CN106997031B - Sensor module and packaging method thereof - Google Patents
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- CN106997031B CN106997031B CN201710351877.9A CN201710351877A CN106997031B CN 106997031 B CN106997031 B CN 106997031B CN 201710351877 A CN201710351877 A CN 201710351877A CN 106997031 B CN106997031 B CN 106997031B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 230000015556 catabolic process Effects 0.000 claims description 30
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 238000004382 potting Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/091—Constructional adaptation of the sensor to specific applications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
The invention discloses a sensor module and a packaging method, wherein the sensor module comprises a base, a plurality of magnets arranged on the front surface of the base, a TMR (total magnetic resistance) magnetoresistive chip arranged on the surface of the magnets, an inner bonding pad arranged on the base and connected with the TMR magnetoresistive chip, and an outer bonding pad arranged on the back surface of the base and connected with the inner bonding pad. The magnet and the TMR chips are assembled and then arranged in the base and packaged, the sensor units formed by the plurality of magnet and TMR chips can be respectively and independently powered and independently operated, multiple groups of differential signals can be simultaneously output and used in cooperation with corresponding gears, one path of signals can be used as zero signals of the encoder, and the plurality of sensor units are integrated in the same base, so that occupied space is reduced, the layout of electric devices is facilitated, and the sensor units can be cut among the plurality of sensor units to become a plurality of independent sensor units to adapt to the use environment of the encoder if necessary.
Description
Technical Field
The present invention relates to the field of magnetoresistive chips, and in particular, to a sensor module and a packaging method thereof.
Background
The magnetic induction detection mainly utilizes the magneto-resistance effect principle, and compared with contact measurement components such as piezoresistors, the magneto-sensitive sensor can detect a detected object without contact, has high sensitivity, does not damage detection, is insensitive to greasy dirt environment, is widely applied to industrial production, and also has wide application in vehicles such as speed detection, angle detection, position detection, current detection and the like.
The magneto-resistive effect is classified into an anisotropic magneto-resistive effect (Anisotropic Magneto Resistance, AMR), a giant magneto-resistive effect (Giant Magneto Resistance, GMR), and a tunnel magneto-resistive effect (Tunnel Magneto Resistance, TMR) according to the different principles of magneto-resistive effect generation.
TMR (Tunnel MagnetoResistance) sensor chip, utilize the tunnel magnetoresistance effect of magnetism multilayer film material to respond to the magnetic field, have bigger resistance change rate than AMR chip and GMR chip, have better temperature stability for the GMR chip, higher sensitivity, wider linear range.
There are generally two types of magnetoresistive chips in the market today. One is to adopt the mode overall arrangement of placing the magnet at the chip back, and signal extraction point is in the chip both sides, similar sandwich structure, from the top down is reluctance chip, bears circuit board and back magnet in proper order, and in this structure, reluctance chip can only be put in the middle of the magnet is huge, and the magnet of back magnetism leads to the sensor after the combination to be bulky, and occupation space is many, is unfavorable for subsequent product development. The magnetic field radiated by the magnet can only act on the magnetic resistance chip after penetrating through the middle circuit board, the magnetic field received by the chip is weakened and unstable (the size of the magnetic field is reduced in power exponent with the increase of distance), when the magnetic resistance chip is combined with the magnetic field, the magnetic field received by the magnetic resistance chip is slightly deviated, and the magnetic field received by the magnetic resistance chip is changed to cause the difference. The consistency of products cannot be controlled in the industrialization process, and the method is not suitable for precision instruments and equipment.
The other structure is that the magnetic resistance chip is directly attached to the magnet, and a binding wire is led out from the rear end, and the whole structure diagram is shown in the second structure diagram. The magnetic resistance chip is tightly attached to the surface of the magnetic field, can receive a uniform magnetic field, and the magnet and the chip are both arranged in the packaging shell, so that the structure is compact and the adaptability is wide. However, the GMR magnetoresistive chip is used, and the arrangement layout cannot enlarge the gap between the sensor and the gear, namely the measurement distance, for the GMR chip, and the measurement gap is about 0.2mm generally, so that the industrial requirement cannot be met.
In summary, only one magnetoresistive chip can be integrated in the package in the existing GMR and TMR magnetoresistive chips, only one group of electrical signals can be output, and no zero signal of the encoder can be output. Two identical sensors are used in use. The cost is increased, meanwhile, the space is also occupied, typesetting layout of electric devices is not facilitated, and the signal quality is unstable or the measurement gap is small, so that the method is not suitable for industrial production.
