CN107074635B - 带膜的玻璃板、触摸传感器、膜、以及带膜的玻璃板的制造方法 - Google Patents
带膜的玻璃板、触摸传感器、膜、以及带膜的玻璃板的制造方法 Download PDFInfo
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- CN107074635B CN107074635B CN201580052760.XA CN201580052760A CN107074635B CN 107074635 B CN107074635 B CN 107074635B CN 201580052760 A CN201580052760 A CN 201580052760A CN 107074635 B CN107074635 B CN 107074635B
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- film
- glass plate
- stacked
- metal film
- glass
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- 239000011521 glass Substances 0.000 title claims abstract description 127
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 97
- 239000002184 metal Substances 0.000 claims abstract description 97
- 239000011248 coating agent Substances 0.000 claims abstract description 47
- 238000000576 coating method Methods 0.000 claims abstract description 47
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 238000007747 plating Methods 0.000 claims description 34
- 229910052759 nickel Inorganic materials 0.000 claims description 24
- 238000007772 electroless plating Methods 0.000 claims description 14
- 238000005868 electrolysis reaction Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000007888 film coating Substances 0.000 claims 1
- 238000009501 film coating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 18
- 238000005530 etching Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 12
- 238000007740 vapor deposition Methods 0.000 description 12
- 238000002310 reflectometry Methods 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- FWFGVMYFCODZRD-UHFFFAOYSA-N oxidanium;hydrogen sulfate Chemical compound O.OS(O)(=O)=O FWFGVMYFCODZRD-UHFFFAOYSA-N 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- SDLBJIZEEMKQKY-UHFFFAOYSA-M silver chlorate Chemical compound [Ag+].[O-]Cl(=O)=O SDLBJIZEEMKQKY-UHFFFAOYSA-M 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910003767 Gold(III) bromide Inorganic materials 0.000 description 1
