CN107017857A - A kind of ceramic low pass filter of miniature multilayer - Google Patents
A kind of ceramic low pass filter of miniature multilayer Download PDFInfo
- Publication number
- CN107017857A CN107017857A CN201710361580.0A CN201710361580A CN107017857A CN 107017857 A CN107017857 A CN 107017857A CN 201710361580 A CN201710361580 A CN 201710361580A CN 107017857 A CN107017857 A CN 107017857A
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- electric capacity
- inductance
- low pass
- pass filter
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- 239000000919 ceramic Substances 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000010923 batch production Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0153—Electrical filters; Controlling thereof
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- Filters And Equalizers (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The present invention relates to a kind of ceramic low pass filter of miniature multilayer, including being laminated the layered product constituted and the filter circuit in layered product by multilayer dielectric substrate, mutually it is connected by conduction band and via between adjacent media substrate and is turned on, at least there is a ground plane in the medium substrate, its surface is provided with input, output end, the filter circuit includes inductance L2, L4, L6 and electric capacity C1, C2, C3, inductance L2 is in parallel with electric capacity C2, its parallel connected end is respectively a ends and b ends, one end of the inductance L6 is connected with inductance L4, its other end is connected with output end, electric capacity C1 one end is connected with a ends, electric capacity C1 other end ground connection, electric capacity C3 one end is connected with b ends, electric capacity C3 other end ground connection.Low pass filter of the present invention, small volume, lightweight, superior performance, cost are low, be adapted to batch production, can be processed into the form of paster, be easy to integrated in microwave system.
Description
Technical field
The present invention relates to a kind of low pass filter, and in particular to a kind of ceramic low pass filter of miniature multilayer.
Background technology
Low pass filter is the important passive device of radio-frequency front-end.One excellent low pass filter should have low band
Internal loss, deep Out-of-band rejection, wide stopband suppresses scope, it is also desirable to volume as small as possible.Traditional LPF
Device uses planar structure, and area occupied is larger, it is impossible to meet the miniature requirement of radio-frequency front-end, while traditional low pass filter
It is more difficult integrated.
In order to meet the small form factor requirements of device, initial method is to use high-k, high quality factor, low-loss
Dielectric material, reduce resonator size, and then reduce device volume.But traditional technology can not be effective
Reduce the dimensioned area of device.
The content of the invention
It is an object of the invention to provide a kind of ceramic low pass filter of miniature multilayer, carried out by inductance and capacity cell
It is three-dimensionally integrated, reduce the area of plane of wave filter.
To achieve the above object, present invention employs following technical scheme：
A kind of ceramic low pass filter of miniature multilayer, including the layered product constituted is laminated by multilayer dielectric substrate and located at layered product
In filter circuit, be mutually connected conducting by conduction band and via between adjacent media substrate, at least had in the medium substrate
Have a ground plane, its surface is provided with input, output end, the filter circuit include inductance L2, L4, L6 and electric capacity C1, C2,
C3, the inductance L2 is in parallel with electric capacity C2, and its parallel connected end is respectively a ends being connected with input and the b being in series with inductance L4
End, one end of the inductance L6 is connected with inductance L4, and its other end is connected with output end, and electric capacity C1 one end is connected with a ends, electricity
Hold C1 other end ground connection, electric capacity C3 one end is connected with b ends, electric capacity C3 other end ground connection.
The medium substrate uses LTCC ceramic substrates.
The lower surface of the lowermost layer of the medium substrate is provided with metal ground plane, and the metal ground plane is connected by side plate with ground
Connect.
Described inductance L2, L4, L6 are the spiral inductance by the metal conduction band formation on medium substrate.
As shown from the above technical solution, the ceramic low pass filter of miniature multilayer of the present invention, small volume is lightweight,
Superior performance, cost is low, is adapted to batch production, can be processed into the form of paster, be easy to integrated in microwave system.Separately
Outside, the present invention realizes the out-of-band transmission zero point of upper frequency, and then realize wide Out-of-band rejection, the stopband suppression of effective broadening
Frequency range processed；Manufacture work is simplified, is played an important role for reduction manufacturing cost and lifting yield rate；To in Jie
In the case that electric constant can not be lifted further or ceramic chips thickness can not further reduce, low pass filter working frequency is dragged down
There is corresponding reference value.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the medium substrate stacking schematic diagram of the present invention；
Fig. 3 is the equivalent filter circuit theory diagrams of the present invention；
Fig. 4 is the simulation result figure of low pass filter of the present invention.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings：
As Figure 1-4, the ceramic low pass filter of the miniature multilayer of the present embodiment, including be laminated what is constituted by multilayer dielectric substrate
Mutually it is connected by conduction band and via between layered product and the filter circuit in layered product, adjacent media substrate and is turned on, is situated between
In matter substrate at least have a ground plane, its surface be provided with input 1, output end 2, filter circuit include inductance L2, L4, L6 and
Electric capacity C1, C2, C3, inductance L2 are in parallel with electric capacity C2, its parallel connected end be respectively a ends that are connected with input 1 and with inductance L4 phases
The b ends of series connection, inductance L6 one end is connected with inductance L4, and its other end is connected with output end 2, electric capacity C1 one end and a ends phase
Even, electric capacity C1 other end ground connection, electric capacity C3 one end is connected with b ends, electric capacity C3 other end ground connection.