Disclosure of Invention
The invention provides a sensor module and a packaging method thereof, which enable the sensor module to integrate a plurality of sensor units and easily realize the zero signal output of an encoder.
In order to solve the technical problems, the embodiment of the invention provides a sensor module, which comprises a base, a plurality of magnets arranged on the front surface of the base, a TMR (total magnetic resistance) magnetoresistive chip arranged on the surface of the magnets, an inner bonding pad arranged on the base and connected with the TMR magnetoresistive chip, and an outer bonding pad arranged on the back surface of the base and connected with the inner bonding pad.
The anti-static breakdown device is arranged on the surface of the magnet on the same side as the magnetic resistance chip, and the magnetic resistance chip is connected with the anti-static breakdown device through a gold wire and then connected with the internal bonding pad.
The front of the base is provided with grooves which are used for installing the magnets and are in one-to-one correspondence with the magnets and formed islands which are located between the grooves, the inner bonding pads are arranged on the surface of the islands, and a plurality of magnets and the inner bonding pads which are arranged on the islands and correspond to the magnetic resistance chips are symmetrically arranged about the central line of the islands.
Wherein the plurality of magnets are equal in size and field strength.
Wherein the same magnetic poles of a plurality of magnets simultaneously deviate from the base or cling to the base.
The anti-static-breakdown device comprises a base, and is characterized by further comprising a potting adhesive layer arranged on the front surface of the base, wherein the potting adhesive layer covers the magnet, the internal bonding pad, the TMR magnetoresistive chip, the anti-static-breakdown device and the gold wire.
The packaging shell is detachably arranged on the front face of the base to form a sealing space with the base.
The fixing pad is arranged on the back surface of the base and used for fixing the base.
In addition, the embodiment of the invention also provides a sensor module packaging method, which comprises the following steps:
Step 1, arranging magnets of which the surfaces are provided with TMR magnetoresistive chips and anti-static breakdown devices in a base with grooves on the front surface in a one-to-one correspondence manner;
step 2, connecting the TMR magnetic resistance chip and the anti-static breakdown device through gold wires, and connecting the anti-static breakdown device and an internal bonding pad of an island arranged between grooves of the base;
and 3, arranging a filling adhesive layer on the front surface of the base, so that the filling adhesive layer covers the magnet, the internal bonding pad, the TMR (TMR magneto-resistance chip), the anti-static breakdown device and the gold wire.
The step 1 comprises a plurality of magnets and internal bonding pads which are arranged on the island and correspond to the magnetic resistance chip and are symmetrically arranged about the central line of the island.
Compared with the prior art, the sensor module and the packaging method thereof provided by the embodiment of the invention have the following advantages:
The sensor module provided by the embodiment of the invention comprises a base, a plurality of magnets arranged on the front surface of the base, a TMR (total magnetic resistance) magnetoresistive chip arranged on the surface of the magnets, an inner bonding pad arranged on the base and connected with the TMR magnetoresistive chip, and an outer bonding pad arranged on the back surface of the base and connected with the inner bonding pad.
The sensor module packaging method provided by the embodiment of the invention comprises the following steps:
Step 1, arranging magnets of which the surfaces are provided with TMR magnetoresistive chips and anti-static breakdown devices in a base with grooves on the front surface in a one-to-one correspondence manner;
step 2, connecting the TMR magnetic resistance chip and the anti-static breakdown device through gold wires, and connecting the anti-static breakdown device and an internal bonding pad of an island arranged between grooves of the base;
and 3, arranging a filling adhesive layer on the front surface of the base, so that the filling adhesive layer covers the magnet, the internal bonding pad, the TMR (TMR magneto-resistance chip), the anti-static breakdown device and the gold wire.