- 240000000233 Melia azedarach Species 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- JEOOVNWNJKBHRG-UHFFFAOYSA-N [Na+].[S--].[S--].[Au+3] Chemical compound [Na+].[S--].[S--].[Au+3] JEOOVNWNJKBHRG-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- XCJXQCUJXDUNDN-UHFFFAOYSA-N chlordene Chemical compound C12C=CCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl XCJXQCUJXDUNDN-UHFFFAOYSA-N 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- OVWPJGBVJCTEBJ-UHFFFAOYSA-K gold tribromide Chemical compound Br[Au](Br)Br OVWPJGBVJCTEBJ-UHFFFAOYSA-K 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- NDBYXKQCPYUOMI-UHFFFAOYSA-N platinum(4+) Chemical compound [Pt+4] NDBYXKQCPYUOMI-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
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- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3671—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use as electrodes
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- C—CHEMISTRY; METALLURGY
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03C17/3642—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating containing a metal layer
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- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
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- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
-
- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/25—Metals
- C03C2217/251—Al, Cu, Mg or noble metals
- C03C2217/253—Cu
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
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- C03C2217/251—Al, Cu, Mg or noble metals
- C03C2217/254—Noble metals
- C03C2217/256—Ag
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
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- C03C2217/261—Iron-group metals, i.e. Fe, Co or Ni
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/115—Deposition methods from solutions or suspensions electro-enhanced deposition
