thereof
WO2025097279A1 (en) * 2023-11-06 2025-05-15 Dow Silicones Corporation Silicone pottant composition, process and use thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824224A (en) * 2010-04-15 2010-09-08 同济大学 Preparation method of anti-poisoning silicon rubber
CN105038694A (en) * 2015-08-12 2015-11-11 东莞兆舜有机硅科技股份有限公司 A two-component addition type silicone adhesive potting glue and its application method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824224A (en) * 2010-04-15 2010-09-08 同济大学 Preparation method of anti-poisoning silicon rubber
CN105038694A (en) * 2015-08-12 2015-11-11 东莞兆舜有机硅科技股份有限公司 A two-component addition type silicone adhesive potting glue and its application method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
杨维生等: "电子工业封装用硅橡胶的研究", 《热固性树脂》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107286861A (en) * 2017-06-08 2017-10-24 仲恺农业工程学院 Pouring sealant anti-poisoning agent and heat-conducting pouring sealant
CN111234771A (en) * 2019-05-24 2020-06-05 深圳市鑫东邦科技有限公司 Single-component addition type silicone gel and preparation method thereof
WO2025097279A1 (en) * 2023-11-06 2025-05-15 Dow Silicones Corporation Silicone pottant composition, process and use thereof

Similar Documents

Publication Publication Date Title
CN105038694B (en) A kind of dual composition addition type organosilicon bonding casting glue and its application method
TW438860B (en) Curable resin composition and cured products
CN101490829B (en) Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device
CN103087665B (en) High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof
KR100552877B1 (en) Sealing Materials for Flip Chip Semiconductor Devices and Flip Chip Semiconductor Devices
CN102942895B (en) A kind of heat conductive electronic pouring sealant and preparation method thereof
MY145804A (en) Underfill composition and package solid state device
CN107286897A (en) A kind of Single-component low-viscosity dealcoholized type organic silicon potting adhesive and preparation method thereof
CN106497508A (en) A kind of high anti-poisoning add-on type casting glue and preparation method thereof
CN104073215A (en) Preparation method for nano silicon dioxide modified organic silicon sealant for packaging of light emitting diode (LED)
JPH0751624A (en) Method of application using molten organosiloxane composition
CN1970623B (en) Liquid epoxy resin composition
JP3773022B2 (en) Flip chip type semiconductor device
JP4176619B2 (en) Flip chip mounting side fill material and semiconductor device
CN101440266B (en) Surface mount adhesive for surface mount technology and preparation method thereof
CN109467942A (en) Resin combination, resin film, semiconductor layer stack, the manufacturing method of the manufacturing method of semiconductor layer stack and semiconductor device
CN104293267B (en) Casting glue of C level electric welding machine modifying epoxy resin by organosilicon and preparation method thereof
JP3674675B2 (en) Underfill material for flip chip type semiconductor devices
CN100475926C (en) Adhesive resin composition, adhesive in film form, and semiconductor device using same
JP2008222961A (en) Liquid epoxy resin composition and flip chip type semiconductor device
KR100983096B1 (en) Underfill Hybrid Epoxy Compositions Having Improved Moisture Resistance and Fluidity
CN115305050A (en) Adhesive addition type organic silicon composition and preparation method thereof
JP2023139659A (en) Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor devices
KR100797614B1 (en) Liquid epoxy resin composition for semiconductor device underfill and semiconductor device using the same
CN118931486B (en) Organosilicon gel composition and preparation method and application thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170315

RJ01 Rejection of invention patent application after publication