According to the sensor module and the packaging method thereof, the magnet and the TMR magnetic resistance chip are assembled and then arranged in the base and then packaged, each magnet and each TMR magnetic resistance chip are connected with the internal bonding pad arranged in the base to form the sensor unit, the sensor units formed by the plurality of magnets and the TMR magnetic resistance chips can be independently powered and independently operated, multiple groups of differential signals can be simultaneously output, the differential signals are matched with corresponding gears for use, and one path of signals can be used as zero signals of the encoder for output. Because a plurality of sensor units are integrated on the same base, occupied space is reduced, layout of electric devices is facilitated, and the electric devices can be changed into a plurality of independent sensor units by cutting among the plurality of sensor units if necessary, so that the electric device is suitable for the use environment of an encoder.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a sensor module according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a front structure of a sensor module according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a back structure of a sensor module according to an embodiment of the present invention;
FIG. 4 is a schematic view of a sensor module according to an embodiment of the present invention;
fig. 5 is a schematic step flow diagram of a specific implementation of a sensor module packaging method according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 5, fig. 1 is a schematic structural diagram of a specific implementation of a sensor module according to an embodiment of the present disclosure; FIG. 2 is a schematic diagram of a front structure of a sensor module according to an embodiment of the present invention; FIG. 3 is a schematic diagram of a back structure of a sensor module according to an embodiment of the present invention; FIG. 4 is a schematic view of a sensor module according to an embodiment of the present invention; fig. 5 is a schematic step flow diagram of a specific implementation of a sensor module packaging method according to an embodiment of the present invention.
In one embodiment, the sensor module includes a base 10, a plurality of magnets 20 disposed on the front surface of the base 10, a TMR magnetoresistive chip 30 disposed on the surface of the magnets 20, an inner pad 60 disposed on the base 10 and connected to the TMR magnetoresistive chip 30, and an outer pad 70 disposed on the back surface of the base 10 and connected to the inner pad 60.
Through setting up magnet 20, TMR magnetic resistance chip 30 after assembling in base 10 and then encapsulating, every magnet 20 and TMR magnetic resistance chip 30 are connected with the inside pad 60 that sets up in base 10 and are formed the sensor unit, can be respectively independent power supply independent work between the sensor unit that a plurality of magnet 20, TMR magnetic resistance chip 30 are constituteed, can output multiunit difference signal simultaneously, use with corresponding gear cooperation, can regard one of them signal as the zero signal output of encoder. Because a plurality of sensor units are integrated on the same base, occupied space is reduced, layout of electric devices is facilitated, and the electric devices can be changed into a plurality of independent sensor units by cutting among the plurality of sensor units if necessary, so that the electric devices are suitable for the use environment of an encoder.
Because the sensor unit has a small volume and high sensitivity, once the sensor unit is stimulated externally, the corresponding speed is very high, and in order to reduce detection inaccuracy possibly caused by external interference, the sensor module further comprises an anti-static breakdown device 40 arranged on the surface of the magnet 20 on the same side as the magnetoresistive chip 30, and the magnetoresistive chip 30 is connected with the anti-static breakdown device 40 through a gold wire 50 and then connected with the internal bonding pad 60. By providing the anti-static breakdown device 40, the interference of the detection of the sensor caused by the static electricity can be removed in the use process, and the detection accuracy is improved.
For further improving the integration level of the whole sensor module and reducing the volume, the sensor module is divided into sensor units for convenience in follow-up, the front surface of the base 10 is provided with grooves for installing the magnets 20 and corresponding to the magnets 20 one by one and island formed between the grooves, the inner bonding pads 60 are arranged on the surface of the island, and a plurality of the magnets 20 and the inner bonding pads 30 corresponding to the island and the magnetoresistive chip 30 are symmetrically arranged about the central line of the island.
In practical application, two sensors are integrated in one sensor module, so that the output of two groups of electric signals can be completed, and one signal can be output as a zero signal of an encoder when the two groups of electric signals are matched with corresponding gears.
Therefore, in one embodiment of the present invention, the number of the magnets 20 is two, the front surface of the base 10 is provided with two grooves for disposing the magnets 20 and formed islands between the two grooves, the internal pads 60 are disposed on the surface of the islands, and the two magnets 20 and the internal pads 60 disposed on the islands corresponding to the magnetoresistive chips 30 are symmetrically disposed about the center line of the islands. The sensor module is integrated with the receiving areas of two groups of magnetic resistance chips 30, the two groups of magnetic resistance chips 30 are spaced at a certain distance, each group of magnetic sensors corresponds to one gear, and 2 groups of sine and cosine signals with 90-degree phase difference can be output. Since the two groups of magnetoresistive chips 30 are powered separately, they are independent of each other and can be cut off from the middle if necessary, becoming two sensor units that output a group of sine and cosine differential signals that differ by 90 degrees. The signal is output after being processed by a subsequent circuit. Because two groups of sine and cosine differential signals with the phase difference of 90 degrees are integrated, the requirements of encoder products on scanning signals and reference signals can be met, and therefore, the problem of inputting all signals can be solved by one sensor module, the product package is small in size, and compared with the conventional GMR chip, the TMR magneto-resistance chip 30 with high sensitivity is adopted, the sensitivity is high, and the receiving distance is large. The large clearance measurement of the gear can be realized.