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
- C03C2218/33—Partly or completely removing a coating by etching
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- G—PHYSICS
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- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
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Abstract
带膜的玻璃板(1)中，层叠多张膜而成的层叠膜(2)形成在玻璃板(3)上。层叠膜(2)具备形成在玻璃板(3)上且至少包含贵金属的无机物膜(4)、形成在无机物膜上的镀敷金属膜(5)、以及形成在镀敷金属膜(5)上的金属膜(6)。层叠膜(2)在从玻璃板(3)侧观察时为黑色。
Description
技术领域
本发明涉及带膜的玻璃板、触摸传感器、膜、以及带膜的玻璃板的制造方法。
背景技术
众所周知，近年来随着电子设备等的发展，使用下述的多种玻璃板：液晶显示器、等离子体显示器、场发射显示器(包括表面发射显示器)以及电致发光显示器等平板显示器(FPD)、传感器的基板；或者固体摄像元件、激光二极管等的半导体封装用罩；以及薄膜化合物太阳能电池的基板等。
然而，例如在电视、个人电脑、智能手机等所使用的显示装置中，在将在玻璃板等透明基材上形成有电极的构件以透明基材侧成为用户侧的方式配置在画面上的情况下，存在电极被用户看到的情况和产生图像的黑色浮现的现象的可能性。进而，为了解决这样的问题，提出了使电极的透明基材侧黑色化(例如专利文献1)。
在先技术文献
专利文献
专利文献1：日本特开2014-89689号公报
发明所要解决的课题
另一方面，作为为了在玻璃板上制作电极而在玻璃板上形成金属膜时所使用的方法，一般可以举出蒸汽沉积、溅射等。
然而，在蒸汽沉积、溅射中，需要减压环境的情况较多，制造设备大规模化从而制造成本高昂。另外，在蒸汽沉积、溅射中，玻璃板的周围成为高温的情况较多，因此在玻璃板和金属膜中产生应力，由此金属膜可能会剥离。另外，在蒸汽沉积、溅射中，所形成的金属膜的表面粗糙度也可能会变大。
发明内容
本发明鉴于上述情况，其技术课题是提供能够不使用蒸汽沉积、溅射地进行制造，且具备金属膜的膜在从玻璃板侧观察时为黑色的带膜的玻璃板、膜、以及带膜的玻璃板的制造方法。
用于解决课题的方案
为了解决前述课题而完成的本发明的带膜的玻璃板是将层叠多张膜而成的层叠膜形成在玻璃板上的带膜的玻璃板，其特征在于，所述层叠膜具备形成在所述玻璃板上且至少包含贵金属的无机物膜、以及形成在该无机物膜上的镀敷金属膜，所述层叠膜在从所述玻璃板侧观察时为黑色。
在该构成中，金属膜通过镀敷形成，因此能够不使用蒸汽沉积、溅射地形成具备金属膜的层叠膜。因此，制造中不需要减压环境从而不需要大规模的制造设备，能够控制制造成本。另外，在处理中，玻璃板的周围不会成为高温，不会产生热引起的玻璃板和金属板中的应力，由此能够抑制金属膜剥离。另外，金属膜通过镀敷形成，因此与蒸汽沉积、溅射相比，能够减小金属膜的表面粗糙度。这样，根据本发明的带膜的玻璃板，可提供能够不使用蒸汽沉积、溅射地进行制造，且具备金属膜的膜在从玻璃板侧观察时为黑色的带膜的玻璃板。
在该构成中，层叠膜在从玻璃板侧观察时成为黑色的理由虽然还不十分明确，但例如可以作以下思考。仅为在玻璃板上形成且包含贵金属的无机物膜在从玻璃板侧观察时为浓重的红色。然后，在该无机物膜上形成镀敷金属膜后，层叠膜在从玻璃板侧观察时成为黑色。由此可以认为，无机物膜中的贵金属与镀敷金属膜中的金属发生某些反应而产生的化合物(例如溴化金、氯化银、氯化铂、氯化钯、氧化钌等)导致从玻璃板侧观察时成为黑色。
在上述构成中，所述镀敷金属膜优选通过非电解镀形成。
根据该构成，由于能够将包含贵金属的无机物膜作为非电解镀的催化剂，因此能够通过非电解镀来容易地形成镀敷金属膜。
在上述构成中，所述层叠膜优选还具备在所述镀敷金属膜上通过电解镀形成的金属膜。
根据该构成，电解镀与非电解镀相比，金属膜的形成速度快，因此能够效率良好形成层叠膜的金属膜部分。
在上述构成中，通过非电解镀形成的所述镀敷金属膜优选由铜或镍构成。