The present embodiment uses LTCC ceramic substrates using medium substrate, is provided with the lower surface of the lowermost layer of medium substrate
Metal ground plane, the metal ground plane is connected by side plate with ground 3.Inductance L2, L4, L6 are by medium substrate
The spiral inductance of metal conduction band formation.Electric capacity C1, C2, C3 use interdigital capacitor structure, pass through the substrate positioned at different layers
Realize.
Totally 28 layers of the medium substrate of the present embodiment, the 29th layer is ground plane, and input is correspondingly provided with the 1st layer and ground plane
End 1, output end 2, layers 2 and 3 are not print the thick ceramic substrates of 0.042mm of metal, except this two-layer substrate, its
The metal level that the dielectric-slab upper surface of his layer is printed with metal level, the 26th and 28 layer of dielectric-slab is ground plane, passes through shell
The side-wall metallic of body is connected to ground, and the metal level constituted on electric capacity C1 ground connection pole plate, the 27th layer of dielectric-slab then constitutes electric capacity C1
Another pole plate.20th, 22,24, the metal level on 26 layers of dielectric-slab constitute ground capacity C3 ground connection pole plate, the 21st, 23,
Metal level on 25 layers constitutes electric capacity C3 another pole plate.6 to 16th layer of metal conduction band constitutes spiral inductance L2, the 18th,
19 layers are then constituted in spiral inductance L4 and L6, the present embodiment, and each layer is all the metal for 0.1mm by width in the 6 to 19th layer
Conduction band is coiled into, from left to right respectively L4 and L6, and the metal level on the 4th, 5 layer constitutes electric capacity C2.
The each layer for constituting spiral inductance is all 1/2 or 3/4 rectangle being coiled into by the metal conduction band of 0.1mm width, so
The metal conduction band of adjacent layer is linked together by via afterwards；Wherein, the spiral inductance of the leftmost side is L2, and centre is L4, most
Right side is L6.Wherein, L2 top is located at the 16th layer, and terminal is located at the 6th layer, and L4 and L6 top are located at the 19th layer, terminal position
In the 18th layer.L2 top is connected for 1 mouthful with input, and L6 2 mouthfuls of terminal and output end is connected, and L2 terminal and L4 beginning
Metal contact wires of the end by metallic vias and on 17 layers are connected, and L4 terminal and L6 top pass through metallic vias phase
Even.
The cut-off frequency of the low pass filter of the present invention is that the insertion loss in 100MHz, passband is less than 1dB.Stopband compared with
Larger stopband can be achieved in wide stopband range to suppress, and the intermediate zone between passband and stopband is precipitous, whole wave filter
Size is 3.2mm × 3.2mm × 1.2mm.
The present invention not only realizes the out-of-band transmission zero point of upper frequency, and then realizes wide Out-of-band rejection, effectively exhibition
Wide stopband suppresses frequency range；And manufacture work is simplified, have for reduction manufacturing cost and lifting yield rate
Important function；Also give in the case where dielectric constant can not be lifted further or ceramic chips thickness can not further reduce, to drawing
Low low pass filter working frequency has corresponding reference value.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to the model of the present invention
Enclose and be defined, on the premise of design spirit of the present invention is not departed from, technical side of the those of ordinary skill in the art to the present invention
In various modifications and improvement that case is made, the protection domain that claims of the present invention determination all should be fallen into.
Claims (4)
1. a kind of ceramic low pass filter of miniature multilayer, it is characterised in that：Including being laminated the stacking constituted by multilayer dielectric substrate
Mutually it is connected by conduction band and via between body and the filter circuit in layered product, adjacent media substrate and is turned on, is given an account of
At least there is a ground plane, its surface is provided with input, output end, and the filter circuit includes inductance L2, L4, L6 in matter substrate
And electric capacity C1, C2, C3, the inductance L2 are in parallel with electric capacity C2, its parallel connected end is respectively a ends and and inductance being connected with input
The b ends that L4 is in series, one end of the inductance L6 is connected with inductance L4, and its other end is connected with output end, electric capacity C1 one end
It is connected with a ends, electric capacity C1 other end ground connection, electric capacity C3 one end is connected with b ends, electric capacity C3 other end ground connection.