If only one set of sine and cosine differential signals with the phase difference of 90 degrees is needed, the magnetic sensor of the sensor module can be cut off from the middle to form sensor units containing a single TMR magnetic resistance chip 30, as shown in fig. 4, each sensor unit also comprises a magnet 20 and a groove for installing the magnet 20, wherein the island of the inner bonding pad 60 is arranged, the TMR magnetic resistance chip 30 is arranged on the magnet 20, the anti-static breakdown device 40 is arranged on the surface of the magnet 20, and the magnetic resistance chip 30 is connected with the anti-static breakdown device 40 through a gold wire 50 and then is connected with the inner bonding pad 60.
In the present invention, the distance between adjacent magnets 20 is not particularly limited, and the magnetic field intensity on the surface of the magnets 20 is not particularly limited, and sensor modules with different distances and magnetic field intensities can be designed according to the use requirements.
It should be noted that the position in the TMR magnetoresistive chip 30 arrangement in the present invention must be the magnetic pole of the magnet 20, either the S-pole or the N-pole, i.e., the performance will be different.
In the present invention, the magnetic field strength of the plurality of magnets 20 may be the same or different, but the magnetic field strength is required to be the same in the production process and the dimensions of the two bar-shaped ferromagnets are required to be the same in consideration of the sensor units which may be the same in performance after cutting.
The placement direction of the plurality of magnets 20 may be the same direction as the same magnetic pole carton or may be different directions. As long as the spacing between the magnets 20 is sufficiently far, the polarity can be reversed, but this increases the overall volume of the sensor module, so that the same poles of the magnets 20 face away from the base 10 or are in close proximity to the base 10 at the same time in order to minimize the overall sensor volume. That is, the plurality of TMR magnetoresistive chips 30 are all provided in the same N-pole or S-pole of the magnet 20.
While the heights of the plurality of TMR magnetoresistive chips 30 with respect to the mount 10 may be the same or different, the heights are generally required to be the same in consideration of the single sensor unit having the same performance after dicing and the requirement for the quality of the product.
The specific position of the TMR magnetoresistive chip 30 placed on the magnet 20 is not particularly limited, and the TMR magnetoresistive chip 30 is placed on the center of the magnet 20 in order to minimize space occupation and avoid collision with other devices. If the number of TMR magnetoresistive chips 30 is two, there is no relative positional relationship between the two TMR magnetoresistive chips 30.
In order to prevent the gold wires 50 or the TMR magnetoresistive chips 30 and the like in the sensor module from being easily contacted by the outside or polluted by dust in the use process, the sensor module further comprises a potting adhesive layer arranged on the front surface of the base 10, wherein the potting adhesive layer covers the magnet 20, the inner bonding pads 60, the TMR magnetoresistive chips 30, the anti-electrostatic breakdown device 40 and the gold wires 50.
It should be noted that the invention is not limited to the type of the potting adhesive, the deposition process and the thickness.
In order to facilitate transportation, the sensor module is further protected, and the sensor module further comprises a packaging shell which is detachably arranged on the front surface of the base 10 and forms a sealing space with the base 10.
The external bonding pad 70 on the back of the sensor module in the present invention is to be bonded to a subsequent electrical device, and the present invention does not limit the position of the external bonding pad 70, and since the sensor module is not generally used independently but is used in combination with other devices during use, it is generally required to integrate the sensor module on other circuit boards, and thus the sensor module further includes a fixing pad 80 disposed on the back of the base 10 for fixing the base 10 for convenience of bonding.
The present invention is not limited to the location of the anchor pads 80, but for convenience of distinction from the external pads 70, quick recognition is generally provided separately. For example, the cross section of the submount 10 is rectangular, and the external pads 70 and the fixing pads 80 occupy two opposite sides of the back surface of the submount 10, respectively.