根据该构成，铜或镍由于是能够进行微细蚀刻的金属材料，因此对于层叠膜能够进行微细蚀刻。
在上述的任一构成中，所述玻璃板的板厚优选为300μm以下。
根据该构成，玻璃板具有挠性，因此能够在画面为曲面的显示器等电子设备中使用。
在上述的任一构成中，若所述层叠膜被加工为触摸传感器用的电极形状，则该带膜的玻璃板适用于触摸传感器。另外，以具备该构成的带膜的玻璃板为特征的触摸传感器也能够解决所述课题。
另外，为了解决所述课题而完成的本发明的膜的特征在于，该膜具备形成在玻璃板上且至少包含贵金属的无机物膜、以及形成在该无机物膜上的镀敷金属膜，该膜在从所述玻璃板侧观察时为黑色。
根据该构成，能够取得和开头说明的带膜的玻璃板实质上相同的作用效果。
另外，为了解决所述课题而完成的本发明的带膜的玻璃板的制造方法是将层叠多张膜而成的层叠膜形成在玻璃板上的带膜的玻璃板的制造方法，其特征在于，在所述玻璃板上形成至少包含贵金属的无机物膜后，在该无机物膜上形成镀敷金属膜，由此形成所述层叠膜，所述层叠膜在从所述玻璃板侧观察时为黑色。
根据该构成，能够取得和开头说明的带膜的玻璃板实质上相同的作用效果。
发明效果
如以上那样，根据本发明，可提供能够不使用蒸汽沉积、溅射地进行制造，且具备金属膜的膜在从玻璃板侧观察时为黑色的带膜的玻璃板、膜、以及带膜的玻璃板的制造方法。
附图说明
图1是示出本发明的第一实施方式的带膜的玻璃板的剖视图。
图2是示出从玻璃板侧对层叠膜的反射率逐波长进行测定的结果的剖视图。
图3是示出本发明的第二实施方式的带膜的玻璃板的剖视图。
具体实施方式
以下，基于附图对本发明的实施方式进行说明。
图1是示出本发明的第一实施方式的带膜的玻璃板的剖视图。在该带膜的玻璃板1中，层叠多张膜而成的层叠膜2形成在玻璃板3上。层叠膜2具备形成在玻璃板3上且至少包含贵金属的无机物膜4、以及形成在无机物膜4上的镀敷金属膜5。而且，层叠膜2在从玻璃板3侧观察时为黑色。作为贵金属，例如可以举出金、银、铂、钯、钌等。
在本实施方式中，镀敷金属膜5通过以无机物膜4作为催化剂的非电解镀形成。另外，层叠膜2还具备通过电解镀形成在镀敷金属膜5上的金属膜6。
玻璃板3的材料并没有特别限定，例如可以举出碱石灰玻璃、无碱玻璃等，另外，也可以是被用作强化玻璃的铝硅酸盐玻璃。
玻璃板3的板厚也没有特别限定，例如为10μm～300μm，优选为20μm～200μm，最优选为50～100μm。在玻璃板3的板厚不足10μm的情况下，由于镀敷金属膜5的应力，玻璃板可能会翘曲或者起皱。另外，在玻璃板3的板厚超过300μm的情况下，由于玻璃板3的挠性几乎消失，因此可能无法在画面为曲面的显示器等电子设备中使用。
作为至少包含贵金属的无机物膜4，例如可以举出对容易吸附于玻璃板3的氯化锡、氯化锌、氯化铜等赋予亚硫酸金钠、氯化银、六水合六氯铂(IV)酸、氯化钯、氯化钌等的膜。无机物膜4除了上述贵金属以外，例如也可以包含镍、钴、铜等成为非电解镀的催化剂的金属。在本实施方式中，无机物膜4例如如以下那样形成。将玻璃板3浸渍于包含锡、锌、铜中的一种或多种以上的溶液中，使它们的金属离子吸附于玻璃板3的表面，接着将其浸渍于包含贵金属的水溶液中。由此，通过离子化倾向的差异，锡、锌、铜等金属离子与贵金属离子置换，在玻璃板3上形成以贵金属或贵金属化合物为主要成分的膜。然后，将形成有该膜的玻璃板3浸渍于还原性溶液中。由此，将膜的表面附近的贵金属还原，使之成为具有非电解镀的催化作用的状态。像这样形成的无机物膜4是能够通过铜、镍的蚀刻液来蚀刻的物质。
无机物膜4的膜厚例如为0.07μm～1.0μm，更优选为0.1μm～0.7μm，最优选为0.2μm～0.5μm。在无机物膜4的膜厚不足0.07μm的情况下，非电解镀的镀敷速度可能会变得非常慢。在无机物膜4的膜厚超过1.0μm的情况下，在从玻璃板3侧观察层叠膜2时，由于无机物膜4所具有的红色的影响而可能不会成为黑色。
镀敷金属膜5并没有特别限定，但铜或镍是能够进行微细蚀刻的金属材料，基于这一观点而优选为铜或镍。铜的电阻低，在非电解镀中膜的均匀性良好。另外，镍与铜相比具有反射率低(黑)的优点，适合面积小的显示装置。另外，非电解镀镍电具有对无机物膜4的密接性良好的优点。
镀敷金属膜5的膜厚例如为0.05μm～5.0μm，更优选为0.1μm～1.0μm，最优选为0.2～0.5μm。在镀敷金属膜5的膜厚不足0.05μm的情况下，在从玻璃板3侧观察层叠膜2时，可能不会成为黑色。在镀敷金属膜5的膜厚超过5.0μm的情况下，成膜花费时间，生产效率可能会降低。