2. the ceramic low pass filter of miniature multilayer according to claim 1, it is characterised in that：The medium substrate is used
LTCC ceramic substrates.
3. the ceramic low pass filter of miniature multilayer according to claim 1, it is characterised in that：The medium substrate it is minimum
The lower surface of layer is provided with metal ground plane, and the metal ground plane is connected to ground by side plate.
4. the ceramic low pass filter of miniature multilayer according to claim 1, it is characterised in that：Described inductance L2, L4, L6 are equal
To pass through the spiral inductance of the metal conduction band formation on medium substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710361580.0A CN107017857B (en) | 2017-05-22 | 2017-05-22 | Miniature multilayer ceramic low-pass filter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710361580.0A CN107017857B (en) | 2017-05-22 | 2017-05-22 | Miniature multilayer ceramic low-pass filter |
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| CN107017857A true CN107017857A (en) | 2017-08-04 |
| CN107017857B CN107017857B (en) | 2023-11-21 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
| CN108429542A (en) * | 2018-03-19 | 2018-08-21 | 南京邮电大学 | A LTCC Bandpass Filter with High Performance Three-dimensional Inner Spiral Inductor |
| CN110429920A (en) * | 2019-09-04 | 2019-11-08 | 研创光电科技（赣州）有限公司 | A kind of miniature multilayer ceramic band-pass filter |
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| JP2000049554A (en) * | 1998-07-30 | 2000-02-18 | Kyocera Corp | Low-pass filter and circuit board |
| JP2001267141A (en) * | 2000-03-15 | 2001-09-28 | Ngk Insulators Ltd | Low-pass filter |
| JP2003110393A (en) * | 2001-09-26 | 2003-04-11 | Fdk Corp | Multi-layer low-pass filter |
| JP2003163503A (en) * | 2001-11-27 | 2003-06-06 | Mitsubishi Electric Corp | Lowpass filter, and multistage lowpass filter, multilayer rf package and multilayer rf module using lowpass filter |
| CN201113933Y (en) * | 2007-06-05 | 2008-09-10 | 浙江正原电气股份有限公司 | Multiple layer ceramic dielectric low-pass filter |
| CN101300712A (en) * | 2005-10-28 | 2008-11-05 | 日立金属株式会社 | Irreversible circuit element |
| CN103944528A (en) * | 2014-05-13 | 2014-07-23 | 苏州博海创业微系统有限公司 | High-rejection LTCC (low temperature co-fired ceramic) low-pass filter |
| CN103944525A (en) * | 2014-05-13 | 2014-07-23 | 苏州博海创业微系统有限公司 | LTCC (low temperature co-fired ceramic) high-pass filter |
| CN206850733U (en) * | 2017-05-22 | 2018-01-05 | 中国电子科技集团公司第四十三研究所 | A kind of miniature multilayer ceramics low pass filter |
-
2017
- 2017-05-22 CN CN201710361580.0A patent/CN107017857B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000049554A (en) * | 1998-07-30 | 2000-02-18 | Kyocera Corp | Low-pass filter and circuit board |
| JP2001267141A (en) * | 2000-03-15 | 2001-09-28 | Ngk Insulators Ltd | Low-pass filter |
| JP2003110393A (en) * | 2001-09-26 | 2003-04-11 | Fdk Corp | Multi-layer low-pass filter |
| JP2003163503A (en) * | 2001-11-27 | 2003-06-06 | Mitsubishi Electric Corp | Lowpass filter, and multistage lowpass filter, multilayer rf package and multilayer rf module using lowpass filter |
| CN101300712A (en) * | 2005-10-28 | 2008-11-05 | 日立金属株式会社 | Irreversible circuit element |
| CN201113933Y (en) * | 2007-06-05 | 2008-09-10 | 浙江正原电气股份有限公司 | Multiple layer ceramic dielectric low-pass filter |
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| CN206850733U (en) * | 2017-05-22 | 2018-01-05 | 中国电子科技集团公司第四十三研究所 | A kind of miniature multilayer ceramics low pass filter |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
| CN108429542A (en) * | 2018-03-19 | 2018-08-21 | 南京邮电大学 | A LTCC Bandpass Filter with High Performance Three-dimensional Inner Spiral Inductor |
| CN110429920A (en) * | 2019-09-04 | 2019-11-08 | 研创光电科技（赣州）有限公司 | A kind of miniature multilayer ceramic band-pass filter |
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| Publication number | Publication date |
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| CN107017857B (en) | 2023-11-21 |
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