In one embodiment, the sensor module is formed of a multi-layer structure, the first layer being an external pad 70, primarily for soldering with subsequent electrical devices, the pad being on a bottom layer, the outer edge of the pad being within the overall package outline, the bottom surface of each pad area and the surface perpendicular to the bottom surface being gold plated. The internal bonding pad 60 is placed in the middle island part of the whole base 10, two magnets 20 are symmetrically placed on two sides of the island, magnetic poles are in the same direction, the TMR magnetoresistive chip 30 is tightly attached to the surface of the magnets 20, the TMR magnetoresistive chip 30 is symmetrically placed relative to the middle island, an anti-static breakdown device is arranged between the TMR magnetoresistive chip 30 and the internal bonding pad 60, the gold wire 50 is used for binding, the outermost layer is pouring sealant, and all the devices are wrapped.
In addition, an embodiment of the present invention further provides a method for packaging a sensor module, as shown in fig. 5, including:
Step 1, arranging a plurality of magnets with TMR magnetoresistive chips and anti-static breakdown devices arranged on the surfaces in a base with grooves on the front surface; through setting up the recess, set up magnet in the recess, the convenience is fixed to magnet.
Step 2, connecting the TMR magnetic resistance chip and the anti-static breakdown device through gold wires, and connecting the anti-static breakdown device and an internal bonding pad of an island arranged between grooves of the base; by providing internal pads on islands between the grooves, the electrical signal of the TMR magnetoresistive chip is output through the internal pads.
And 3, arranging a filling adhesive layer on the front surface of the base, so that the magnet, the internal bonding pad, the TMR magnetic resistance chip, the anti-static breakdown device and the gold wire are covered by the filling adhesive layer, and the thickness and the process of the filling adhesive layer are not limited in order to protect the TMR magnetic resistance chip, related devices and the Xinin.
In the sensor module, a plurality of groups of receiving areas of the magnetic resistance chips are integrated, the magnetic resistance chips are spaced at certain distances, each group of magnetic sensors corresponds to one gear, and a plurality of groups of sine and cosine differential signals with the phase difference of 90 degrees can be output. Since the magnetoresistive chips are individually powered, they can be disconnected from each other if necessary, and become a plurality of sensor units that output a set of sine and cosine signals that differ by 90 degrees. The signal is output after being processed by a subsequent circuit. Because of integrating a plurality of groups of sine and cosine differential signals with the phase difference of 90 degrees, the requirements of encoder products on scanning signals and reference signals can be met, the problem of inputting all signals can be solved by one sensor module, the product package is small in size, and compared with the traditional GMR chip, the TMR chip with high sensitivity is adopted, the sensitivity is high, and the receiving distance is large. The large clearance measurement of the gear can be realized.
If only one set of sine and cosine differential signals with the phase difference of 90 degrees is needed, the magnetic sensor of the sensor module can be cut off from the middle to form a sensor unit comprising a single TMR magnetic resistance chip, so that the volume is reduced, and the cost is reduced.
In order to facilitate the division of the sensor module, the step 1 includes that a plurality of magnets and internal bonding pads corresponding to the island and the magneto-resistive chip are symmetrically arranged about the central line of the island, and only the plurality of sensor units are required to be cut along the central line by symmetrically arranging the plurality of sensor units.
It should be noted that the external pad of the sensor module and the TMR magnetoresistive chip in the invention are also in correspondence, and the external pad of the same sensor and the TMR magnetoresistive chip are located on the same side of the island.
In summary, according to the sensor module and the packaging method thereof provided by the embodiments of the present invention, the magnet and the TMR magnetoresistive chip are assembled and then arranged in the base and packaged, each magnet and the TMR magnetoresistive chip are connected with the internal bonding pad arranged in the base to form the sensor unit, the sensor units formed by the plurality of magnets and the TMR magnetoresistive chips can be respectively and independently powered and independently operated, and multiple groups of signals can be simultaneously output for use in cooperation with corresponding gears, and one path of signals can be output as zero signals of the encoder. Because a plurality of sensor units are integrated on the same base, occupied space is reduced, layout of electric devices is facilitated, and the electric devices can be changed into a plurality of independent sensor units by cutting among the plurality of sensor units if necessary, so that the electric devices are suitable for the use environment of an encoder.