金属膜6并没有特别限定，但考虑到作为电极的用途而优选电阻低，基于该观点而优选铜和镍。非电解镀层以及电解镀铜的体积电阻率为3μΩ·cm，电解镀镍的体积电阻率为8μΩ·cm。另外，如上所述，铜或镍是能够进行微细蚀刻的金属材料，基于这一观点也优选铜或镍。
金属膜6的膜厚例如为0.1μm～5.0μm，更优选为0.3μm～3.0μm，最优选为0.5～2.0μm。在金属膜6的膜厚不足0.1μm的情况下，可能无法充分地得到金属膜6的特长。在金属膜6的膜厚超过5.0μm的情况下，制造成本可能会增加。
在由非电解镀铜构成镀敷金属膜5且由电解镀铜构成金属膜6的情况下，能够以短时间得到膜厚均匀性良好的低电阻率的层叠膜2。另外，虽然能够由非电解镀镍构成镀敷金属膜5且由电解镀镍构成金属膜6，但若由非电解镀镍构成镀敷金属膜5且由电解镀铜构成金属膜6，则能够进一步降低层叠膜2的电阻率。
在由非电解镀铜构成镀敷金属膜5且由非电解镀铜构成金属膜6的情况下，由于均由铜构成，因此基于蚀刻的微细加工变得容易。
在由非电解镀铜构成金属膜5且由非电解镀镍或电解镀镍构成金属膜6的情况下，由于表面由镍构成，因此耐蚀性好。
在由非电解镀镍构成镀敷金属膜5且由电解镀铜构成金属膜6的情况下，由于能够使用低廉的镀敷浴，因此能够低廉且生产率良好地形成低电阻的层叠膜2。
在由非电解镀镍构成镀敷金属膜5且由非电解镀铜构成金属膜6的情况下，能够形成膜厚均匀性良好的层叠膜2。另外，即使使用低廉的硫酸铜水溶液作为镀敷浴，镀敷金属膜5也不会变质，与无机物膜4之间的密接性也不会降低。
在由非电解镀镍构成镀敷金属膜5且由非电解镀镍或电解镀镍构成金属膜6的情况下，由于均由镍构成，因此基于蚀刻的微细加工变得容易。另外，由于表面由镍构成，因此耐蚀性好。
图2是示出从玻璃板3侧对层叠膜2的反射率逐波长进行测定的结果的图。需要说明的是，该测定所使用的层叠膜2是由形成在玻璃板3上且包含银的无机物膜4、以及形成在无机物膜4上的镀敷金属膜5构成的层叠膜(在图1中未形成金属膜6)，镀敷金属膜5是非电解镀镍。此外，该图的反射率是将来自玻璃板3与空气的界面的4％左右的反射光去除之后的反射率。
实线所示的数据为层叠膜2的反射率，虚线所示的数据为用于比较的铜的反射率。可知与铜的反射率相比，层叠膜2的反射率低，为10％以下，且波长引起的反射率之差小。因此，能够理解层叠膜2在从玻璃板3侧观察时为黑色，在用作配置在画面上的电极的情况下，对被用户看到的情况和图像的黑色浮现等现象的抑制的效果大。
需要说明的是，层叠膜2的反射率优选为30％以下，最优选为10％以下。
在如以上那样构成的本实施方式的带膜的玻璃板3中，能够享有以下效果。
能够不使用蒸汽沉积、溅射地形成具备镀敷金属膜5、金属膜6的层叠膜2。因此，制造中不需要减压环境从而不需要大规模的制造设备，能够抑制制造成本。另外，在处理中，玻璃板3的周围不会成为高温，不会产生热引起的玻璃板3与镀敷金属膜5、金属膜6中的应力，由此能够抑制镀敷金属膜5、金属膜6剥离。另外，镀敷金属膜5、金属膜6通过镀敷形成，因此与蒸汽沉积、溅射相比，能够减小镀敷金属膜5、金属膜6的表面粗糙度。这样，根据本实施方式，可提供能够不使用蒸汽沉积、溅射地进行制造，且具备镀敷金属膜5、金属膜6的层叠膜2在从玻璃板3侧观察时为黑色的带膜的玻璃板3。
另外，在由铜或镍构成镀敷金属膜5与金属膜6的情况下，无机物膜4能够与镀敷金属膜5和金属膜6一起通过相同的蚀刻液统一蚀刻。由此，在对层叠膜2进行基于蚀刻的加工的情况下，能够提高加工精度，另外能够提高生产效率。另外，在进行蚀刻的情况下，连无机物膜4也能够以无残渣的方式被蚀刻，因此在被蚀刻的位置，玻璃板3露出，在光透射时不会发生光散射，能够得到良好的光学特性。
接下来，对本发明的第二实施方式的带膜的玻璃板3进行说明。
如图3所示，在本实施方式中，在玻璃板3的两面形成有层叠膜2、2。本实施方式的带膜的玻璃板3的层叠膜2、2被加工成触摸传感器用的电极形状，详细而言，层叠膜2、2通过蚀刻而图案化(加工)，成为触摸传感器用的电极的形状。层叠膜2、2成为所谓的网眼型电极图案。换言之，层叠膜2、2在玻璃板3的两面，分别以俯视观察时多个层叠膜隔开间隔而并列的方式呈直线状延伸。而且，俯视观察时，玻璃板3的一面侧的层叠膜2与另一面侧的层叠膜2正交。
在本实施方式中，层叠膜2、2的镀敷金属膜5、5为非电解镀铜膜，层叠膜2、2的金属膜6、6为电解镀铜。而且，在金属膜6、6的表面形成有黑色的氧化铜被膜7、7。因此，在从任一面侧观察玻璃板3的情况下，层叠膜2、2均为黑色。因此，在将玻璃板3的任一面配置于用户侧的情况下，都能够取得抑制电极被用户看到的情况、和图像的黑色浮现现象的效果。
如本实施方式那样，在玻璃板3的两面形成有方向不同的直线状的电极的情况下，可能会产生莫尔条纹不均。但是，若将玻璃板3的板厚设定在例如200μm以下，则玻璃板3的两面的电极图案的网眼对齐精度提高，从而难以产生莫尔条纹不均。若将玻璃板3的板厚进一步设定为100μm以下，则玻璃板3的两面的电极图案的网眼对齐精度进一步提高。而且，倾斜观察时的视差也变小，由此能够在显示器整面范围内在像素与像素之间配置电极，能够得到触摸传感器的电极图案的开口率的损耗变少的优势。
另外，玻璃板3与树脂膜相比没有膨胀、收缩，没有因从外部施加的力所引起的伸张、褶皱，能够精度良好地形成网眼型电极图案。尤其在如本实施方式那样在玻璃板3的两面形成有电极的情况下，该效果变得明显。与该效果相结合，在光刻工序中不进行两面的同时曝光，而将一面在图案化后翻转且使之与已形成的图案进行网眼对齐并将另一面图案化，由此实现高精度的对位。
另外，如本实施方式那样，在带膜的玻璃板1用于触摸传感器的情况下，为抑制画质的降低，电极的宽度需要微细至例如3μm，从而要求高精度的蚀刻。与此相对，由于铜和镍均为能够通过加水硫酸的液体蚀刻的材料，因此若由铜或镍构成镀敷金属膜5和金属膜6，则能够通过由相同的蚀刻液进行一并蚀刻来提高加工精度。
实施例1
本申请的发明人等关于本发明的带膜的玻璃板评价了其层叠膜的加工性。
评价对象的带膜的玻璃板使用日本电气硝子公司制OA-10G(板厚200μm)作为玻璃板。在该玻璃板的一面形成了由无机物膜、镀敷金属膜以及金属膜构成的层叠膜。无机物膜通过上述的方法形成。镀敷金属膜为非电解镀镍且膜厚为0.4μm，金属膜为电解镀铜且膜厚为3μm。
对于上述带膜的玻璃板的层叠膜，如以下那样使用光刻法进行图案化。将电解镀铜的表面利用丙酮进行超声波清洗，然后用异丙醇置换后进行水洗，并旋转干燥。接下来，在电解镀铜的表面用AZ公司制AZ1500旋涂光致抗蚀剂。在光致抗蚀剂的涂布后，在热板上以100℃进行了90秒钟的预烘焙。接下来，通过接触式曝光机进行掩模图案曝光。显影利用东京应化制NMD-3的TMAH碱液进行。然后，对其进行水洗，在干燥后以120℃进行2分钟的后烘焙，由此完成作为蚀刻掩模的抗蚀剂图案。
在蚀刻中，首先利用加水硫酸液对铜和镍膜进行蚀刻。在本实施例中，作为加水硫酸液的组成，使用了过氧化氢浓度为1.5％、硫酸浓度为5％的水溶液。将该溶液加热至60℃并进行蚀刻。以3分钟完成了层叠膜的蚀刻。在该加水硫酸液中，无机物膜的蚀刻速度慢，因此使用三菱气体化学制铜的蚀刻液CPB-40N进行无机物膜的蚀刻。具体而言，若浸渍于将CPB-40N用水稀释10倍的溶液加热至60℃的液体，则以90秒，玻璃板变得透明，实现了无残渣地蚀刻。
本发明并不限定于上述说明，在其技术思想的范围内能够进行各种变形。例如，在上述实施方式中，层叠膜除了具备无机物膜以及镀敷金属膜之外，还具备通过电解镀形成的金属膜，但也可以不具备该金属膜。另外，在上述实施方式中，带膜的玻璃板的层叠膜作为电极而被使用，但也可以仅作为外观黑色的板而用于装饰等。
附图标记说明
1 带膜的玻璃板
2 层叠膜
3 玻璃板
4 无机物膜
5 镀敷金属膜
6 金属膜
Claims (9)
1.一种带膜的玻璃板，其是将层叠多张膜而成的层叠膜形成在玻璃板上的带膜的玻璃板，其特征在于，
所述层叠膜具备形成在所述玻璃板上且至少包含贵金属的无机物膜、以及形成在该无机物膜上的镀敷金属膜，
所述层叠膜在从所述玻璃板侧观察时为黑色。
2.根据权利要求1所述的带膜的玻璃板，其特征在于，
所述镀敷金属膜通过非电解镀形成。
3.根据权利要求2所述的带膜的玻璃板，其特征在于，
所述层叠膜还具备在所述镀敷金属膜上通过电解镀形成的金属膜。
4.根据权利要求2或3所述的带膜的玻璃板，其特征在于，
通过非电解镀形成的所述镀敷金属膜由铜或镍构成。
5.根据权利要求1至3中任一项所述的带膜的玻璃板，其特征在于，
所述玻璃板的板厚为300μm以下。
6.根据权利要求1至3中任一项所述的带膜的玻璃板，其特征在于，
所述层叠膜被加工为触摸传感器用的电极形状。
7.一种触摸传感器，其特征在于，
具备权利要求6所述的带膜的玻璃板。
8.一种膜，其特征在于，
该膜具备形成在玻璃板上且至少包含贵金属的无机物膜、以及形成在该无机物膜上的镀敷金属膜，
该膜在从所述玻璃板侧观察时为黑色。
9.一种带膜的玻璃板的制造方法，其是将层叠多张膜而成的层叠膜形成在玻璃板上的带膜的玻璃板的制造方法，其特征在于，
在所述玻璃板上形成至少包含贵金属的无机物膜后，在该无机物膜上形成镀敷金属膜，由此形成所述层叠膜，
所述层叠膜在从所述玻璃板侧观察时为黑色。
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