The sensor module and the packaging method thereof provided by the invention are described in detail. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (9)
1. The sensor module is characterized by comprising a base, a plurality of magnets arranged on the front face of the base, TMR magnetoresistive chips arranged on the surfaces of the magnets, an internal bonding pad arranged on the base and connected with the TMR magnetoresistive chips, an external bonding pad arranged on the back face of the base and connected with the internal bonding pad, and an anti-static breakdown device arranged on the surface of the magnets on the same side as the magnetoresistive chips, wherein the magnetoresistive chips are connected with the internal bonding pad after being connected with the anti-static breakdown device through gold wires.
2. The sensor module of claim 1, wherein the front surface of the base is provided with grooves for mounting the magnets and corresponding to the magnets one by one and islands formed between the grooves, the internal bonding pads are arranged on the surface of the islands, and a plurality of the magnets and the internal bonding pads corresponding to the magnetoresistive chips are symmetrically arranged about the central line of the islands.
3. The sensor module of claim 2, wherein a plurality of said magnets are of equal size and field strength.
4. A sensor module according to claim 3, wherein the same poles of a plurality of said magnets face away from or abut against said base at the same time.
5. The sensor module of claim 4, further comprising a potting adhesive layer disposed on a front side of the base, the potting adhesive layer covering the magnet, the internal bond pad, the TMR magnetoresistive chip, the anti-electrostatic breakdown device, and the gold wire.
6. The sensor module of claim 5, further comprising a package housing removably disposed on the front side of the base to form a sealed space with the base.
7. The sensor module of claim 6, further comprising a mounting pad disposed on a back side of the base for mounting the base.
8. A method of packaging a sensor module according to any one of claims 1 to 7, comprising:
Step 1, arranging magnets of which the surfaces are provided with TMR magnetoresistive chips and anti-static breakdown devices in a base with grooves on the front surface in a one-to-one correspondence manner;
step 2, connecting the TMR magnetic resistance chip and the anti-static breakdown device through gold wires, and connecting the anti-static breakdown device and an internal bonding pad of an island arranged between grooves of the base;
step 3, arranging a filling adhesive layer on the front surface of the base, so that the filling adhesive layer covers the magnet, the internal bonding pad, the TMR (total magnetic resistance) magnetoresistive chip, the anti-static breakdown device and the gold wire;
the anti-static breakdown device is arranged on the surface of the magnet and is arranged on the same side of the magnetic resistance chip, and the magnetic resistance chip is connected with the anti-static breakdown device through a gold wire and then connected with the internal bonding pad.
9. The method of packaging a sensor module of claim 8, wherein step 1 comprises a plurality of magnets and internal bonding pads disposed on the island and corresponding to the magnetoresistive chip are symmetrically disposed about a center line of the island.
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| CN101587174A (en) * | 2008-05-14 | 2009-11-25 | 新科实业有限公司 | Magnetic sensor |
| KR20120086989A (en) * | 2011-01-27 | 2012-08-06 | 주식회사 엘지생명과학 | Flip-chip Magnetic resistance sensor Package and Manufacturing Method thereof |
| CN102809665A (en) * | 2012-06-04 | 2012-12-05 | 江苏多维科技有限公司 | Magnetic resistance gear sensor |
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| CN207263908U (en) * | 2017-05-18 | 2018-04-20 | 长春禹衡光学有限公司 | A kind of sensor module |
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| CN101587174A (en) * | 2008-05-14 | 2009-11-25 | 新科实业有限公司 | Magnetic sensor |
| KR20120086989A (en) * | 2011-01-27 | 2012-08-06 | 주식회사 엘지생명과학 | Flip-chip Magnetic resistance sensor Package and Manufacturing Method thereof |
| CN102809665A (en) * | 2012-06-04 | 2012-12-05 | 江苏多维科技有限公司 | Magnetic resistance gear sensor |
| CN203858698U (en) * | 2014-04-18 | 2014-10-01 | 江苏多维科技有限公司 | Low-flying height in-plane magnetic image recognition sensor chip |
| CN105698671A (en) * | 2016-02-01 | 2016-06-22 | 重庆理工大学 | Novel angular displacement sensor |
| CN106206934A (en) * | 2016-07-14 | 2016-12-07 | 长春禹衡光学有限公司 | A kind of gear type sensor module based on magnetoresistive chip and method for packing thereof |
| CN207263908U (en) * | 2017-05-18 | 2018-04-20 | 长春禹衡光学有限公司 | A kind of sensor module |
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